JPS62187035A - Manufacture of ceramic-coated lamianted board - Google Patents
Manufacture of ceramic-coated lamianted boardInfo
- Publication number
- JPS62187035A JPS62187035A JP61028695A JP2869586A JPS62187035A JP S62187035 A JPS62187035 A JP S62187035A JP 61028695 A JP61028695 A JP 61028695A JP 2869586 A JP2869586 A JP 2869586A JP S62187035 A JPS62187035 A JP S62187035A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- copper foil
- manufacturing
- resin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 20
- 229910000831 Steel Inorganic materials 0.000 description 14
- 239000011888 foil Substances 0.000 description 14
- 239000010959 steel Substances 0.000 description 14
- 239000011162 core material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- -1 ether ketone Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000855 fermentation Methods 0.000 description 1
- 230000004151 fermentation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は熱伝導性、耐熱性にすぐｒＬるプリント配線板
用の積層板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a laminate for printed wiring boards that has excellent thermal conductivity and heat resistance.
（従来の技術）
従来、プリント配線板としてはフェノール樹脂積層板、
エポキシ樹脂積層板が多く用いらｒｋ。(Conventional technology) Conventionally, phenolic resin laminates,
Epoxy resin laminates are often used.
できた。しかし、最近、電子機器の高性能化。did it. However, recently, electronic devices have become more sophisticated.
小型化に伴い、高密度実装化か望まｆＬ、そｊＬによっ
て生ずる熱の高密度発生をいかに処理するかということ
が問題になってきた。With miniaturization, it has become a problem how to deal with the high density generation of heat caused by high density packaging.
これに対し、従来の有機質系基板は熱伝導性が悪いため
熱放散性に欠ける。また耐熱性に乏しいなどのために高
密度実装化は困難であった。In contrast, conventional organic substrates lack heat dissipation properties due to poor thermal conductivity. In addition, high-density packaging has been difficult due to poor heat resistance.
そのため、熱伝導性にすぐｒした基鈑としてアルミナな
どのセラミック基板、あるいは金Ａ４＆を８拐としてそ
の表面ｔ−ｉｅ縁被ａｔ−で覆ったメタルコア基板など
が注目さｎている。また、耐熱性の点からも従来のフェ
ノール樹脂、エポキシ樹脂系基板に代わり、ポリイミド
樹脂あるいはポリエーテルエーテルケトン、ポリナル７
オンなどの耐熱性熱可塑性樹脂を用いた基板の開発も行
われている。For this reason, ceramic substrates such as alumina, or metal core substrates made of A4 gold and covered with a T-IE edge coating, etc., are attracting attention as substrates with excellent thermal conductivity. In addition, from the viewpoint of heat resistance, polyimide resin, polyether ether ketone, Polynal 7
Substrates using heat-resistant thermoplastic resins such as ON are also being developed.
（発明が解決しようとする間踊点）
しかし、こｒしらの基板についてみると種々の問題点が
ある。すなわち、アルミナ、炭化ケイ素などのセラミッ
ク基板は熱伝導性、耐熱性にすぐｎているか、製造工程
かａ雑で、加工性が悪い、機械的強度が低い、基板の大
きさに制限があり、大型の基板が得らｎないなどの欠点
かある。また、金属板を芯材としたメタルコア基鈑は回
路となる導体部と接しているのは熱伝導率の低い樹脂か
らなる絶縁層であるために金属芯の高熱伝導性を十分に
活かしきγ（ず、熱放散性は十分ではない。また芯材か
金属板であるのでスルーホールの形成が容易ではなく、
非常に権雑な製造工程を必要とする。(Intermediate Points to be Solved by the Invention) However, when looking at these substrates, there are various problems. In other words, ceramic substrates made of alumina, silicon carbide, etc. have poor thermal conductivity and heat resistance, have a sloppy manufacturing process, have poor workability, have low mechanical strength, and are limited in substrate size. There are drawbacks such as the inability to obtain a large substrate. In addition, the metal core substrate with a metal plate as the core material has an insulating layer made of resin with low thermal conductivity that is in contact with the conductor part that forms the circuit, so the high thermal conductivity of the metal core can be fully utilized. (First, heat dissipation is not sufficient.Also, since it is a core material or a metal plate, it is not easy to form through holes.
It requires a very complicated manufacturing process.
さら忙耐熱性樹脂基板は耐熱性は向上しているものの、
樹脂の熱伝導率が低いために熱放散効果は望めない。Although the heat resistance of heat-resistant resin substrates has improved,
Since the thermal conductivity of the resin is low, no heat dissipation effect can be expected.
本発明はこハらの欠点を改良し、従来の有機質系基板と
同様な製造、加工方法が可能で、しかも熱伝導性、耐熱
性にすぐｒした基板を安価に得る製造法を提供するもの
である。The present invention improves these drawbacks and provides a manufacturing method for producing a substrate that can be manufactured and processed in the same manner as conventional organic substrates and has excellent thermal conductivity and heat resistance at a low cost. It is.
（問題点を解決するための手段）
すなわち本発明は、圧延鋼箔の片面に′電気絶縁性のセ
ラミックを両前」してセラミックＲｊを形成し、そのセ
ラミック層側にプリプレグ’！ｋ ＩＡ／１して熱圧成
形して一体化し、鋼箔と有機質基板の間にセラミック層
を設けることを特徴とするものである。(Means for Solving the Problems) That is, the present invention forms a ceramic Rj on one side of a rolled steel foil by coating an electrically insulating ceramic on both sides, and prepregs on the ceramic layer side! k IA/1 and heat-press molded to integrate, and a ceramic layer is provided between the steel foil and the organic substrate.
銅箔として圧延鋼箔を用いるのはコストとセラミック溶
射層との密層性のためである。一般にプリント配線板の
回路を形成する之めの銅２６には圧延鋼箔と電解銅ｗ３
かある。電専銅箔は、製造時にすて和片面は酸化、ＰＡ
面化さｎており、さらに樹脂との密層性を向上させるた
めに電層により粗面化処理か施さｎる。圧延銅箔は電解
鋼箔に比べるともともとは安価であるが樹脂との＠層性
を向上させるためＫは融化、粗開化処理か必要である。The reason why rolled steel foil is used as the copper foil is because of the cost and the closeness of the ceramic sprayed layer. Generally, the copper 26 that forms the circuit of a printed wiring board is made of rolled steel foil and electrolytic copper w3.
There is. Densen copper foil is discarded during manufacturing, and one side is oxidized and PA
It is surface-roughened, and is further subjected to surface roughening treatment using an electric layer in order to improve the layering properties with the resin. Rolled copper foil is originally cheaper than electrolytic steel foil, but in order to improve layerability with resin, K needs to be melted or roughened.
本発明で用いるのは酸化、粗面化処理を行っていない生
の圧延鋼箔である。The raw rolled steel foil used in the present invention is not subjected to oxidation or roughening treatment.
これは次の理由によるものである。本発明においては銅
箔表面にセラミックを溶射してセラミック＃を設けるわ
けであるが、そのときの密着性は酸化処理さｎた銅箔よ
ジ純粋な鋼箔の方が良好である。このことがら鋼箔とし
て生の圧延鋼箔を用いるのか密層性も良好でさらにコス
ト的にも有利である。なお、セラミックを溶射するに際
しては一般の溶射で行われるように密層力を高めるため
に銅箔の溶射面にプラスト処理が施される。This is due to the following reason. In the present invention, a ceramic # is provided by thermal spraying a ceramic onto the surface of a copper foil, and the adhesion at this time is better with a pure steel foil than with an oxidized copper foil. For this reason, using raw rolled steel foil as the steel foil has good layer density and is also advantageous in terms of cost. When thermally spraying ceramic, the sprayed surface of the copper foil is subjected to a blast treatment in order to increase the layer strength, as is done in general thermal spraying.
セラミックとしてはセラミック基板として最も多く用い
らｒしているアルミナが好適であるか。Is alumina, which is the most commonly used ceramic substrate, suitable as a ceramic?
その他にスピネル、ムライト、ベリリア、炭化ケイ素、
窒化アルミニウムなどの高熱伝導性で電気絶縁性のセラ
ミックを用いることができる。In addition, spinel, mullite, beryllia, silicon carbide,
A highly thermally conductive, electrically insulating ceramic such as aluminum nitride can be used.
ざらにプリプレグについて述べると、樹脂としては電気
特性、成形加工性の点からエポキシ樹脂、ポリイミド樹
脂が好適であるが、その個にフェノール樹脂、不飽和ポ
リエステル樹脂。To briefly discuss prepregs, epoxy resins and polyimide resins are preferred from the standpoint of electrical properties and moldability, but phenolic resins and unsaturated polyester resins are also preferred.
メラミン４＋１脂、ビニルエステル値（Ｊ指などの熱硬
化性樹脂、あるいはポリサル７オン、ポリチーチルエー
テルケトン、ｙｊ？ＩＪエーテルサルフオン。Melamine 4+1 fat, vinyl ester value (thermosetting resin such as J finger, or polysal 7one, polythiyl ether ketone, yj?IJ ethersulfon).
ポリエーテルイミドなどの熱可塑性樹脂を用いることが
できる。また繊維としては一般に用いらｎるガラス繊維
の他に、ケプラー繊維１紙、ＳｉＣＭｔｍ、シリカ繊維
などを用いることができる。Thermoplastic resins such as polyetherimide can be used. Further, as the fiber, in addition to the commonly used glass fiber, Kepler fiber paper, SiCMtm, silica fiber, etc. can be used.
セラミックのｍ刑法としてはプラズマ両射法、ガス溶射
法、水プラズマｍ側法などの各ａｌｌ浴法法適用できる
。All bath methods such as plasma spraying, gas spraying, and water plasma m-side methods can be applied to ceramics.
さらにセラミック層を溶射した鋼箔は有機質基板の両面
に用いても１片面に用いてもさしつかえない。Further, the steel foil sprayed with a ceramic layer may be used on both sides or one side of the organic substrate.
（作用）
本発明の方法により得らｒＬる積層板を工有機貴基板の
表面に熱伝導性の良好なセラミック層を有するために熱
放散性にすぐｒＬる。また、１ｇｌ路の形成は表面の鋼
箔にレジスト層を形成してエツチング処理を行うことに
より容易に形成することができ、スルーホールの形成も
便米の有慎質、４板と同様の方法で行うことかでさる。(Function) The laminate obtained by the method of the present invention has excellent heat dissipation properties because it has a ceramic layer with good thermal conductivity on the surface of the noble substrate. In addition, the 1gl path can be easily formed by forming a resist layer on the surface steel foil and performing an etching process, and the through hole can also be formed using the same method as the 4th plate. It depends on what you do.
ざらに醸化処理していない銅箔にセラミックを溶射する
ために銅箔とセラミック層の＠層性も良好である。’！
７ｔ、 −ｆｆに無機質であるセラミックと有機償であ
るプラスチックは親和性が乏しいため十分なりｉａが得
らｎないといわｊしているが１本発明のようにセラミッ
クの浴刺ノーに１リプレグを載置して熱圧酸形すると、
両側＃は粗面であり気孔も存在するために＃ｊ１１．低
粘度化したｉＭ！４脂がその間隙に浸透して接右面槓が
増大する。そのために十分な密着性力ｌ得らｒＬる。ま
た、セラミック溶射層の気孔も樹脂により封孔さｒＬる
という長所もある。Since ceramic is thermally sprayed onto copper foil that has not been subjected to rough fermentation treatment, the layering properties between the copper foil and the ceramic layer are also good. '!
It is said that it is not possible to obtain sufficient ia because of the poor affinity between ceramic, which is an inorganic substance, and plastic, which is an organic compound, for 7t, -ff. When placed in hot pressure acid form,
Both sides # are rough and have pores, so #j11. iM with lower viscosity! 4 fat permeates into the gap and increases the contact surface. For this purpose, sufficient adhesion force is obtained. Another advantage is that the pores in the ceramic sprayed layer can be sealed by the resin.
以下、実施例全挙げて本発明をさらに詳細に説明する。Hereinafter, the present invention will be explained in further detail with reference to all Examples.
（実２０例）
＠１図（工銅箔へのセラミック溶射工程の模式図、第２
図をエセラミック＃ｊ創銅箔とプリプレグの積層＃４成
図である。(20 actual examples) @Figure 1 (Schematic diagram of ceramic spraying process on engineered copper foil, 2nd
The figure is a diagram of lamination #4 of Eceramic #j created copper foil and prepreg.
表面を酸化、粗面化処理していない圧延＠箔（厚さ５５
μ）の片ｒｊｆＪをプラスト処理後、第１図に示す方法
によりプラズマ溶射法によってブラスト処理面にアルミ
ナを約１００μの厚さに溶射して１片面にアルミナ層を
設けた銅箔を得た。Rolled @ foil (thickness: 55 mm) without surface oxidation or roughening treatment
After the pieces rjfJ of μ) were blast-treated, alumina was sprayed on the blast-treated surface to a thickness of about 100 μm by plasma spraying according to the method shown in FIG. 1 to obtain a copper foil having an alumina layer on one side.
この鋼箔とカラスクロス／エポキシ位４月百含浸プリプ
レグ８を第２図の積／＊構成に積み重ね。This steel foil and crow cloth/epoxy impregnated prepreg 8 were stacked in the product/* configuration shown in Figure 2.
島田成形してａ層ａｔ得た。Shimada molding was performed to obtain the a-layer at.
この積層板はカラス繊維基材エポキシ樹脂の表面にアル
ミナ層を有し−さらにその上に銅糸屑を有するものであ
り、鋼箔とセラミック間。This laminate has an alumina layer on the surface of the glass fiber-based epoxy resin and further has copper thread scraps on top of it, and is between the steel foil and the ceramic.
およびセラミックとエポキシ樹ハ旨山】の密着性を１良
好であり、一般のガラス繊維基材エポキシ樹脂銅張積層
板と同様の方法でエツチングによる回路形成、スルーホ
ールの形成が可能であった。The adhesion between the ceramic and the epoxy resin was excellent, and it was possible to form circuits and through-holes by etching in the same manner as general glass fiber-based epoxy resin copper-clad laminates.
また１回路に接して熱伝導性のよいアルミナ層があるた
め、熱放散性にすぐｒＬ、 Ｌかも耐熱性もよく、さ
らに耐アーク性、耐トラツキング性も良好なものであっ
た。In addition, since there was an alumina layer with good thermal conductivity in contact with one circuit, the heat dissipation properties were excellent, and the heat resistance was also good, and the arc resistance and tracking resistance were also good.
（発明の効果）
本発明によｎば高熱伝導性、高耐熱性に優ｉＬ九積＃板
を容易にしかも安価に製造することかできる。また本発
明によシ得らｒＬる積層板を工時性的にもすぐｎたもの
で１回路形成、スルーホールの形成などの後加工も従来
の有機質基鈑と同様の方法で行うことができ、従来のセ
ラミック基板、メタルコア基板の問題点を解決し得るも
のである。(Effects of the Invention) According to the present invention, it is possible to easily and inexpensively produce an iL nine-laminated #board with excellent high thermal conductivity and high heat resistance. In addition, the laminate obtained by the present invention is easy to manufacture, and post-processing such as forming one circuit and forming through holes can be performed in the same manner as with conventional organic substrates. This can solve the problems of conventional ceramic substrates and metal core substrates.
第１図ヲ：１本発明の実施例の銅箔へのアルミナ溶射の
模式図、第２□□□はアルミナ溶射鋼箔とプリプレグの
積層構成図である。
符号の説明
１ プラズマ溶射ガン ２ セラミック粉末供給口５
プラズマ炎 ４ セラミック＃刺層５ 圧延銅
箔 ６ 銅箔送りロール７ 銅箔巻取りロール
８ プリプレグ代理人弁理士 黄 瀬 章：、。
゛“・＼Figure 1:1 is a schematic diagram of alumina spraying on copper foil according to an embodiment of the present invention, and Figure 2 is a laminated configuration diagram of alumina sprayed steel foil and prepreg. Explanation of symbols 1 Plasma spray gun 2 Ceramic powder supply port 5
Plasma flame 4 Ceramic #thin layer 5 Rolled copper foil 6 Copper foil feed roll 7 Copper foil winding roll 8 Prepreg representative patent attorney Akira Kise:.゛“・＼
Claims (1)
形成し、該銅箔のセラミック溶射層側に所定数のプリプ
レグを積層熱圧成形することを特徴とする積層板の製造
方法。 ２、セラミック溶射に用いるセラミックがアルミナを主
成分とするものである特許請求の範囲第１項記載の積層
板の製造方法。 ３、プリプレグの樹脂がエポキシ樹脂またはポリイミド
樹脂である特許請求の範囲第１項記載の積層板の製造方
法。 ４、プリプレグの繊維がガラス繊維である特許請求の範
囲第１項記載の積層板の製造方法。[Claims] 1. A lamination characterized by forming an electrically insulating ceramic sprayed layer on one side of a rolled copper foil, and laminating and hot-pressing a predetermined number of prepregs on the ceramic sprayed layer side of the copper foil. Method of manufacturing the board. 2. The method for manufacturing a laminate according to claim 1, wherein the ceramic used for ceramic spraying has alumina as a main component. 3. The method for manufacturing a laminate according to claim 1, wherein the resin of the prepreg is an epoxy resin or a polyimide resin. 4. The method for manufacturing a laminate according to claim 1, wherein the fibers of the prepreg are glass fibers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61028695A JPS62187035A (en) | 1986-02-12 | 1986-02-12 | Manufacture of ceramic-coated lamianted board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61028695A JPS62187035A (en) | 1986-02-12 | 1986-02-12 | Manufacture of ceramic-coated lamianted board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62187035A true JPS62187035A (en) | 1987-08-15 |
Family
ID=12255612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61028695A Pending JPS62187035A (en) | 1986-02-12 | 1986-02-12 | Manufacture of ceramic-coated lamianted board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62187035A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2713984A1 (en) * | 1993-12-22 | 1995-06-23 | Mtu Muenchen Gmbh | Part in a fiber-reinforced composite material, comprising a layer of protection against erosion. |
| EP0681322A3 (en) * | 1988-04-25 | 1998-01-21 | Kabushiki Kaisha Toshiba | Bonded ceramic metal composite substrates and circuit boards constructed therewith |
| WO1998007188A1 (en) * | 1996-08-08 | 1998-02-19 | Siemens Aktiengesellschaft | Wafer frame |
-
1986
- 1986-02-12 JP JP61028695A patent/JPS62187035A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0681322A3 (en) * | 1988-04-25 | 1998-01-21 | Kabushiki Kaisha Toshiba | Bonded ceramic metal composite substrates and circuit boards constructed therewith |
| FR2713984A1 (en) * | 1993-12-22 | 1995-06-23 | Mtu Muenchen Gmbh | Part in a fiber-reinforced composite material, comprising a layer of protection against erosion. |
| WO1998007188A1 (en) * | 1996-08-08 | 1998-02-19 | Siemens Aktiengesellschaft | Wafer frame |
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