JPS6219455A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPS6219455A JPS6219455A JP60159156A JP15915685A JPS6219455A JP S6219455 A JPS6219455 A JP S6219455A JP 60159156 A JP60159156 A JP 60159156A JP 15915685 A JP15915685 A JP 15915685A JP S6219455 A JPS6219455 A JP S6219455A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminate
- long
- thermoplastic resin
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器%電子機器、通信機器、計算機器等に
用いられるプリント配線板用積層板の製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminate for printed wiring boards used in electrical equipment, such as electronic equipment, communication equipment, and computing equipment.
従来、積層板はプリント配線板として用するためには部
品実装用孔やスルホール孔を開孔したり。Conventionally, in order to use a laminate board as a printed wiring board, holes for mounting components or through holes were drilled.
外形打抜加工をする必要があり、代′表的な積層板であ
る紙基材フェノール樹脂積層板にあっては積層板を加温
し可塑化してからパンチング加工で打抜加工をしている
が加温時の孔径や外形寸法が室温に冷却された時点で収
縮するため孔径、外形寸法にバラツキが発生して−た。It is necessary to perform external punching, and in the case of paper-based phenolic resin laminates, which are a typical laminate, the laminate is heated to plasticize it and then punched. However, the pore diameter and external dimensions during heating shrink when cooled to room temperature, resulting in variations in pore diameter and external dimensions.
又残る代表的な積層板であるガラス布基材エポキシ樹脂
積層板にあっては打抜加工が難しく、ドリル孔加工や外
形をルータ−加工する必要があり加工コストの上昇を招
来する問題があった。このため熱可塑性樹脂シートや熱
可塑性樹脂板に鋼箔を接着した熱可塑性樹脂積層板を用
い室温パンチング加工で打抜加工することが試みられた
が1部品実装時の半田処理等の熱処理で積層板九反り、
ネジレが発生したり、部品取付ICよるタワミが発生す
る問題があった。In addition, the remaining typical laminates, glass cloth-based epoxy resin laminates, are difficult to punch and require drilling holes and router processing, leading to increased processing costs. Ta. For this reason, attempts have been made to use a thermoplastic resin sheet or a thermoplastic resin laminate in which steel foil is bonded to a thermoplastic resin plate, and perform punching at room temperature. Board nine warped,
There were problems such as twisting and deflection due to the ICs attached to the parts.
本発明の目的は室温パンチング加工が可能で且つ部品実
装時の熱処理で積層板に反り、ネジレの発生しない積層
板の製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a laminate that can be punched at room temperature and that does not warp or twist during heat treatment during component mounting.
本発明は長尺状熱可塑性樹脂シートの上、下面に長尺状
熱硬化性樹脂含浸基材を配し、更にその上面及び又は下
面に長尺状金属箔を配設してから全体を連続的に積層成
形後、所要寸法に切断することを特徴のため室温パンチ
ングが可能となり且つ部品実装時の熱処理で反り、ネジ
レの発生することのない積層板を効富よく製造すること
ができるもので、以下本発明の方法を詳細に説明する。In the present invention, a long thermosetting resin-impregnated base material is arranged on the top and bottom surfaces of a long thermoplastic resin sheet, and a long metal foil is further placed on the top and/or bottom surface of the long thermoplastic resin sheet, and then the whole is continuous. The feature is that it is cut to the required size after lamination molding, so it can be punched at room temperature, and it is possible to efficiently manufacture laminated plates that will not warp or twist due to heat treatment during component mounting. Hereinafter, the method of the present invention will be explained in detail.
本発明に用いる長尺状熱可塑性樹脂y−)としては熱可
塑性ポリイミド樹脂、ポリブタジェン樹脂、ポリウレタ
ン樹脂、ポリフェニレンサルファイド樹脂、ポリフェニ
レンオキサイド樹脂、ポリプロピレン樹脂、ポリアミド
樹脂、ポリエステル樹脂、ポリカーボネート樹脂、ポリ
アセタール樹脂、弗化樹脂、シリコン樹脂等のように耐
熱性のある熱可塑性樹脂の長尺状シート全般を用するこ
とができ、特に限定するものではな−、長尺状熱可塑性
樹脂シートの上、下面に配する長尺状熱硬化性樹脂含浸
基材としては、フェノール樹脂、クレゾール樹脂、エポ
キシ樹脂、不飽和ポリエステル樹脂、メラミン樹脂、ポ
リイミド樹脂、ジアリルフタレート樹脂等の単独、混合
物、変性樹脂をガラス、アスベスト等の無機繊維やポリ
エステル、ポリアミド、ポリビニルアルコール、ポリア
クリル等の有機合成繊維や木綿等の天然繊維からなる織
布、不織布、マプト、寒冷紗、紙等の基材に含浸した長
尺状樹脂含浸基材で必要に応じて1枚乃至複数枚を用い
ることができる。長尺状金属箔トシては鋼、アルミニウ
ム、ステンレス鋼、真鍮、鉄、ニッケル等の皐独、合金
等からなる金属箔を用いるもので必要に厄じて金属箔に
接着層を設けておくこともできるものである。連続積層
成形手段につ−ては移動型プレス、マルチロール、ロー
ル、ダブルベルト等による積層成形方法をとることがで
き特に限定するものではない、以下本発明の一実施例を
図示実施例にもとづいて説明する。The elongated thermoplastic resin y-) used in the present invention includes thermoplastic polyimide resin, polybutadiene resin, polyurethane resin, polyphenylene sulfide resin, polyphenylene oxide resin, polypropylene resin, polyamide resin, polyester resin, polycarbonate resin, polyacetal resin, and fluorocarbon resin. Any elongated sheet of heat-resistant thermoplastic resin such as synthetic resin, silicone resin, etc. can be used, and there is no particular limitation. The long thermosetting resin-impregnated base materials include phenolic resins, cresol resins, epoxy resins, unsaturated polyester resins, melamine resins, polyimide resins, diallyl phthalate resins, etc. alone, mixtures, and modified resins such as glass, asbestos, etc. A long resin-impregnated base material made of inorganic fibers, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, polyacrylic, and natural fibers such as cotton, such as woven fabrics, nonwoven fabrics, Maputo, cheesecloth, paper, etc. One or more sheets can be used as needed. The long metal foil is a metal foil made of steel, aluminum, stainless steel, brass, iron, nickel, etc., or an alloy, and if necessary, an adhesive layer must be provided on the metal foil. It is also possible. Continuous lamination molding means may be a lamination molding method using a moving press, multi-roll, roll, double belt, etc., and is not particularly limited.One embodiment of the present invention will be described below based on the illustrated embodiment. I will explain.
実施例
第1図は本発明の一実施例を示す闇路製造工程図である
a K を図に示すように厚さ1.4ffの長尺状ポリ
フェニレンオキサイド樹脂シート1の上、下面に淳さ0
.1鰭のエポキシ樹脂含浸ガラス布2を夫々配し、更に
その上、下面に岸さ0.0351111の接着層付銅箔
3を夫々配設してから160〜210℃の熱ロール4で
連続的に積層成形後、カリター5で所要寸法に切断して
積層板を得た。Embodiment FIG. 1 is a dark road manufacturing process diagram showing an embodiment of the present invention. As shown in the figure, a long polyphenylene oxide resin sheet 1 with a thickness of 1.4 ff was printed on the top and bottom surfaces of a long polyphenylene oxide resin sheet 1. 0
.. A single fin of epoxy resin-impregnated glass cloth 2 is placed on each fin, and a copper foil 3 with an adhesive layer 3 having a shore height of 0.0351111 is placed on the bottom surface thereof, and then continuously heated with a hot roll 4 at 160 to 210°C. After lamination molding, the laminated plate was cut into required dimensions using a culitor 5.
従来例1
厚さ1.6Mのポリフェニレンオキサイド樹脂シートの
、E1下面に厚さ0.035mの接着層付鋼箔を夫々配
設した積層体を加熱プレスで加熱加圧成形して積層板を
得た。Conventional Example 1 A laminate of polyphenylene oxide resin sheets with a thickness of 1.6M and a steel foil with a 0.035m thick adhesive layer disposed on the lower surface of E1 was heated and pressure-molded using a hot press to obtain a laminate. Ta.
従来例2
厚さ0.2nのエポキシ樹脂含浸ガラス布8枚の上、下
面に厚さ0.035allの鋼箔を夫々配設した積層体
を加熱プレスで加熱加圧成形して積層板を得た。Conventional Example 2 A laminate was obtained by heating and pressure forming a laminate in which steel foils of 0.035all thickness were arranged on the top and bottom surfaces of eight sheets of epoxy resin-impregnated glass cloth with a thickness of 0.2n using a hot press. Ta.
〔発明の効果]
実施例及び従来例1と2の積層板のパンチング加工性、
熱処理時の反り、ネジレはfa1表で明白なように本発
明の積層板の製造方法で得られた積層板の性能はよく本
発明の積層板の製造方法の優れていることを確認した。[Effects of the invention] Punching processability of the laminates of Examples and Conventional Examples 1 and 2,
The performance of the laminate obtained by the method of manufacturing a laminate of the present invention was good in terms of warping and twisting during heat treatment, as shown in the FA1 table, confirming the superiority of the method of manufacturing a laminate of the present invention.
注 ※ 従来品を100とした場合の比である。Note: *This is the ratio when the conventional product is set as 100.
第1図は本発明の一実施例を示す簡略工程図である。
1は長尺状熱可塑性樹脂シート、2は長尺状熱硬化性樹
脂含浸基材、3は長尺状金属箔、4は熱ロール、5はカ
ワターである。FIG. 1 is a simplified process diagram showing an embodiment of the present invention. 1 is a long thermoplastic resin sheet, 2 is a long thermosetting resin-impregnated base material, 3 is a long metal foil, 4 is a hot roll, and 5 is a cloth.
Claims (2)
硬化性樹脂含浸基材を配し、更にその上面及び又は下面
に長尺状金属箔を配設してから全体を連続的に積層成形
後、所要寸法に切断することを特徴とする積層板の製造
方法。(1) A long thermosetting resin-impregnated base material is arranged on the top and bottom surfaces of a long thermoplastic resin sheet, and a long metal foil is further placed on the top and/or bottom surface of the long thermoplastic resin sheet, and then the whole is continuous. A method for manufacturing a laminate, which comprises cutting the laminate into required dimensions after lamination molding.
あることを特徴とする特許請求の範囲第1項記載の積層
板の製造方法。(2) The method for manufacturing a laminate according to claim 1, wherein the thermoplastic resin is a polyphenylene oxide resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60159156A JPS6219455A (en) | 1985-07-18 | 1985-07-18 | Manufacture of laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60159156A JPS6219455A (en) | 1985-07-18 | 1985-07-18 | Manufacture of laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6219455A true JPS6219455A (en) | 1987-01-28 |
Family
ID=15687489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60159156A Pending JPS6219455A (en) | 1985-07-18 | 1985-07-18 | Manufacture of laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6219455A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203330A (en) * | 1987-02-20 | 1988-08-23 | 日本シイエムケイ株式会社 | Copper-clad laminated board |
JPH0275159U (en) * | 1988-11-23 | 1990-06-08 |
-
1985
- 1985-07-18 JP JP60159156A patent/JPS6219455A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203330A (en) * | 1987-02-20 | 1988-08-23 | 日本シイエムケイ株式会社 | Copper-clad laminated board |
JPH0275159U (en) * | 1988-11-23 | 1990-06-08 |
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