JPS6377737A - Composite metallic-foil lined laminated board - Google Patents
Composite metallic-foil lined laminated boardInfo
- Publication number
- JPS6377737A JPS6377737A JP22326586A JP22326586A JPS6377737A JP S6377737 A JPS6377737 A JP S6377737A JP 22326586 A JP22326586 A JP 22326586A JP 22326586 A JP22326586 A JP 22326586A JP S6377737 A JPS6377737 A JP S6377737A
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- thickness
- sides
- glass cloth
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 title claims description 30
- 239000002131 composite material Substances 0.000 title claims description 17
- 229920005989 resin Polymers 0.000 claims description 70
- 239000011347 resin Substances 0.000 claims description 70
- 239000011521 glass Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 31
- 239000004744 fabric Substances 0.000 claims description 30
- 239000011162 core material Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 65
- 239000000758 substrate Substances 0.000 description 21
- 239000004745 nonwoven fabric Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011188 CEM-1 Substances 0.000 description 1
- 239000011190 CEM-3 Substances 0.000 description 1
- 101100257127 Caenorhabditis elegans sma-2 gene Proteins 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔技術分野〕 この発明は、コンポジット金属箔張り積層板に関する。[Detailed description of the invention] 〔Technical field〕 The present invention relates to a composite metal foil laminate.
近年、電子機器の高密度化、高性能化、低価格化が急速
に進み、これに使用される金属箔張り積層板に対して、
絶縁性、信頼性、打抜加工性、そりおよびねじれの安定
性、コストなどについて高い要求がされるようになって
きている。In recent years, the density, performance, and price of electronic devices have rapidly increased, and the metal foil laminates used in these devices have
High demands are being placed on insulation, reliability, punching workability, stability against warpage and torsion, cost, etc.
こうした背景の中で、従来がら多く使用されているＦＲ
−４，Ｇ−１０等のガラスエポキシ金属箔張り積層板に
対し、打抜加工性に優れ、コスト面で有利なＣＥＭ−３
，ＣＥＭ−１等のコンポジット金属箔張り積層板が注目
され始めている。Against this background, FR, which has traditionally been widely used,
-4, G-10 and other glass epoxy metal foil clad laminates, CEM-3 has excellent punching workability and is advantageous in terms of cost.
, CEM-1 and other composite metal foil laminates are beginning to attract attention.
しかし、従来、コンポジット金属箔張り積層板は、バッ
チ式のプレス工法でつくられていたが、そりおよびねじ
れが大きく、ガラスエポキシ金属箔張り積層板に取って
変わることができなかった〔発明の目的〕
以上の事情に鑑みて、この発明は、そりおよびねしれの
小さなコンボジノＩ・金属箔張り積層板を提供すること
を目的とする。However, conventionally, composite metal foil-clad laminates were made using a batch press method, but they were prone to warping and twisting, and could not be used as a substitute for glass-epoxy metal foil-clad laminates. ] In view of the above circumstances, an object of the present invention is to provide a Combobino I metal foil-clad laminate with small warpage and twist.
前記目的を達成するため、この発明は、芯Ｈの両側にガ
ラス布基材が配置され、さらにその両側に金属箔が配置
されるとともにそれぞれの間に樹脂層が形成されるよ・
うにして、これらが積層成形されてなるコンポジット金
属箔張り積層板であって、芯＋４とその両側のガラス布
基材との間の樹脂層の厚みがそれぞれ１０〜１００μｍ
、ガラス布基材とその両側の金属溶きの間の樹脂層の厚
みがそれぞれ１０〜５０μｍ１芯祠とその両側のガラス
布基材との間の樹脂層の−・方と他方との厚みの差が６
０μｍ以下、ガラス布基材とその両側の金属箔との間の
樹脂層の一方と他方との厚みの差が３０ ｉｔ ｍ以下
になっていることを特徴とするコンポジット金属箔張り
積層板をその要旨としている以下に、この発明を、その
一実施例をあられず図面を参照しながら詳しく説明する
。In order to achieve the above object, the present invention provides a method in which glass cloth substrates are arranged on both sides of the core H, metal foils are further arranged on both sides, and a resin layer is formed between them.
A composite metal foil-clad laminate is obtained by laminating and molding these materials, and the thickness of the resin layer between the core +4 and the glass cloth base material on both sides thereof is 10 to 100 μm, respectively.
, the thickness of the resin layer between the glass cloth base material and the metal welding on both sides thereof is 10 to 50 μm, respectively.The difference in the thickness of the resin layer between the 1-core shrine and the glass cloth base materials on both sides. is 6
The composite metal foil clad laminate is characterized in that the thickness difference between one resin layer and the other resin layer between the glass cloth base material and the metal foil on both sides is 30 it m or less. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図は、この発明にかかるコンボシソ）金属箔張り積
層板の一実施例をあられしている。図にのるように、こ
のｒｌンボジノＩ・金属箔張り積層板は、８十Ａとして
ガラス不織布基材１が用いらＪ９．３枚のガラス不織布
基材１の両側に２枚のカラス布基材（ガラスフじ１ス＆
ｔｔ）２が配；〃され、さらにその両側Ｑこ金属箔４が
配置されるとともにそれぞれの間に樹脂層５・〜９が形
成されるようにして積層成形されてなり、ガラス不織布
基材１．ガラス布基＋Ａ２および樹脂層５〜９で基板１
２が構成されていて、この基板１２の両面に金属箔４か
張られたようになっている。樹脂層６〜９の厚みは、ガ
ラス不織布基材１とその両側のガラス布基材２との間の
樹脂層（以下、ｒ ｌｘ側基材間樹脂層」、ＦＦ側基林
間樹脂層１と言う）６，７の厚みがそれぞれ１０〜１０
０μｍ１ガラス布基材２とその両側の金属箔４との間の
樹脂層（以下、［」−４側表層樹脂層」、１下側表層樹
脂層」とｄう）８゜９の厚みがそれぞれ１０〜５０μｍ
、１−側基材間樹脂層６とド側基材間樹脂層７との厚み
の差が〔；０μｍ以下、１−側表層樹脂層８と上側表層
樹脂層９との厚みの差が３０μｍ以下になっている。FIG. 1 shows an embodiment of a metal foil-clad laminate according to the present invention. As shown in the figure, this rl nbojino I metal foil clad laminate has a glass non-woven fabric substrate 1 of 80A and two glass cloth substrates on both sides of J9.3 glass non-woven fabric substrates 1. Material (Glass Fuji 1st &
tt) 2 is disposed, metal foils 4 are further disposed on both sides thereof, and resin layers 5 to 9 are formed between them, so that the glass nonwoven fabric base material 1 is laminated. ．． Substrate 1 with glass cloth base + A2 and resin layers 5 to 9
2, and metal foil 4 is pasted on both sides of this substrate 12. The thickness of the resin layers 6 to 9 is the same as the resin layer between the glass nonwoven fabric base material 1 and the glass cloth base materials 2 on both sides thereof (hereinafter referred to as "rlx side intersubstrate resin layer", and the FF side base resin layer 1). ) The thickness of 6 and 7 is 10 to 10 respectively.
The resin layer between the glass cloth base material 2 and the metal foils 4 on both sides (hereinafter referred to as "-4 side surface resin layer", 1 lower surface resin layer") has a thickness of 8°9, respectively. 10~50μm
, the difference in thickness between the 1-side inter-substrate resin layer 6 and the do-side inter-substrate resin layer 7 is 0 μm or less, and the difference in thickness between the 1-side surface resin layer 8 and the upper surface resin layer 9 is 30 μm It is as below.
このコンポジット金属箔張り積層板をつくるには、つぎ
のようにする。To make this composite metal foil laminate, proceed as follows.
第２図は前記コンポジット金属箔張り積層板の製法の要
部をあられし、第３図はそのＡ部拡大図をあられしてい
る。これらの図にみるように、３枚のガラス不織布基材
１と２枚のガラス布基材２とに不飽和樹脂ワニス３を連
続的に含浸させる。FIG. 2 shows the main part of the manufacturing method of the composite metal foil-clad laminate, and FIG. 3 shows an enlarged view of part A thereof. As shown in these figures, three glass nonwoven fabric substrates 1 and two glass cloth substrates 2 are continuously impregnated with an unsaturated resin varnish 3.
充分に浸透した時点で、ガラス不織布基材１の両側にガ
ラス布基材２が配置され、さらにその両側に金属箔４が
配置されるとともに、それぞれの間に樹脂層５〜９が形
成されるようにして、１対のラミネートロール１０間に
連続的に送り込み、０〜５０ｋｇ／ｃ１１程度の低圧で
積層成形する。この積層成形にあたっては、製造後にお
いて、ト側基林間樹脂層６９丁側基４４間樹脂層７の厚
みがそれぞれ１０〜１００８ｍ、上側表層樹脂層８．下
側表層樹脂層９の厚みがそれぞれ１０〜５０μｍ１上側
基月間樹脂層６と下側表層樹脂層７との厚みの差が６０
μｍ以下、上側表層樹脂層８と下側表層樹脂層９との厚
みの差が３ Ｑ ｐ ｒｎ以下になるように、ラミネー
トロ−ル１０間のクリアランス条件を合わせておく。こ
の後、得られた積層体］１を加熱硬化させて、アフター
キュアし、所定の寸法に切断して、第１図に示した基板
１２の両面に金属箔４が張られたコンポジ・／１・金属
箔張り積層板を得るようにするのである。At the time of sufficient penetration, the glass cloth base material 2 is arranged on both sides of the glass nonwoven fabric base material 1, and the metal foil 4 is further arranged on both sides, and resin layers 5 to 9 are formed between each. In this way, it is continuously fed between a pair of laminating rolls 10 and laminated and formed at a low pressure of about 0 to 50 kg/c11. In this laminated molding, after manufacturing, the thickness of the resin layer 7 between the front and rear 69 sides is 10 to 1008 m, and the thickness of the upper surface resin layer 8 is 10 to 1008 m. The thickness of the lower surface resin layer 9 is 10 to 50 μm, and the difference in thickness between the upper base resin layer 6 and the lower surface resin layer 7 is 60 μm.
The clearance conditions between the laminating rolls 10 are adjusted so that the difference in thickness between the upper surface resin layer 8 and the lower surface resin layer 9 is 3 Q prn or less. Thereafter, the obtained laminate] 1 is heat-cured, after-cured, and cut into a predetermined size to form a composite laminate 1 with metal foil 4 stretched on both sides of the substrate 12 shown in FIG. - A metal foil-clad laminate is obtained.
芯材としては、ガラス不織布基材以外の不織布基材や紙
基材、ガラスベーパ等を用いてもよいし、これらを複数
種使用してもよい。金属箔としては、銅箔、アルミニウ
ム箔等を用いる。不飽和樹ＭＦｉ”）ニスとしては、通
常用いられているものを使用する。含浸方法も、ロール
コータ法や塗布による方法など通常用いられている方法
を使用する。As the core material, a nonwoven fabric base material other than the glass nonwoven fabric base material, a paper base material, glass vapor, etc. may be used, or a plurality of types of these may be used. As the metal foil, copper foil, aluminum foil, etc. are used. As the unsaturated wood MFi'') varnish, a commonly used varnish is used.As for the impregnation method, a commonly used method such as a roll coater method or a coating method is used.
以上にみてきたように１、−の−】ンボジソト金属箔張
り積層板は、ガラス不織布基材（芯（わ １の両側にガ
ラス布基材２が配置され、さらにその両側に金属箔４が
配置されるととも乙こそれぞれの間に樹脂層５〜９が形
成されるようにして、これらが積層成形されてなり、＋
側基林間樹脂層６および下側ノλ祠間樹脂層７の厚みが
それぞれ１０−１００μＨ１、上側表層樹脂層８および
下側表層樹脂層９の厚みがそれぞれ１０〜５０μｍ、上
側Ｘ＋Ａ間樹脂層６と下側基材間樹脂層７との厚めの差
が６０μｍ以下、上側表層樹脂層８と下側表層樹脂層９
との厚みの差が３０μｍ以下になっているので、そりお
よびねじれが小さいものである。As we have seen above, the metal foil-clad laminate (1, -) has a glass non-woven fabric base material (core 1) with glass cloth base materials 2 placed on both sides, and metal foils 4 placed on both sides of the glass cloth base material 2. The resin layers 5 to 9 are formed between each layer, and these are laminated and molded.
The thickness of the side base resin layer 6 and the lower lambda shrine resin layer 7 is 10 to 100 μH1, respectively, the thickness of the upper surface resin layer 8 and the lower surface resin layer 9 is 10 to 50 μm, and the upper X+A resin layer 6 and the lower inter-substrate resin layer 7 have a thickness difference of 60 μm or less, the upper surface resin layer 8 and the lower surface resin layer 9
Since the difference in thickness is less than 30 μm, warping and twisting are small.
この発明では、ｈ （ｊ！１１基材間基材層樹脂層基材
間樹脂層の厚みがそれぞれ１０〜１００μｒｎ、上側表
層樹脂層と下側表層樹脂層の厚みがそれぞれ１０〜５０
μｍ、上側表層樹脂層と下側基材間樹脂層との厚みの差
が６０μｍ以下、上側表層樹脂層と下側表層樹脂層との
厚みの差が３０μｍ以下になっていることが必要である
。なぜなら、ト側基材間樹脂層と下側基材間樹脂層との
厚めの差が６０μｍを越えたり、上側表層樹脂層と下側
表層樹脂層との厚みの差が３０μｍを越えたりすると、
そりおよびねじれが著しく大きくなるからである。また
、−Ｉ−側基材間樹脂層および下側表層樹脂層の厚みが
１０μｍより小さくなると層間接着強度の低■Ｊを招き
、１１００ｔｚを越えると板厚Ｊｊ向の寸法変化率が大
きくなって、スルボール信頼性が低下するからであり、
上側表層樹脂層および下側表層樹脂層の厚みが１０１１
ｍより小さくなるとガラス布の目が金属箔表面に出やす
く、表面粗度が悪くなり、５Ｑ７ｚｍを越えると基板表
面に波打ちが出やすくなるからである。In this invention, h
μm, the difference in thickness between the upper surface resin layer and the lower inter-substrate resin layer must be 60 μm or less, and the difference in thickness between the upper surface resin layer and the lower surface resin layer must be 30 μm or less. . This is because if the difference in thickness between the upper and lower inter-substrate resin layers exceeds 60 μm, or the difference in thickness between the upper surface resin layer and the lower surface resin layer exceeds 30 μm,
This is because warping and twisting become significantly large. Furthermore, if the thickness of the -I- side intersubstrate resin layer and lower surface resin layer is less than 10 μm, the interlayer adhesion strength will be low, and if it exceeds 1100 tz, the dimensional change rate in the board thickness Jj direction will increase. , because the reliability of the surball decreases,
The thickness of the upper surface resin layer and the lower surface resin layer is 1011.
This is because if it is smaller than m, the grains of the glass cloth tend to appear on the surface of the metal foil, resulting in poor surface roughness, and if it exceeds 5Q7zm, undulations tend to appear on the substrate surface.
なお、ト側基材間樹脂層と下側基材間樹脂層との厚みの
差は３０μｍ以下が好ましく、−１−側表層樹脂層と下
側表層樹脂層との厚みの差は１５μｍ以下が好ましい。In addition, the difference in thickness between the top-side inter-substrate resin layer and the lower-side inter-substrate resin layer is preferably 30 μm or less, and the difference in thickness between the -1- side surface resin layer and the lower surface resin layer is preferably 15 μm or less. preferable.
つぎに、実施例と比較例とを示す。Next, examples and comparative examples will be shown.
（実施例１）
不飽和樹脂ワニスとして、市販のビニルエステル樹脂（
昭和高分子社製Ｒ−８０６ＤΔ）１００重璽車重クメン
ハイドロバーオキサ４１１重量部に、さらに２５℃の粘
度が５ボイズになるようにスチレンを添加したものを用
い、これをガラス布基材（日東紡績株ｉｔ会社製ＷＩＥ
−１８に−ＢＳ）２枚およびガラスペーパ基材（ＬＩ本
バイリーン株式会省製ＥＰ−４０３５）３枚に連続的に
含浸させた。充分に浸透させた時点で、３枚のガラスペ
ーパ基Ｈの両側にガラス布基材が配置され、さらにその
両側に電解銅箔（古河ザーヰットフォル株式会社製ＴＳ
ＴＯ，厚み１８μｍ）が配置されるとともに、それぞれ
の間に樹脂層が形成されるようにして、１対のラミネー
トロール間に連続的に送り込み、低圧で積層成形した。(Example 1) Commercially available vinyl ester resin (
Using 411 parts by weight of R-806DΔ (manufactured by Showa Kobunshi Co., Ltd.), 411 parts by weight of cumene hydroveroxa (manufactured by Showa Kobunshi Co., Ltd.), styrene was further added so that the viscosity at 25°C was 5 voids, and this was used as a glass cloth base material ( WIE made by Nitto Boseki IT company
-18-BS) and three glass paper substrates (EP-4035 manufactured by LI Hon Vilene Co., Ltd.) were impregnated continuously. When the penetration is sufficient, a glass cloth base material is placed on both sides of the three glass paper bases H, and electrolytic copper foil (TS manufactured by Furukawa Zarwitfor Co., Ltd.) is placed on both sides of the glass cloth base material.
TO, thickness 18 μm) were arranged, and a resin layer was formed between each roll, and the rolls were continuously fed between a pair of laminating rolls and laminated at low pressure.
その後、１００℃で２０分間加熱硬化させ、１６０℃で
２０分間アフターキエアして、厚み１．６璽■のコンポ
ジット銅張り積層板を得た。なお、ラミネートロール間
のクリアランスは、第１表に示す条件に設定した（実施
例２．３および比較例１，２）
ラミネー）・ロール間のクリアランスを第１表に示す条
件に変えた以外は、実施例１と同様にして、厚み１．６
ｍｍのコンポジット銅張り積層板を得た以上、得られ
た″１ンボジノト銅張り積層板を２５０Ｘ２５０ｍｍに
切断し、」−側表層樹脂層厚み。Thereafter, it was heated and cured at 100° C. for 20 minutes, and after-aired at 160° C. for 20 minutes to obtain a composite copper-clad laminate having a thickness of 1.6 mm. Note that the clearance between the laminating rolls was set to the conditions shown in Table 1 (Example 2.3 and Comparative Examples 1 and 2) except that the clearance between the rolls was changed to the conditions shown in Table 1. , in the same manner as in Example 1, with a thickness of 1.6
After obtaining a composite copper-clad laminate with a thickness of 1 mm, the obtained copper-clad laminate was cut into a size of 250 x 250 mm, and the thickness of the surface resin layer on the side was determined.
下側表層樹脂層厚め、上側基材間樹脂層厚みおよび下側
表層樹脂層厚童をそれぞれ測定した。その結果を第１表
に示す。その後、両側銅箔をエツチングにより除去して
、電気オーブンにて１３０°Ｃの恒温の空気中で１時間
加熱処ＰＰシてから冷却し、そりおよびねしれを測定し
た。その結果、実施例１が−０，８ｙａｗａ、実施例２
が ２．６ ａｓ、実施例３が−４，４ｍｍ、比較例１
が−７，３ａｍ、比較例２が−６，Ｏ＊＊であった。The thickness of the lower surface resin layer, the thickness of the upper inter-substrate resin layer, and the thickness of the lower surface resin layer were measured. The results are shown in Table 1. Thereafter, the copper foils on both sides were removed by etching, heat-treated in air at a constant temperature of 130° C. in an electric oven for 1 hour, and then cooled, and warpage and twisting were measured. As a result, Example 1 had -0.8 yawa, Example 2
is 2.6 as, Example 3 is -4.4 mm, Comparative Example 1
was -7.3 am, and Comparative Example 2 was -6.0**.
以上の結果かられかるように、実施例１〜３ば、比較例
１．２と比べて、そりおよびねしれが極めて小さくなっ
ている。As can be seen from the above results, the warpage and twisting of Examples 1 to 3 are extremely small compared to Comparative Examples 1 and 2.
この発明にかかるコンポジット金属箔張り積層板は、前
記実施例に限定されない。The composite metal foil clad laminate according to the present invention is not limited to the above embodiments.
以上にみてきたように、この発明にかかるコンポジット
金属箔張り積層板は、芯材の両側にガラス布基材が配置
され、さらにその両側に金属箔が配置されるとともにそ
れぞれの間に樹脂層が形成されるようにして、これらが
積層成形されてなるコンポジ、ノ］・金属箔張り積層板
であって、芯材とその両側のガラス布基材との間の樹脂
層の厚みがそれぞれ１０〜１００μｍ、ガラス布基材と
その両側の金属箔との間の樹脂層の厚みがそれぞれ１０
〜５０μｍ、芯材とその両側のガラス布基材との間の樹
脂層の一方と他力との厚みの差が６０ ｆｔｍ以下、ガ
ラス布基材とその両側の金属箔との間の樹脂層の一方と
他方との厚みの差が３０μｍ以下になっていることを特
徴としているため、そりおよびねじれの小さなコンボジ
ノ１−金属箔張り積層板を得ることができる。As seen above, the composite metal foil clad laminate according to the present invention has glass cloth base materials arranged on both sides of a core material, metal foils further arranged on both sides, and a resin layer between them. A metal foil-clad laminate, in which the thickness of the resin layer between the core material and the glass cloth base materials on both sides of the core material is 10 to 10%, respectively. 100 μm, and the thickness of the resin layer between the glass cloth base material and the metal foil on both sides is 10 μm, respectively.
~50 μm, the difference in thickness between one of the resin layers between the core material and the glass cloth substrate on both sides of it and the other layer is 60 ftm or less, the resin layer between the glass cloth substrate and the metal foil on both sides thereof Since the difference in thickness between one side and the other side is 30 μm or less, it is possible to obtain a composite metal foil-clad laminate with small warpage and twist.
第１図はこの発明にかかるコンポジット金属箔張り積層
板の一実施例をあられず断面図、第２図は前記実施例の
製法をあられず説明図、第３図は第２図のＡ部拡大図で
ある。
１・・・ガラス不織布（芯材） ２・・・ガラス布
４・・・金属箔 ６．７・・・８十Ａとその両側のガラ
ス布基材との間の樹脂層 ８，９・・・ガラス布基材と
その両側の金属箔との間の樹脂層Fig. 1 is a cross-sectional view of an embodiment of a composite metal foil-clad laminate according to the present invention, Fig. 2 is an explanatory diagram of the manufacturing method of the embodiment, and Fig. 3 is an enlarged view of part A of Fig. 2. It is a diagram. 1...Glass nonwoven fabric (core material) 2...Glass cloth
4...Metal foil 6.7...Resin layer between 80A and the glass cloth base material on both sides thereof 8,9...Resin between the glass cloth base material and the metal foil on both sides thereof layer
Claims (1)
の両側に金属箔が配置されるとともにそれぞれの間に樹
脂層が形成されるようにして、これらが積層成形されて
なるコンポジット金属箔張り積層板であって、芯材とそ
の両側のガラス布基材との間の樹脂層の厚みがそれぞれ
１０〜１００μｍ、ガラス布基材とその両側の金属箔と
の間の樹脂層の厚みがそれぞれ１０〜５０μｍ、芯材と
その両側のガラス布基材との間の樹脂層の一方と他方と
の厚みの差が６０μｍ以下、ガラス布基材とその両側の
金属箔との間の樹脂層の一方と他方との厚みの差が３０
μｍ以下になっていることを特徴とするコンポジット金
属箔張り積層板。(1) A composite metal made by laminating and molding glass cloth base materials on both sides of a core material, metal foils on both sides, and a resin layer formed between them. A foil-clad laminate, in which the thickness of the resin layer between the core material and the glass cloth base materials on both sides thereof is 10 to 100 μm, and the thickness of the resin layer between the glass cloth base material and the metal foils on both sides thereof. are each 10 to 50 μm, the difference in thickness between one and the other resin layer between the core material and the glass cloth base material on both sides is 60 μm or less, and the resin between the glass cloth base material and the metal foil on both sides thereof. The difference in thickness between one layer and the other is 30
A composite metal foil clad laminate characterized by a thickness of less than μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22326586A JPS6377737A (en) | 1986-09-19 | 1986-09-19 | Composite metallic-foil lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22326586A JPS6377737A (en) | 1986-09-19 | 1986-09-19 | Composite metallic-foil lined laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6377737A true JPS6377737A (en) | 1988-04-07 |
Family
ID=16795401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22326586A Pending JPS6377737A (en) | 1986-09-19 | 1986-09-19 | Composite metallic-foil lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6377737A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02252294A (en) * | 1989-03-25 | 1990-10-11 | Matsushita Electric Works Ltd | Manufacture of multilayer board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50136377A (en) * | 1974-04-17 | 1975-10-29 | ||
| JPS55103786A (en) * | 1979-02-02 | 1980-08-08 | Kanegafuchi Chemical Ind | Electric insulated laminated layer and printed circuit metal foil laminated plate |
-
1986
- 1986-09-19 JP JP22326586A patent/JPS6377737A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50136377A (en) * | 1974-04-17 | 1975-10-29 | ||
| JPS55103786A (en) * | 1979-02-02 | 1980-08-08 | Kanegafuchi Chemical Ind | Electric insulated laminated layer and printed circuit metal foil laminated plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02252294A (en) * | 1989-03-25 | 1990-10-11 | Matsushita Electric Works Ltd | Manufacture of multilayer board |
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