JPH01225545A - Laminated sheet for electrical application - Google Patents
Laminated sheet for electrical applicationInfo
- Publication number
- JPH01225545A JPH01225545A JP5183888A JP5183888A JPH01225545A JP H01225545 A JPH01225545 A JP H01225545A JP 5183888 A JP5183888 A JP 5183888A JP 5183888 A JP5183888 A JP 5183888A JP H01225545 A JPH01225545 A JP H01225545A
- Authority
- JP
- Japan
- Prior art keywords
- glass powder
- resin
- resin varnish
- particle size
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000002966 varnish Substances 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 2
- 239000002585 base Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 8
- 239000003513 alkali Substances 0.000 abstract description 5
- 238000004062 sedimentation Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000000123 paper Substances 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は′１電気器、計算機器、通信機器等に剛力られ
る電気用積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an electrical laminate that is rigidly applied to electrical appliances, computing equipment, communication equipment, etc.
従来、電気機器、計算機器等に用−られる電気用積層板
は紙、布等の基材に樹脂ワニスを含浸して得る樹脂含浸
基材を所要枚数重ね、その上面及び又は下面に金属箔を
配設した積層体を積層成形してなるものであるが、布基
材積層板に比較し紙基材積層板はパンチング加工性に優
れる反面寸法安定性に劣っていた。Conventionally, electrical laminates used for electrical equipment, computing equipment, etc. are made by piling up the required number of resin-impregnated base materials obtained by impregnating base materials such as paper or cloth with resin varnish, and then covering the upper and/or lower surfaces with metal foil. The paper-based laminate is formed by laminating and molding the arranged laminates, but compared to the cloth-based laminate, the paper-based laminate has excellent punching processability but is inferior in dimensional stability.
従来の技術で述べたように紙基材積層板にあっては寸法
安定性が劣ると論う問題があった。本発明は従来の技術
における上述の問題点に鑑みてなされたもので、その目
的とするところは寸法安定性のより紙基材の電気用積層
板を提供することにある。As described in the prior art section, paper-based laminates have a problem in that they have poor dimensional stability. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a paper-based electrical laminate with improved dimensional stability.
ｃ問題点を解決するための手段〕
本発明は粒径１０ミクロン以下の無アルカリガラス粉末
を５〜フ０ｆｉｋ％含有Ｔる樹＋Ｉｔワニスを紙に含浸
してなる所要枚数の樹脂含浸基材の上面及び父は下面に
金属箔を配設した積層体を積層成形してなることを特徴
とする電気用積層板のため、寸法安定ヰが向上したもの
で、以下不発明の詳細な説明する。Means for Solving Problems] The present invention provides a method for preparing a required number of resin-impregnated base materials made by impregnating paper with a varnish containing 5 to 0 fik% of non-alkali glass powder with a particle size of 10 microns or less. This electrical laminate is characterized in that the upper and lower surfaces are formed by laminating and molding a laminate with metal foil disposed on the lower surface, and thus has improved dimensional stability.The invention will be described in detail below.
本発明に用いる樹脂ワニスとしてはフェノール樹脂、ク
レゾール情脂、エポキシ樹脂、不飽和ボ１１エステル樹
脂、メラミン樹脂、ポリイミド、ポリブタジェン、ポリ
アミド、ポリアミＦイミド、ポリスルフォン、ポリフェ
ニレンサルファイド、ポリフェニレンオキサイド、ポリ
ブチレンテレフタレート、ポリエーテルエーテルケトン
、弗化樹脂、ブチラール樹脂、ゴム等の単独、変性物、
混合物等が周込られ必要に応じて粘度調整に水、メチル
アルコール、アセトン、シクロヘキサノン、スチレン等
の溶媒を添加したもので、粒径１０ミクロン以下の魚ア
ルカリガラス粉末を５〜７０重量係重量子風に憾と記す
）含有することが必要である。The resin varnishes used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamide Fimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, and polybutylene terephthalate. , polyether ether ketone, fluorinated resin, butyral resin, rubber, etc. alone, modified products,
A mixture etc. is mixed in and a solvent such as water, methyl alcohol, acetone, cyclohexanone, styrene is added to adjust the viscosity as necessary, and fish alkali glass powder with a particle size of 10 microns or less is mixed with a weight coefficient of 5 to 70. It is necessary to contain the following:
粒径が１０ミクロンをこえると樹脂ワニス内での沈降性
が大となり、均一分散比が低下し、添加量が５憾未満で
は寸法安定性が低下し、７０φをこえると沈降性が大と
なるからである。なお伴アルカ１１ガラス粉末含有樹脂
ワニスφこよる樹脂含浸基材は槓１ｖＩｉ体の１部でも
よく、全部に用−てもよく任意である。紙としてはクラ
フト紙、リンター紙或はこれらの混紗紙等咎れでもよく
、特に限定するものではない。企酋箔としては銅、アル
ミニウム、鉄、ニラケル、亜鉛等の単独、合金、複合品
であり必要に応じてその異面を化学処理、吻理処塊し、
更に必要に応じて接着面ζこ接４Ｉ剤層を設けておくこ
ともできる。If the particle size exceeds 10 microns, sedimentation in the resin varnish becomes large and the uniform dispersion ratio decreases, if the amount added is less than 5 μm, dimensional stability decreases, and if it exceeds 70φ, sedimentation increases. It is from. The base material impregnated with the resin varnish containing glass powder φ may be used for a part or all of the 1vIi body, and is optional. The paper may be kraft paper, linter paper, or paper mixed with these, and is not particularly limited. The planned foils are single, alloy, and composite products of copper, aluminum, iron, Nilacel, zinc, etc., and if necessary, the different sides are chemically treated, processed into blocks,
Furthermore, a 4I agent layer can be provided on the adhesive surface ζ if necessary.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１乃至３
フェノール１モルに対シ、ホルムアルデヒド１．５モル
ヲ４０係ホルマリンで加え、アルカリ性下、還流温度で
６０分間反応させて得たレゾール視フェノール樹脂１こ
メチルアルコールを加え桝’ＡＨ階ｓ ｏ％のレゾール
型フェノール樹脂ワニスを辱だ。次ｌζ該ワニスに粒径
４〜６ミクロンの無アルカリガラス粉末を実施例１につ
いては！０壬、実施例２につ−ては３５％、実施例３に
つ論ては６０％添加してから厚さ０，２■のクラフト紙
に夫々乾燥後の付４稲が５０％になるように含浸、乾燥
して便脂含？！Ｔｈ基枳を１４、次に該う（脂含浸基材
７枚の上下面に厚さ０．０３５鱈の接着剤層付銅箔を載
置した積層体を成）［多圧力１００Ｋｇ／ｄ 、 １６
０℃で６０分間積層成形して厚さ１．６鰭の両面鋼張積
層板を得た。Examples 1 to 3 Add 1.5 moles of formaldehyde to 1 mole of phenol in 40% formalin, react in alkaline conditions at reflux temperature for 60 minutes, add 1 mass of resol-visible phenolic resin, and add methyl alcohol. It's a disgrace to SO% resol type phenolic resin varnish. Next lζFor Example 1, add alkali-free glass powder with a particle size of 4 to 6 microns to the varnish! After adding 0, 35% for Example 2 and 60% for Example 3, the amount of rice after drying becomes 50% on kraft paper with a thickness of 0.2cm. Does it impregnate, dry and contain stool oil? ! Th base material 14, then applied (forming a laminate in which copper foil with an adhesive layer of 0.035 thickness was placed on the upper and lower surfaces of 7 oil-impregnated base materials) [multiple pressure 100 Kg / d, 16
Lamination molding was carried out at 0° C. for 60 minutes to obtain a double-sided steel-clad laminate having a thickness of 1.6 fins.
比較例
無アルカリガラス粉末を含亘しなＬすＶゾール型フェノ
ール樹脂ワニスを用すた以外は実施例と同様に処理して
厚さ１．６ｆｌの両面鋼張積層板を得た。Comparative Example A double-sided steel-clad laminate with a thickness of 1.6 fl was obtained in the same manner as in the example except that a V-sol type phenolic resin varnish containing no alkali glass powder was used.
実施例１乃至３と比較例の積層板の寸法安定性は第１表
のようである。The dimensional stability of the laminates of Examples 1 to 3 and Comparative Example is shown in Table 1.
本発明は上述した如く構成されて（八る。特許請求の範
囲第１項に記載した構成を有する片面金属張積湘板にお
いては、インク密着性が大巾に向上する効果を有して因
る。The present invention is constructed as described above, and the single-sided metal-clad laminated board having the construction described in claim 1 has the effect of greatly improving ink adhesion.
ｆ！Ｐ！ｆ許出願人 検出願人株式会社 代理人弁理士 竹元敏丸（ほか２名）f! P! f permit applicant Senkenjin Co., Ltd. Representative Patent Attorney Toshimaru Takemoto (and 2 others)
Claims (1)
５〜７０重量％含有する樹脂ワニスを紙に含浸してなる
所要枚数の樹脂含浸基材の上面及び又は下面に金属箔を
配設した積層体を積層成形してなることを特徴とする電
気用積層板。(1) Laminate with metal foil arranged on the upper and/or lower surfaces of the required number of resin-impregnated bases made by impregnating paper with a resin varnish containing 5 to 70% by weight of alkali-free glass powder with a particle size of 10 microns or less An electrical laminate board characterized by having a body formed by lamination molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5183888A JPH01225545A (en) | 1988-03-04 | 1988-03-04 | Laminated sheet for electrical application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5183888A JPH01225545A (en) | 1988-03-04 | 1988-03-04 | Laminated sheet for electrical application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01225545A true JPH01225545A (en) | 1989-09-08 |
Family
ID=12898003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5183888A Pending JPH01225545A (en) | 1988-03-04 | 1988-03-04 | Laminated sheet for electrical application |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01225545A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
-
1988
- 1988-03-04 JP JP5183888A patent/JPH01225545A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
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