JPH03241785A - Lamination board for printed circuit - Google Patents
Lamination board for printed circuitInfo
- Publication number
- JPH03241785A JPH03241785A JP3811090A JP3811090A JPH03241785A JP H03241785 A JPH03241785 A JP H03241785A JP 3811090 A JP3811090 A JP 3811090A JP 3811090 A JP3811090 A JP 3811090A JP H03241785 A JPH03241785 A JP H03241785A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- obtaining
- resin
- board
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003475 lamination Methods 0.000 title abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 239000004744 fabric Substances 0.000 claims abstract description 11
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 9
- 239000002131 composite material Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 6
- 239000002966 varnish Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 3
- 239000002344 surface layer Substances 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 101100257134 Caenorhabditis elegans sma-4 gene Proteins 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 150000001916 cyano esters Chemical class 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- 235000002566 Capsicum Nutrition 0.000 description 1
- 239000006002 Pepper Substances 0.000 description 1
- 235000016761 Piper aduncum Nutrition 0.000 description 1
- 235000017804 Piper guineense Nutrition 0.000 description 1
- 244000203593 Piper nigrum Species 0.000 description 1
- 235000008184 Piper nigrum Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、耐熱性、打抜加工性に優れ、ＣＯＢ （Ｃｈ
ｉｐ ｏｎ Ｂｏａｒｄ ）実装が可能で、軽量、低コ
ストなプリント回路用積層板に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention has excellent heat resistance and punching workability, and the COB (Ch
IP on Board) This invention relates to a lightweight, low-cost printed circuit laminate that can be mounted.
（従来の技術）
コンピュータ、工業計測機器等の産業用機器は、小形化
、軽量化の傾向が進み、それらに使用される回路基板も
ＣＯＢ等高密度実装がなされ、従来のＡ Ｎ Ｓ Ｉ
（Ａｎｅｒｉｃａｎ Ｎａｔｉｏｎａｌ ５ｔａｎｄａ
ｒｄｓ Ｉｎ５ｔｉｔｕｔｅ）規格Ｇ−１０，（一般用
）、ＰＲ−４（耐燃用〉より耐熱性が高く、しかもボン
ディング性の良いものが必要となってきた。 それに応
えるため、Ｇ−１１（耐熱性）、ＦＲ−５（耐熱耐燃用
）グレードのプリン・ト回路用積層板の需要は年々増加
傾向にある。(Prior art) Industrial equipment such as computers and industrial measuring instruments are becoming smaller and lighter, and the circuit boards used for them are also being mounted with high density such as COB, and the conventional A N S I
(Anerican National 5tanda
There is a need for a product that has higher heat resistance and better bonding properties than G-10 (general use) and PR-4 (flame resistance), and has good bonding properties. The demand for FR-5 (heat-resistant and flame-resistant) grade printed circuit laminates is increasing year by year.
（発明が解決しようとする課題）
しかし、Ｇ−１１、ＰＲ−５グレードの積層用樹脂は、
ポリイミド系樹脂より安価であるものの、Ｇ−１０，Ｐ
Ｒ−４用樹脂に比べて高価である。(Problem to be solved by the invention) However, G-11 and PR-5 grade laminating resins
Although it is cheaper than polyimide resin, G-10,P
It is more expensive than resin for R-4.
一方、Ｆ ＩＮ −／１に単する特性を有し、コストパ
フォーマンスに優れた基板として、コンポジット積層板
であるＯＥＭ−１＜ガラス補強紙・エポキシ〉、ＣＥＭ
−３（ガラス補強ガラスペーパー・エポキシ）グレード
が存在するが、これをさらに高耐熱化する試みはほとん
どなされていないのが実情である。On the other hand, OEM-1 (glass reinforced paper/epoxy), which is a composite laminate, and CEM
-3 (glass reinforced glass paper epoxy) grade exists, but the reality is that almost no attempts have been made to make it even more heat resistant.
本発明は、上記の事情に鑑みてなされたもので、耐熱性
、ボンディング性、打抜加工性に優れ、ＣＯＢ実装等の
高密度実装が可能で、軽量、低コストなプリント回路用
積層板を提供することを目的としている。The present invention was made in view of the above circumstances, and provides a lightweight, low-cost printed circuit laminate that has excellent heat resistance, bonding performance, and punching workability, allows high-density mounting such as COB mounting, and is lightweight and low-cost. is intended to provide.
［発明の構成］
（課題を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結果、コンポジット基板の表面ガラスクロス層に高
耐熱性樹脂を用いることによって、耐熱性に優れ、従来
のコンポジット基板の特性・特徴を有する積層板が得ら
れ、上記目的が達成されることを見いだし、本発明を完
成させたものである。[Structure of the Invention] (Means for Solving the Problems) As a result of extensive research in an attempt to achieve the above object, the present inventors have discovered that by using a highly heat-resistant resin for the surface glass cloth layer of a composite substrate. The inventors have now completed the present invention by discovering that a laminate having excellent heat resistance and having the characteristics and features of conventional composite substrates can be obtained, thereby achieving the above object.
すなわち、本発明は、
不織布に熱硬化性樹脂を含浸・乾燥したプリプレグ（Ｉ
）の両面に、ガラスクロスに高耐熱性樹脂を含浸・乾燥
したプリプレグ（Ｉｔ）を重ね合わせ、加熱・加圧一体
に成形してなることを特徴とするプリント回路用積層板
である。That is, the present invention provides prepreg (I
This is a laminate for printed circuits, characterized in that prepreg (It), which is made by impregnating glass cloth with a highly heat-resistant resin and drying it, is superimposed on both sides of the laminate (It), and integrally molded by heating and pressing.
本発明に用いる不織布としては、セルロース系ペーパー
、ガラスペーパー、ガラスマット、合成樹脂系ペーパー
、合成樹脂系不織布等が挙げられ、積層用のものであれ
ばすべての不織布を使用することができる。 これらの
不織布は単独又は２種以上使用することもできる。 ま
た厚さについては、目的・用途に応じて適宜選択して使
用することができる。Examples of the nonwoven fabric used in the present invention include cellulose paper, glass paper, glass mat, synthetic resin paper, and synthetic resin nonwoven fabric, and any nonwoven fabric can be used as long as it is for lamination. These nonwoven fabrics can be used alone or in combination of two or more. Further, the thickness can be appropriately selected and used depending on the purpose and use.
本発明で不織布に含浸する熱硬化性樹脂としては、フェ
ノール樹脂、エポキシ樹脂、ポリエステル樹脂、高耐熱
エポキシ樹脂、シアノエステル樹脂、ポリイミド樹脂、
又はこれらの変性樹脂等が挙げられ、これらは単独又は
２種以上混合して使用することかできる。 これらの中
でもエポキシ樹脂を使用するのが最も有効である。The thermosetting resin to be impregnated into the nonwoven fabric in the present invention includes phenol resin, epoxy resin, polyester resin, high heat resistant epoxy resin, cyanoester resin, polyimide resin,
or modified resins thereof, which may be used alone or in combination of two or more. Among these, it is most effective to use epoxy resin.
本発明に用いるガラスクロスとしては、通常積層板用と
して使用できるものであれば広く使用でき、特に限定さ
れるものではない。The glass cloth used in the present invention is not particularly limited and can be used in a wide variety of ways as long as it can be used for ordinary laminates.
本発明ガラスクロスを含浸する高耐熱性樹脂としては、
高耐熱エポキシ樹脂、ポリイミド樹脂、シアノエステル
系樹脂又はこれらの変性樹脂が挙げられ、これらは単独
又は２種以上混合して使用することができる。 高耐熱
性樹脂は、不織布に含浸された熱硬化性樹脂と同一のも
のでもよい。The highly heat-resistant resin impregnated with the glass cloth of the present invention includes:
Examples include highly heat-resistant epoxy resins, polyimide resins, cyanoester resins, and modified resins thereof, and these may be used alone or in combination of two or more. The highly heat-resistant resin may be the same as the thermosetting resin impregnated into the nonwoven fabric.
本発明に用いる熱硬化性樹脂又は高耐熱性樹脂の中に、
本発明の目的に反しない限度において無機質充填剤を分
散して使用することもできる。Among the thermosetting resins or highly heat-resistant resins used in the present invention,
An inorganic filler may also be used in a dispersed manner within the scope of the purpose of the present invention.
本発明の積層板を製造する一般的な方法は、熱硬化性樹
脂を溶剤に溶解してワニスとし、該ワニス中に不織布を
通過させて含浸し、次いで熱風を吹き付は溶剤を揮散さ
せると同時にセミキュアをさせてプリプレグ（Ｉ）を得
る。 同様に高耐熱性樹脂を溶剤に溶解してワニスとし
、ガラスクロスに含浸・乾燥させてプリプレグ（ｎ）を
得ることができる。A general method for manufacturing the laminate of the present invention is to dissolve a thermosetting resin in a solvent to form a varnish, pass a nonwoven fabric through the varnish to impregnate it, and then blow hot air to volatilize the solvent. At the same time, semi-cure is performed to obtain prepreg (I). Similarly, a prepreg (n) can be obtained by dissolving a highly heat-resistant resin in a solvent to make a varnish, impregnating it into a glass cloth and drying it.
こうして得られたプリプレグ（Ｉ）の両面に、プリプレ
グ（ｎ）を重ね合わせ、更に導電層として銅箔を重ね合
わせて、加熱加圧成形して一体にし、銅箔を張ったプリ
ント回路用積層板とすることができる。 回路形成する
導電層としては、上記銅張のほか、銅以外の金属箔張り
、金属メツキ、導電ペース１〜焼付は等、回路形成可能
なものであればいかなるものでも使用できるが、金属箔
の使用が大量生産に適し、また、最も信頼性も高く好ま
しい。A laminate for printed circuits in which prepreg (n) is superimposed on both sides of the prepreg (I) obtained in this way, and copper foil is further superimposed as a conductive layer, and the resultant product is molded under heat and pressure to form a single body and covered with copper foil. It can be done. As the conductive layer for forming a circuit, in addition to the above-mentioned copper cladding, any material can be used as long as it can form a circuit, such as metal foil cladding other than copper, metal plating, conductive paste 1 to baked, etc. It is preferred because it is suitable for mass production and is also the most reliable.
（作用）
本発明のプリント回路用積層板は、表面層としてガラス
クロスに高耐熱性樹脂を含浸したプリプレグを使用して
いるため耐熱性に優れ、ＣＯＤ等の高密度実装が可能で
ある。 高密度実装工程で要求される耐熱性は、アッセ
ンブリ環境の高温時における表面硬度と、引き剥し強さ
で示されるが、本発明の積層板は高温時の硬度及び引き
剥し強さを有しており、十分対応できる。 また、中間
層に従来のコンポジット用のプリプレグを使用するため
、従来のコンポジット基板に比べ表面層のプリプレグに
おけるコスト上昇分だけで済み、耐熱性基板として大幅
なＣＤとなる。 さらに、不織布を用いたことにより総
ガラス布積層板に比べ総ガラス量が減少して総樹脂量が
増加するため、誘電率が低下して高速化対応ができ、そ
の上、従来のコンポジット基板の優れた特性である打抜
加工性、軽量化等の特徴もそのまま保存された積層板で
ある。(Function) The printed circuit laminate of the present invention uses prepreg, which is glass cloth impregnated with a highly heat-resistant resin, as the surface layer, so it has excellent heat resistance and is capable of high-density mounting such as COD. The heat resistance required in high-density packaging processes is indicated by surface hardness and peel strength at high temperatures in the assembly environment, and the laminate of the present invention has hardness and peel strength at high temperatures. Therefore, it is possible to respond adequately. In addition, since a conventional composite prepreg is used for the intermediate layer, only the cost increase for the surface layer prepreg is required compared to the conventional composite substrate, resulting in a significant CD as a heat-resistant substrate. Furthermore, by using non-woven fabric, the total amount of glass is reduced and the total amount of resin is increased compared to an all-glass cloth laminate, which lowers the dielectric constant and allows for higher speeds. This is a laminate board that retains its excellent properties such as punching workability and light weight.
（実施例）
次に本発明を実施例によって具体的に説明するが、本発
明は以下の実施例に限定されるものではない。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited to the following examples.
実施例
ＯＥＭ−３用ガラスペ一パープリプレグ６枚を重ね、そ
の両面に厚さ１８０μｍのＰＲ−５グレードプリプレグ
ＴＬＰ−５５６（東芝ケミカル社製、商品名）を重ね、
更にその外測に厚さ１８μｍの電解鋼箔を重ね合わせ、
温度１８０℃、圧力４０ｋｇｆ／Ｃ１１１２の条件で９
０分間加熱加圧一体に成形し、厚さ１．６■のプリント
回路用積層板（ＡＮＳＩグレードＯＥＭ−３相当）を製
造した。Example 6 sheets of glass pepper prepreg for OEM-3 were stacked, and on both sides, PR-5 grade prepreg TLP-556 (manufactured by Toshiba Chemical Corporation, trade name) with a thickness of 180 μm was stacked.
Furthermore, an electrolytic steel foil with a thickness of 18 μm is superimposed on the outer surface,
9 under the conditions of temperature 180℃ and pressure 40kgf/C1112
The product was integrally molded under heat and pressure for 0 minutes to produce a 1.6-inch thick printed circuit laminate (corresponding to ANSI grade OEM-3).
比較例 １
市販される通常タイプのＣＥＭ−３グレ一ドコンポジツ
ト積層板である。Comparative Example 1 This is a commercially available ordinary type CEM-3 graded composite laminate.
比較例 ２
市販される通常タイプのＰＲ−４グレ一ドガラスエポキ
シ積層板である。Comparative Example 2 This is a commercially available regular type PR-4 grade glass epoxy laminate.
実施例および比較例で得た積層板について１５０℃のワ
イヤボンディング試験、２５０℃におけるパーコール硬
度、打抜加工試験を行ったので、その結果を第１表に示
した。 本発明はいずれも優れた特性を示し、本発明の
効果が確認された。The laminates obtained in Examples and Comparative Examples were subjected to wire bonding tests at 150°C, Percoll hardness at 250°C, and punching tests, and the results are shown in Table 1. The present invention exhibited excellent characteristics, and the effects of the present invention were confirmed.
＊１ ：○印・・・良好に接合、×印・・・接合不良多
い＊２：○印・・・良好で自白、層間剥離が認められな
い、△・・・若干の自白、層間剥離あり、×・・・自白
、眉間剥離不良
［発明の効果］
以上の説明および第１表から明らかなように、本発明の
プリント回路用積層板は、耐熱性、打抜加工性、ボンデ
ィング性に優れ、ＣＯＢ等高密度実装が可能で、軽量か
つ低コストなもので工業上有益なものである。*1: ○ mark: Good bonding, × mark: Many bonding defects *2: ○ mark: Good, no confession or delamination observed, △: Some confession, delamination observed , ×... Confession, poor glabella peeling [Effects of the invention] As is clear from the above explanation and Table 1, the printed circuit laminate of the present invention has excellent heat resistance, punching workability, and bonding property. , COB, etc., which can be mounted at high density, are lightweight and low cost, and are industrially useful.
Claims (1)
（ I ）の両面に、ガラスクロスに高耐熱性樹脂を含浸
・乾燥したプリプレグ（II）を重ね合わせ、加熱・加圧
一体に成形してなることを特徴とするプリント回路用積
層板。1 Prepreg (I), which is a nonwoven fabric impregnated with a thermosetting resin and dried, is overlaid with prepreg (II), which is a glass cloth impregnated with a highly heat-resistant resin and dried, and molded by heating and pressure. A laminated board for printed circuits characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3811090A JPH03241785A (en) | 1990-02-19 | 1990-02-19 | Lamination board for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3811090A JPH03241785A (en) | 1990-02-19 | 1990-02-19 | Lamination board for printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03241785A true JPH03241785A (en) | 1991-10-28 |
Family
ID=12516338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3811090A Pending JPH03241785A (en) | 1990-02-19 | 1990-02-19 | Lamination board for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03241785A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010073940A (en) * | 2008-09-19 | 2010-04-02 | Yazaki Corp | Sheet material for printed circuit board, and printed circuit board |
-
1990
- 1990-02-19 JP JP3811090A patent/JPH03241785A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010073940A (en) * | 2008-09-19 | 2010-04-02 | Yazaki Corp | Sheet material for printed circuit board, and printed circuit board |
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