JPS6044342A - Copper lined laminated board - Google Patents

Copper lined laminated board

Info

Publication number
JPS6044342A
JPS6044342A JP15381283A JP15381283A JPS6044342A JP S6044342 A JPS6044342 A JP S6044342A JP 15381283 A JP15381283 A JP 15381283A JP 15381283 A JP15381283 A JP 15381283A JP S6044342 A JPS6044342 A JP S6044342A
Authority
JP
Japan
Prior art keywords
copper
glass
clad laminate
base material
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15381283A
Other languages
Japanese (ja)
Inventor
達也 藤村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP15381283A priority Critical patent/JPS6044342A/en
Publication of JPS6044342A publication Critical patent/JPS6044342A/en
Pending legal-status Critical Current

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Landscapes

  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 し発明の技術分野] 本発明は、M材としてノコラス不織布を使用しノこ銅張
積層板に関づる。
DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a sawn copper-clad laminate using a sawn nonwoven fabric as the M material.

[発明の技((,1的背與j 近年、電子技術の急速な進歩に伴い、銅張積層板の使用
も多種多用になるとともに、高品質の6のが要求されて
さている。
[Techniques of Invention ((, 1の書與j) In recent years, with the rapid progress of electronic technology, copper-clad laminates are being used in a wide variety of ways, and high-quality laminates are being required.

一般に、基材としてガラス不織布を使用した銅張積層板
を製造するには、カラス不織イ1」に1ボ:1−シ樹脂
等の合成樹脂ワニスを含浸乾燥させた半硬化状態のプリ
プレグを複数枚積層し、イの両面に、ガラスクロスに合
成樹脂ワニスを含浸乾燥さUたプリプレグを重ね、さら
にその両面または片面に銅箔を積層して加熱加圧成形に
J、り一体化させる方法がとられている。
Generally, in order to manufacture copper-clad laminates that use glass nonwoven fabric as a base material, semi-cured prepreg is prepared by impregnating glass nonwoven fabric with a synthetic resin varnish such as 1BO:1-C resin and drying it. A method in which multiple sheets are laminated, prepreg made by impregnating and drying glass cloth with synthetic resin varnish is layered on both sides of the prepreg, and then copper foil is laminated on both or one side of the prepreg and integrated by heating and pressure molding. is taken.

[背景技術の問題点] しかしながら、このような銅張積層仮におい−(は、耐
熱性や寸法安定性等に侵れ(いる反面、ガラス不織布の
機械的強度が小8いために成形+1’lの含有樹脂の流
動により、特に端部においC基材切れが発生し易いとい
う難点かあった。
[Problems with the background technology] However, such copper-clad laminated materials suffer from poor heat resistance and dimensional stability. Due to the flow of the resin contained therein, there was a problem in that the C base material was likely to break, especially at the edges.

[発明の目的] 本発明者等はこのような従来のfflll点を解消1へ
く使用するカラス不織イ1jについて種々検同した結果
、端部の坪量を中央部より小さくしたカラス不織布を使
用することtこより、成形時の端部にお【プる含有樹脂
の流IJJが容易になつ−C1基材切れの発生を防止づ
ることができることを見出した。
[Object of the Invention] The inventors of the present invention investigated various types of Karasu non-woven fabrics 1j that can be used to solve the conventional fflll point. As a result, they developed a Karasu non-woven fabric in which the basis weight of the edges is smaller than that of the center. It has been found that by using this method, it is possible to prevent the occurrence of breakage of the C1 base material, which facilitates the flow of the contained resin at the edges during molding.

本発明はこのような知見に基づいてなされlこもので、
成形時に、13(プる基材切れの発生を防止した銅張積
層板を提供しようとするものひある。
The present invention was made based on such knowledge, and
There is an attempt to provide a copper-clad laminate that prevents the occurrence of breakage of the base material during molding.

U発明の概要] すなわら本発明の銅張1ili層板は、ガラス不織布に
合成樹脂ワニスを含浸乾燥さtICなる半硬化状態のシ
リプレグの複数枚ど、銅箔どを重ね合μ、加熱加圧成形
してなる銅張積層板におい−C1前記ガラス不械布はそ
の両端部の坪mが中央部より小さくされていることを特
徴としCいる。
[Summary of the Invention] In other words, the copper-clad 1ili laminate of the present invention is produced by impregnating a glass non-woven fabric with a synthetic resin varnish, drying it, stacking a plurality of semi-cured silicone preg sheets called tIC, or copper foil, etc., and then heating it. Copper-clad laminate formed by pressure forming - C1 The glass unfinished fabric is characterized in that the tsubo m of both ends thereof is smaller than that of the central part.

本発明に使用するガラス不織布は、りYましくは両縁端
から幅1〜10mmの範囲においC1その坪ωが中央部
のそれより小さくされている。このように端部幅を限定
したのは、1闘以下では、得られる銅張積層板の基材切
れの発生に対Jる十分な防止効果が117られり゛、ま
た10m++を越える場合は、端部の板厚が薄くなり板
厚精度が低下するからである。
The glass nonwoven fabric used in the present invention has a C1 area ω smaller than that of the center portion, preferably in a width range of 1 to 10 mm from both edges. The reason why the end width is limited in this way is that if the width is less than one stroke, there will be a sufficient effect of preventing the occurrence of base material breakage in the resulting copper-clad laminate, and if it exceeds 10 m++, This is because the plate thickness at the end portion becomes thinner and the plate thickness accuracy decreases.

なお、カラス不織’fliの端部のl’l’−Q%は、
中火部の3〜15%、好ましく(よ5〜10%程度小ざ
くされていることが望;(、しい。
In addition, l'l'-Q% of the end of the crow non-woven 'fli' is:
3 to 15%, preferably 5 to 10% of the medium heat area.

本光1す1に用いられる合成樹脂ワニスのベース)84
脂としては、エポキシ系樹脂、フェノール系樹脂、ポリ
エステル系樹脂等の他、これらに難燃剤を添加したもの
等、〜般に含浸用合成樹脂ワニスのベース樹脂として使
用可能なしのであればいずれら使用でさる。
Base of synthetic resin varnish used for Honko 1S1) 84
As the resin, in addition to epoxy resin, phenol resin, polyester resin, etc., flame retardants added to these resins can be used.In general, any resin that can be used as a base resin for synthetic resin varnish for impregnation can be used. It's a monkey.

本発明の銅張積層板は、ガラス不織イ1ij;j祠合成
樹脂銅張!i!i層板の製造方法としく、一般にf)わ
れでいる方法に基づいて製造される。
The copper-clad laminate of the present invention is made of non-woven glass, synthetic resin copper-clad! i! The I-layer board is generally manufactured based on the f) method.

づなわlう、両端部におい−C1幅1〜10都の範囲で
坪mが中央部に比へ小さいカラス不MA 4iを基材と
し、これに合成樹脂ワニスを3浸し、加熱※2燥さ「て
半硬化状態のプリプレグを1!1に後、このプリプレグ
を所定枚数重ね、イの片面またLL両面に銅箔を重ね合
せ−C加熱加圧成形により一体化される。
Tsunawa, both ends - C1 Width in the range of 1 to 10 mm, and the tsubom is smaller than the center part. The base material is Karasuma MA 4i, soaked with synthetic resin varnish for 3 times, heated * 2 dry. After the semi-cured prepreg is made 1!1, a predetermined number of sheets of this prepreg are stacked, copper foil is stacked on one side of A and both sides of LL, and they are integrated by heating and pressure molding.

なお本発明においては、ガラス不II イOa +3プ
リプレグを所定枚数重ねた後、その両面にカラスクロス
基材プリプレグを重ね、さらに銅箔を積層しにれを一体
化させたちのCあってもよい。
In the present invention, after a predetermined number of Glass Foil II Oa +3 prepregs are stacked, crow cloth base material prepregs are stacked on both sides, and copper foil is further laminated to integrate the layers. .

[発明の実施例コ 次に本発明の実施例J3よび比較例につい゛C説明する
[Example of the Invention] Next, Example J3 of the invention and a comparative example will be explained.

実施例 表に示したカラス不織布に難燃性エポキシ樹脂ワニスを
含浸さぜ、加熱乾燥して半硬化状態のガラス不織イl’
j基材ブリブレクを得る。同様にガラスクロスに難燃性
エポキシ樹脂ワニスを3浸させ、1j11熱乾燥しC半
硬化状態のガラスクロス阜祠プリプレグを得る。
The glass non-woven fabric shown in the Examples table is impregnated with flame-retardant epoxy resin varnish and heated and dried to produce a semi-cured glass non-woven fabric.
j Obtain a base material. Similarly, a glass cloth is dipped in flame-retardant epoxy resin varnish for three times and dried under heat to obtain a semi-hardened glass cloth prepreg.

このようにして得られたガラス不械布基4Aプリプレグ
を8枚重ね、その両面にガラスフ1」ス基祠プリプレグ
を各1枚重ね、ざらにこれらの両面に厚さ3511mの
印刷回路板用電解銅箔を配置して、これをステンレス鏡
面板ひ挾んたbのを熱根間に挿入して170℃、40眩
/C仁60分間の条イ′iで加熱加圧成形し、本発明の
銅張積層板を製造しIC。
8 sheets of the 4A glass fabric prepreg obtained in this way were stacked, one sheet of glass 1'' fabric prepreg was stacked on each side of the 4A prepreg, and a printed circuit board electrolytic film with a thickness of 3511 m was roughly coated on both sides. Copper foil was arranged, and a mirror plate of stainless steel was inserted between the heated roots and heated and pressure molded at 170°C and 40 dazzle/C for 60 minutes. Manufacture copper clad laminates and IC.

比較例 次表に示すように、実施例に(13ける刀うス不械イ5
の中央部と同−坪量、同一厚さからなるガラス不織布を
用意し、実施例と同様にし−C銅張槓層板を製造した。
Comparative Example As shown in the following table, in the example (13)
A glass nonwoven fabric having the same basis weight and thickness as the central part of the sample was prepared, and a -C copper-clad laminate was manufactured in the same manner as in the example.

このようにして得られた銅張積層板についC基材切れの
発生状況を調べたところ、実施例の銅張積層板について
は基材切れの発生はまったく認められなかった。
When the copper-clad laminates thus obtained were examined for occurrence of C base material breakage, no base material breakage was observed in the copper-clad laminates of Examples.

(以上余白) 「発明の効果」 以上の実施例からも明らかなように、本発明によれば、
銅張積層板の製造時におけるカラス不織イIJ71 H
Aプリプレグの基拐切れの発生が防止され、高品質の銅
張積層板が得られる。
(Blank above) "Effects of the Invention" As is clear from the above embodiments, according to the present invention,
Karasu non-woven material IJ71H when manufacturing copper clad laminates
A high-quality copper-clad laminate can be obtained by preventing the occurrence of substrate breakage in the A prepreg.

代理人弁理士 須 山 佐 −Representative Patent Attorney Su Yamasa -

Claims (3)

【特許請求の範囲】[Claims] (1)カラス不IE イIjに合成樹脂ワニスを含浸乾
燥させてなる半硬化状態のプリプレグの複数枚と、銅箔
とを重ね合せ、加熱加圧成形してなる銅張積層仮におい
て、前記ガラス不織布はその両端部の坪ff1が中央部
より小さくされていることを特徴とする銅張積層板。
(1) Karasu IE In a copper-clad laminate made by laminating multiple sheets of semi-cured prepreg made by impregnating and drying a synthetic resin varnish with copper foil and heating and press-molding the glass, A copper-clad laminate, characterized in that the nonwoven fabric has a tsubo ff1 smaller at both ends than at the center.
(2)中央部より小さい坪量を有J−る端部の幅I、L
。 縁端から1〜10mである特ム′1請求の範囲i4!1
項記載の銅張積層板。
(2) Widths I and L of the ends that have a smaller basis weight than the center part
. Feature '1 Claim i4!1 which is 1-10m from the edge
Copper-clad laminate described in section.
(3)前記カラス不織布基材プリプレグと銅箔との間に
、ガラスクロス基材プリプレグが介在している特g7.
請求の範囲第1項または第2項記載の銅張積層板。
(3) A glass cloth base material prepreg is interposed between the glass nonwoven fabric base material prepreg and the copper foil g7.
A copper-clad laminate according to claim 1 or 2.
JP15381283A 1983-08-23 1983-08-23 Copper lined laminated board Pending JPS6044342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15381283A JPS6044342A (en) 1983-08-23 1983-08-23 Copper lined laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15381283A JPS6044342A (en) 1983-08-23 1983-08-23 Copper lined laminated board

Publications (1)

Publication Number Publication Date
JPS6044342A true JPS6044342A (en) 1985-03-09

Family

ID=15570642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15381283A Pending JPS6044342A (en) 1983-08-23 1983-08-23 Copper lined laminated board

Country Status (1)

Country Link
JP (1) JPS6044342A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55126445A (en) * 1979-03-26 1980-09-30 Matsushita Electric Works Ltd Laminated board
JPS5649256A (en) * 1979-09-28 1981-05-02 Shin Kobe Electric Machinery Manufacture of copper lined laminated board
JPS57165250A (en) * 1981-04-07 1982-10-12 Toshiba Chem Prod Manufacture of copper plated laminated board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55126445A (en) * 1979-03-26 1980-09-30 Matsushita Electric Works Ltd Laminated board
JPS5649256A (en) * 1979-09-28 1981-05-02 Shin Kobe Electric Machinery Manufacture of copper lined laminated board
JPS57165250A (en) * 1981-04-07 1982-10-12 Toshiba Chem Prod Manufacture of copper plated laminated board

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