JPH01139531U - - Google Patents

Info

Publication number
JPH01139531U
JPH01139531U JP3340588U JP3340588U JPH01139531U JP H01139531 U JPH01139531 U JP H01139531U JP 3340588 U JP3340588 U JP 3340588U JP 3340588 U JP3340588 U JP 3340588U JP H01139531 U JPH01139531 U JP H01139531U
Authority
JP
Japan
Prior art keywords
prepreg
metal foil
plasma treatment
temperature plasma
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3340588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3340588U priority Critical patent/JPH01139531U/ja
Publication of JPH01139531U publication Critical patent/JPH01139531U/ja
Pending legal-status Critical Current

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  • Laminated Bodies (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の実施例を示すものであり、第
２図は比較例を示す断面説明図である。 １０……銅箔、１２……低温プラズマ処理を行
つたフイルム、１４……プリプレグ。 FIG. 1 shows an example of the present invention, and FIG. 2 is a cross-sectional explanatory diagram showing a comparative example. 10...Copper foil, 12...Film subjected to low temperature plasma treatment, 14...Prepreg.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フツ素樹脂含浸率４５〜７５重量％のプリプレ
グを複数枚重ね両側に金属箔を貼り合わせ、加熱
、加圧成形してなる積層板において、金属箔とプ
リプレグの間に低温プラズマ処理を行つたフツ素
樹脂系のフイルムを挾圧させて成ることを特徴と
するプリント回路用積層板。 In a laminate made by laminating multiple sheets of prepreg with a fluororesin impregnation rate of 45 to 75% by weight and pasting metal foil on both sides, heating and pressure forming, a low-temperature plasma treatment is performed between the metal foil and the prepreg. A laminated board for printed circuits, characterized by being made by compressing base resin films.
JP3340588U 1988-03-14 1988-03-14 Pending JPH01139531U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3340588U JPH01139531U (en) 1988-03-14 1988-03-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3340588U JPH01139531U (en) 1988-03-14 1988-03-14

Publications (1)

Publication Number Publication Date
JPH01139531U true JPH01139531U (en) 1989-09-25

Family

ID=31260085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3340588U Pending JPH01139531U (en) 1988-03-14 1988-03-14

Country Status (1)

Country Link
JP (1) JPH01139531U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125698A (en) * 1983-01-06 1984-07-20 松下電工株式会社 Method of producing multilayer printed circuit board
JPS60235844A (en) * 1984-05-08 1985-11-22 Hitachi Ltd Prepreg sheet and laminate thereof
JPS60258232A (en) * 1984-06-04 1985-12-20 Matsushita Electric Works Ltd Laminated board of fluorine-containing resin
JPS61177793A (en) * 1985-02-01 1986-08-09 株式会社フジクラ Manufacture of heatproof flexible printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125698A (en) * 1983-01-06 1984-07-20 松下電工株式会社 Method of producing multilayer printed circuit board
JPS60235844A (en) * 1984-05-08 1985-11-22 Hitachi Ltd Prepreg sheet and laminate thereof
JPS60258232A (en) * 1984-06-04 1985-12-20 Matsushita Electric Works Ltd Laminated board of fluorine-containing resin
JPS61177793A (en) * 1985-02-01 1986-08-09 株式会社フジクラ Manufacture of heatproof flexible printed circuit board

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