JPH0235464U - - Google Patents
Info
- Publication number
- JPH0235464U JPH0235464U JP11484688U JP11484688U JPH0235464U JP H0235464 U JPH0235464 U JP H0235464U JP 11484688 U JP11484688 U JP 11484688U JP 11484688 U JP11484688 U JP 11484688U JP H0235464 U JPH0235464 U JP H0235464U
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- dielectric film
- aluminum plate
- circuit board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
Landscapes
- Laminated Bodies (AREA)
Description
第１図および第２図はいずれも本考案に係る回
路基板の実例を示す断面図である。
１……誘電体板、２……銅箔、３……アルミニ
ウム板、４，５……誘電体フイルム。
FIG. 1 and FIG. 2 are both sectional views showing an example of a circuit board according to the present invention. 1... Dielectric plate, 2... Copper foil, 3... Aluminum plate, 4, 5... Dielectric film.
Claims (1)
板が積層されて成る回路基板であり、前記銅箔ま
たはアルミニウム板の少なくとも一方が誘電体フ
イルムの介在により積層され、更にアルミニウム
板の側面が誘電体フイルムにより被覆せしめられ
て成る回路基板。 This is a circuit board consisting of a dielectric plate with copper foil laminated on one side and an aluminum plate on the other side, and at least one of the copper foil or the aluminum plate is laminated with a dielectric film interposed therebetween, and the side surface of the aluminum plate is laminated with a dielectric film interposed therebetween. A circuit board covered with a dielectric film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11484688U JPH0235464U (en) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11484688U JPH0235464U (en) | 1988-08-30 | 1988-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235464U true JPH0235464U (en) | 1990-03-07 |
Family
ID=31355965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11484688U Pending JPH0235464U (en) | 1988-08-30 | 1988-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235464U (en) |
-
1988
- 1988-08-30 JP JP11484688U patent/JPH0235464U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0235464U (en) | ||
| JPS62140760U (en) | ||
| JPS61145632U (en) | ||
| JPS6262497U (en) | ||
| JPS6153131U (en) | ||
| JPH0341960U (en) | ||
| JPH0264032U (en) | ||
| JPS6212938U (en) | ||
| JPS6344500U (en) | ||
| JPH0310572U (en) | ||
| JPH0193765U (en) | ||
| JPS61192497U (en) | ||
| JPS6098642U (en) | Insulated waterproof panel that can detect pinholes in the waterproof layer | |
| JPS63140696U (en) | ||
| JPS63193875U (en) | ||
| JPS6237956U (en) | ||
| JPH0385642U (en) | ||
| JPS62199980U (en) | ||
| JPH03102754U (en) | ||
| JPS58131076U (en) | Bulletin board sheet | |
| JPH0292968U (en) | ||
| JPS6339537U (en) | ||
| JPH0250914U (en) | ||
| JPS61158025U (en) | ||
| JPH01146573U (en) |