JPH03126552A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPH03126552A JPH03126552A JP26734689A JP26734689A JPH03126552A JP H03126552 A JPH03126552 A JP H03126552A JP 26734689 A JP26734689 A JP 26734689A JP 26734689 A JP26734689 A JP 26734689A JP H03126552 A JPH03126552 A JP H03126552A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminated
- long
- impregnated
- sized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000000835 fiber Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000011888 foil Substances 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 21
- 239000011347 resin Substances 0.000 abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 3
- 239000004342 Benzoyl peroxide Substances 0.000 abstract description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 abstract description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000005470 impregnation Methods 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 polyphenylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、を気機器、コンピューター、通信機
器等に用いられる積層板の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a laminate used in electronic equipment, electrical equipment, computers, communication equipment, and the like.
従来、電気機器等に用いられる積層板は樹脂含浸紙、樹
脂含浸ガラス布等と金属箔とからなる積層板を多段プレ
スを用−11〜2時間とbう長時間の加熱加圧成形によ
って得られるため、積層板中に成形歪が残留し、積層板
を印刷配線板に加工する際や印刷配線板に電子部品を実
装する際の熱によって反りを発生し、自動化工程に支障
を招来する欠点があった。特に高周波特性を充足するた
めのセラミック繊維布基材についてはその傾向が大であ
った。Conventionally, laminates used for electrical equipment, etc. are obtained by heating and pressing a laminate made of resin-impregnated paper, resin-impregnated glass cloth, etc. and metal foil for a long time of 11 to 2 hours using a multistage press. As a result, molding distortion remains in the laminate, causing warping due to the heat generated when processing the laminate into a printed wiring board or mounting electronic components on the printed wiring board, causing problems in automated processes. was there. This tendency was particularly strong for ceramic fiber cloth base materials that satisfy high frequency characteristics.
従来の技術で述べたように、多段プレス方式によって得
られる積層板はその加工工程において反りを発生する。As described in the related art section, the laminate obtained by the multi-stage press method warps during the processing process.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは反り発生のな込セ
ラミリクm維布基材積層板の製造方法を提供することに
ある。The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a method for manufacturing a hollowed Ceramic m-fiber base laminate that does not cause warping.
本発明は所要枚数の長尺樹脂含浸セラミック繊維布を、
上下に配設したスクイズロール間を通しラミネート後、
その上面及び又は下面に長尺金籾箔を配役、ラミネート
した長尺帯状積層体全連続的に移行させつつ硬化後、n
r要寸法に切断し、更に熱変形温度以上に加熱後、熱変
形温度以下に冷却することを特徴とする積層板の製造方
法のため、加圧することがなく積層板中に残留歪を発生
することがなくなったもので、以下本発明の詳細な説明
する。The present invention uses a required number of long resin-impregnated ceramic fiber cloths,
After laminating through the squeeze rolls placed above and below,
A long strip-shaped laminate is cast and laminated with a long gold rice foil on its upper and/or lower surfaces, and after curing while continuously transferring, n
Since the laminate manufacturing method is characterized by cutting into required dimensions, heating above the heat distortion temperature, and cooling below the heat distortion temperature, residual strain is generated in the laminate without applying pressure. The present invention will now be described in detail.
本発明に用いる長尺樹脂含浸セラミック繊維布?
トシては、石英、アルミナ、ボロンナイトライド等のセ
ラミック11i維布にフェノール樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂、ジアリルフタレート樹脂、ビ
ニルエステル樹脂、エポキシアクリレート樹脂、ポリイ
ミド4対脂、ポリフエニVンオキサイド樹脂、弗素樹脂
等の単独、変性物、混合物を含浸させたもので、樹脂含
浸は同系樹脂のみによる含浸でもよAが、異系樹脂によ
る1次、2次含浸でもよく、又、1次含浸は低粘度樹脂
、2次含浸は1次含浸より高粘度樹脂による含浸という
ように含浸を複数にし、より均一な含浸ができるように
してもよ−。樹脂には硬化剤、架橋剤、重合開始剤、七
ツマー希釈剤、充填剤、補強剤等を必要に応じて加える
こともできる。更に上記樹脂はそのまま用いてもよいが
好ましくは減圧脱泡してから用することが樹脂含浸布内
の気泡発生を抑える上で望ましbことである。金属箔と
しては銅、アルミニウム、鉄、ニッケル、亜鉛等の単独
、合金、複合箔が用いられ、必要に応じて金属箔の片面
に接着剤層を設けておき、より接着性を向上させること
もできる。スクイズロールとしては金属製、ゴム製、合
成樹脂製或すは金属ロール表面にゴムや合成樹脂をライ
ニングしたものでもよく任意である。ラミネートに際し
てはスクイズロールと樹脂含浸布との間に樹脂溜まりを
発生させることが樹脂含浸布内に気泡を発生させなく好
ましいことである。長尺帯状積層体の硬化は樹脂の種類
によって硬化温度、硬化時間を選択することができるが
硬化は無圧であることが重要である。Long resin-impregnated ceramic fiber cloth used in the present invention? Toshi is made of ceramic 11i fabric made of quartz, alumina, boron nitride, etc., phenol resin, epoxy resin,
It is impregnated with unsaturated polyester resin, diallyl phthalate resin, vinyl ester resin, epoxy acrylate resin, polyimide 4 resin, polyphenylene V oxide resin, fluororesin, etc. alone, modified products, and mixtures, and the resin impregnation is the same type of resin. Impregnation may be done only by A, but primary and secondary impregnation with a different type of resin may also be used, or multiple impregnations may be carried out, such as primary impregnation with a low viscosity resin and secondary impregnation with a higher viscosity resin than the primary impregnation. You can also do this to achieve more uniform impregnation. A curing agent, a crosslinking agent, a polymerization initiator, a 7-mer diluent, a filler, a reinforcing agent, etc. can be added to the resin as necessary. Furthermore, although the above resin may be used as it is, it is preferable to use it after defoaming under reduced pressure, in order to suppress the generation of bubbles in the resin-impregnated cloth. As the metal foil, single, alloy, or composite foils of copper, aluminum, iron, nickel, zinc, etc. are used, and if necessary, an adhesive layer can be provided on one side of the metal foil to further improve adhesion. can. The squeeze roll may be made of metal, rubber, synthetic resin, or a metal roll whose surface is lined with rubber or synthetic resin. During lamination, it is preferable to generate a resin pool between the squeeze roll and the resin-impregnated cloth to avoid generating air bubbles in the resin-impregnated cloth. The curing temperature and curing time for curing the long strip-shaped laminate can be selected depending on the type of resin, but it is important that the curing is done without pressure.
切断後の加熱、冷却につbでは用−た樹脂の熱変形温度
以上、以下にできるものであれば特に限定しないが、冷
却につbでは急冷できるものであることが望ましbo
以下本発明の一実施例を図示実施例にもとづbて説明す
れば次のようである。For heating and cooling after cutting, there is no particular limitation as long as the temperature can be lowered or higher than the heat deformation temperature of the resin used, but for cooling, it is desirable that the temperature can be rapidly cooled.Hereinafter, the present invention One embodiment of the present invention will be explained as follows based on the illustrated embodiment.
実施例
91図は本発明の積層板の製造方法の一実施例を示す簡
略工程図である。Example 91 Figure 1 is a simplified process diagram showing an example of the method for manufacturing a laminate of the present invention.
第1図1こ示すように巾1050m、厚さ0.2鰭の長
尺セラミック繊維布(サンゴパン社製、品番ヰ18)に
減圧脱圧した過酸化ベンゾイル含有不飽和ポリエステル
樹脂を含浸した長尺樹脂含浸布lの4枚を上下に配設し
たスクイズロール2間を通して樹脂jIkを50重!I
k俤に調整すると同時に樹脂含浸布1とスクイズロール
2間に樹脂溜まり3を発生させつつラミネート後、その
上下面に厚さ0.035闘の接着剤付銅箔4の接着剤側
を樹脂含浸布と対向させて配設しラミネートロール5で
ラミネートした長尺帯状積層体6を硬化炉7に送り、無
圧下で加熱硬化させた。この硬化物の熱変形温度は80
℃であった。次に該硬化物を1000 X 1000
fi毎に力9ター8で切断後、加熱炉9で85℃に加熱
後、冷却炉IOで60℃に急冷して厚さ0.8Hの両面
鋼張積層板11を得た。Figure 1 As shown, a long ceramic fiber cloth (manufactured by Sango Pan Co., Ltd., product number I18) with a width of 1050 m and a thickness of 0.2 fins is impregnated with unsaturated polyester resin containing benzoyl peroxide that has been depressurized. 50 layers of resin jIk are passed between 2 squeeze rolls with 4 sheets of resin-impregnated cloth 1 placed above and below! I
At the same time, while creating a resin pool 3 between the resin-impregnated cloth 1 and the squeeze roll 2, after laminating, the adhesive side of the adhesive-coated copper foil 4 with a thickness of 0.035mm is impregnated with resin on the upper and lower surfaces. A long strip-shaped laminate 6 placed facing the cloth and laminated with a laminating roll 5 was sent to a curing furnace 7 and cured by heating under no pressure. The heat distortion temperature of this cured product is 80
It was ℃. Next, the cured product was 1000 x 1000
After cutting with a force of 9 terres for each fi, it was heated to 85° C. in a heating furnace 9 and then rapidly cooled to 60° C. in a cooling furnace IO to obtain a double-sided steel clad laminate 11 with a thickness of 0.8H.
比較例
実施例と同じセラミ9り繊維布に実施例と同じ樹脂を含
浸、乾燥して得たプリプレグを10!50 X 105
0鱈角に切断して4枚を重ねた上下面に実施例と同じ銅
箔を上記寸法と同じく切断して配設した積層体を成形圧
力20Kq/d 、 145℃で60分間加熱加圧し
て厚さg、 B mmの両面銅張積層板を得た。Comparative Example A prepreg obtained by impregnating the same ceramic fiber cloth as in the example with the same resin as in the example and drying it was prepared in a size of 10!50 x 105.
The same copper foil as in the example was cut to the same dimensions as above and arranged on the upper and lower surfaces of 4 sheets cut to 0 cod angle and placed on top and bottom, and heated and pressed at 145°C for 60 minutes at a molding pressure of 20 Kq/d. A double-sided copper-clad laminate with a thickness of g and B mm was obtained.
実施例及び比較例の積層板の性能は?41表のようであ
る。What is the performance of the laminates in Examples and Comparative Examples? It looks like Table 41.
本発明は上述した如く構成されてbる。特許請求の範囲
に記載した構成を有する積層板の製造方法においては反
りの少な−積層板が得られる効果がある。The present invention is constructed as described above. The method for manufacturing a laminate having the structure described in the claims has the effect of producing a laminate with less warpage.
第1図は本発明の積層板の製造方法の一実施例を示す簡
略工程図である。
1は長尺樹脂含浸布、2はスクイズロール、3は樹脂溜
まり、4は銅箔、5はラミネートロール6は長尺帯状積
層体、7は硬化炉、8はカッタ9は加熱炉、lOは冷却
炉、11は積層板である。FIG. 1 is a simplified process diagram showing an embodiment of the method for manufacturing a laminate according to the present invention. 1 is a long resin-impregnated cloth, 2 is a squeeze roll, 3 is a resin reservoir, 4 is a copper foil, 5 is a laminate roll 6 is a long strip-shaped laminate, 7 is a curing furnace, 8 is a cutter 9 is a heating furnace, IO is a In the cooling furnace, 11 is a laminated plate.
Claims (1)
下に配設したスクイズロール間を通しラミネート後、そ
の上面及び又は下面に長尺金属箔を配設、ラミネートし
た長尺帯状積層体を連続的に移行させつつ硬化後、所要
寸法に切断し、更に熱変形温度以上に加熱後、熱変形温
度以下に冷却することを特徴とする積層板の製造方法。(1) After laminating the required number of long resin-impregnated ceramic fiber cloths through squeeze rolls placed above and below, a long metal foil is placed on the upper and/or lower surfaces of the laminated long strip-shaped laminate. 1. A method for manufacturing a laminate, which comprises curing the laminate while continuously transferring it, cutting it into a required size, heating it above the heat distortion temperature, and cooling it below the heat distortion temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26734689A JPH03126552A (en) | 1989-10-12 | 1989-10-12 | Manufacture of laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26734689A JPH03126552A (en) | 1989-10-12 | 1989-10-12 | Manufacture of laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03126552A true JPH03126552A (en) | 1991-05-29 |
Family
ID=17443538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26734689A Pending JPH03126552A (en) | 1989-10-12 | 1989-10-12 | Manufacture of laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03126552A (en) |
-
1989
- 1989-10-12 JP JP26734689A patent/JPH03126552A/en active Pending
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