JPS52121687A - Copper clad laminates - Google Patents
Copper clad laminatesInfo
- Publication number
- JPS52121687A JPS52121687A JP15897676A JP15897676A JPS52121687A JP S52121687 A JPS52121687 A JP S52121687A JP 15897676 A JP15897676 A JP 15897676A JP 15897676 A JP15897676 A JP 15897676A JP S52121687 A JPS52121687 A JP S52121687A
- Authority
- JP
- Japan
- Prior art keywords
- clad laminates
- copper clad
- copper
- subjected
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Abstract
PURPOSE: Copper-clad laminates consisting of resin-impregnated paper layers which are free from warping even when subjected to a severe heat treatment after the formation of copper foil circuits.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15897676A JPS52121687A (en) | 1976-12-27 | 1976-12-27 | Copper clad laminates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15897676A JPS52121687A (en) | 1976-12-27 | 1976-12-27 | Copper clad laminates |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3599774A Division JPS5222792B2 (en) | 1974-03-30 | 1974-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52121687A true JPS52121687A (en) | 1977-10-13 |
JPS578657B2 JPS578657B2 (en) | 1982-02-17 |
Family
ID=15683479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15897676A Granted JPS52121687A (en) | 1976-12-27 | 1976-12-27 | Copper clad laminates |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52121687A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62162532A (en) * | 1986-01-14 | 1987-07-18 | 松下電工株式会社 | Single-sided metal-lined laminated board |
JPS62221535A (en) * | 1986-03-24 | 1987-09-29 | 新神戸電機株式会社 | Single-sided metallic-foil lined composite laminated board |
JPS6369640A (en) * | 1986-09-11 | 1988-03-29 | 東洋紡績株式会社 | Thermosetting resin film laminate |
JPH01196339A (en) * | 1988-01-30 | 1989-08-08 | Toshiba Chem Corp | Preparation of copper-clad laminate sheet |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63140446A (en) * | 1986-12-03 | 1988-06-13 | Csk Corp | Card conveying mechanism for card reader |
-
1976
- 1976-12-27 JP JP15897676A patent/JPS52121687A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62162532A (en) * | 1986-01-14 | 1987-07-18 | 松下電工株式会社 | Single-sided metal-lined laminated board |
JPS62221535A (en) * | 1986-03-24 | 1987-09-29 | 新神戸電機株式会社 | Single-sided metallic-foil lined composite laminated board |
JPS6369640A (en) * | 1986-09-11 | 1988-03-29 | 東洋紡績株式会社 | Thermosetting resin film laminate |
JPH01196339A (en) * | 1988-01-30 | 1989-08-08 | Toshiba Chem Corp | Preparation of copper-clad laminate sheet |
Also Published As
Publication number | Publication date |
---|---|
JPS578657B2 (en) | 1982-02-17 |
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