JPS62221535A - Single-sided metallic-foil lined composite laminated board - Google Patents
Single-sided metallic-foil lined composite laminated boardInfo
- Publication number
- JPS62221535A JPS62221535A JP6536186A JP6536186A JPS62221535A JP S62221535 A JPS62221535 A JP S62221535A JP 6536186 A JP6536186 A JP 6536186A JP 6536186 A JP6536186 A JP 6536186A JP S62221535 A JPS62221535 A JP S62221535A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- paper
- pulp
- core layer
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 title claims description 17
- 239000002131 composite material Substances 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229920001131 Pulp (paper) Polymers 0.000 claims description 11
- 239000012792 core layer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、反り、ねじれの発生を抑制された片面金属箔
張コンポジット積層板f二関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a single-sided metal foil-clad composite laminate which is inhibited from warping and twisting.
従来の技術
]ンポジット積層板は、紙基材にエポキシ樹脂を含浸さ
せた芯層とガラス織布にエポキシ樹脂乞含浸させた両表
面層で構成され、これらを加熱加圧して一体化したもの
である。芯/l!’に構成する紙基材としては、リンタ
ーパルプを原料とする紙あるいは木材パルプを原料とす
る紙が用いられるのが一般的である。[Prior art] Composite laminates are composed of a core layer made of a paper base material impregnated with epoxy resin and both surface layers made of woven glass cloth impregnated with epoxy resin, which are integrated by heating and pressing. be. Core/l! As the paper base material for the ', paper made from linter pulp or paper made from wood pulp is generally used.
発明が解決しようとする問題点
ところで、片面(二金属箔?一体に貼りつけて成形した
コンポジット積層板においては、加熱加圧成形過程(二
おいて金属箔側の表面樹脂層の硬化収縮が抑さえられ、
積層板には金属箔側乞凸としたいわゆるプラス反りが発
生する。そして、回路加工に際してエンチング1ユより
金属箔な部分的に除去すると、金鵡箔の存在により収縮
7抑さえられていた表向樹脂層は、金属箔がなくなった
ことにより収縮し、今度は金属箔側を凹とするマイナス
反りが発生する。Problems to be Solved by the Invention By the way, in a composite laminate formed by bonding one side (two metal foils) together, it is difficult to prevent curing shrinkage of the surface resin layer on the metal foil side during the heating and pressure forming process. protected,
A so-called positive warpage occurs in the laminate, which is a convexity on the metal foil side. When the metal foil is partially removed during circuit processing, the surface resin layer, which had been suppressed from shrinking due to the presence of the gold foil, shrinks due to the disappearance of the metal foil, and now the metal foil is removed. Negative warpage occurs with the foil side being concave.
これらのことが、回路加工々程に8けるレジストインキ
や絶縁インキの印刷作業、あるl;)はチップ部品の自
動挿入作業の障害となっていた。These factors have hindered the automatic insertion of chip components, such as the printing of resist ink and insulating ink during circuit processing.
本発明は、これらの点に鑑み、反り、ねじれの発生を抑
さえた片面金属箔張りコンポジット積層板を提供するこ
とを目的とする。In view of these points, an object of the present invention is to provide a single-sided metal foil-clad composite laminate that suppresses the occurrence of warping and twisting.
問題点を解決するための手段
を記目的をil成するために、本発明は、従来の技術で
説明した片面金属箔張コンポジット積層板Cj;いて、
芯層の金属箔に近い側の紙基材はリンターパルプを原料
とし、金属箔から遠い側の紙基材は木材パルプとリンタ
ーパルプの混抄紙(木材パルプの含有t5〜20 wt
%)としたことを特徴とするものである。In order to achieve the object described above, the present invention provides a single-sided metal foil-clad composite laminate Cj as described in the prior art;
The paper base material on the side closer to the metal foil of the core layer is made of linter pulp, and the paper base material on the side farther from the metal foil is a mixed paper of wood pulp and linter pulp (wood pulp content t5-20 wt).
%).
作用
リンターパルプは、はぼぴセルロース100%からなり
、αセルロースは重合度が大きく結晶化度が高いので寸
法安定性に優れている。−万木材ハルブは70〜85
wt%のαセルロースと他にべだセルロースヲ含み、リ
ンターパルプの場合はど寸法安定性はよくない。Function Linter pulp is made of 100% Habopi cellulose, and α-cellulose has a high degree of polymerization and high crystallinity, so it has excellent dimensional stability. -Manzoku Harubu is 70-85
In the case of linter pulp, which contains α-cellulose and other cellulose (wt%), its dimensional stability is not good.
本発明は、寸法安定性のよいリンターパルプを原料とす
る紙基材を芯層の金属箔に近い側(−用いて樹脂の硬化
収縮を抑さえ、芯層の金属箔から遠い側には上記範囲の
配合の木材パルプとリンターパルプの混抄紙に基材とし
て用いることにより、積層板両面の応力をバランスさせ
たものである。The present invention suppresses curing shrinkage of the resin by using a paper base material made from linter pulp, which has good dimensional stability, on the side near the metal foil of the core layer (-), and on the side far from the metal foil of the core layer, The stress on both sides of the laminate is balanced by using it as a base material for mixed paper made of wood pulp and linter pulp in a range of proportions.
同、ここでいう金属箔とは、銅、アルミニウム、ニッケ
ルクロム基等である。Similarly, the metal foil referred to here includes copper, aluminum, nickel-chromium base, and the like.
実施例 次に、本発明の一実施例を説明する。Example Next, one embodiment of the present invention will be described.
エポキシ樹脂(油化シェル製エピコート1001)10
0重景部、ジシアンジアミド4重量部、ベンジルジメチ
ルアミン0.5重景部を配合した組成物をガラス織布に
樹脂t40wt%になるよう(二含浸、乾燥して、表面
1−用プリプレグとした。Epoxy resin (Epicoat 1001 manufactured by Yuka Shell) 10
A composition containing 0 parts by weight, 4 parts by weight of dicyandiamide, and 0.5 parts by weight of benzyldimethylamine was impregnated into a glass woven fabric to a resin content of 40 wt% (2 impregnated, dried, and prepared as a prepreg for surface 1). .
−万、リンターパルプを原料とする紙2よび木材パルプ
の含有量がl Q wt Xである木材パルプとリンタ
ーパルプとの混抄紙に、メチロールフェノール樹脂を四
脂t10wt%(二なるよう含浸、乾燥し、更(二、エ
ポキシ樹脂(油化シェル製エポン1045)100重量
部、ジシアンジアミド4重量部、ペンジルジメチルアt
70.5重量部を配合した組成物を、総樹脂t 60
wt%になるように含浸、乾燥して、それぞれ芯層用プ
リプレグとした。-10,000, paper 2 made from linter pulp and mixed paper of wood pulp and linter pulp with a wood pulp content of 1 Q wt (2) 100 parts by weight of epoxy resin (Epon 1045 manufactured by Yuka Shell Co., Ltd.), 4 parts by weight of dicyandiamide, penzyl dimethyl at
The total resin t 60
It was impregnated and dried to give a prepreg for the core layer, respectively, so as to achieve a concentration of wt%.
上記表面層用プリプレグ2枚の間に、上記2種の芯層用
ブリプレグン各2枚ずつ計4枚重ねて介在させ、芯−用
プリプレグのうち、リンターパルプを原料とする紙基材
≦:近い側の表面に銅箔を配置して、圧力50Kg/a
j、温度150tl:で45分間加熱加圧取形し、1.
211m厚の片面鋼張コンポジット積m板を得た。Between the two prepregs for the surface layer, two of each of the two types of prepregs for the core layer, a total of four sheets, are stacked and interposed, and among the prepregs for the core, a paper base made from linter pulp ≦: close Place copper foil on the side surface and apply pressure 50Kg/a
j, temperature: 150 tl: heated and pressed for 45 minutes, 1.
A single-sided steel-clad composite laminate plate with a thickness of 211 m was obtained.
比較例I
L記実施例において、木材パルプ1に10wt%含肩す
る混抄紙に代えて木材パルプy3owt%含肩する混抄
紙を用いた以外は同様にして41!!liI板を得た。Comparative Example I In the same manner as in Example L, except that instead of the mixed paper containing 10 wt % of wood pulp 1, a mixed paper containing 3 owt % of wood pulp was used. ! A liI plate was obtained.
比較例2
虹記実1@例において、混抄紙を基材とする芯層用プリ
プレグに近い11111の表面に銅箔!配置すること以
外は同様f二して積層板を得た。Comparative Example 2 In Nijikiji 1 @ example, copper foil is placed on the surface of 11111, which is close to the prepreg for the core layer made of mixed paper as the base material! A laminate was obtained in the same manner f2 except for the arrangement.
比較例3
芯層は全てリンターパルプ?原料とする紙乞基材とする
以外、実施例と同様にして積層板を得た。Comparative Example 3 Is the core layer all linter pulp? A laminate was obtained in the same manner as in the example except that the paper base material was used as a raw material.
比較例4
芯層は全て実施例と同様の混抄紙を基材とする以外、実
施例と同様にして積層板7得た。Comparative Example 4 A laminate 7 was obtained in the same manner as in the example except that all the core layers were made of the same mixed paper as in the example.
上記実施例、比較例における積層板の成形後の受理時、
銅箔全全面エツチングして除去後、T2−0.5/15
0処理後の反りの変化を第1図に示す。反り量は、50
0x5(lom+の試験片?平な定盤の41+−置き、
四隅の浮きとり量の最大値’]’ 損11定した。Upon receiving the laminates after molding in the above Examples and Comparative Examples,
After etching and removing the entire copper foil, T2-0.5/15
Figure 1 shows the change in warpage after the 0 treatment. The amount of warpage is 50
0x5 (lom+ test piece? Place 41+- on a flat surface plate,
The maximum value of the amount of lift at the four corners ']' The loss was fixed at 11.
比較例1から、混抄中の木材パルプの含有量を多くし過
ぎると、反り抑制の効果が低下することがわかる。Comparative Example 1 shows that when the content of wood pulp in the mixed paper is increased too much, the effect of suppressing warpage decreases.
発明の効果
第1図から明らかなように、本発明は、積層板の成形後
から、その後の各処理工程の闇を通じても反り乞小さく
抑さえることができ、その工業的価値は極めて大である
。Effects of the Invention As is clear from Fig. 1, the present invention can suppress warping to a minimum even after forming the laminate and through the various subsequent processing steps, and its industrial value is extremely large. .
第1図は片面鋼張コンポジット積層板の種々の処理工程
に8ける反りの変化7示す曲線図である。
特許量1♀〔1人
W[神PF5シ機株式会社
代表取締役櫻井泰男・づFIG. 1 is a curve diagram showing the change in warpage of a single-sided steel-clad composite laminate during various processing steps. Patent amount 1♀ [1 person W [Kami PF5 Shiki Co., Ltd. Representative Director Yasuo Sakurai
Claims (1)
エポキシ樹脂を含浸させた両表面層で構成され一方の表
面に金属箔が一体化されたコンポジット積層板において
、芯層の金属箔に近い側はリンターパルプを原料とする
紙基材で構成され、金属箔から遠い側は木材パルプとリ
ンターパルプの混抄(木材パルプの含有量5〜20wt
%)紙基材で構成された片面金属箔張コンポジット積層
板。In a composite laminate consisting of a core layer made of a paper base impregnated with epoxy resin and both surface layers made of woven glass fabric impregnated with epoxy resin, with metal foil integrated on one surface, the metal foil of the core layer The side closer to the metal foil is made of paper base material made from linter pulp, and the side far from the metal foil is made of a mixed paper of wood pulp and linter pulp (wood pulp content 5-20wt).
%) Single-sided metal foil-clad composite laminate made of paper substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6536186A JPS62221535A (en) | 1986-03-24 | 1986-03-24 | Single-sided metallic-foil lined composite laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6536186A JPS62221535A (en) | 1986-03-24 | 1986-03-24 | Single-sided metallic-foil lined composite laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62221535A true JPS62221535A (en) | 1987-09-29 |
Family
ID=13284743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6536186A Pending JPS62221535A (en) | 1986-03-24 | 1986-03-24 | Single-sided metallic-foil lined composite laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62221535A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01238932A (en) * | 1988-03-19 | 1989-09-25 | Matsushita Electric Works Ltd | Composite one side face metal laminated plate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52121687A (en) * | 1976-12-27 | 1977-10-13 | Toshiba Chem Corp | Copper clad laminates |
JPS5940106A (en) * | 1982-08-30 | 1984-03-05 | Fujitsu Ltd | Trigger signal generator |
-
1986
- 1986-03-24 JP JP6536186A patent/JPS62221535A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52121687A (en) * | 1976-12-27 | 1977-10-13 | Toshiba Chem Corp | Copper clad laminates |
JPS5940106A (en) * | 1982-08-30 | 1984-03-05 | Fujitsu Ltd | Trigger signal generator |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01238932A (en) * | 1988-03-19 | 1989-09-25 | Matsushita Electric Works Ltd | Composite one side face metal laminated plate |
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