JPH066035A - Manufacturing method of multilayer printed wiring board - Google Patents

Abstract

PURPOSE:To manufacture a multilayer printed wiring board having enhanced bond properties of inner layer onto an additive polyimide base resin. CONSTITUTION:Within this multilayer printed wiring board comprising specific numbers of inner layers whose upper and lower layer surfaces are bonded onto an outer layer through the intermediary of an additive polyimide base resin layer are integrally arranged with the outer layer, the circuit surface of the inner layers, after finishing the etching step, is oxidized and reduced and then processed with a coupling agent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board used in electronic equipment and the like.

[0002]

2. Description of the Related Art A conventional multilayer printed wiring board is obtained by laminating and molding a resin layer between inner layer materials and / or between an inner layer material and an outer layer material. In this case, there is a problem that the adhesive strength between the inner layer material and the resin layer is weak.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a multilayer printed wiring board having improved adhesion between the inner layer material and the additional polyimide resin. It is to provide a manufacturing method capable of manufacturing.

[0004]

DISCLOSURE OF THE INVENTION The present invention provides a method for manufacturing a multilayer printed wiring board in which an outer layer material is integrally formed on the upper surface and / or the lower surface of a predetermined number of inner layer materials via an addition type polyimide resin layer. The inner layer material is a method for producing a multilayer printed wiring board, characterized in that the circuit surface after etching is subjected to oxidation treatment, then reduction treatment, and then coupling agent treatment, and the present invention is described in detail below. To do.

The inner layer material used in the present invention is a material in which a circuit is formed by etching a metal-clad laminate on one side or both sides, and the circuit surface after etching is oxidized by black copper oxide treatment or the like. Next, the oxide layer on the circuit surface is subjected to reduction treatment with a substance having a reducing property such as aminoborane and then treated with a coupling agent such as a silane coupling agent.

The coupling agent treatment is a treatment in which the inner layer material is immersed in the coupling agent solution and then heated to a required temperature, and the heating temperature is selected depending on the type of the coupling agent used.

Further, in the present invention, the required number of inner layer materials is used according to the number of layers of the circuit. The addition-type polyimide resin layer disposed on the surface of the inner layer material may be a modified version of the addition-type polyimide. This resin layer is formed by a method such as application of a liquid resin, placement of a film or sheet resin, or a method of using a resin-impregnated base material, and these methods can be used in combination. Examples of the resin-impregnated base material include woven fabrics, non-woven fabrics, mats or a combination base material of inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyvinyl alcohol and acrylic, and natural fibers such as cotton. There is.

As the outer layer material of the present invention, it is possible to use a single-sided metal-clad laminate, a laminate in which a circuit is formed only on one side of a double-sided metal-clad laminate, and the like. Examples of the metal disposed on the laminated plate include metals such as copper, aluminum, brass, nickel, and iron. When the metal foil of these metals is disposed on the laminated plate, the outer layer material of the present invention can be easily formed. Obtainable.

[0009]

EXAMPLES The present invention will be described below with reference to examples. Needless to say, the present invention is not limited to the following examples.

Example 1 A circuit was formed on both sides of a double-sided copper clad laminate having a thickness of 1 mm by etching, then black oxidation treatment was performed, then aminoborane reduction treatment was performed, and 0.5 wt% acetic acid aqueous solution was further added. And epoxy silane coupling agent (KBM-403 manufactured by Shin-Etsu Silicone Co., Ltd.) in a concentration of 1
After dipping for 60 seconds in a solution that has been dissolved to a weight percentage, 1
The inner layer material was heated at 10 ° C. for 30 minutes. Next, the upper and lower surfaces of the inner layer material are each provided with two glass cloths impregnated with a 0.1 mm-thick addition type polyimide resin and dried, and 0.035 mm-thick copper foil is further provided on the outermost side thereof. Then, the laminated body thus obtained is molded at a molding pressure of 40 kgf / cm ² ,
Lamination molding was performed for 120 minutes at 180 ° C. to obtain a multilayer printed wiring board having four layers. In order to examine the adhesiveness between the inner layer material and the additional type polyimide resin in this wiring board, the inner layer adhesive strength was measured. The results are shown in Table 1 below.

(Example 2) In the same manner as in Example 1, circuits were formed on both surfaces of a double-sided copper-clad laminate having a thickness of 1 mm by etching, followed by black oxidation treatment and then aminoborane reduction treatment. . Then, after dipping for 60 seconds in a solution prepared by dissolving an aminosilane coupling agent (KBM-603 manufactured by Shin-Etsu Silicone Co., Ltd.) in a 0.5% by weight acetic acid aqueous solution to a concentration of 1% by weight, heating at 110 ° C. for 30 minutes. Used as the inner layer material. A four-layer multilayer printed wiring board was obtained in the same manner as in Example 1 except that this inner layer material was used. In order to examine the adhesiveness between the inner layer material and the additional type polyimide resin in this wiring board, the inner layer adhesive strength was measured. The results are shown in Table 1 below.

(Comparative Example) In the same manner as in Example 1, the thickness 1
After forming circuits by etching on both sides of a double-sided copper clad laminate having a size of 2 mm, black oxidation treatment was performed, and then aminoborane reduction treatment was performed. And, in this state,
The subsequent steps were performed in the same manner as in Example 1, except that the inner layer material was used immediately without the coupling agent treatment.
A multilayer printed wiring board of layers was obtained. In this wiring board,
In order to investigate the adhesiveness between the inner layer material and the additional polyimide resin, the inner layer adhesive strength was measured. The results are shown in Table 1 below.
Shown in.

[0013]

[Table 1]

From the above results, the adhesiveness between the inner layer material and the additional-type polyimide resin in the multilayer wiring board manufactured by the present invention is determined by the inner layer material and the additional-type polyimide resin in the conventional multilayer wiring board. It was confirmed that the adhesiveness was improved.

[0015]

According to the manufacturing method of the present invention, as clearly shown in Table 1, a multilayer wiring board having a high inner layer adhesive strength, that is, an improved adhesiveness between the inner layer material and the additional type polyimide resin is obtained. It is possible to manufacture, and thus the present invention is useful for manufacturing a multilayer wiring board having excellent performance.

Claims (1)

[Claims] 1. In a method for producing a multilayer printed wiring board in which an outer layer material is integrally arranged on the upper surface and / or the lower surface of a predetermined number of inner layer materials via an addition-type polyimide resin layer, the inner layer material is A method for producing a multilayer printed wiring board, characterized in that the circuit surface is subjected to an oxidation treatment, then a reduction treatment, and then a coupling agent treatment.