JPS6339537U - - Google Patents
Info
- Publication number
- JPS6339537U JPS6339537U JP13310986U JP13310986U JPS6339537U JP S6339537 U JPS6339537 U JP S6339537U JP 13310986 U JP13310986 U JP 13310986U JP 13310986 U JP13310986 U JP 13310986U JP S6339537 U JPS6339537 U JP S6339537U
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- copper
- resistant film
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第1図は本考案の銅張積層板の断面図である。
符号の説明、1…耐熱性フイルム、2…銅はく
、3…積層板。
FIG. 1 is a sectional view of the copper-clad laminate of the present invention. Explanation of symbols: 1...Heat-resistant film, 2...Copper foil, 3...Laminated board.
Claims (1)
フイルムを貼り合わせた銅張積層板。 A copper-clad laminate with a peelable heat-resistant film laminated on at least one side of the laminate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13310986U JPS6339537U (en) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13310986U JPS6339537U (en) | 1986-08-29 | 1986-08-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6339537U true JPS6339537U (en) | 1988-03-14 |
Family
ID=31033121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13310986U Pending JPS6339537U (en) | 1986-08-29 | 1986-08-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6339537U (en) |
-
1986
- 1986-08-29 JP JP13310986U patent/JPS6339537U/ja active Pending