JPS6339333A - Single-sided metal-lined laminated board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a single-sided metal-clad laminate used in electrical equipment, electronic equipment, etc.

[Background technology]

Conventionally, in the case of single-sided metal-clad laminates, the amount of resin in the laminate excluding metal foil was adjusted to 45 to 55 weight range (hereinafter simply referred to as "related") in order to balance performance such as shoulder resistance, moisture resistance, and dimensional stability. ), the solder register process is the process of processing a single-sided metal-clad laminate into a printed wiring board.
During the mark printing process, the temporary fixing process of chip parts after mounting, and the soldering process, UV irradiation, heating, etc. cause thermal expansion of the gold, causing warping with the gold foil side facing outward, which inhibits fine patterning. It was the cause.

[Purpose of the invention]

An object of the present invention is to provide a single-sided metal-clad laminate with small warpage.

[Disclosure of the invention]

The present invention provides a single-sided metal-clad laminate formed by laminating and molding a required number of resin-impregnated substrates with metal foil on one side, in which the amount of resin in the plate excluding the metal foil is opposite to that of the metal foil. One-sided metal cladding layer Jim O) characterized by having a side of 55 to 65 and [2, and other parts of 45 to 55.] 1- on the opposite side of the metal foil adjusts the expansion of the metal foil due to heating. This invention was able to reduce warpage, and the present invention will be described in detail below.

As the resin for the resin-impregnated base material used in the present invention, phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, fluorinated resin, polyphenylene sulfide, etc. may be used alone, in mixtures, or modified. etc., and a solvent such as water, methyl alcohol, acetone, cyclohexenone, styrene, etc. is added to adjust the viscosity as necessary.

The base material may be woven fabric, non-woven fabric, mat, paper, or a combination of these materials made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. A
That's true. Metal foils include copper, brass, aluminum,
A metal foil such as nickel, stainless steel, or iron is used, and if necessary, an adhesive layer can be provided on one side of the metal foil to improve adhesive strength. The amount of resin in the laminate excluding the metal foil must be 55-65% on the side opposite the metal foil. In other words, if it is less than 55 inches, it is not possible to reduce the warpage.
This is because if it exceeds 65 LL, the amount of runoff wood 111 M during molding becomes large, reducing production efficiency. Resin amount 55
~65 layers using the required number of 1 to 4 resin-impregnated substrates, preferably I? It is desirable that the thickness is 1/2 or less of the total thickness of the impregnated base material, more preferably 1A or less. Resin i of other parts is 45-559! A balance of magnetic insulation resistance, moisture resistance, and dimensional stability is required. 55 ~ resin lid of laminate excluding metal foil
In order to obtain 65% and 45% to 55%, it is preferable that the amount of resin in the resin-impregnated base material be approximately 55% to 67% and 45% to 57%, taking into consideration the amount of resin flowing out during lamination molding.

The present invention will be explained below based on examples. 4-ru.

Example: A phenolic resin face with a resin amount of 50% was applied to kraft paper with a thickness of 0.2 MJ4, and the resin amount was 30% so that the resin amount was 50%.
Copper foil with an adhesive layer was placed on the upper surface of six sheets of dried resin-impregnated paper, and a resin amount of phenolic resin varnish of resin M5096 was applied to kraft paper with a thickness of 0.20 on top of the resin-impregnated paper. A laminate with two sheets of dried resin-impregnated paper arranged with a ribbon so that the diameter is 60φ (with a molding pressure of 100 Kq/d,
After lamination molding at 160℃ for 60 minutes, the thickness of the laminate was 1.6 silk, and the amount of resin in the laminate excluding the copper foil was 59 on the opposite side of the metal foil, and on the other i'
A single-sided copper-clad laminate with a content of 49% was obtained.

Ratio Example of 5 sheets A paper sheet was processed in the same manner as in Example Vj1 except that 8 sheets of resin-impregnated paper obtained by impregnating and drying the resin-impregnated paper of Example 1 to have a resin amount of 50 L1 were used. A paper-based phenolic resin laminate was obtained in which the amount of resin in the laminate excluding the copper foil was 49 cm.

〔Effect of the invention〕

As is clear from Table 1, the warping of the single-sided metal-clad laminates of the Examples and Comparative Examples was confirmed to be due to the superior performance of the single-sided metal-clad laminates of the present invention.

Table 1

Claims (2)

[Claims] (1) In a single-sided metal-clad laminate formed by laminating and molding a required number of resin-impregnated base materials with metal foil on one side, the amount of resin in the laminate excluding the metal foil is greater than the amount of resin on the other side of the gold-layer foil. 55～
A single-sided metal-clad laminate, characterized in that the content is 65% by weight and the other parts are 45 to 55% by weight. (2) The electrical laminate according to claim 1, wherein the base material of the resin-impregnated base material is paper.