JPS62259843A - Single metal-lined laminated board and manufacture thereof - Google Patents
Single metal-lined laminated board and manufacture thereofInfo
- Publication number
- JPS62259843A JPS62259843A JP61104032A JP10403286A JPS62259843A JP S62259843 A JPS62259843 A JP S62259843A JP 61104032 A JP61104032 A JP 61104032A JP 10403286 A JP10403286 A JP 10403286A JP S62259843 A JPS62259843 A JP S62259843A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- resin
- film
- single metal
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算機器、通信機器等に
周込られる片面金属張り積層板およびその製造方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a single-sided metal-clad laminate that is incorporated into electrical equipment, electronic equipment, computing equipment, communication equipment, etc., and a method for manufacturing the same.
従来、１狂気機器等に用いられるプリント配線板は積層
板に紫外線硬化型インクを塗布して得られるものである
が、積層板と紫外線硬化型インクとの密着性が悪Ａため
積ＭＩＰｙ表面に水洗、薬品処理、研磨等して密着性を
向上させているが工程が複雑で生産幼名を低下させるも
のでちった。Conventionally, printed wiring boards used in 1-instrument devices are obtained by applying ultraviolet curable ink to a laminate, but because the adhesion between the laminate and the ultraviolet curable ink is poor, the surface of the laminate is coated with MIPy. Although the adhesion was improved by washing with water, chemical treatment, polishing, etc., the process was complicated and resulted in a decline in production quality.
本発明の目的とするところは紫外線便化型インクとの密
着性のよ１積層板およびその製造方法を提供することＶ
こある。An object of the present invention is to provide a laminate with good adhesion to ultraviolet ray inks and a method for manufacturing the same.
There it is.
不発明は金属面の反対面の粗度を１０〜３０ミクロンに
したことを特徴とする吟面令１張り冶１−！ｉ板および
その製造方法で、紫外線硬化型インクとの密着面を特定
粗度にすることにより密着性を向上させることができた
もので、以下本発明の詳細な説明する。The invention is characterized in that the surface opposite to the metal surface has a roughness of 10 to 30 microns. This invention is an i-plate and a method for manufacturing the same, in which adhesion can be improved by making the adhesion surface with ultraviolet curable ink have a specific roughness, and the present invention will be described in detail below.
本発明に用いる樹脂含浸基を才の遺′盾としては、フェ
ノール樹弓旨、クレソ°−ル磁月旨、エポキシ樹を旨、
不飽和ポリエステル樹脂、メラミン樹脂、ポリイミド、
ポリブタジェン、ポリアミド、ポリアミドイミド、ポリ
フェニレンサルファイド、ポリフェニレンオキサイド、
ポリスルフォン、ボリプチレンテレフタレート、ポリエ
ーテルエーテルケトン、弗化樹脂等の風蝕、変性物、混
合ｖＡ等が用いられ必要に応じて粘度上１整に水、メチ
ルアルコール、アセトン、シクロヘキサノン、スチレン
等の溶媒を添加したものを用い、基材としては、ガラス
、アスベスト等のｓ ｍ ｐｉｔ維やポリエステル、ポ
リアミド、ポリビニルアルコール、アクリル等の有機合
成繊維や木綿等の天然繊維からなる織布、不織布、マヴ
ト或は紙又はこれらの組合せ基材等を用ｂ％金属龜とし
ては銅、アルミニウム、鉄、ニーＪケル、ステンレン倦
、真鍮等の金属箔を用Ａ１必要に応じて金属箔の片面に
接着層を設けたものである。トリアセテート系フィルム
としてはトリアセテート（三酢酸セルローズ）虫独、変
性物のフィルムを用いることができ、更にフィルム表面
を所要粗度にしたフィルムを用いることもできるもので
ある。金属面の反対面の粗度は１０〜３０ミクロンであ
ることが必要である。即ちｌＯミクロン未満ではインク
の密着性が低下し、 ３０ミクロンをこえるとインク消
費量が大となり、乾燥性が低下し且つ表示の鮮明性が低
下するためである。Examples of the resin-impregnated base used in the present invention include phenol resin, cresol resin, epoxy resin,
unsaturated polyester resin, melamine resin, polyimide,
Polybutadiene, polyamide, polyamideimide, polyphenylene sulfide, polyphenylene oxide,
Polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. are used, and if necessary, water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are used to adjust the viscosity. The substrate is made of sm pit fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. Alternatively, use paper or a combination of these as a base material.b% As the metal head, use metal foil such as copper, aluminum, iron, aluminum, stainless steel, brass, etc. A1 If necessary, add an adhesive layer on one side of the metal foil. It has been established. As the triacetate film, a film of triacetate (cellulose triacetate) or a modified product can be used, and a film whose surface has been roughened to a desired degree can also be used. The surface opposite the metal surface needs to have a roughness of 10 to 30 microns. That is, if it is less than 10 microns, the adhesion of the ink will decrease, and if it exceeds 30 microns, the amount of ink consumption will increase, the drying performance will decrease, and the clarity of the display will decrease.
以下不発明を実施例にもとづいて説明する。The invention will be explained below based on examples.
実施列１
樹脂量５０重、吐チ（眉、子機に係と記す）のフェノー
ル樹月旨ワニスに厚さ０．２ｆｆのクラフト紙を樹月旨
量が５０％になるように含浸、乾燥して得た樹脂含浸基
材８枚を重ねた片面に、厚さ０．０３５ｉｉの接着層付
銅箔の接着層側を１妾着層側が樹脂含浸基材と対向する
ように重ね、更に他の片面知厚さ０．０２５ａのトリア
セテートフィルム（富士フィルム株式会社裂、商品名フ
ジタック）を配設した積層体を成型プレートに挾み、成
形圧力ＩＱＯＫ（１／ｄ 、 １６０℃で６０分間積層
成形後、フィルムを除去して厚さし６目の片面鋼張り増
Ｘｊ＠を得た。Practical row 1: Impregnated 0.2 ff thick kraft paper with phenolic varnish of 50 weight resin and 50 parts (denoted as eyebrows and handset) so that the amount of resin was 50%, and dried. The adhesive layer side of the copper foil with adhesive layer having a thickness of 0.035 ii was stacked on one side of the 8 resin-impregnated base materials obtained by stacking one layer on top of the other, with the adhesive layer side facing the resin-impregnated base material, and then the other layer. A laminate with a triacetate film (Fuji Film Co., Ltd., trade name: Fujitac) with a thickness of 0.025a on one side was sandwiched between molding plates, and laminated at a molding pressure of IQOK (1/d) at 160°C for 60 minutes. Thereafter, the film was removed to obtain a single-sided steel-clad sheet with a thickness of 6 mm.
実施３２
実施列１のフィルムを厚さ０．０２５ ｑｍの々ット処
理トリア七テートフィルム（冨士フィルム株式会社裂、
商品名フジタ・ソクマヴト）に変えた以外は実施例１と
同様に処理して片面鋼張り漬り板を得た。Run 32 The film of Run 1 was made into a 0.025 qm thick treated tria-7tate film (Fuji Film Co., Ltd.,
A single-sided steel-clad plate was obtained in the same manner as in Example 1, except that the product name was changed to Fujita Sokkavut (trade name).
比較例１
実施例１のフィルムを厚さ０．０２５ ｍのポリプロピ
レンフィルムに変えた以外は実施例１と同様だ処理して
片面銅張り積層板を得た。Comparative Example 1 A single-sided copper-clad laminate was obtained in the same manner as in Example 1 except that the film in Example 1 was replaced with a polypropylene film having a thickness of 0.025 m.
比較例２
実施例１のフィルムを用Ａな１以外は実施例１と同様に
処理して片面銅張り積層板を遵だ。Comparative Example 2 The film of Example 1 was treated in the same manner as in Example 1, except for A, to produce a single-sided copper-clad laminate.
実施例１と２及び比較例１と２の片面銅張り積層板の今
１服面の反対面の粗度および紫外線硬化型インクとの＠
着性は４１表で明白なように本発明のものの性能はよく
本発明の片面金属張り積層板およびその製造方法の優れ
ていることを確認した。Roughness of the opposite side of the single-sided copper-clad laminates of Examples 1 and 2 and Comparative Examples 1 and 2 and the relationship with ultraviolet curable ink
As is clear from Table 41, the adhesion properties of the present invention were good, confirming the superiority of the single-sided metal-clad laminate of the present invention and its manufacturing method.
Claims (2)
たことを特徴とする片面金属張り積層板。(1) A single-sided metal-clad laminate characterized in that the surface opposite to the metal surface has a roughness of 10 to 30 microns.
重ね、更に他の片面にトリアセテート系フィルムを配設
した積層体を積層成形後、トリアセテート系フィルムを
除去することを特徴とする片面金属張り積層板の製造方
法。(2) A laminate in which a required number of resin-impregnated substrates are stacked, metal foil is stacked on one side, and a triacetate film is further disposed on the other side is laminated, and then the triacetate film is removed. A method for producing a single-sided metal-clad laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61104032A JPS62259843A (en) | 1986-05-07 | 1986-05-07 | Single metal-lined laminated board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61104032A JPS62259843A (en) | 1986-05-07 | 1986-05-07 | Single metal-lined laminated board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62259843A true JPS62259843A (en) | 1987-11-12 |
Family
ID=14369894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61104032A Pending JPS62259843A (en) | 1986-05-07 | 1986-05-07 | Single metal-lined laminated board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62259843A (en) |
-
1986
- 1986-05-07 JP JP61104032A patent/JPS62259843A/en active Pending
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