JPH0259637B2 - - Google Patents
Info
- Publication number
- JPH0259637B2 JPH0259637B2 JP84783A JP84783A JPH0259637B2 JP H0259637 B2 JPH0259637 B2 JP H0259637B2 JP 84783 A JP84783 A JP 84783A JP 84783 A JP84783 A JP 84783A JP H0259637 B2 JPH0259637 B2 JP H0259637B2
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- electrical
- resin
- base material
- aromatic polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004744 fabric Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000004760 aramid Substances 0.000 claims description 6
- 229920003235 aromatic polyamide Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- -1 polyamideoid Polymers 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- UBAZGMLMVVQSCD-UHFFFAOYSA-N carbon dioxide;molecular oxygen Chemical compound O=O.O=C=O UBAZGMLMVVQSCD-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電子機器、電気機器、計算機、コンピ
ユター等に用いられる多層印刷配線板用電気用積
層板の分野に属するものである。
〔背景技術〕
従来の電気用積層板はフエノール樹脂、エポキ
シ樹脂、不飽和ポリエステル樹脂等の積層板用樹
脂ワニスを紙、布、ガラス布等の積層板用基材に
含浸、乾燥したプリプレグを所要枚数重ね、更に
含浸、乾燥したプリプレグを所要枚数重ね、更に
必要に応じてその上、下面に金属箔を載置した積
層体を積層成形してなるものであるが多層印刷配
線板は高密度化、多層化、高速演算性の要望が大
きく従来の材料では対応することができなかつ
た。
〔発明の目的〕
本発明の目的は高密度化、多層化、高速演算性
に優れた多層印刷配線板用の電気用積層板を提供
することにある。
〔発明の開示〕
本発明は積層板用基材の一部に表面プラズマ処
理芳香族ポリアミド繊維布を用いたことを特徴と
する電気用積層板で、以下本発明を詳細に説明す
る。
本発明に用いる積層板用樹脂はフエノール樹
脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリ
エステル樹脂、メラミン樹脂、ポリイミド、ポリ
ブタジエン、ポリアミド、ポリアミドイド、ポリ
スルフオン、ポリブチレンテレフタレート、ポリ
エーテルエーテルケトン、弗化樹脂等の単独、変
性物、混合物等が用いられ必要に応じて粘度調整
に水、メチルアルコール、アセトン、シクロヘキ
サノン、スチレン等の溶媒を添加したもので、積
層板用基材としては、ガラス、アスベスト等の無
機繊維やポリエステル、ポリアミド、ポリビニル
アルコール、アクリル等の有機合成繊維や木綿等
の天然繊維からなる織布、不織布、マツト或いは
紙又はこれらの組合せ基材等であるが、積層板用
基材の一部に表面プラズマ処理芳香族ポリアミド
繊維布を用いることが必要である。プラズマ処理
機器としては特に限定するものではないが、処理
条件は真空度10-2Torr以上、好ましくは
10-3Torr.使用ガスは四フツ化エチレン、酸素、
炭酸ガス等がよく、周波数は100〜200KHzで10〜
60分間、15〜35℃で処理することが好ましく、バ
ツチ式、連続式各れでもよい。該表面処理プラズ
マ処理芳香族ポリアミド繊維布は積層板用基材の
任意の位置に配設することができるが好ましくは
積層板用基材の最外側に配設することが望まし
い。即ち高速演算性に必要な誘電率を4×106Hz
未満にしやすくする傾向があるからである。又配
設数も特に限定するものではないが好ましくは複
数枚用いることが望ましい。
実施例
厚さ0.18mmのガラス布(日東紡績株式会社製、
品番WE18K−104)に、エポキシ樹脂(シエル化
学株式会社製、エピコート1001)100重量部(以
下単に部と記す)、ジシアンジアミド4部、ベン
ジルジメチルアミン0.2部、メチルオキシトール
100部からなるエポキシ樹脂ワニスを樹脂量が50
重量%(以下単に%と記す)になるように含浸、
乾燥したプリプレグ(以下プリプレグAと記す)
4枚の上、下面に、厚さ0.18mmの芳香族ポリアミ
ド繊維布(カネボウ硝子繊維株式会社製、品名ケ
ブラークロスK120)をバツチ式プラズマ処理機
にて、真空度10-3Torr、使用ガスは四フツ化エ
チレン、150KHzで25℃で30分間プラズマ処理し
て得た表面プラズマ処理芳香族ポリアミド繊維布
に上記エポキシ樹脂ワニスを樹脂量が50%になる
ように含浸乾燥したプリプレグ1枚づつ重ね、更
に最外側に銅箔を1枚づつ重ねた積層体を成形プ
レートに挟み成形温度165℃、成形圧力60Kg/cm2
で120分間積層成形して厚さ1.6mmの電気用積層板
を得た。
〔従来例〕
実施例と同じプリプレグA6枚を重ねた上、下
面に銅箔を重ねた積層体を用いた以外は実施例と
同様に処理して厚さ1.6mmの電気用積層板を得た。
〔発明の効果〕
実施例及び従来例で得られた電気用積層板を試
験した結果は、第1表に明白なように本発明の電
気用積層板の寸法安定性は優れているので高密度
化、多層化に対応でき且つ誘電率を4×106Hz未
満にすることができたので高速演算性にも対応で
きたものである。
【表】DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention belongs to the field of electrical laminates for multilayer printed wiring boards used in electronic equipment, electrical equipment, calculators, computers, and the like. [Background technology] Conventional electrical laminates require a prepreg in which a laminate base material such as paper, cloth, or glass cloth is impregnated with a laminate resin varnish such as phenolic resin, epoxy resin, or unsaturated polyester resin and then dried. Multilayer printed wiring boards are made by stacking a required number of prepreg sheets, then impregnating and drying them, and then, if necessary, placing metal foil on the bottom surface of the laminate. , multi-layering, and high-speed calculation performance were in great demand and could not be met using conventional materials. [Object of the Invention] An object of the present invention is to provide an electrical laminate for a multilayer printed wiring board that has high density, multilayer structure, and excellent high-speed calculation performance. [Disclosure of the Invention] The present invention is an electrical laminate characterized in that a surface plasma-treated aromatic polyamide fiber cloth is used as a part of the base material for the laminate, and the present invention will be described in detail below. Resins for laminates used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideoid, polysulfon, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. These materials are used alone, modified products, or mixtures of these materials, and if necessary, solvents such as water, methyl alcohol, acetone, cyclohexanone, and styrene are added to adjust the viscosity. Woven fabrics, nonwoven fabrics, pine, paper, or combinations of these are made of inorganic fibers, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton, but they are one of the substrates for laminates. It is necessary to use a surface plasma-treated aromatic polyamide fiber cloth for the parts. The plasma processing equipment is not particularly limited, but the processing conditions are a vacuum level of 10 -2 Torr or higher, preferably
10 -3 Torr. Gases used are tetrafluoroethylene, oxygen,
Carbon dioxide, etc. is good, and the frequency is 100 to 200 KHz.
The treatment is preferably carried out at 15 to 35°C for 60 minutes, and may be carried out either batchwise or continuously. The surface-treated plasma-treated aromatic polyamide fiber cloth can be disposed at any position on the laminate base material, but it is preferably disposed on the outermost side of the laminate base material. In other words, the dielectric constant required for high-speed calculation is 4×10 6 Hz.
This is because there is a tendency to make it easier to make the value less than . Further, the number of the arrangement is not particularly limited, but it is preferable to use a plurality of them. Example: Glass cloth with a thickness of 0.18 mm (manufactured by Nittobo Co., Ltd.,
Product number WE18K-104), 100 parts by weight of epoxy resin (manufactured by Ciel Chemical Co., Ltd., Epicote 1001) (hereinafter simply referred to as parts), 4 parts of dicyandiamide, 0.2 parts of benzyldimethylamine, methyloxytol.
Epoxy resin varnish consisting of 100 parts with resin amount of 50 parts
Impregnated so that it becomes % by weight (hereinafter simply referred to as %),
Dried prepreg (hereinafter referred to as prepreg A)
Aromatic polyamide fiber cloth (manufactured by Kanebo Glass Fiber Co., Ltd., product name: Kevlar Cloth K120) with a thickness of 0.18 mm was placed on the top and bottom surfaces of the four sheets using a batch-type plasma processing machine at a vacuum level of 10 -3 Torr and the gas used. A surface plasma-treated aromatic polyamide fiber cloth obtained by plasma treatment with tetrafluoroethylene at 150KHz at 25℃ for 30 minutes was impregnated with the above epoxy resin varnish to a resin content of 50%, and dried prepreg sheets were layered one by one. Furthermore, a laminate with one copper foil layered on the outermost layer is sandwiched between molding plates at a molding temperature of 165℃ and a molding pressure of 60Kg/cm 2
Laminate molding was performed for 120 minutes to obtain an electrical laminate with a thickness of 1.6 mm. [Conventional example] An electrical laminate with a thickness of 1.6 mm was obtained by processing in the same manner as in the example except that a laminate was used in which the same six prepreg A sheets as in the example were stacked and copper foil was layered on the bottom surface. . [Effects of the Invention] The results of testing the electrical laminates obtained in the examples and conventional examples show that, as is clear from Table 1, the electrical laminates of the present invention have excellent dimensional stability and high density. The structure is compatible with multi-layering and multi-layering, and the dielectric constant can be made less than 4×10 6 Hz, so it is also compatible with high-speed calculation. 【table】
Claims (1)
たプリプレグを所要枚数重ね、更に必要に応じて
その上、下面に金属箔を載置した積層体を積層成
形してなる電気用積層板において、積層板用基材
の一部に表面プラズマ処理芳香族ポリアミド繊維
布を用いたことを特徴とする電気用積層板。1. An electrical laminate made by laminating and molding a laminate in which a required number of prepregs are impregnated with a laminate resin and dried into a laminate base material, and if necessary, a metal foil is placed on the bottom surface of the laminate. An electrical laminate, characterized in that a surface plasma-treated aromatic polyamide fiber cloth is used as a part of the laminate base material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP84783A JPS59125690A (en) | 1983-01-06 | 1983-01-06 | Electric laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP84783A JPS59125690A (en) | 1983-01-06 | 1983-01-06 | Electric laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59125690A JPS59125690A (en) | 1984-07-20 |
JPH0259637B2 true JPH0259637B2 (en) | 1990-12-13 |
Family
ID=11485026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP84783A Granted JPS59125690A (en) | 1983-01-06 | 1983-01-06 | Electric laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59125690A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04186789A (en) * | 1990-11-20 | 1992-07-03 | Matsushita Electric Ind Co Ltd | Printed wiring board |
-
1983
- 1983-01-06 JP JP84783A patent/JPS59125690A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59125690A (en) | 1984-07-20 |
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