JPH0483626U - - Google Patents

Info

Publication number
JPH0483626U
JPH0483626U JP12735090U JP12735090U JPH0483626U JP H0483626 U JPH0483626 U JP H0483626U JP 12735090 U JP12735090 U JP 12735090U JP 12735090 U JP12735090 U JP 12735090U JP H0483626 U JPH0483626 U JP H0483626U
Authority
JP
Japan
Prior art keywords
film
heat
double
resistant
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12735090U
Other languages
Japanese (ja)
Other versions
JPH084285Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990127350U priority Critical patent/JPH084285Y2/en
Publication of JPH0483626U publication Critical patent/JPH0483626U/ja
Application granted granted Critical
Publication of JPH084285Y2 publication Critical patent/JPH084285Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の両面カバーレイフイルムの断
面図、第２図は本考案の両面カバーレイフイルム
を使用して基板を多層化するときの説明図、第３
図は従来のカバーレイフイルムの断面図、第４図
は多層化する基板の断面図、第５図は従来のカバ
ーレイフイルムを使用して基板を多層化するとき
の説明図、第６図はボンデイングシートの断面図
である。 １……カバーレイフイルム、２……耐熱性プラ
スチツクフイルム、３……耐熱性接着剤層、４…
…離型膜、５……樹脂コート、６……基板、７…
…基板本体、８……耐熱性接着剤、９……金属箔
、１０……ボンデイングシート、１１……離型性
フイルム、１２……接着剤、１３……樹脂コート
、１４……離型紙、１５……両面カバーレイフイ
ルム、１６……離型膜。 Fig. 1 is a sectional view of the double-sided cover lay film of the present invention, Fig. 2 is an explanatory diagram of multilayering a board using the double-sided cover lay film of the present invention, and Fig. 3 is a cross-sectional view of the double-sided cover lay film of the present invention.
The figure is a cross-sectional view of a conventional coverlay film, Figure 4 is a cross-sectional view of a substrate to be multilayered, Figure 5 is an explanatory diagram when a conventional coverlay film is used to layer a substrate, and Figure 6 is a cross-sectional view of a substrate to be multilayered. It is a sectional view of a bonding sheet. 1 ...Coverlay film, 2...Heat-resistant plastic film, 3...Heat-resistant adhesive layer, 4...
...Release film, 5...Resin coat, 6 ...Substrate, 7...
... Substrate body, 8 ... Heat-resistant adhesive, 9 ... Metal foil, 10 ... Bonding sheet, 11 ... Release film, 12 ... Adhesive, 13 ... Resin coat, 14 ... Release paper, 15 ...Double-sided cover lay film, 16 ...Release film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 耐熱性プラスチツクフイルムの両面に半硬化状
態の耐熱性接着剤層を有し、各接着剤層に樹脂コ
ートした離型膜が圧着されていることを特徴とす
るプリント回路基板多層化用両面カバーレイフイ
ルム。 A double-sided coverlay for multilayer printed circuit boards, characterized by having heat-resistant adhesive layers in a semi-cured state on both sides of a heat-resistant plastic film, and having a resin-coated release film pressure-bonded to each adhesive layer. film.
JP1990127350U 1990-11-29 1990-11-29 Double-sided coverlay film for multilayering printed circuit boards Expired - Lifetime JPH084285Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990127350U JPH084285Y2 (en) 1990-11-29 1990-11-29 Double-sided coverlay film for multilayering printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990127350U JPH084285Y2 (en) 1990-11-29 1990-11-29 Double-sided coverlay film for multilayering printed circuit boards

Publications (2)

Publication Number Publication Date
JPH0483626U true JPH0483626U (en) 1992-07-21
JPH084285Y2 JPH084285Y2 (en) 1996-02-07

Family

ID=31874849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990127350U Expired - Lifetime JPH084285Y2 (en) 1990-11-29 1990-11-29 Double-sided coverlay film for multilayering printed circuit boards

Country Status (1)

Country Link
JP (1) JPH084285Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4890778B2 (en) * 2005-03-31 2012-03-07 リンテック株式会社 Process film for manufacturing laminated circuit boards

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02202441A (en) * 1989-01-31 1990-08-10 Shin Etsu Chem Co Ltd Cover lay film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02202441A (en) * 1989-01-31 1990-08-10 Shin Etsu Chem Co Ltd Cover lay film

Also Published As

Publication number Publication date
JPH084285Y2 (en) 1996-02-07

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term