JPH03183187A - Laminated board for electrical use - Google Patents
Laminated board for electrical useInfo
- Publication number
- JPH03183187A JPH03183187A JP32167189A JP32167189A JPH03183187A JP H03183187 A JPH03183187 A JP H03183187A JP 32167189 A JP32167189 A JP 32167189A JP 32167189 A JP32167189 A JP 32167189A JP H03183187 A JPH03183187 A JP H03183187A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- paper
- fluororesin
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000011521 glass Substances 0.000 description 10
- 239000000123 paper Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 239000002759 woven fabric Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000002655 kraft paper Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- -1 polybutylene terephthalate Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- RRZIJNVZMJUGTK-UHFFFAOYSA-N 1,1,2-trifluoro-2-(1,2,2-trifluoroethenoxy)ethene Chemical compound FC(F)=C(F)OC(F)=C(F)F RRZIJNVZMJUGTK-UHFFFAOYSA-N 0.000 description 1
- LHASLBSEALHFGO-ASZAQJJISA-N 1-[(4s,5r)-4-hydroxy-5-(hydroxymethyl)oxolan-2-yl]-5-[[(2r,3r,4s,5s,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxymethyl]pyrimidine-2,4-dione Chemical compound C1[C@H](O)[C@@H](CO)OC1N1C(=O)NC(=O)C(CO[C@H]2[C@@H]([C@@H](O)[C@H](O)[C@@H](CO)O2)O)=C1 LHASLBSEALHFGO-ASZAQJJISA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 206010041349 Somnolence Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分封〕
本光四は電気!嗜イぐ、は子)表器、コンピューター通
(M慢米等lこ用いられる′出;気用槓層板に関するも
のである。[Detailed Description of the Invention] [Industrial Use Separation] This light four is electricity! This is related to the laminate used by computer experts, computer experts, etc.
従来より、紙やガラス織布Iこフェノール樹脂、エポキ
シ樹脂、ポリイミド樹脂を含浸、乾燥させた樹脂含浸基
材の所要枚数と金属箔を重ねた積層体を槓!−威形して
電気用槓噛板が製造されているが、この′ぼ気用積層板
の誘電率は、エポキシ樹脂含浸ガラス布を用いた場合で
5.01ポリイミド樹脂ガラス布の場合には40と比較
的大きく、従りてプリント配線板として用めた場合には
高周波特性が不足となり、高周波演算閉略や通信機器回
路用には制約が加えられていた。このためクラフト紙や
ガラス織布にフッ素樹脂を含浸させたフーノ素樹脂含浸
クラフト紙やフッ素樹脂含浸ガラス織布を用(八ること
が試みられたが’7−p素樹脂腋はエマルジョン形態で
の供給しかないため、環材に所要樹脂櫨を行為させるに
は含次、乾燥金反復する手tutがあり、更に積層成形
時に7・・−素樹脂の融点以上に加熱する必要があるた
め250℃以上の高温成形が必要となる問題がありた。Conventionally, we have produced a laminate made by layering the required number of resin-impregnated base materials, which are made by impregnating and drying paper or glass woven fabric with phenol resin, epoxy resin, or polyimide resin, and metal foil! - The dielectric constant of this laminated board is 5.01 when using epoxy resin-impregnated glass cloth, and 5.01 when using polyimide resin glass cloth. 40, which is relatively large, and therefore, when used as a printed wiring board, the high frequency characteristics are insufficient, and restrictions have been imposed on high frequency calculation circuits and communication equipment circuits. For this purpose, kraft paper or glass woven cloth impregnated with fluororesin, such as kraft paper impregnated with fluororesin or glass woven cloth impregnated with fluororesin, were tried, but the '7-P resin armpit was in the form of an emulsion. Because there is only a supply of There was a problem in that high temperature molding at temperatures above ℃ was required.
従来の技術で述べたように、エポキシ樹脂、ポリイミド
樹脂をクラフト紙、ガラス織′HIに含浸させた樹脂含
浸基材からなる眠気用積層板は高周波特性が不足する。As described in the prior art, laminates for drowsiness made of resin-impregnated base materials in which kraft paper or glass woven HI is impregnated with epoxy resin or polyimide resin lack high frequency characteristics.
そうかといってフッ素411111’tクラフト紙、ガ
ラス織布に含浸させた樹脂含浸基材からなる電気用積層
板は生産性が低b0本発明は従来の技術における上述の
問題点に鑑みてなされたもので、その目的とするところ
は、生産性tm持したまま、高周波特性lこ優れた電気
用M層板を提供することにある。On the other hand, electrical laminates made of a resin-impregnated base material impregnated with fluorine 411111't kraft paper or glass woven fabric have low productivity.The present invention was made in view of the above-mentioned problems in the conventional technology. The purpose is to provide an electrical M-layer board that has excellent high frequency characteristics while maintaining productivity.
本発明は所要枚数の樹脂含浸基材の上面及び又は下11
Nfこ金属箔を配設したntwI体を一体化してなる電
気用M周板において、樹脂含浸基材の少くとも1枚が、
樹脂含浸7咋素樹脂ペーパーであることを特徴とする電
気用積層板のため、高周波特性がよく、七つ含浸用樹脂
として7.素樹脂を用いた以外は生産性を維持すること
ができるもので、以下本発明の詳細な説明する。The present invention provides the upper and/or lower surfaces of the required number of resin-impregnated substrates.
In the electrical M circumferential plate formed by integrating the NtwI body on which the Nf metal foil is arranged, at least one of the resin-impregnated base materials is
This is an electrical laminate that is characterized by being a resin-impregnated 7-layer resin paper, so it has good high frequency characteristics and has a 7-layer resin impregnated with 7-layer resin. Except for the use of base resin, productivity can be maintained, and the present invention will be described in detail below.
本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メラミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミド、ポリスルフォン、
ポリフェニレンサルファイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルヶトンフーJ素樹脂等の単独、変性物、混合物等が用
い6れ必要に応じて粘度調整に水、メチルアルコール、
アセトン、シクロヘキサノン、スチレン等の溶媒を添加
したもので、基材としては三7Q化塩化エチレン樹脂、
四フッ化工子しン樹脂、四フッ化工千しン六7 +7化
プロピレン共矩合体樹脂、四ツ−I化エチレンパーフル
オロビニルエーテル共1合体樹脂等のツーy素樹脂縁縫
を抄紙してなる7−X。Examples of resins for the resin-impregnated base material used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyetheretherkatonfu J base resin, etc. alone, modified products, mixtures, etc. are used6, and if necessary, water, methyl alcohol,
It contains solvents such as acetone, cyclohexanone, and styrene, and the base material is tri7Q chlorinated ethylene resin,
Paper is made from two-y base resin edge stitches such as tetrafluorocarbon resin, tetrafluorocarbon resin, 7-propylene co-rectangular polymer resin, and tetrafluoroethylene perfluorovinyl ether co-polymer resin. 7-X.
素樹脂ペーパーを、所要枚数の樹脂含浸基材の全部に用
(八でもよく、又所要枚数積層された中央部のみ、或は
最外層のみ、更には通常の樹脂含浸基材と交互に積層し
た状態で用すでもよく任意であるが樹脂含浸基材の少く
とも1枚lこ粗しることが必要である。フッ素樹脂ペー
パーとしては好ましくは伸率が150〜350優である
ことが望ましb0即ち1504未満では取扱時に破損し
ゃすく、350%をこえると取扱時−こ歪を残留し寸法
安定性が低下する力)らである。金属箔としては鋼、ア
ルミニウム、ニリケル、亜鉛、鉄等の単独、合金、複合
の箔が用すられ、必要に応じて接材性をより向上させる
ため、金属箔の片面に接着剤層を設けておくこともでき
る。積層−像化手段についてはプレス、多段プレス、マ
ルチロール、ダブルベルト。Base resin paper can be used for all of the required number of resin-impregnated base materials (or even just the central part of the required number of laminated sheets, or only the outermost layer, or alternately laminated with regular resin-impregnated base materials). Although it is optional, it is necessary to roughen at least one sheet of the resin-impregnated base material.The fluororesin paper preferably has an elongation of 150 to 350. If b0 is less than 1504, it will break during handling, and if it exceeds 350%, strain will remain during handling and dimensional stability will decrease. As the metal foil, single, alloy, or composite foils of steel, aluminum, Nikel, zinc, iron, etc. are used, and if necessary, an adhesive layer is provided on one side of the metal foil to further improve adhesive properties. You can also leave it there. Lamination-imaging means include presses, multistage presses, multirolls, and double belts.
無比加熱等の任意方式を選択することができ、特に限定
するものではない。Any method such as incomparable heating can be selected and is not particularly limited.
以下取発明を実施例にもとづ帆て説明する。The invention will be explained below based on examples.
実施例
四ツつ化エチレンパーフルオロビニルエーテル共重合体
樹脂繊維を抄紙してなる厚み400ミクロン、伸率25
0係の7.V素蘭脂ペーパー1c、乾燥後樹脂量が45
1竜優になるように硬化剤含有エポキシ樹脂ワニス金含
浸、乾燥して得た樹脂含浸フッ素樹脂ペーパー3枚を重
ねた上下面に、厚さQ、035鱈の接看剤付鋼箔を夫々
配設した積層体を成形圧力30に9/d 、 170℃
で90分間横層威形して厚さ1.2鱈の両面銅張電気用
積層板を得た。Example: A paper made from tetrattylated ethylene perfluorovinyl ether copolymer resin fiber, thickness 400 microns, elongation rate 25.
Section 0's 7. V-solan resin paper 1c, resin amount after drying is 45
Three sheets of resin-impregnated fluororesin paper obtained by applying hardening agent-containing epoxy resin varnish gold-impregnated and drying are stacked on top and bottom so as to have a thickness of 1,000 yen, respectively. The arranged laminate was molded at a molding pressure of 30/d at 170°C.
A double-sided copper-clad electrical laminate having a thickness of 1.2 mm was obtained by cross-layer forming for 90 minutes.
比較例1
硬化剤含有エボ牛シ樹IIF17ニスを、犀さ0.2M
のガラス織布に、乾燥後樹脂口が45重41%になるよ
うに含浸、乾燥して得た樹脂含浸ガラス織布6救命重ね
た上下廂に、厚さl)、035 tmの採肴剤付銅箔を
夫々配設した積層体を用りた以外は実権例と同様に処理
して厚さ1.211の電気用積層板を得た。Comparative Example 1 Hardening agent-containing ebo-beef IIF17 varnish was applied to a varnish of 0.2M
After drying, impregnate a glass woven fabric with a resin-impregnated glass fabric so that the resin volume becomes 45% by weight and 41%, and dry it. An electrical laminate having a thickness of 1.21 mm was obtained by processing in the same manner as in the practical example except that a laminate having copper foils provided thereon was used.
比較例2
四7ツ化エチレン樹脂エマルジョン金、厚さ□、2崩の
がチス織布に、乾燥後樹脂道が45重1t96になるよ
うに含浸、乾燥して得た樹脂含浸ガラス織布6枚を重ね
た上下面に、厚さ0.035 mの接樹剤付銅箔を夫々
配設したn4層体を成形圧力30KQ/d。Comparative Example 2 Resin-impregnated glass woven fabric 6 obtained by impregnating and drying 47-ethylene resin emulsion gold, thickness □, 2 pieces of Tis woven fabric so that the resin path becomes 45 weight 1 t 96 after drying. An n4-layer body with binder-coated copper foil of 0.035 m thick was placed on the upper and lower surfaces of the stacked sheets, respectively, at a molding pressure of 30 KQ/d.
335℃で60分間積層成形して厚さ1.2 tmの電
気用積層板金褥た。Laminate molding was performed at 335° C. for 60 minutes to form an electrical laminated sheet metal with a thickness of 1.2 tm.
実施例及び比較例1と2の電気用積層板の性能は第1表
のようである。The performances of the electrical laminates of Examples and Comparative Examples 1 and 2 are shown in Table 1.
庄 ※ 比較例1を100とした場合の比である。Sho *This is the ratio when Comparative Example 1 is set as 100.
本発明は上述した如く構成されて−る。特許請求の範囲
に記載した構成に有する電気用績!−板におりでは生産
性を維持したまま、?a:1周波特性を向上させること
のできる効果がある。The present invention is constructed as described above. Electrical performance with the configuration described in the claims! - Can you maintain productivity while staying on the board? a: There is an effect of improving single frequency characteristics.
Claims (2)
属箔を配設した積層体を一体化してなる電気用積層板に
おいて、樹脂含浸基材の少くとも1枚が、樹脂含浸フッ
素樹脂ペーパーであることを特徴とする電気用積層板。(1) In an electrical laminate formed by integrating a laminate in which a required number of resin-impregnated substrates are provided with metal foil on the upper and/or lower surfaces, at least one of the resin-impregnated substrates is made of resin-impregnated fluororesin. An electrical laminate characterized by being made of paper.
ることを特徴とする特許請求の範囲第1項記載の電気用
積層板。(2) The electrical laminate according to claim 1, wherein the fluororesin paper has an elongation of 150 to 350%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32167189A JPH03183187A (en) | 1989-12-12 | 1989-12-12 | Laminated board for electrical use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32167189A JPH03183187A (en) | 1989-12-12 | 1989-12-12 | Laminated board for electrical use |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03183187A true JPH03183187A (en) | 1991-08-09 |
Family
ID=18135114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32167189A Pending JPH03183187A (en) | 1989-12-12 | 1989-12-12 | Laminated board for electrical use |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03183187A (en) |
-
1989
- 1989-12-12 JP JP32167189A patent/JPH03183187A/en active Pending
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