JPH0220337A - Preparation of laminated sheet - Google Patents

Preparation of laminated sheet

Info

Publication number
JPH0220337A
JPH0220337A JP17160188A JP17160188A JPH0220337A JP H0220337 A JPH0220337 A JP H0220337A JP 17160188 A JP17160188 A JP 17160188A JP 17160188 A JP17160188 A JP 17160188A JP H0220337 A JPH0220337 A JP H0220337A
Authority
JP
Japan
Prior art keywords
resin
metal foil
base material
impregnated base
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17160188A
Inventor
Yasuo Azumabayashi
Sadahiro Shirakawa
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17160188A priority Critical patent/JPH0220337A/en
Publication of JPH0220337A publication Critical patent/JPH0220337A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Abstract

PURPOSE: To increase the stiffness of an extremely thin metal foil, to eliminate wrinkles and breakage, and to reduce an inferiority rate, cost and a working process by laminating a metal foil provided with a resin layer to a surface, on which a resin impregnated base material is superposed, to perform molding.
CONSTITUTION: Laminates each of which is formed by arranging a metal foil having a thickness of 3-12μm provided with a resin layer in a thickness of 1-100g/m2 to the upper surface and/or lower surface on which a required number of resin impregnated base materials are superposed are laminated and molded. As the resin of the resin impregnated base material to be used, a phenol resin, a cresol resin, an epoxy resin and a fluorocarbon resin are used alone or in a mixed state or modified resins thereof are used. As the base material, there are a fabric, a nonwoven fabric, a mat, paper or a combination thereof composed of an inorg. fiber of glass or asbestos, an org. synthetic fiber of polyester or acrylic resin or a natural fiber. The metal foil provided with the resin layer is composed of copper, aluminum, iron or the like, an alloy thereof or a composite product thereof.
COPYRIGHT: (C)1990,JPO&Japio
JP17160188A 1988-07-08 1988-07-08 Preparation of laminated sheet Pending JPH0220337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17160188A JPH0220337A (en) 1988-07-08 1988-07-08 Preparation of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17160188A JPH0220337A (en) 1988-07-08 1988-07-08 Preparation of laminated sheet

Publications (1)

Publication Number Publication Date
JPH0220337A true JPH0220337A (en) 1990-01-23

Family

ID=15926192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17160188A Pending JPH0220337A (en) 1988-07-08 1988-07-08 Preparation of laminated sheet

Country Status (1)

Country Link
JP (1) JPH0220337A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283501A (en) * 1991-07-18 1994-02-01 Motorola, Inc. Electron device employing a low/negative electron affinity electron source
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283501A (en) * 1991-07-18 1994-02-01 Motorola, Inc. Electron device employing a low/negative electron affinity electron source
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby

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