JPS61177793A - Manufacture of heatproof flexible printed circuit board - Google Patents
Manufacture of heatproof flexible printed circuit boardInfo
- Publication number
- JPS61177793A JPS61177793A JP1641285A JP1641285A JPS61177793A JP S61177793 A JPS61177793 A JP S61177793A JP 1641285 A JP1641285 A JP 1641285A JP 1641285 A JP1641285 A JP 1641285A JP S61177793 A JPS61177793 A JP S61177793A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- flexible printed
- sputtering
- circuit board
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は耐熱性に優れたフレキシブル基板の製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a flexible substrate with excellent heat resistance.
（従来の技術）
フレキシブルプリント基板の代表的な構造は、絶縁性と
可撓性を併せ持つ薄いベースフィルムの表面に配線パタ
ーンを密着して形成したもので。(Conventional technology) The typical structure of a flexible printed circuit board is that a wiring pattern is formed in close contact with the surface of a thin base film that has both insulation and flexibility.
通常は配線パターンにはその一部を除いてカバーレイが
設けられておシ、このベースフィルムにはポリイミドフ
ィルムやポリエステルフィルムが用いられている。Usually, a coverlay is provided on all but a part of the wiring pattern, and a polyimide film or a polyester film is used as the base film.
（発明が解決しようとする問題点）
このような従来の技術により製造されるフレキシブルプ
リント基板は比較的耐熱性のよいポリイミドフィルムの
場合でも、３００℃程度でフィルムが軟化変形を起し易
く、又、極性基のあることから高周波特性に優れたもの
ではない。ところです７ｏ−ルソルダなど高度の耐熱性
の要求される実装形式のものでは一層の耐熱性が要請さ
れるとともに、無線機器などに於ては高周波特性も要求
されるが、これらを満足させる基板はいまだ製造されて
いない。(Problems to be Solved by the Invention) Even in the case of flexible printed circuit boards manufactured by such conventional techniques, even in the case of polyimide films that have relatively good heat resistance, the films tend to soften and deform at about 300°C. , it does not have excellent high frequency characteristics due to the presence of polar groups. By the way, mounting formats that require a high degree of heat resistance, such as 7o-less solder, require even higher heat resistance, and radio equipment and other devices require high frequency characteristics, but the board that satisfies these requirements is Not manufactured yet.
なお本発明者等の検討によればフッ素樹脂フィルムを用
いれば耐熱性に優れているとともに、高周波特性にも優
れているため優れた基板が期待されるが、これに回路を
直接メッキしても密着が悪欠プリント基板を製造するこ
とはできない。According to studies conducted by the present inventors, using a fluororesin film has excellent heat resistance and high frequency characteristics, so it is expected to produce an excellent board. However, even if a circuit is plated directly on it, It is not possible to manufacture printed circuit boards with poor adhesion.
（問題点を解決するための手段）
本発明は上述のような状況に鑑みてなされたもので、フ
ッ素樹脂フィルムの表面にスパッタ処理を行なった後メ
ッキにより導電層を形成してフレキシブルプリント基板
を製造する方法に存し、その好ましい実施態様は第１の
スパッタ処理に１０″′″３〜１０−６Ｔｏｒｒという
高真空で行ない、 フッ素樹脂表面の単分子Ｃ２Ｆ＋１
＋ Ｃ２’４等の励起ガスを急速に排出させ、しかる
後にフッ素樹脂表面に所定パターンの金属膜が生成した
ら通常の圧力１０−１〜１０１程度まで圧力を増加して
金属膜のスパッタを行なう。モしてつｂで常法によりメ
ツキを行ない、導電性の膜（回路導体）を形成するフレ
キシブルプリント基板の製造方法である。(Means for Solving the Problems) The present invention has been made in view of the above-mentioned situation, and it is possible to form a flexible printed circuit board by sputtering the surface of a fluororesin film and then forming a conductive layer by plating. A preferred embodiment of the manufacturing method is to carry out the first sputtering treatment in a high vacuum of 10''3 to 10-6 Torr, so that the monomolecular C2F+1 on the fluororesin surface is
+ Excited gas such as C2'4 is rapidly discharged, and after a predetermined pattern of metal film is formed on the surface of the fluororesin, the pressure is increased to a normal pressure of about 10-1 to 10-1 to perform sputtering of the metal film. This is a method for manufacturing a flexible printed circuit board in which plating is performed using conventional methods to form a conductive film (circuit conductor).
（作用）
本発明は上記のような構成で従来技術では不可能とされ
ていたフッ素樹脂フィルムへの金属付着をスパッタ法に
よって行ない、これをメッキすることによって導体金属
層の密着力の優れたものを極めて容易に製造し、延いて
はフッ素樹脂の耐熱性や、高周波特性を生かした可撓性
の良いプリント基板を製造するものであり、特に実施態
様として示した方法では最初のスパッタで１０−３〜１
０１Ｔ□ｒｒ の高真空下で行なうことによりフッ素樹
脂表面から生成するＣ２ Ｆ＠ ＋ Ｃ＊ ’４ 等
の励起ガスを急速に排出し、１０−３〜１０−’ Ｔｏ
ｒｒ の高真空下でスパッタすることにより排出し、
円錐状に凸凹が生長するのを適当な大きさに留めるよう
にし、この上（：常法（：よりメッキするものである〇
（実施例）
以下本発明の実施例について述べる。(Function) The present invention uses a sputtering method to attach metal to a fluororesin film, which was considered impossible with the prior art, and plated it to create a conductive metal layer with excellent adhesion. This makes it extremely easy to manufacture printed circuit boards that take advantage of the heat resistance and high-frequency properties of fluororesin, and that makes use of the heat resistance and high frequency characteristics of fluororesin to manufacture highly flexible printed circuit boards. 3-1
By performing this under a high vacuum of 01 T
Discharge by sputtering under high vacuum of rr,
The growth of conical irregularities is kept to an appropriate size, and then plating is performed using the conventional method (Example) Examples of the present invention will be described below.
タテ９０Ｈ１ヨコ９０ＪｌｉＪ厚さ０．５Ｈのテトラフ
ルオロエチレン−へキサフルオロプロピレン共重合体（
デュポン社商品名テフロン）を１５０Ｈφの高周波スパ
ッタ装置に設置し、１０”’ Ｔｏｒｒ まで減圧し
た。Vertical 90H1 Horizontal 90JliJ 0.5H thick tetrafluoroethylene-hexafluoropropylene copolymer (
DuPont (trade name: Teflon) was placed in a 150Hφ high-frequency sputtering device, and the pressure was reduced to 10'' Torr.
減圧後アルゴン（Ａｒ ）ガスを導入し、５×１０″Ｔ
□ｒｒにした。After reducing the pressure, introduce argon (Ar) gas and
□I changed it to rr.
ついで１３．５ ＭＩＨ２の高周波により銅（Ｃｕ）
のスパッタを行った。スパッタ中の圧力は放出ガスに
より１０″″５になる。Then copper (Cu) was
Sputtering was performed. The pressure during sputtering is 10''5 due to the released gas.
この層が５００１形成された後圧力をｓ ｘ ｉｏ′Ｔ
Ｏｒｒ まで増加し、膜を５０００ムまでスパッタを
行ない、次にハンダメッキを行な一１導電層を形成した
。なお本発明の前記実施例に比べ、同じ樹脂を用いた基
板でも、直接５ Ｘ １０＝ Ｔｏｒｒ 程でスパッ
タメッキ（（ｌｊｕ）をして構成したものは。After this layer 5001 is formed, the pressure is s x io′T
The film was sputtered to a thickness of 5,000 μm, and then solder plated to form a conductive layer. It should be noted that, compared to the above embodiments of the present invention, even though the substrate is made of the same resin, it is constructed by directly sputter plating ((lju)) at about 5×10= Torr.
剥離強度が一程度のものである。即ち本発明の実施に際
しては高真空で第１のスパッタを行ない、常真空で第２
のスパッタを行なうことがよ〕好ましいものと云える。It has a peel strength of about 1. That is, when carrying out the present invention, the first sputtering is performed in a high vacuum, and the second sputtering is performed in a normal vacuum.
It can be said that it is preferable to perform sputtering.
又１本発明によ）得られた配線板の耐熱性及び高周波特
性の一例は以下のとおシで優れている。Furthermore, the heat resistance and high frequency characteristics of the wiring board obtained according to the present invention are excellent in the following manner.
（発明の効果）
以上の説明から判るように本発明の方法によれば、耐熱
性及び高周波特性に優れたフッ素樹脂系のフレキシブル
プリント基板を比較的簡単なスパッタ法によって得るこ
とができるので、スパッタ時Ｃ：回路の形状を決定でき
ることとから回路の精度を大きくすることが可能である
〇
なお本発明で用いられるフッ素樹脂フィルムとしては、
四フッ化エチレン樹脂、テトラフルオロエチレン−ヘキ
サフルオロプロピレン、テトラフルオロエチレン−クロ
ロトリフルオロエチレン等の各種のものを適用すること
ができる。(Effects of the Invention) As can be seen from the above explanation, according to the method of the present invention, a fluororesin flexible printed circuit board with excellent heat resistance and high frequency characteristics can be obtained by a relatively simple sputtering method. Time C: Since the shape of the circuit can be determined, it is possible to increase the precision of the circuit. The fluororesin film used in the present invention is as follows:
Various resins such as tetrafluoroethylene resin, tetrafluoroethylene-hexafluoropropylene, and tetrafluoroethylene-chlorotrifluoroethylene can be used.
Claims (2)
つた後メッキにより導電層を形成することを特徴とする
耐熱性フレキシブルプリント基板の製造方法(1) A method for producing a heat-resistant flexible printed circuit board, characterized by forming a conductive layer on the surface of a fluororesin film by sputtering and plating.
のスパッタを行なうことを特徴とする特許請求の範囲第
１項記載の耐熱性フレキシブルプリント基板の製造方法(2) Perform the first sputtering in a high vacuum, and the second sputtering in a normal vacuum.
A method for manufacturing a heat-resistant flexible printed circuit board according to claim 1, characterized in that sputtering is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1641285A JPS61177793A (en) | 1985-02-01 | 1985-02-01 | Manufacture of heatproof flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1641285A JPS61177793A (en) | 1985-02-01 | 1985-02-01 | Manufacture of heatproof flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61177793A true JPS61177793A (en) | 1986-08-09 |
Family
ID=11915523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1641285A Pending JPS61177793A (en) | 1985-02-01 | 1985-02-01 | Manufacture of heatproof flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177793A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63185091A (en) * | 1987-01-28 | 1988-07-30 | 三井金属鉱業株式会社 | Circuit board and manufacture of the same |
| JPH01139531U (en) * | 1988-03-14 | 1989-09-25 |
-
1985
- 1985-02-01 JP JP1641285A patent/JPS61177793A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63185091A (en) * | 1987-01-28 | 1988-07-30 | 三井金属鉱業株式会社 | Circuit board and manufacture of the same |
| JPH01139531U (en) * | 1988-03-14 | 1989-09-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5766740A (en) | Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink | |
| JP4804806B2 (en) | Copper-clad laminate and manufacturing method thereof | |
| JP3447070B2 (en) | Flexible circuit board materials | |
| JPH0298994A (en) | Formation of conductor layer on polyimide insulation layer | |
| JPS61177793A (en) | Manufacture of heatproof flexible printed circuit board | |
| JP3112128B2 (en) | Method for producing metal-coated glass epoxy substrate | |
| JP2004009357A (en) | Metal vapor-deposited/metal plated laminated film and electronic part using the same | |
| JPH04267597A (en) | Manufacture of flexible printed wiring board | |
| US5763060A (en) | Printed wiring board | |
| JPS61177792A (en) | Manufacture of flexible printed circuit board | |
| JPH0243353B2 (en) | ||
| JPH01321687A (en) | Flexible printed wiring board | |
| JPH0644667B2 (en) | Flexible printed circuit board with shield | |
| JP2000101231A (en) | Manufacture of printed wiring board | |
| JPS61182297A (en) | Circuit wiring material and manufacture thereof | |
| JP2018181944A (en) | High-frequency substrate | |
| JPH0653684A (en) | Thin film multilayer wiring board and module using the same | |
| WO2002098193A1 (en) | A method for applying thick copper on substrates | |
| JPH11102937A (en) | Double-side wiring tab tape | |
| JPH0287589A (en) | Manufacture of flexible double-sided printed circuit board | |
| JPS6039883A (en) | Flexible circuit board | |
| JP2536604B2 (en) | Copper / organic insulation film wiring board manufacturing method | |
| JPS62242390A (en) | Manufacture of printed wiring board | |
| JPS61208895A (en) | Manufacture of metal core printed wiring board | |
| JPS6265394A (en) | Flexible circuit board |