JPS6032655A - One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof - Google Patents

One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof

Info

Publication number
JPS6032655A
JPS6032655A JP14229983A JP14229983A JPS6032655A JP S6032655 A JPS6032655 A JP S6032655A JP 14229983 A JP14229983 A JP 14229983A JP 14229983 A JP14229983 A JP 14229983A JP S6032655 A JPS6032655 A JP S6032655A
Authority
JP
Japan
Prior art keywords
metal foil
base material
paper
base materials
sided metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14229983A
Other languages
Japanese (ja)
Inventor
八洲男 伏木
博康 古川
大泉 正征
実 一色
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP14229983A priority Critical patent/JPS6032655A/en
Publication of JPS6032655A publication Critical patent/JPS6032655A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は機械的、電気的特性にすぐれ、かつ反り特性の
改良された紙基材の片面金属箔張り積層板及びその製造
法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a paper-based single-sided metal foil-clad laminate having excellent mechanical and electrical properties and improved warping properties, and a method for producing the same.

近年、印刷回路基板の製造工程の自動化及び、印刷回路
基板への部品挿入の自動化の進展により、印刷回路基板
の反り、ねじれ防止に対する要求はますまず厳しいもの
となってきている。
In recent years, with the progress in automation of the manufacturing process of printed circuit boards and the automation of parts insertion into printed circuit boards, the requirements for preventing warpage and twisting of printed circuit boards have become increasingly severe.

片面金属箔張り積層板は積層板の片面のみに金属箔を張
り合わ・l゛た非対称な構造を有するため、金属箔張り
積層板の製造時や印刷回路基板の製造時に受ける加熱あ
るいは吸湿による金属箔と基板との膨張、収縮差により
不可避的に反り、ねじれが発生する。加熱の反りは積層
板が金属に比べ収縮するため金属箔面側を外側にしての
凸状の反り(プラス反り)となり、また吸湿による反り
は積層板の膨張により金属箔面側を内側にしての凹状の
反り (マイナス反り)となる。従来より、反り特性を
改善するための試みは種々行われているが、加熱による
プラス反りと吸湿によるマイナス反りの発41″をとも
に低域し、しかも機械的特性、電気的特性のすぐれた片
面金属箔張り積層板を得ることは極めて困難であった。
Single-sided metal foil-covered laminates have an asymmetric structure in which metal foil is pasted on only one side of the laminate, so the metal foil may be exposed to heat or moisture absorption during the manufacturing of metal foil-covered laminates or printed circuit boards. Warping and twisting inevitably occur due to the difference in expansion and contraction between the substrate and the substrate. Warping due to heating occurs when the laminate shrinks compared to metal, resulting in a convex warp (plus warpage) with the metal foil side facing outward, and warping due to moisture absorption results in a convex warpage (positive warpage) due to expansion of the laminate, with the metal foil side facing inward. This results in a concave warp (minus warp). Conventionally, various attempts have been made to improve warpage characteristics, but single-sided products have low levels of both positive warpage due to heating and negative warpage due to moisture absorption, and have excellent mechanical and electrical properties. It has been extremely difficult to obtain metal foil-clad laminates.

例えば樹脂として加熱や吸湿による膨張収縮の小さなも
のを使用したり、社(脂や基材の剛性を大きくすること
により反りを生じにくくすることが考えられるが、これ
らの方法は打抜加工性、衝撃強度等の機械的特性の低下
を招き、実用上大きな問題がある。
For example, it is possible to use a resin that expands and contracts less when heated or absorbs moisture, or to increase the rigidity of the resin or base material to make it less likely to warp. This causes a decrease in mechanical properties such as impact strength, which poses a serious problem in practice.

かかる現状に鑑み、本発明者らが鋭意検耐を行った結果
、基材としてクラフト紙を以下説明するように適宜組み
合わせることにより加熱によるプラス反り、吸湿による
マイナス反りともに少なく、しかも機械的特性、電気的
特性ともにすくれた片面金属箔張り積層板が得られるこ
とを見い出し、本発明に至った。すなわち本発明は、硬
化性樹脂液を含浸した複数枚の基材と接着材つきの金属
箔を積層、硬化してなる片面金属箔張り積層板において
、複数枚の基材がクラフト紙とリンター紙から構成され
、1枚または複数枚からなるリンター紙の基材の中心が
基材全体の中心と一致するか、あるいは金属箔から遠い
側に位置し、しかも複数枚の基材の最も外側の層が両側
ともクラフト紙で構成されていることを特徴とする片面
金属箔張り積層板を提供することにある。5枚の基材か
らなる片面金属箔張り積層板の場合について本発明の基
材の構成を例示すれば第1図ないし第5図の如くである
。1枚あるいは複数枚の基材の中心が基材全体の中心と
一致するかあるいは金属箔から遠い側に位置するように
配置している理由は、反り、特に吸湿によるマイナス反
りの発生を少なくするためである。基材の構成に非対称
構造を導入することにより反りが改良される理由につい
ては必ずしも明らかではないが、クラフト紙とリンター
紙の吸湿や加熱による膨張、収縮の差が微妙に作用して
いるものと考えられる。
In view of this current situation, the inventors of the present invention have carried out extensive testing and testing, and have found that by appropriately combining kraft paper as a base material as explained below, both positive warping due to heating and negative warping due to moisture absorption are small, and the mechanical properties are good. It has been discovered that a single-sided metal foil-clad laminate with excellent electrical properties can be obtained, leading to the present invention. That is, the present invention provides a single-sided metal foil-covered laminate formed by laminating and curing a plurality of base materials impregnated with a curable resin liquid and metal foil with an adhesive, in which the plurality of base materials are made of kraft paper and linter paper. The center of the base material of the linter paper, which consists of one or more sheets of linter paper, coincides with the center of the entire base material, or is located on the far side from the metal foil, and the outermost layer of the plurality of base materials is To provide a single-sided metal foil-covered laminate characterized in that both sides are made of kraft paper. An example of the structure of the base material of the present invention in the case of a single-sided metal foil-clad laminate consisting of five base materials is shown in FIGS. 1 to 5. The reason why the center of one or more base materials is aligned with the center of the entire base material or located on the side far from the metal foil is to reduce the occurrence of warping, especially negative warping due to moisture absorption. It's for a reason. The reason why warping is improved by introducing an asymmetric structure into the base material composition is not necessarily clear, but it is thought that the subtle differences in expansion and contraction due to moisture absorption and heating between kraft paper and linter paper are at play. Conceivable.

次に、複数枚の基材の最も外側の層をクラフト紙とする
理由は、一つは、リンター紙による曲げ強度、剛性、衝
撃強度等の機械的特性の低下を防ぐためである。例えば
、第1図において1枚のリンター紙を銅箔に最も近い最
上層かあるいは銅箔と最も遠い最下層に用いた場合、積
層板の曲げ強度、剛性、(h撃強度の低下が大きくなる
。また別の理由はリンター紙を銅箔と最も遠い層に配置
すると加熱によるプラス反りが強くなりすぎる傾向があ
るためである。使用するリンター紙の枚数に制限はない
が、リンター紙トータルの厚みがクラフト紙トータルの
厚みより薄くなるように枚数を調整するのが反り特性及
び機械的特性の観点から好ましい。
Next, one reason why the outermost layer of the plurality of base materials is made of kraft paper is to prevent deterioration of mechanical properties such as bending strength, rigidity, and impact strength due to linter paper. For example, in Figure 1, if a sheet of linter paper is used on the top layer closest to the copper foil or the bottom layer furthest from the copper foil, the bending strength, rigidity, and (h impact strength) of the laminate will decrease significantly. Another reason is that if the linter paper is placed on the layer farthest from the copper foil, the positive warpage due to heating tends to become too strong.There is no limit to the number of sheets of linter paper that can be used, but the total thickness of the linter paper It is preferable from the viewpoint of warping characteristics and mechanical properties to adjust the number of sheets so that the kraft paper is thinner than the total thickness of the kraft paper.

図面において、第1図ないし第5図は、本発明の片面金
属箔張り積層板の拡大分解断面図である。
In the drawings, FIGS. 1 to 5 are enlarged exploded sectional views of the single-sided metal foil-clad laminate of the present invention.

1は金属箔、2はリンター紙層、3はクラフト紙層であ
る。金属箔1を除いた基材全体の中心A−Aは、第1図
、第4図および第5図の例ではリンター紙基材2の中心
と一致していることが見られる。また第2図および第3
図においては、リンター紙基材の中心B−Bは基材全体
の中心A−Aよりも金属箔1から遠い側に位置している
ことが見られる。いずれの場合も基材の最外側の層はク
ラフト紙2で構成されている。特にリンター紙基材の中
心B−Bが基材全体の中心A−Aよりも金属箔1から遠
い側に位置していることが吸湿によるマイナス反りが少
なく、好ましいことがわかった。
1 is a metal foil, 2 is a linter paper layer, and 3 is a kraft paper layer. It can be seen that the center A-A of the entire base material excluding the metal foil 1 coincides with the center of the linter paper base material 2 in the examples of FIGS. 1, 4, and 5. Also, Figures 2 and 3
In the figure, it can be seen that the center B-B of the linter paper base material is located on the side farther from the metal foil 1 than the center A-A of the entire base material. In both cases, the outermost layer of the base material is composed of kraft paper 2. In particular, it has been found that it is preferable for the center B-B of the linter paper base material to be located farther from the metal foil 1 than the center A-A of the entire base material, since negative warping due to moisture absorption is reduced.

本発明で基材として用いるクラフト紙、リンター紙は、
一般に電気用積層板の含浸紙として使用されているもの
であればいずれでもよい。密度が0.45〜0.60、
厚さが100〜350 μmのものが特に好適である。
The kraft paper and linter paper used as the base material in the present invention are:
Any paper that is generally used as impregnated paper for electrical laminates may be used. Density is 0.45-0.60,
Particularly suitable is one having a thickness of 100 to 350 μm.

これらの基材は硬化性樹脂を含浸する前にメラミン樹脂
、フェノール樹脂、エポキシ樹脂等を主成分とするセル
ロースと親和性を有する樹脂で予備処理されていること
が高度の電気的特性、耐水性および打抜加工性を具備す
るために望ましい。
Before being impregnated with the curable resin, these base materials are pre-treated with resins that have an affinity for cellulose, mainly composed of melamine resins, phenolic resins, epoxy resins, etc., resulting in advanced electrical properties and water resistance. It is desirable to have good punching workability.

本発明でいう硬化性樹脂とは、不飽和ポリエステル樹脂
、ジアクリルフタレート樹脂、ビニルエステル樹脂、フ
ェノール樹脂、メラミン樹脂、エポキシ樹脂等である。
The curable resin in the present invention includes unsaturated polyester resin, diacrylphthalate resin, vinyl ester resin, phenol resin, melamine resin, epoxy resin, and the like.

これらの中でも硬化に際して水分等の反応副生成物を本
質的に発生しない不飽和ポリエステル樹脂、ジアリルフ
タレート樹脂、ビニルエステル樹脂、エポキシ樹脂の場
合、本発明の効果は特に顕著に発揮される。上記の樹脂
の場合、製造直後の積層板の含水率は極めて低いために
、印刷回路基板の製造工程、印刷回路基板への部品の実
装工程あるいは在庫中、吸湿の影響を受けやすく、本発
明のようにリンター紙とクラフト紙を組み合わせること
により、マイナス反りの発生を防止することができる。
Among these, the effects of the present invention are particularly remarkable in the case of unsaturated polyester resins, diallyl phthalate resins, vinyl ester resins, and epoxy resins that essentially do not generate reaction by-products such as moisture during curing. In the case of the above resin, since the moisture content of the laminate immediately after production is extremely low, it is easily affected by moisture absorption during the printed circuit board manufacturing process, the component mounting process on the printed circuit board, or during inventory. By combining linter paper and kraft paper, the occurrence of negative warping can be prevented.

上記の如く硬化に際して反応副生成物を本質的に発生せ
ず、しかもそれ自身常温で液状の硬化性樹脂の場合、本
発明者らがすでに特開昭55−53013、特開昭56
−8227、特開昭56−98136等で提案している
ように、無圧連続製造法が適用でき、本発明の好ましい
実施態様である。
As mentioned above, in the case of a curable resin that essentially does not generate reaction by-products during curing and is itself liquid at room temperature, the present inventors have already developed
As proposed in JP-A-8227, JP-A-56-98136, etc., a pressureless continuous manufacturing method can be applied and is a preferred embodiment of the present invention.

金属箔としては、銅箔、アルミニウム箔、ニッケル箔、
鉄箔、ステンレス箔等があげられるが、通常は銅箔が用
いられる。なお接着材としてはフェノール樹脂系接着剤
、エポキシ樹脂接着剤、ビニルエステル系接着剤等いず
れを用いてもよい。
Metal foils include copper foil, aluminum foil, nickel foil,
Examples include iron foil, stainless steel foil, etc., but copper foil is usually used. Note that as the adhesive material, any of phenol resin adhesives, epoxy resin adhesives, vinyl ester adhesives, etc. may be used.

基剤に含浸する樹脂が不飽和ポリエステル樹脂の場合、
エポキシ系接着剤を用いると良好な半田耐熱性、接着強
度、反り特性が得られており、好ましい。
If the resin impregnated into the base is unsaturated polyester resin,
It is preferable to use an epoxy adhesive because it provides good soldering heat resistance, adhesive strength, and warpage characteristics.

次に本発明を実施例により説明する。Next, the present invention will be explained by examples.

実施例1〜5.比較例1〜3 不飽和ポリエステル (ポリマール3311.成田薬品製)100重量部にク
メンハイドロパーオキサイド1重量部、6%ナフテン酸
コバル) 0.2重量部からなる不飽和ポリエステル樹
脂液を調整した。メラミン樹脂(三相ケミカル製二カラ
ツクMX−031)で予備処理したクラフト紙(出隅国
策パルプZBS−135,10ミルス)とリンター紙(
ダイセル化学製C−10,10ミルス)に上記不飽和ポ
リエステル樹脂液で含浸を行い、第−表に示す基材構成
で樹脂含浸基材及びエポキシ樹脂系接着剤つき銅箔を積
み重ね、ロールにより一定厚みにしごいた後、110℃
で30分間、更に150℃で15分間の硬化を行い、厚
さ約1.6鶴の片面銅箔張り積層板を得た。得られた積
層板に銅箔残存率65%の回路をエツチングにより成形
し、160℃で10分間加熱した後の反りを測定した。
Examples 1-5. Comparative Examples 1 to 3 An unsaturated polyester resin liquid was prepared containing 100 parts by weight of unsaturated polyester (Polymer 3311, manufactured by Narita Pharmaceutical Co., Ltd.), 1 part by weight of cumene hydroperoxide, and 0.2 parts by weight of 6% cobal naphthenate. Kraft paper (Desumi Kokusaku Pulp ZBS-135, 10 mils) pretreated with melamine resin (Nikaratsuku MX-031 manufactured by Sansho Chemical Co., Ltd.) and linter paper (
Daicel Chemical Co., Ltd. C-10, 10 mils) was impregnated with the above unsaturated polyester resin liquid, and the resin-impregnated base material and copper foil with epoxy resin adhesive were stacked with the base material composition shown in Table 1, and then fixed by a roll. After squeezing to a thickness, 110℃
The mixture was cured for 30 minutes at 150° C. and further for 15 minutes at 150° C. to obtain a single-sided copper foil-clad laminate having a thickness of about 1.6 mm. A circuit with a copper foil residual rate of 65% was formed on the obtained laminate by etching, and the warp was measured after heating at 160° C. for 10 minutes.

さらにこの印刷回路基板を40℃85%RHの恒温恒湿
機に4日間放置した後の吸湿による反りについて測定を
行った。なお、基板の寸法は縦400mm、横340u
+で反りの測定は定盤上で四隅の高さを測定し、その平
均値を反り量とした。また反りとともに、曲げ強度及び
落球衝撃強度を測定した。実施例、比較例についてそれ
ぞれの銅張り積層板の性能を第−表に示す。
Further, this printed circuit board was left in a constant temperature and humidity machine at 40° C. and 85% RH for 4 days, and then warpage due to moisture absorption was measured. The dimensions of the board are 400mm long and 340u wide.
To measure warpage with +, the heights of the four corners were measured on a surface plate, and the average value was taken as the amount of warpage. In addition to warpage, bending strength and falling ball impact strength were also measured. Table 1 shows the performance of each copper-clad laminate for Examples and Comparative Examples.

(以下余白) 0(Margin below) 0

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第5図は本発明の実施例の片面金属箔張り
積層板の基材構成を示す断面図である。 1は金属箔、2はリンター紙、3はクラフト紙である。 2 第1図 第2図 第31”l!l 第4図 第5図
1 to 5 are cross-sectional views showing the structure of a base material of a single-sided metal foil-clad laminate according to an embodiment of the present invention. 1 is metal foil, 2 is linter paper, and 3 is kraft paper. 2 Figure 1 Figure 2 Figure 31"l!l Figure 4 Figure 5

Claims (1)

【特許請求の範囲】 [11硬化性樹脂液を含浸した複数枚の基材と接着材つ
きの金属箔を積層、硬化してなる片面金属箔張り積層板
において、複数枚の基材がクラフト紙とリンター紙から
構成され、1枚または複数枚からなるリンター紙の基材
の中心が基材全体の中心と一致するかあるいは金属箔か
ら遠い側に位置し、しかも複数枚の基材の最も外側の層
がクラフト紙で構成されていることを特徴とする片面金
属箔張り積層板。 (2)硬化性樹脂液が硬化に際して反応副生成物を本質
的に発生しない樹脂である特許請求の範囲第1項の片面
金属箔張り積層板。 (3)硬化樹脂液が不飽和ポリエステル樹脂である特許
請求の範囲第2項の片面金属箔張り積層板。 (4)接着剤がエポキシ樹脂系である特許請求の範囲第
1項ないし第3項のいずれかの片面金属箔張り積層板。 (5)複数枚の基材に硬化に際して反応副生成物を本質
的に発生せず、それ自身液状である硬化性樹脂液をそれ
ぞれ別個に連続的に含浸させ、該含浸基材と接着剤つき
の金属箔を連続的に積層し、実質的に無圧の条件下で連
続的に硬化して片面金属箔張り積層板を製造する方法に
おいて、複数枚の基材がクラフト紙とリンター紙からな
り、1枚または複数枚のリンター紙の基材の中心が基材
全体の中心と一致するかあるいは金属箔から遠い側に位
置し、しかも複数枚の基材の最も外側の層にクラフト紙
を用いることを特徴とする片面金属箔張り積層板の製造
法。
[Claims] [11] In a single-sided metal foil-covered laminate formed by laminating and curing a plurality of base materials impregnated with a curable resin liquid and a metal foil with an adhesive, the plurality of base materials are made of kraft paper and Consisting of linter paper, the center of the base material of one or more sheets of linter paper coincides with the center of the entire base material or is located on the far side from the metal foil, and the outermost part of the multiple base materials A single-sided metal foil-covered laminate characterized in that the layers are made of kraft paper. (2) The single-sided metal foil-clad laminate according to claim 1, wherein the curable resin liquid is a resin that essentially does not generate reaction by-products during curing. (3) The single-sided metal foil-clad laminate according to claim 2, wherein the cured resin liquid is an unsaturated polyester resin. (4) A single-sided metal foil-clad laminate according to any one of claims 1 to 3, wherein the adhesive is an epoxy resin-based adhesive. (5) A plurality of base materials are individually and continuously impregnated with a curable resin solution that essentially does not generate reaction by-products during curing and is itself liquid, and the impregnated base materials and adhesive-attached In a method of manufacturing a single-sided metal foil laminate by continuously laminating metal foils and curing them continuously under substantially no pressure conditions, the plurality of base materials are made of kraft paper and linter paper, The center of the base material of one or more sheets of linter paper coincides with the center of the entire base material or is located on the far side from the metal foil, and the outermost layer of the multiple sheets of base material is kraft paper. A method for producing a single-sided metal foil-clad laminate characterized by:
JP14229983A 1983-08-02 1983-08-02 One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof Pending JPS6032655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14229983A JPS6032655A (en) 1983-08-02 1983-08-02 One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14229983A JPS6032655A (en) 1983-08-02 1983-08-02 One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6032655A true JPS6032655A (en) 1985-02-19

Family

ID=15312144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14229983A Pending JPS6032655A (en) 1983-08-02 1983-08-02 One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6032655A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461241A (en) * 1987-09-02 1989-03-08 Matsushita Electric Works Ltd Laminate for electricity
JPS6461240A (en) * 1987-09-02 1989-03-08 Matsushita Electric Works Ltd Laminate for electric use
JPH01222955A (en) * 1988-03-03 1989-09-06 Hitachi Chem Co Ltd Manufacture of laminated plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553013A (en) * 1978-10-11 1980-04-18 Kanegafuchi Chemical Ind Method of manufacturing electric laminated plate
JPS5814739A (en) * 1981-07-20 1983-01-27 松下電工株式会社 Manufacture of metallic foil lined laminated board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553013A (en) * 1978-10-11 1980-04-18 Kanegafuchi Chemical Ind Method of manufacturing electric laminated plate
JPS5814739A (en) * 1981-07-20 1983-01-27 松下電工株式会社 Manufacture of metallic foil lined laminated board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461241A (en) * 1987-09-02 1989-03-08 Matsushita Electric Works Ltd Laminate for electricity
JPS6461240A (en) * 1987-09-02 1989-03-08 Matsushita Electric Works Ltd Laminate for electric use
JPH01222955A (en) * 1988-03-03 1989-09-06 Hitachi Chem Co Ltd Manufacture of laminated plate

Similar Documents

Publication Publication Date Title
JPS6032655A (en) One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof
JPS5947973B2 (en) Manufacturing method of laminates
JPS6319246A (en) Multilayer copper-lined laminated board
JPH01238932A (en) Composite one side face metal laminated plate
JP3350908B2 (en) Single-sided metal-clad laminate
JPH01317758A (en) Single surface metal clad laminated sheet
JPH02133983A (en) Manufacture of copper-clad laminated plate
JPS6381036A (en) Manufacture of laminated board
JPS61202834A (en) Copper lined laminated board
JPS60174647A (en) Paper base-material epoxy resin laminated board
JPS6140094A (en) Method of producing multilayer circuit board
JPS62162532A (en) Single-sided metal-lined laminated board
JPS60145840A (en) Single-side metallic foil lined laminated board
JPS6226195Y2 (en)
JPS62238680A (en) Printed wiring board
JPS62162533A (en) Single-sided metal-lined laminated board
JPH0497838A (en) Copper plated laminated sheet
JPH0688282B2 (en) Method for manufacturing multilayer printed wiring board
JPS61135738A (en) Multilayer board
JPH0655480B2 (en) Laminated board manufacturing method
JPS60201946A (en) Manufacture of metallic foil lined laminated board
JPS6060796A (en) Method of producing printed circuit board
JPS6369638A (en) Electrical laminated board
JPS62124938A (en) Manufacture of metallic-foil lined laminated board
JPS5989487A (en) Method of producing printed circuit board paper substrate laminate plate