JPS6169409A - Manufacture of prepreg - Google Patents
Manufacture of prepregInfo
- Publication number
- JPS6169409A JPS6169409A JP19350984A JP19350984A JPS6169409A JP S6169409 A JPS6169409 A JP S6169409A JP 19350984 A JP19350984 A JP 19350984A JP 19350984 A JP19350984 A JP 19350984A JP S6169409 A JPS6169409 A JP S6169409A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thickness
- base materials
- prepreg
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、電子機器用積層板等に用いられるプリプレ
グの製法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for producing prepreg used for laminates for electronic devices and the like.
プリプレグは、プリプレグ所定枚を銅箔とともに積層成
形して銅張積層板をつくったり、内層用プリント配線板
の両側にプリプレグ、さらにその外側に銅箔を配置する
ようにして積層成形し、多層銅張積層板をつくるという
ようにして用いられている。Prepreg is produced by laminating and molding predetermined sheets of prepreg together with copper foil to make a copper-clad laminate, or by laminating and molding prepreg by placing prepreg on both sides of an inner layer printed wiring board and copper foil on the outside. It is used to make stretched laminates.
プリプレグは、普通、基材に樹脂を含浸させたのち、樹
脂が半硬化するよう乾燥させてつくられるが、基材とし
てガラス布等のガラス基材が用いられている場合、この
ようにしてつくられたプリプレグを用いて積層板をつく
ると、■得られる積層板の耐熱性が悪くなる、■プリプ
レグの使用枚数が決められているときは、得られる積層
板が所望の厚みより薄くても、それ以上厚みを厚くする
ことができない、■得られる積層板の表面平滑性が悪い
、■積層成形時の成形性も悪いといったような問題が生
じていた。たとえば、ガラスエポキシ積N坂の製造にお
いては、ガラス布にエポキシ樹脂を含浸させたプリプレ
グが用いられるが、このようなプリプレグの樹脂含有率
は、ガラス布の見かけ体積と実容積の関係から、普通、
43重量%以下(比較的厚手で標準タイプのガラス布で
ある日東紡績株式会社製の7628タイプ等の場合)で
あって、ガラス布は樹脂とのなじみがあまりよくないと
いった理由で、これ以上樹脂含有率を増やすことは困難
である。そのため、プリプレグに含ませる樹脂を増やす
ことにより、積層板中に含ませる樹脂量を増やして積層
板の厚みを厚くするといったようなことができず、8枚
のエポキシ樹脂含浸ガラス布を積層して1.6鶴程度の
厚みの積層板つくろうとしても、せいぜい、1.5鶴ぐ
らいにしかすることができない。また、プリプレグの樹
脂含有率が少ないため、積層成形後、第1図に示されて
いるように、ガラス布1.1同志が接触する部分ができ
て、樹脂による両者間の接着力が低下し、眉間剥離が発
生しやすくなって耐熱性が悪くなることが多く、ガラス
繊維が厚き出て表面子?・ 滑性が悪くなっ
たり・積層成形特番こブリブ′り゛同志が互いにずれる
等して成形性が悪くなったりすることも多かった。図中
、1aはガラス糸である〔発明の目的〕
この発明は、このような事情に鑑みてなされたもので、
樹脂含浸基材の使用枚数が同じであっても積層板の厚み
を従来よりも厚くすることができ、積層成形時の成形性
が良好で、しかも、表面平滑性および耐熱性の良好な積
層板を得ることのできるプリプレグの製法を提供するこ
とを目的としている。Prepreg is usually made by impregnating a base material with resin and then drying it so that the resin is semi-hardened. However, if a glass base material such as glass cloth is used as the base material, it can be made in this way. If a laminate is made using prepreg, the heat resistance of the resulting laminate will deteriorate; ■When the number of prepregs to be used is determined, even if the resulting laminate is thinner than the desired thickness, Problems such as the inability to increase the thickness further, (1) poor surface smoothness of the resulting laminate, and (2) poor formability during lamination molding have occurred. For example, in the manufacture of glass epoxy stacked N-slopes, a prepreg made by impregnating a glass cloth with an epoxy resin is used, but the resin content of such prepreg is usually determined from the relationship between the apparent volume and the actual volume of the glass cloth. ,
43% by weight or less (in the case of 7628 type manufactured by Nittobo Co., Ltd., which is a relatively thick and standard type of glass cloth), and glass cloth does not blend well with resin, so it is difficult to use resin any more. It is difficult to increase the content. Therefore, it is not possible to increase the thickness of the laminate by increasing the amount of resin contained in the prepreg, and it is not possible to increase the thickness of the laminate by increasing the amount of resin contained in the prepreg. Even if you try to make a laminate with a thickness of about 1.6 tsuru, you can only make it about 1.5 tsuru thick at most. In addition, since the resin content of the prepreg is low, after lamination molding, as shown in Figure 1, there are areas where the glass cloths 1 and 1 come into contact with each other, reducing the adhesive force between them due to the resin. , peeling between the eyebrows is more likely to occur, heat resistance often deteriorates, and the glass fibers become thicker and the surface becomes softer. - In many cases, moldability deteriorated due to poor lubricity and laminated molding special number ribs shifting from each other. In the figure, 1a is a glass thread [Object of the invention] This invention was made in view of the above circumstances,
Even if the number of resin-impregnated base materials used is the same, the thickness of the laminate can be made thicker than before, and the laminate has good formability during lamination molding, as well as good surface smoothness and heat resistance. The purpose is to provide a method for producing prepreg that can obtain the following.
前記のような目的を達成するため、この発明は、ガラス
基材に樹脂を含浸させ、一旦乾燥させたのち、表裏面合
わせて10μm以上の厚みで樹脂を塗布するようにする
プリプレグの製法をその要旨゛としている。以下に、こ
の発明の詳細な説明する。In order to achieve the above-mentioned objects, the present invention proposes a prepreg manufacturing method in which a glass substrate is impregnated with resin, once dried, and then the resin is applied to the front and back surfaces with a total thickness of 10 μm or more. This is the summary. The present invention will be explained in detail below.
この発明にかかるプリプレグの製法では、ガラス基材に
樹脂を含浸させたのち、樹脂を半硬化させるため一旦乾
燥させ、つぎに、表裏面合わせて10μm以上の厚みと
なるよう樹脂を塗布して樹脂層を設けるようにする。表
裏面に、それぞれ、同じ厚みの樹脂層を設けるようにし
てもよいし、表裏面の樹脂層の厚みが異なっていてもよ
い。要するに、表裏面合計で10μm以上になればよい
のである。必要に応じて、樹脂層を半硬化させる。この
ようにして得られたプリプレグを積層成形するようにす
る。そうすると、得られる積層板は、第2図に示されて
いるように、基材1,1間に10μm程度以上等適宜の
厚みの樹脂N2ができるので、基材1,1同志が接触す
ることがなくなり、樹脂による両基材1,1間の接着力
が充分高いものとなる。図中、1aはガラス糸である。In the prepreg manufacturing method according to the present invention, a glass base material is impregnated with resin, then dried to semi-cure the resin, and then coated with resin to a thickness of 10 μm or more on both front and back surfaces. Try to create layers. The resin layers may have the same thickness on the front and back surfaces, or the resin layers on the front and back surfaces may have different thicknesses. In short, it is sufficient that the total thickness of the front and back surfaces is 10 μm or more. If necessary, the resin layer is semi-cured. The prepreg thus obtained is laminated and molded. Then, in the resulting laminate, as shown in FIG. 2, resin N2 with an appropriate thickness of about 10 μm or more is formed between the base materials 1, 1, so that the base materials 1, 1 do not come into contact with each other. , and the adhesive strength between the two base materials 1 and 1 due to the resin becomes sufficiently high. In the figure, 1a is a glass thread.
それと同時に、積層板の厚みを樹脂要分だけ厚(するこ
ともできる。また、プリプレグの表面に樹脂層ができて
、ガラス糸が隠されるので、積層板の平滑性も向上し、
基材間の樹脂層が介在した状態で成形するので、基材同
志がずれるといったようなことが起こらず成形性も向上
する。基材間の樹脂層の厚みが10μm未満では、基材
間で充分な接着力が得られず、成形性もあまり良くない
といつた不都合が生じる。最外層に用いるプリプレグの
外側面の樹脂層の厚みは5μm以上とするのがよい。5
μm未満では得られる積層板の平滑性が低下する傾向に
あるからである。たとえば、5μmの厚みの樹脂層を設
けるようにした場合、積層板の表面粗さが、樹脂層のな
い場合に3〜3.5μmであるのに対して2.0μm程
度に減少する。また、銅箔等の金属箔を最外側に配置す
るようにした場合、最外側の基材と金属箔との間の接着
力が低下する傾向にあるからでもある。プリプレグ中の
樹脂の割合は55体積%以上とするのがよい。At the same time, the thickness of the laminate can be increased by the amount of resin required.Also, since a resin layer is formed on the surface of the prepreg and the glass threads are hidden, the smoothness of the laminate is improved.
Since molding is performed with a resin layer interposed between the base materials, the base materials do not shift from each other, and moldability is also improved. If the thickness of the resin layer between the base materials is less than 10 μm, there will be problems such as insufficient adhesion between the base materials and poor moldability. The thickness of the resin layer on the outer surface of the prepreg used as the outermost layer is preferably 5 μm or more. 5
This is because if the thickness is less than μm, the smoothness of the resulting laminate tends to decrease. For example, when a resin layer with a thickness of 5 μm is provided, the surface roughness of the laminate is reduced to about 2.0 μm, whereas it is 3 to 3.5 μm when there is no resin layer. Another reason is that when a metal foil such as copper foil is placed on the outermost side, the adhesive force between the outermost base material and the metal foil tends to decrease. The proportion of resin in the prepreg is preferably 55% by volume or more.
この発明にかかるプリプレグの製法では、ガラス布、ガ
ラス不織布といったガラスからなる基材が用いられる。In the prepreg manufacturing method according to the present invention, a base material made of glass such as glass cloth or glass nonwoven fabric is used.
ガラスのほかに他の成分が多少加えられるようであって
もよい。樹脂の種類は特に限定されない。たとえば、エ
ポキシ樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂
等が用いられる。Besides the glass, some other ingredients may also be added. The type of resin is not particularly limited. For example, epoxy resin, unsaturated polyester resin, polyimide resin, etc. are used.
この発明にかかるプリプレグの製法では、ガラス基材に
樹脂を含浸させ、一旦乾燥させたのち、表裏面合わせて
10μm以上の厚みで樹脂を塗布するようにするので、
樹脂含浸基材の使用枚数が同じであっても積層板の厚み
を従来よりも厚くすることかでき、積層成形時の成形性
が良好で、しかも、表面平滑性および耐熱性の良好な積
層板を得ることができる。In the prepreg manufacturing method according to the present invention, a glass substrate is impregnated with resin, once dried, and then the resin is applied to a thickness of 10 μm or more on the front and back surfaces.
Even if the number of resin-impregnated substrates used is the same, the thickness of the laminate can be made thicker than before, and the laminate has good formability during lamination molding, and also has good surface smoothness and heat resistance. can be obtained.
第1図は従来の製法により得られたプリプレグを用いて
つくった積層板の一部拡大縦断面図、第2図はこの発明
にかかる製法により得られたプリプレグを用いてつくっ
た積層板の一部拡大縦断面図である。
代理人 弁理士 松 本 武 彦
第1図
第2図FIG. 1 is a partially enlarged vertical cross-sectional view of a laminate made using prepreg obtained by a conventional manufacturing method, and FIG. FIG. Agent: Patent Attorney Takehiko Matsumoto Figure 1 Figure 2
Claims (4)
ち、表裏面合わせて10μm以上の厚みで樹脂を塗布す
るようにするプリプレグの製法。(1) A prepreg manufacturing method in which a glass substrate is impregnated with a resin, once dried, and then the resin is applied to a thickness of 10 μm or more on both front and back surfaces.
項記載のプリプレグの製法。(2) Claim 1 in which the glass substrate is glass cloth
Prepreg manufacturing method described in section.
樹脂である特許請求の範囲第1項または第2項記載のプ
リプレグの製法。(3) The method for producing a prepreg according to claim 1 or 2, wherein the resin is an epoxy resin and/or a polyimide resin.
る特許請求の範囲第1項から第3項までのいずれかに記
載のプリプレグの製法。(4) The method for producing a prepreg according to any one of claims 1 to 3, wherein the proportion of resin in the prepreg is 55% by volume or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19350984A JPS6169409A (en) | 1984-09-14 | 1984-09-14 | Manufacture of prepreg |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19350984A JPS6169409A (en) | 1984-09-14 | 1984-09-14 | Manufacture of prepreg |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6169409A true JPS6169409A (en) | 1986-04-10 |
Family
ID=16309237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19350984A Pending JPS6169409A (en) | 1984-09-14 | 1984-09-14 | Manufacture of prepreg |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6169409A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04111603U (en) * | 1991-03-12 | 1992-09-29 | ヤマハ株式会社 | manual operation device |
WO2002034023A1 (en) * | 2000-10-16 | 2002-04-25 | Matsushita Electric Industrial Co., Ltd. | Circuit forming board producing method, circuit forming board, and material for circuit forming board |
US6799369B2 (en) | 2000-08-28 | 2004-10-05 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method for producing the same |
US10510489B2 (en) | 2016-03-18 | 2019-12-17 | Murata Manufacturing Co., Ltd. | Mounting structure and multilayer capacitor built-in substrate |
-
1984
- 1984-09-14 JP JP19350984A patent/JPS6169409A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04111603U (en) * | 1991-03-12 | 1992-09-29 | ヤマハ株式会社 | manual operation device |
US6799369B2 (en) | 2000-08-28 | 2004-10-05 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method for producing the same |
WO2002034023A1 (en) * | 2000-10-16 | 2002-04-25 | Matsushita Electric Industrial Co., Ltd. | Circuit forming board producing method, circuit forming board, and material for circuit forming board |
US6833042B2 (en) | 2000-10-16 | 2004-12-21 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board |
US7754321B2 (en) | 2000-10-16 | 2010-07-13 | Panasonic Corporation | Method of manufacturing clad board for forming circuitry, clad board and core board for clad board |
US10510489B2 (en) | 2016-03-18 | 2019-12-17 | Murata Manufacturing Co., Ltd. | Mounting structure and multilayer capacitor built-in substrate |
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