JPS60201946A - Manufacture of metallic foil lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a metal foil-clad laminate having high rigidity.

Conventionally, metal foil-clad laminates that can be punched have a size of 10 to 1
A prepreg obtained by impregnating and drying a 1 mils paper base material with an oil-modified phenol resin is laminated and molded. As for the plate thickness,
Most of them are 16wn to 0.8 gates.

Metal foil-clad laminates are used as printed circuit boards, and as circuits are becoming more densely patterned, especially in the consumer electronics field, and boards are becoming lighter, they are being used to promote weight reduction. There are some cases in which paper-based phenolic resin laminates cannot be used.

In view of the above points, the present invention provides a lightweight and highly rigid metal foil-clad laminate by laminating and molding thin wooden boards impregnated with a phenolic resin and dried.

The present invention is a thin plate (1 m thick) of wood (beech, oak, etc.).
/mt), for example, is impregnated with a water-soluble full resin, further impregnated with a tung oil-modified thunol resin, dried, and then a predetermined number of sheets are stacked and molded under heat and pressure.

Since wood (thin board) has a stronger bonding force between fibers than a paper base material, even when it is made into a laminate, the strength is higher than that of a paper base material-two-nor resin laminate.

Next, the present invention will be explained in detail.

Example 1 A 0.251X thick beech veneer was impregnated with 15% by weight of water-soluble phenolic resin face and dried, and then further impregnated with tung oil-modified phenolic resin and dried to obtain a prepreg. The resin content of this prepreg was 47% by weight. 8 sheets of this prepreg are stacked, and a 35j thick copper foil is placed on the surface.
A copper clad laminate having a thickness of 1.61 was obtained by heating and pressing at 60°C and 100 kg yal. (referred to as Invention Product 1) Example 2 A 1.0X thick beech veneer was impregnated with varnish and dried in the same manner as in Example 1 to obtain a prepreg. The resin content of this prepreg was 45% by weight.

Two sheets of this prepreg were stacked, and a 35μ thick copper foil was placed on the surface, and heated and pressed at 160°C'100ky/d.
．． A copper-clad laminate having a thickness of 61 mm was obtained. (Referred to as Invention Product 2) Comparative Example 1. A 21-thick beech veneer was impregnated with varnish and dried in the same manner as in Example 1 to obtain a prepreg. The resin content of this prepreg was 40% by weight.

Layer two sheets of this prepreg and place a 35μ thick copper foil on the surface to achieve a temperature of 160°C - IQOk! Heat and pressurize with .
．． A 6X thick copper clad laminate was obtained.

(Referred to as a comparative product) Conventional Example 10 mils kraft paper was impregnated with 15 layers of water-soluble phenolic resin varnish, dried, and further impregnated with tung oil-modified phenolic resin and dried to obtain a prepreg. The resin content of this prepreg was 50% by weight. Layer 8 sheets of this prepreg and place 35# thick copper foil on the surface and heat to 160°C-100 for 17cu.
A 1.6X copper-clad laminate was obtained by heating and pressing at t. (referred to as conventional product) The characteristics of the laminates obtained in the above examples, comparative examples, and conventional examples were
Shown in the table.

Table 1 As shown in Table 1, in the present invention, the paper base material
It is equivalent to a 7-Nol resin laminate (conventional product), and has higher rigidity (larger bending strength and flexural modulus) than a paper base-2Nol resin laminate. Therefore, it is possible to sufficiently reduce the thickness (light weight) of the substrate when used as a printed circuit board.

Regarding the comparative product, when the thickness of the thin plate exceeds 1 wm, varnish impregnation rapidly deteriorates, and the general properties and punching workability of the laminate deteriorate.

patent applicant Shin-Kobe Electric Co., Ltd.

Claims (1)

[Claims] A method for manufacturing a metal foil-clad laminate, which comprises impregnating and drying a thin wood board not exceeding one fin in thickness with a phenol resin, overlapping an appropriate number of metal foils on the surface, and laminating and molding the sheets.