JPH01238932A - Composite one side face metal laminated plate - Google Patents
Composite one side face metal laminated plateInfo
- Publication number
- JPH01238932A JPH01238932A JP6615888A JP6615888A JPH01238932A JP H01238932 A JPH01238932 A JP H01238932A JP 6615888 A JP6615888 A JP 6615888A JP 6615888 A JP6615888 A JP 6615888A JP H01238932 A JPH01238932 A JP H01238932A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- metal foil
- foil
- paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- 239000002131 composite material Substances 0.000 title claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 14
- 239000004744 fabric Substances 0.000 claims abstract description 13
- 239000002655 kraft paper Substances 0.000 claims abstract description 12
- 239000000123 paper Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 13
- 239000011162 core material Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 238000005530 etching Methods 0.000 description 5
- -1 fluororesins Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリント配線板等に使用されるコンポジッ
ト片面金属張積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite single-sided metal-clad laminate used for printed wiring boards and the like.
近年、電子機器の高密度化、高性能化、低価格化等が急
速に進み、こうした趨勢に対応できるプリント配線板材
料として、電気絶縁性、打抜加工性、耐熱性などに優れ
、価格面でも有利なコンポジット基板が注目されている
。In recent years, the density, performance, and price of electronic devices have rapidly increased, and printed wiring board materials that can respond to these trends have excellent electrical insulation, punching workability, heat resistance, etc., and are becoming more affordable. However, advantageous composite substrates are attracting attention.
このコンポジフト基板とは、２種または２種以上の基材
を用いた積層板であって、異なる特性を有する両基材の
それぞれの短所を改善し、長所を生かすように構成され
ている。代表的なコンポジット基板としては、たとえば
、芯材としてエポキシ樹脂含浸紙、その外側の表層材と
して同樹脂含浸ガラス布が用いられた銅張積層板（ＣＥ
Ｍ−１）、芯材としてエポキシ樹脂含浸ガラス不織布、
表層材として同樹脂含浸ガラス布が用いられた銅張積層
板（ＯＥＭ−３）等が挙げられる。This composite substrate is a laminated board using two or more types of base materials, and is configured to improve the respective disadvantages and take advantage of the advantages of both base materials having different characteristics. A typical composite board is, for example, a copper-clad laminate (CE), which uses epoxy resin-impregnated paper as the core material and glass cloth impregnated with the same resin as the outer surface layer material.
M-1), epoxy resin-impregnated glass nonwoven fabric as core material,
Examples include a copper-clad laminate (OEM-3) in which the same resin-impregnated glass cloth is used as a surface layer material.
ところが、上記ＯＥＭ−ｌ等のように、芯材として紙基
材が用いられたコンポジット基板のうち、とりわけ片面
金属張の積層板においては、従来から、金属箔面が凹と
なるような反り（マイナス反り、あるいは単に反りとい
う）が大きい、という問題があった。紙基材としては、
通常、リンター紙が用いられているが、この場合、主と
してプリント加工工程時、特にエソチング工程時にマイ
ナス反りが大きい、という欠点がある。このことは、最
近のパターンサイズの大型化においては、致命的な欠陥
になってしまう。そこで、リンター紙に代えてクラフト
紙を用いることが試みられたが、こちらは、エツチング
加工、パンチング加工時等における反り挙動は小さいが
、積層板成形直後の反り、または保管時における経時的
な反りが大きいため、加工直前に反り直しを行う必要が
ある、という別の難点を有していた。However, among composite substrates that use a paper base material as a core material, such as the OEM-1 mentioned above, especially in single-sided metal-clad laminates, warping (such as a concave metal foil surface) has traditionally occurred. The problem was that there was a large amount of negative warpage (or simply warpage). As a paper base material,
Usually, linter paper is used, but in this case, there is a drawback that negative warpage is large mainly during the printing process, especially during the etching process. This becomes a fatal flaw in the recent increase in pattern size. Therefore, attempts were made to use kraft paper in place of linter paper, but although this paper has less warping behavior during etching and punching processes, it does not warp immediately after forming the laminate or warp over time during storage. Another problem was that since the curve was large, it was necessary to correct the warpage immediately before processing.
このような事情に鑑み、この発明は、最終的に反りの少
ないプリント配線板等が得られるようなコンポジット片
面金属張積層板を提供することを課題とする。In view of these circumstances, it is an object of the present invention to provide a composite single-sided metal-clad laminate that can ultimately yield a printed wiring board or the like with less warpage.
上記課題を解決するため、この発明は、芯材として樹脂
含浸紙、表層材として樹脂含浸ガラス布が用いられ、片
面に金属箔が配されてなるコンポジット片面金属張積層
板において、前記樹脂含浸紙として、前記金属箔に近い
側に所定枚数の樹脂含浸クラフト紙を、前記金属箔から
遠い側に所定枚数の樹脂含浸リンター紙をそれぞれ用い
るようにした。In order to solve the above problems, the present invention provides a composite single-sided metal-clad laminate in which resin-impregnated paper is used as a core material, resin-impregnated glass cloth is used as a surface material, and metal foil is arranged on one side. As such, a predetermined number of resin-impregnated kraft paper was used on the side closer to the metal foil, and a predetermined number of resin-impregnated linter paper was used on the side farther from the metal foil.
このコンポジット片面金属張積層板では、上記のように
、金属箔に近い側に所定枚数の樹脂含浸クラフト紙が配
設されており、クラフト紙の長所、すなわちプリント配
線板への加工時の反りが起こりにくい、という特性が生
かされている。他方、積層板成形後および保管時におけ
る反り挙動が大きい、というクラフト紙の短所は、併用
されているリンター紙の該段階における安定性にカバー
されるため、いずれの段階における反り挙動にも対応で
きる、反りの少ない積層板となる。As mentioned above, in this composite single-sided metal-clad laminate, a predetermined number of resin-impregnated kraft paper is placed on the side closer to the metal foil, and the advantage of kraft paper is that it does not warp when processed into a printed wiring board. It takes advantage of the characteristic that it is difficult to occur. On the other hand, the disadvantage of kraft paper is that it exhibits large warping behavior after forming the laminate and during storage, but this is covered by the stability of the linter paper that is used in combination, so it can handle warping behavior at any stage. , resulting in a laminate with less warpage.
以下に、この発明にかかるコンポジット片面金属張積層
板について、図面を参照しつつ詳しく説明する。EMBODIMENT OF THE INVENTION Below, the composite single-sided metal clad laminate according to the present invention will be explained in detail with reference to the drawings.
第１図は、コンポジット片面金属張積層板の一実施例を
模式的にあられす断面図であり、上から、金属箔ｌ、樹
脂含浸ガラス布２．樹脂含浸クラフト紙３．樹脂含浸リ
ンター紙４．樹脂含浸ガラス布２という順に積層された
組み合わせになっている。FIG. 1 is a schematic cross-sectional view of an embodiment of a composite single-sided metal-clad laminate, in which, from the top, metal foil 1, resin-impregnated glass cloth 2. Resin impregnated kraft paper 3. Resin-impregnated linter paper4. The resin-impregnated glass cloth 2 is laminated in this order.
この発明における樹脂含浸紙３，４および樹脂含浸ガラ
ス布２に用いられる樹脂としては、特に限定はされず、
たとえば、フェノール樹脂、メラミン樹脂、エポキシ樹
脂、ジアリルフタレート樹脂、不飽和ポリエステル樹脂
、クレゾール樹脂。The resin used for the resin-impregnated papers 3 and 4 and the resin-impregnated glass cloth 2 in this invention is not particularly limited,
For example, phenolic resins, melamine resins, epoxy resins, diallyl phthalate resins, unsaturated polyester resins, cresol resins.
ビニルエステル樹脂、ポリイミド樹脂、ポリアミド樹脂
、ポリアミドイミド樹脂、フッ素樹脂、シリコーン樹脂
、ポリブタジェン樹脂、ポリエチレンテレフタレート樹
脂、ポリブチレンテレフタレート樹脂、ポリフェニレン
スルフィド樹脂等の一般的な各種熱硬化性樹脂、および
それらの変性物等が、単独で、あるいは複数種を併せて
用いられる。なかでも、耐熱性１強度等のバランスがよ
いことからエポキシ樹脂を用いることが好ましく、たと
えば、ビスフェノールＡ型、ノボラック型。Various general thermosetting resins such as vinyl ester resins, polyimide resins, polyamide resins, polyamideimide resins, fluororesins, silicone resins, polybutadiene resins, polyethylene terephthalate resins, polybutylene terephthalate resins, polyphenylene sulfide resins, and their modifications. These items can be used singly or in combination. Among them, it is preferable to use epoxy resins because they have a good balance of heat resistance, strength, etc., such as bisphenol A type and novolak type.
グリシジルエステル型等の各エポキシ樹脂や、ハロゲン
化エポキシ樹脂、高分子型エポキシ樹脂。Various epoxy resins such as glycidyl ester type, halogenated epoxy resin, and polymer type epoxy resin.
可撓性エポキシ樹脂など、エポキシ樹脂全般を用いるこ
とができる。Any epoxy resin can be used, including flexible epoxy resins.
各基材への上記樹脂の含浸、乾燥方法等についても、特
に限定されず、上記樹脂および溶剤に、必要に応じて硬
化剤（架橋剤）、硬化促進剤９重合開始剤等の添加剤を
配合してフェスを調製し、これを通常の方法で基材に含
浸させ、その後、乾燥しつつ半硬化状態にまで樹脂の硬
化を進めればよい。There are no particular limitations on the method of impregnating each base material with the above resin, drying method, etc. Additives such as a curing agent (crosslinking agent), a curing accelerator, and a polymerization initiator are added to the resin and solvent as necessary. The resin may be blended to prepare a face, impregnated into a base material by a normal method, and then dried to proceed with curing of the resin to a semi-cured state.
積層板の最外層となる金属箔１としては、たとえば、銅
、アルミニウム、ニッケル、亜鉛、鉄等の単独あるいは
合金の金属箔が挙げられるが、これらに限定されること
はない。また、必要に応じて、金属箔の片面（裏面）に
接着剤層が設けられていてもよい。Examples of the metal foil 1 serving as the outermost layer of the laminate include, but are not limited to, metal foils made of copper, aluminum, nickel, zinc, iron, etc. alone or in alloys. Moreover, an adhesive layer may be provided on one side (back side) of the metal foil, if necessary.
以上の各構成要素を、第１図に示したような順に積層し
て積層体とし、通常の積層成形等を行って、この発明に
かかる積層板が製造される。The above-mentioned components are laminated in the order shown in FIG. 1 to form a laminate, and the laminate plate according to the present invention is manufactured by performing ordinary lamination molding or the like.
なお、この発明にかかるコンポジフト片面金属張積層板
の構成は、ここに図示されたものに限定されないことは
言うまでもない。たとえば、樹脂含浸紙３．４および樹
脂含浸ガラス布２の積層枚数は、それぞれの配設位置に
おいて各１枚以上が、全体厚みとの関係上、任意に選択
されうるちのである。また、必要に応じては、上記樹脂
含浸基材２，３．４とともに、電気絶縁性、耐熱性等を
有する熱溶着性プラスチックフィルム（たとえば、ポリ
フェニレンオキシド、ポリフェニレンスルフィド、エポ
キシ樹脂、ポリイミド樹脂等）などが併用されていても
よい。It goes without saying that the structure of the composite single-sided metal-clad laminate according to the present invention is not limited to that shown here. For example, the number of laminated sheets of resin-impregnated paper 3.4 and resin-impregnated glass cloth 2 can be arbitrarily selected such that one or more sheets of each are stacked at each arrangement position, depending on the overall thickness. If necessary, a heat-fusible plastic film (for example, polyphenylene oxide, polyphenylene sulfide, epoxy resin, polyimide resin, etc.) having electrical insulation, heat resistance, etc. may be used together with the resin-impregnated base materials 2, 3.4. etc. may be used together.
つぎに、さらに具体的な実施例および比較例について説
明する。Next, more specific examples and comparative examples will be described.
一実施例１〜３および比較例１〜３−
基材として、ガラスクロス（日東紡績部製９品名誉Ｅ１
８に−１０４，厚み０．１８ｍｍ）、クラフト紙（重陽
国策バルブ■製、厚み０．２龍）およびリンター紙（阿
部用製紙■製、厚み０．２ｗｍ）を使用し、これらに下
記成分からなるエポキシ樹脂フェスをレジンコンテント
５０重量％になるよう含浸させ、乾燥してプリプレグを
得た。Examples 1 to 3 and Comparative Examples 1 to 3 - Glass cloth (9 products manufactured by Nitto Boseki Department, Honor E1) was used as the base material.
8-104, thickness 0.18mm), kraft paper (manufactured by Chūyō Kokusaku Valve ■, thickness 0.2wm) and linter paper (manufactured by Abeyo Paper Manufacturing ■, thickness 0.2wm), and added the following ingredients to these. The epoxy resin face was impregnated with a resin content of 50% by weight and dried to obtain a prepreg.
※エポキシ樹脂フェスの組成
得られたプリプレグおよび銅箔（厚さ０．０１８鶴）を
用い、第１表に示した構成の各積層体を積層成形してコ
ンポジット片面銅張積層板（縦横２５０龍、厚み１．６
ｍｍ）を得た。なお、成形条件は、温度１６０℃、圧力
１００ｋｇ／ｃｄ、時間６０分間であった。*Composition of epoxy resin face Using the obtained prepreg and copper foil (thickness: 0.018mm), each laminate with the configuration shown in Table 1 was laminated and molded to form a composite single-sided copper-clad laminate (250 mm in length and width). , thickness 1.6
mm) was obtained. The molding conditions were a temperature of 160° C., a pressure of 100 kg/cd, and a time of 60 minutes.
得られた各積層板について、成形直後、１０日間保管（
温度２０℃、湿度６０％）後、続いて全面エツチング後
におけるそれぞれの反りを測定した（ＪＩＳ Ｃ６４８
１に準じる）。なお、上記全面エツチングは、温度約３
０℃、４０°ボーメの塩化第二鉄溶液を用い、この中に
約３分間浸漬させて行った。Immediately after forming, each laminate obtained was stored for 10 days (
The warpage was measured after etching (temperature: 20°C, humidity: 60%) and then after etching the entire surface (JIS C648
1). Note that the above-mentioned entire surface etching is performed at a temperature of approximately 3.
A ferric chloride solution at 0° C. and 40° Baume was used, and the samples were immersed in this solution for about 3 minutes.
以上の結果を、第１表に示す。The above results are shown in Table 1.
第１表にみるように、実施例のコンポジット片面銅張積
層板では、比較例に比べ、全面エツチング後においても
、大幅にマイナス反りが減少していることが判明した。As shown in Table 1, it was found that the negative warpage of the composite single-sided copper-clad laminate of the example was significantly reduced compared to the comparative example even after the entire surface was etched.
この発明にかかるコンポジット片面金属張積層板では、
芯材となる樹脂含浸紙として、金属箔に近い側に所定枚
数の樹脂含浸クラフト紙が、金属箔から遠い側に所定枚
数の樹脂含浸リンター紙がそれぞれ用いられているため
、従来の問題点が解決され、マイナス反りの小さなガラ
ス布基材／紙基材コンボジフト片面金属張積層板の実現
を可能としている。In the composite single-sided metal-clad laminate according to the present invention,
As the resin-impregnated paper that serves as the core material, a predetermined number of resin-impregnated kraft paper is used on the side closer to the metal foil, and a predetermined number of resin-impregnated linter paper is used on the side farther from the metal foil, which eliminates the problems of conventional methods. This problem has been solved, making it possible to create a single-sided metal-clad laminate made of a glass cloth base/paper base combo with a small amount of negative warpage.
【図面の簡単な説明】
第１図は、この発明にかかるコンポジット片面金属張積
層板の一実施例を模式的にあられす断面図である。
１・・・金属箔 ２・・・樹脂含浸ガラス布 ３・・・
樹脂含浸クラフト紙 ４・・・樹脂含浸リンター紙代理
人 弁理士 松 本 武 彦
第１図BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of an embodiment of a composite single-sided metal-clad laminate according to the present invention. 1... Metal foil 2... Resin-impregnated glass cloth 3...
Resin-impregnated kraft paper 4...Resin-impregnated linter paper Agent Patent attorney Takehiko Matsumoto Figure 1
Claims (1)
ス布が用いられ、片面に金属箔が配されてなるコンポジ
ット片面金属張積層板であって、前記樹脂含浸紙として
、前記金属箔に近い側に所定枚数の樹脂含浸クラフト紙
が、前記金属箔から遠い側に所定枚数の樹脂含浸リンタ
ー紙がそれぞれ用いられていることを特徴とするコンポ
ジット片面金属張積層板。1 A composite single-sided metal-clad laminate in which resin-impregnated paper is used as a core material, resin-impregnated glass cloth is used as a surface material, and metal foil is arranged on one side, and the resin-impregnated paper is used on the side closer to the metal foil. A composite single-sided metal-clad laminate, characterized in that a predetermined number of resin-impregnated kraft paper is used on the side farthest from the metal foil, and a predetermined number of resin-impregnated linter paper is used on the side far from the metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6615888A JPH01238932A (en) | 1988-03-19 | 1988-03-19 | Composite one side face metal laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6615888A JPH01238932A (en) | 1988-03-19 | 1988-03-19 | Composite one side face metal laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01238932A true JPH01238932A (en) | 1989-09-25 |
Family
ID=13307773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6615888A Pending JPH01238932A (en) | 1988-03-19 | 1988-03-19 | Composite one side face metal laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01238932A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003055486A (en) * | 2001-05-24 | 2003-02-26 | Hitachi Chem Co Ltd | Prepreg and laminate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649257A (en) * | 1979-09-28 | 1981-05-02 | Shin Kobe Electric Machinery | Manufacture of copper lined laminated board |
| JPS62221535A (en) * | 1986-03-24 | 1987-09-29 | 新神戸電機株式会社 | Single-sided metallic-foil lined composite laminated board |
-
1988
- 1988-03-19 JP JP6615888A patent/JPH01238932A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649257A (en) * | 1979-09-28 | 1981-05-02 | Shin Kobe Electric Machinery | Manufacture of copper lined laminated board |
| JPS62221535A (en) * | 1986-03-24 | 1987-09-29 | 新神戸電機株式会社 | Single-sided metallic-foil lined composite laminated board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003055486A (en) * | 2001-05-24 | 2003-02-26 | Hitachi Chem Co Ltd | Prepreg and laminate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01238932A (en) | Composite one side face metal laminated plate | |
| JPH0697670A (en) | Board for multilayer printed wiring | |
| JPH0753420B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JPS6169409A (en) | Manufacture of prepreg | |
| JP3542612B2 (en) | Metal clad laminate | |
| JPS6032655A (en) | One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof | |
| JPH01222955A (en) | Manufacture of laminated plate | |
| JPH04122644A (en) | Laminated board for electrical use | |
| JPH04223113A (en) | Manufacture of laminated sheet | |
| JPH03183186A (en) | Laminated board for electrical use | |
| JPS62173246A (en) | Metallic-foil lined laminated board | |
| JPH0688282B2 (en) | Method for manufacturing multilayer printed wiring board | |
| JPH0771839B2 (en) | Laminated board manufacturing method | |
| JPH06278222A (en) | Production of copper clad laminated sheet | |
| JPH04316390A (en) | One-side copper-plated laminated board | |
| JPS62162533A (en) | Single-sided metal-lined laminated board | |
| JPH0489253A (en) | Manufacture of laminated plate | |
| JPH03285391A (en) | Manufacture of multilayer wiring board | |
| JPS59232844A (en) | Manufacture of laminated board | |
| JPS6369635A (en) | Electrical laminated board | |
| JPH03183187A (en) | Laminated board for electrical use | |
| JPS60257591A (en) | Method of producing multilayer printed circuit board | |
| JPS62124938A (en) | Manufacture of metallic-foil lined laminated board | |
| JPS6381036A (en) | Manufacture of laminated board | |
| JPH08267663A (en) | Single-sided metallic foil-clad laminate |