JPH03128236A - Manufacture of copper-clad laminate - Google Patents
Manufacture of copper-clad laminateInfo
- Publication number
- JPH03128236A JPH03128236A JP26617089A JP26617089A JPH03128236A JP H03128236 A JPH03128236 A JP H03128236A JP 26617089 A JP26617089 A JP 26617089A JP 26617089 A JP26617089 A JP 26617089A JP H03128236 A JPH03128236 A JP H03128236A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- prepreg
- glass
- copper
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002344 surface layer Substances 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 239000004744 fabric Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 3
- 238000003303 reheating Methods 0.000 abstract description 9
- 230000009477 glass transition Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000754 repressing effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は加工時において、反りの生じ難い片面銅張積層
板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for producing a single-sided copper-clad laminate that is less likely to warp during processing.
〈従来の技術〉
従来、表面層基材としてガラスクロスを使用し、中心層
としてガラス不織布基材を使用し、エポキシ樹脂をバイ
ンダーとするいわゆるＣＦ、Ｍ−３タイプの銅張積層板
の製造において、通常の成形条件は圧力３０〜１００
ｋｇ／ ｃｄ、温度１５０〜２００°Ｃ１時間７０〜１
５０分程度であり、一定圧力又は何段階か今の昇圧を行
っている。<Prior art> Conventionally, in the production of so-called CF, M-3 type copper clad laminates, glass cloth is used as the surface layer base material, glass nonwoven fabric base material is used as the center layer, and epoxy resin is used as the binder. , normal molding conditions are pressure 30-100
kg/cd, temperature 150-200°C 1 hour 70-1
It takes about 50 minutes, and the pressure is kept constant or increased in several steps.
ＯＥＭ−３タイプの片面銅張積層板の場合、このような
通常の成形条件で得られたものは、プリント回路板への
加工時通常２５０×３００ＴＩＩ１１サイズのもので、
１．０〜５．０ｍｍの反りが発生する。In the case of OEM-3 type single-sided copper-clad laminates, the ones obtained under these normal molding conditions are usually 250 x 300 TII11 size when processed into printed circuit boards,
A warpage of 1.0 to 5.0 mm occurs.
反りが発生したプリント回路板は、加熱ロールの間を通
すなどにより、反りを小さくする工夫がなされているが
、未だ十分な解決が得られていない。Efforts have been made to reduce the warpage by passing warped printed circuit boards between heated rolls, but no satisfactory solution has yet been found.
〈発明が解決しようとする課題〉
本発明は、ＯＥＭ−３タイプの片面銅張積層板の加工時
の反りをより一層小さくすることを目的とする。<Problems to be Solved by the Invention> An object of the present invention is to further reduce warpage during processing of an OEM-3 type single-sided copper-clad laminate.
く課題を解決するための手段〉
本発明は、表面層としてエポキシ樹脂ガラスクロスプリ
プレグを使用し、中心層としてエポキシ樹脂ガラス不織
布プリプレグを使用し、更に片方の表面層上に銅箔を重
ね合わせ、加熱加圧成形する片面銅張積層板を製造する
際、加圧時加熱により脱泡を行ったのち、冷却し、その
後再び加熱することを特徴とする片面銅張積層板の製造
方法である。Means for Solving the Problems> The present invention uses an epoxy resin glass cloth prepreg as the surface layer, an epoxy resin glass nonwoven fabric prepreg as the center layer, and further overlays copper foil on one of the surface layers. This is a method for manufacturing a single-sided copper-clad laminate, which is characterized in that when manufacturing a single-sided copper-clad laminate that is subjected to heat and pressure molding, defoaming is performed by heating during pressurization, cooling, and then heating again.
本発明においては、積層成形時にエポキシ樹脂が硬化し
た後−度冷却して再び加熱するが、その理由は冷却時に
積層板に残存する内部歪みを再加熱により取除くことが
できるからである。In the present invention, after the epoxy resin is cured during lamination molding, it is cooled and then heated again, because internal distortions remaining in the laminated plate during cooling can be removed by reheating.
従って、中間の冷却は硬化したエポキシ樹脂のガラス転
移温度（通常１２０〜１４０”Ｃ）以下、好ましくは１
００ ’Ｃ以下（５０’Ｃ以下にする必要はない）であ
る、また再加熱の温度はガラス転移温度以上、好ましく
は１５０℃〜１８０°Ｃである。Therefore, the intermediate cooling is below the glass transition temperature (usually 120-140"C) of the cured epoxy resin, preferably 1
00'C or less (not necessarily 50'C or less), and the reheating temperature is above the glass transition temperature, preferably from 150°C to 180°C.
更に、冷却と同時に成形圧力を零にし、再加熱の時に再
び加圧すれば、積層板の内部歪みを取除くためにより効
果的である。Furthermore, reducing the molding pressure to zero at the same time as cooling and applying pressure again during reheating is more effective for removing internal distortions in the laminate.
再加圧の時の圧力は１〜１０ｋｇ／ｃＪ程度と低くする
のが好ましい。The pressure during repressurization is preferably as low as about 1 to 10 kg/cJ.
なお、再加熱または再加熱と再加圧の時間は通常３０分
間以下であるが、５〜ｌＯ分間が好ましい。Note that the time for reheating or reheating and repressurization is usually 30 minutes or less, but preferably 5 to 10 minutes.
特に、再加熱と再加圧を行う場合、積層板を始めの加熱
加圧を行うプレスから別のプレスに移し換えて行うこと
もできる。後段の加熱加圧は前段はどの高温高圧を要し
ないので、より簡素なプレスを使用することができる。In particular, when reheating and repressing are performed, the laminate may be transferred from the press that initially heats and presses to another press. Since heating and pressing in the latter stage does not require any high temperature and high pressure in the former stage, a simpler press can be used.
このようにして得られた片面銅張積層板はその後の加工
工程における反りを、２５０Ｘ３００ｍｍサイズで、０
６０〜１．５Ｍと、従来の１．０〜５．０ ＋ｎ＋ｎに
比較してかなり低く抑えることができる。The single-sided copper-clad laminate obtained in this way has a size of 250 x 300 mm and has 0 warpage in subsequent processing steps.
60 to 1.5M, which can be kept considerably lower than the conventional 1.0 to 5.0 +n+n.
この理由は冷却再加熱、またはこれと成形圧力を零にす
ることの組合せにより、樹脂硬化時の内部歪みが、開放
されるためである。The reason for this is that by cooling and reheating, or a combination of cooling and reheating and reducing the molding pressure to zero, internal distortions during resin curing are released.
次に実施例及び比較例により本発明を具体的に説明する
。Next, the present invention will be specifically explained with reference to Examples and Comparative Examples.
比較例１
ガラス織布にエポキシ樹脂を樹脂分４５重量％になるよ
う含浸したプリプレグを各１枚表面層とし、内層として
ガラス不織布にエポキシ樹脂及び無機フィラー分が８０
重量％になるよう含浸したプリプレグを３枚使用し、更
に、片面に銅箔を重ね、熱板温度１８０°Ｃのプレスに
挿入し、圧力４０ｋｇ／ｃ−ｄで３０分間加圧後、圧力
を６０ｋｇ／ｃ−とし１２０分間威形１、そのままの圧
力で常温まで冷却し、得られた積層板をプレスから取り
出した。Comparative Example 1 A glass woven fabric impregnated with epoxy resin to a resin content of 45% by weight was used as the surface layer, and an inner layer was a glass nonwoven fabric with an epoxy resin and an inorganic filler content of 80% by weight.
Three sheets of prepreg impregnated to the same weight percent were used, and copper foil was layered on one side, and the sheets were inserted into a press with a hot plate temperature of 180°C, and after being pressed at a pressure of 40 kg/c-d for 30 minutes, the pressure was turned off. The pressure was set at 60 kg/c- for 120 minutes, and the pressure was then cooled to room temperature, and the obtained laminate was taken out from the press.
比較例２
比較例１に使用した表面層用プリプレグと内層用プリプ
レグとその片面に銅箔１枚を重ね、比較例１と同様にし
て１８０ ’Ｃ、４０ｋｇ／ ｃ＋ｊで３０分間、更に
６０ｋｇ／ｃ−で１２０分間加熱加圧した。その後冷却
を開始すると共にプレスを開放して圧力をＯとし、２分
後圧力５ ｋｇ ／ ｃｄに再加圧した。再加圧時のプ
レス温度は１６０°Ｃであった。常温まで冷却後積層板
をプレスから取り出した。Comparative Example 2 The surface layer prepreg and inner layer prepreg used in Comparative Example 1 were stacked with one sheet of copper foil on one side, and heated in the same manner as Comparative Example 1 at 180'C and 40 kg/c+j for 30 minutes, and then at 60 kg/c. -Heat and pressure was applied for 120 minutes. Thereafter, cooling was started, and the press was opened to set the pressure to O, and after 2 minutes, the pressure was again increased to 5 kg/cd. The press temperature during repressing was 160°C. After cooling to room temperature, the laminate was taken out from the press.
実施例１
比較例１及び２と同様の構成でプリプレグと銅箔を重ね
合わせ、比較例２と同様にして１８０”Ｃ１４０ｋｇ／
ｃｄで３０分間、更に６０ｋｇ／ｃｄで１２０分間加熱
加圧した。その後５０°Ｃまで冷却し、５分後再び１５
０°Ｃまで加熱し、１０分後冷却し、得られた積層板を
取出した。Example 1 Prepreg and copper foil were overlapped with the same structure as Comparative Examples 1 and 2, and 180"C140kg/
It was heated and pressurized at CD for 30 minutes and then at 60 kg/cd for 120 minutes. Then cool to 50°C, and after 5 minutes return to 15°C.
It was heated to 0°C, cooled after 10 minutes, and the obtained laminate was taken out.
実施例２
比較例１及び２と同様の構成で、プリプレグと銅箔を重
ね合わせ、比較例１と同様に１８０°Ｃ１４０ｋｇ／ｃ
ｄで３０分間、更に６０ｋｇ／ｃｄで１２０分間加熱加
圧した。その後５０°Ｃまで冷却し、その直後プレス開
放して圧力を零とした。Example 2 With the same configuration as Comparative Examples 1 and 2, prepreg and copper foil were overlapped and heated at 180°C 140 kg/c as in Comparative Example 1.
d for 30 minutes, and then heated and pressurized at 60 kg/cd for 120 minutes. Thereafter, it was cooled to 50°C, and the press was immediately opened to bring the pressure to zero.
５分後、温度１５０°Ｃ１圧力１０ｋｇ／ｃＪに再加熱
再加圧し、１０分後冷却し、常温で得られた積層板を取
り出した。After 5 minutes, the mixture was reheated and pressurized to a temperature of 150° C. and a pressure of 10 kg/cJ, and after 10 minutes, it was cooled and the resulting laminate was taken out at room temperature.
これらの例に用いたエポキシ樹脂は硬化物のガラス転移
点が１３０°Ｃのものである。これらの例で得られた積
層板の反りは、それぞれ次の通りである。The epoxy resin used in these examples has a glass transition point of the cured product of 130°C. The warpage of the laminates obtained in these examples is as follows.
（単位：閣）
なお、反りは、底形された積層板を２５０Ｘ３横
００ｍｍに切断し、その直隻及び１５０ ’Ｃ１３０分
間加熱処理を行って求めた。(Unit: Kaku) Note that the warpage was determined by cutting the bottom-shaped laminate into 250 x 3 00 mm width pieces, cutting them straight, and heating them at 150'C for 130 minutes.
〈発明の効果〉
本発明により、積層板の加工時の反りが従来の１、０〜
５．０ ｍに対して０．０〜１．５ ｍと、改良するこ
とができる。この改良により積層板上に形成するパター
ンの位置ズレが殆どなくなる。また、積層板に設けた穴
の位置精度が向上することにより、積層板上に搭載する
部品の自動挿入時のトラブルがなくなる。<Effects of the Invention> According to the present invention, the warpage during processing of a laminate is reduced to 1.0 to 0.
It can be improved to 0.0 to 1.5 m compared to 5.0 m. This improvement almost eliminates misalignment of the pattern formed on the laminate. Furthermore, by improving the positional accuracy of the holes provided in the laminate, troubles during automatic insertion of components to be mounted on the laminate are eliminated.
Claims (1)
グを使用し、中心層としてエポキシ樹脂ガラス不織布プ
リプレグを使用し、更に片方の表面層上に銅箔を重ね合
わせ、加熱加圧成形する片面銅張積層板を製造する際、
加圧時加熱により脱泡を行ったのち、冷却し、その後再
び加熱することを特徴とする片面銅張積層板の製造方法
。(1) Single-sided copper-clad laminate that uses epoxy resin glass cloth prepreg as the surface layer, uses epoxy resin glass nonwoven prepreg as the center layer, and then overlays copper foil on one surface layer and molds under heat and pressure. When manufacturing
A method for manufacturing a single-sided copper-clad laminate, which comprises defoaming by heating during pressurization, cooling, and then heating again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26617089A JPH03128236A (en) | 1989-10-16 | 1989-10-16 | Manufacture of copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26617089A JPH03128236A (en) | 1989-10-16 | 1989-10-16 | Manufacture of copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128236A true JPH03128236A (en) | 1991-05-31 |
Family
ID=17427242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26617089A Pending JPH03128236A (en) | 1989-10-16 | 1989-10-16 | Manufacture of copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128236A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009094216A (en) * | 2007-10-05 | 2009-04-30 | Sumitomo Bakelite Co Ltd | Manufacturing method of semiconductor device, and manufacturing method of printed circuit board for semiconductor device |
| CN106042528A (en) * | 2016-05-31 | 2016-10-26 | 中国科学院理化技术研究所 | Novel low-temperature insulation and thermal insulation pre-impregnated fiber cloth and preparation method thereof |
-
1989
- 1989-10-16 JP JP26617089A patent/JPH03128236A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009094216A (en) * | 2007-10-05 | 2009-04-30 | Sumitomo Bakelite Co Ltd | Manufacturing method of semiconductor device, and manufacturing method of printed circuit board for semiconductor device |
| CN106042528A (en) * | 2016-05-31 | 2016-10-26 | 中国科学院理化技术研究所 | Novel low-temperature insulation and thermal insulation pre-impregnated fiber cloth and preparation method thereof |
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