JPH0245142A - Manufacture of laminated board - Google Patents

Abstract

PURPOSE:To reduce the warpage of a thin laminated board by laminating and molding laminates in which copper foils with adhesive layers, in which specific quantities of adhesives mainly comprising phenol resin are applied onto copper foils, are arranged onto top faces and/or undersides in which required numbers of resin impregnated base materials are superposed. CONSTITUTION:Laminates in which copper foils with adhesive layers, in which adhesives mainly comprising phenol resin are applied onto copper foils in 15-30g/m<3>, are disposed onto top faces and/or under-sides, in which required numbers of resin impregnated base materials are stacked, are laminated and molded, thus acquiring a laminated board in thickness of 1.2mm or less. Phenol resin, cresol resin, an epoxy resin, etc., are used as the resin of the resin impregnated base material. A woven fabric, a nonwoven fabric, etc., composed of inorganic fiber such as glass, asbestos, etc., organic synthetic fiber such as polyester, polyamide, etc., and natural fiber such as cotton are employed as a base material. A curing agent, a coloring agent and a solvent are added to phenol resin as required as adhesives. It is faborable that the copper foil with a thickness of 0.018-0.07mm is used as the copper foil.

Description

[Detailed Description of the Invention] [Field of Application of Sumitomo] The invention relates to a method for manufacturing laminates used in electrical appliances, electronic equipment, communication equipment, and Shinkiji temples.

[Conventional Ij! Technique]

Laminated boards form electrical paths on the metal foil on their surface and are used in printed wiring boards and multilayer printed wiring boards, but recently there has been a demand for more compactness. /m plate thickness 1.21m2. Q
Thin laminates such as , gfi and b are becoming mainstream. However, as the thickness of the laminate becomes thinner, the warpage of the laminate increases, which poses a problem in that automation of the wiring board processing process is hindered.

[Problem that the invention seeks to solve]

As mentioned in the conventional technology, the thin laminate with a thickness of 1.2 fins bO, 8n has a large warp and requires a process to correct the warp in the wiring board processing process, which is a problem in terms of production efficiency. The present invention has been made in view of the above-mentioned problems in the prior art, and an object thereof is to provide a method for manufacturing a thin laminate that can reduce warping of the thin laminate.

[Means for solving problems]

The present invention is a copper dovetailed copper foil made by applying a bonding agent containing phenolic resin as a main component to copper foil for 15 to 30 f on the upper and/or lower surfaces of a required number of resin-impregnated base materials. For the IF2 method of the laminate, which is characterized by laminating and molding the horizontal JtII body on which the foil is arranged to obtain a laminate with a thickness of 1.2 u or less, the phenolic resin, which is the main component of the soothing agent, is used. The present invention will be described in detail below.

Examples of the resin for the Tsukuda Gon-immersion base material used in the present invention include phenol resin, cresol resin, epoxy resin, Fushowa polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, a mixture of fluorinated resins and water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are used to adjust the viscosity. The base material is glass, asbestos fibers, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic, etc., and woven fabrics and non-woven mats made from Mokkenji natural fibers. It is preferable to use a combination of these materials, etc. (The retentive agent is phenolic resin, mixture, modified product of phenolic resin such as cresol resin, etc., such as novolak, resol type, etc.) In addition, if necessary, a hardening agent, a coloring agent, a bath agent, etc. are added, and if necessary, a butyral resin rubber, an epoxy resin, etc. are added, but phenolic resin is the main material. It is necessary that it is a component.As a copper chrysanthemum, the thickness is 0.018 ~
Although it is preferable to use S with 0.07+, u, there is no particular limitation. Ayubu Ayu with A touch on copper foil is 15~
This is because at 30 f//ii' and 15 ν/m, a contact force comparable to that of light cannot be obtained, and when it exceeds 30, the warpage increases.i).

It is essential that the thickness of the nuclear layer is 1.2 mm or less.

With a spear plate that is thicker than 41.2 ff, the warpage is small compared to the main road 8 mm! This is because the effect of fi light is not encouraging.

As for the stack-up molding, a multi-stage press method, a multi-roll roll press, a tuple belt method, and a pressureless lamination molding 7i:b empty molding are used, but the method is not limited to these.

The present defense will be explained below based on the merit tun vIj.

Examples 1 to 3 and Comparative Examples 1 and 2 A phenolic resin varnish of Resin 1150 Salt (hereinafter referred to as car related) was applied to a kraft paper container of thickness Q and 211 liters so that the resin varnish after drying was 50%. The upper and lower surfaces of 4 resin-impregnated base materials obtained by impregnating and drying were coated with resol-type phenol fat-resistant 80] 4 wrinkles (hereinafter referred to as "car parts"), Fresol novolac-type epoxy DJ fat to part, and Holivinyl. Finalal n411k 507f15, methyl ethyl ketone tns, toluene 120, methyl alcohol 12
0 iris, the thickness of the 6th tangent 1 punishment is 0.035a +
Apply to a piece of copper foil 1t11 14 Tips 17
y/j, 2 2 for Example 2, s Vnl
2 8 f , h for % real 7/lii9iJ 3
d. In the hole, 10 f/W for Te Example I (35 V for Hi-Soft 2), 8-molding pressure of 1 o okg/
CR, rigorous molding at 160°C for 60 minutes to give I'l-0.
An 8u double-sided copper-clad laminate was obtained.

"Aha! Ga 1 to 3 and Comparative Examples 1 and 2, the V ability of the fallen J Soban seems to be 1st order.

The present invention is constructed as described above. The Rokuzou method of a laminating machine having the configuration described in item 1 of the claim has the effect of reducing warpage.

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Claims (1)

[Claims] (1) Apply an adhesive mainly composed of phenolic resin to copper foil on the upper and/or lower surfaces of the required number of resin-impregnated substrates.
A method for manufacturing a laminate, which comprises laminating and molding a laminate having a copper foil coated with an adhesive layer coated at a rate of 5 to 30 g/m^2 to obtain a laminate having a thickness of 1.2 mm or less.