JPH02214741A - Prepreg and circuit board produced by using the same - Google Patents

Abstract

PURPOSE:To obtain a prepreg giving a circuit board having excellent through- hole reliability and high-frequency property by impregnating a substrate with a resin varnish containing a dicyclopentadiene phenolic polymer epoxy resin, etc., and drying the varnish. CONSTITUTION:The objective prepreg can be produced by impregnating a substrate with a resin varnish containing a dicyclopentadiene phenolic polymer epoxy resin of formula I, a dicyclopentadiene phenolic polymer of formula II (R is H or CH3; n is 0-5), etc., a polyaromatic cyanate of formula III (Ar is aromatic group; B is 7-20C polycyclic aliphatic substituent; D is substituent free from active hydrogen; q, r and s are 0-3; x is 0-5), etc., and, as necessary, a flame-retardant and drying the resin varnish. A circuit board is produced by stacking a prescribed number of the prepregs one upon another, inserting an inner layer circuit material at a prescribed position between the prepregs as necessary, placing a laminate having an outer-layer circuit material as the outermost layer and integrating the layers.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high frequency wiring board used in electronic equipment, electrical equipment, computers, communication equipment, etc., and a prepreg used therein.

[Conventional technology]

Conventionally, wiring boards and prepregs used in electronic devices, electrical equipment, etc. are prepregs made by impregnating paper or cloth base materials with phenolic resin or epoxy resin and drying them, and wiring boards using the same. The tangent was large, which was a problem for high frequencies. For this reason, wiring boards using fluororesin or polyphenylene oxide resin were tried, but the glass transition temperature of these resins was low, and there was a problem that smear occurred during through-hole processing, reducing the reliability of the wiring board. [Problems to be solved by the invention] As described in the conventional technology, prepregs and wiring boards using phenol resins and epoxy resins have poor high frequency properties, and wiring boards using fluororesin and polyphenylene oxide resins have poor through-hole reliability. low gender. The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to produce prepregs with excellent flame retardancy and high frequency properties;
Our goal is to provide wiring boards.

[Means for solving problems]

The present invention involves impregnating a base material with a resin varnish containing a dicyclopentadiene phenolic polymer epoxy resin, a dicyclopentadiene phenolic polymer, a polymer, a polyaromatic cyanate, and further containing a flame retardant as necessary.
Dry prepreg? The method is characterized by stacking a required number of prepregs, interposing an inner layer circuit material at a required position between the prepregs as necessary, and then integrating a laminate with an outer layer circuit material disposed on the outermost layer. The present invention will be described in detail below.

It is preferable that the dicyclopentadiene phenolic 9-polymer epoxy resin used in the present invention is represented by the following formula [1].

Dicyclopentadiene phenolic polymer, the polymer is shown by the following formula [2], provided that R is H or CHs n is 0 to 5, and the polyaromatic cyanate is shown by the following formula [3] Preferably, the formula [3] is 50, where Ar is aromatic, B is Cγ~20 polycyclic aliphatic substituents, each independently contains no active hydrogen, and the substituents q*rsl are independently, Integer X of O, 1, 2, or 3 is a number of θ to 5. Dimethylformamide or dimethylacetamide is added to the resin varnish as necessary to adjust the viscosity.

Solvents such as acetone and methyl ethyl ketone, flame retardant catalysts,
A curing agent etc. can be added. The base material is woven fabric, non-woven fabric, Maputo or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyacrylic, polyvinyl acryl, polyaramid, and natural fibers such as cotton. It is a combination base material.

The inner layer circuit material used as required is a double-sided or single-sided metal-clad laminate with an electric circuit formed on the metal surface, and a required number of inner layer circuit materials are inserted between prepregs as necessary to form a multilayer wiring board. As the outer layer circuit material, single-sided metal-clad laminates and metal foils made of copper, aluminum, nickel, zinc, etc. alone, alloys, or composites are used, but preferably have a thickness of 18 to 18 cm.
A 105 micron double-sided roughened copper foil, more preferably a copper foil with an aluminum carrier, is preferred. A required number of prepregs made by impregnating and drying the above resin varnish into a base material are stacked, inner layer circuit materials are interposed at required positions between the prepregs as necessary, and then an outer layer circuit material is arranged as the outermost layer. The bodies are laminated and integrated at 170 to 230°C using a multi-stage press method, double belt method, multi-roll method, drum method, etc. If necessary, after lamination and integration, the temperature is further increased to 60 to 120°C.
You can also do a minute after cure.

The present invention will be explained below based on examples.

Example Di-V90 pentadiene phenolic polymer epoxy resin (manufactured by Sanyo Kokusaku Pulp Co., Ltd.) 40 heavy lid parts (hereinafter simply referred to as parts) to 10 parts of zinclopentadiene phenolic polymer (manufactured by Sanyo Kokusaku Pulp Co., Ltd.) , a glass cloth with a thickness of 0.15 fi was added to a resin varnish prepared by adding SO part of polyaromatic cyanate (Dow Chemical Co. g) and adjusting the resin amount to 70 parts In (hereinafter simply referred to as "I") with dimethyl formaldehyde. After drying, the prepreg was impregnated with a resin matrix of 50% and dried to obtain a prepreg. Next, a laminate in which 9 micron thick copper foil with aluminum carrier was placed on the upper and lower surfaces of the 8 sheets of prepreg was formed under a molding pressure of 50 Kq.
/(14%) After heating and pressure molding at 170°C for 90 minutes, after-curing at 220°C for 60 minutes without pressure, the thickness was 1
．． 6 Cod wiring boards were obtained.

Comparative Example 1 Comparative Example 1 was a glass-based epoxy resin double-sided copper-clad laminate having a thickness of 1.6 fl.

Comparative Example 2 Comparative Example 2 was a glass-based fluororesin double-sided copper-clad laminate having a thickness of 1.6 ff.

The performance of the wiring boards of Examples and Comparative Examples 1 and 2 is shown in Table 1.

〔Effect of the invention〕

The present invention is constructed as described above. The prepreg having the structure described in the claims and the wiring board using the same have the effect of improving through-hole reliability and high frequency performance.

Claims (3)

[Claims] (1) Dicyclopentadiene phenolic polymer A product obtained by impregnating a base material with a resin varnish containing an epoxy resin, a dicyclopentadiene phenolic polymer, a polyaromatic cyanate, and further containing a flame retardant as necessary and drying it. A prepreg characterized by (2) Dicyclopentadiene phenolic polymer A prepreg obtained by impregnating a base material with a resin varnish containing an epoxy resin, a dicyclopentadiene phenolic polymer, a polyaromatic cyanate, and further containing a flame retardant as necessary and drying it. A wiring board characterized in that it is formed by stacking a required number of prepregs, interposing an inner layer circuit material at a required position between the prepregs as necessary, and then integrating a laminate with an outer layer circuit material disposed on the outermost layer. . (3) The wiring board according to claim 2, wherein the outer layer circuit material is a metal foil.