JP2017193691A5 - - Google Patents

Claims (21)

A thermosetting resin composition comprising (a) an epoxy resin, (b) a curing agent, (c) an inorganic filler, and (d) a resin having a polysiloxane skeleton,
  The content of the (c) inorganic filler is 50 to 90% by mass with respect to the solid content of the thermosetting resin composition,
  Thermosetting resin composition whose content of resin which has said (d) polysiloxane structure is 0.01-1 mass% with respect to solid content of a thermosetting resin composition. The thermosetting resin composition according to claim 1, wherein the (b) curing agent contains at least one selected from the group consisting of (b1) an active ester curing agent and (b2) a cyanate curing agent. . The thermosetting resin composition according to claim 1, wherein the curing agent (b) contains a phenol novolac curing agent containing a (b3) triazine ring. The (a) epoxy resin has at least one selected from the group consisting of bisphenol A type epoxy resin, naphthalene type epoxy resin, aralkyl novolac type epoxy resin having a biphenyl skeleton, and cresol novolac type epoxy resin. The thermosetting resin composition of any one of -3. The thermosetting resin composition according to any one of claims 1 to 4, wherein the (c) inorganic filler contains silica. The thermosetting resin composition according to any one of claims 1 to 5, wherein the (c) inorganic filler contains surface-treated silica. The thermosetting resin composition according to any one of claims 1 to 6, wherein the (c) inorganic filler contains silica surface-treated with an aminosilane coupling agent. The thermosetting resin composition according to any one of claims 1 to 7, further comprising (e) a phenoxy resin. The thermosetting resin composition according to any one of claims 1 to 8, further comprising (f) a curing accelerator. The thermosetting resin composition according to claim 9, wherein the curing accelerator (f) contains at least one organic curing accelerator selected from the group consisting of organic phosphorus compounds, imidazole compounds and amine compounds. object. The thermosetting resin composition according to claim 9, wherein the curing accelerator (f) contains a metal-based curing accelerator. The resin film for interlayer insulation layers formed using the thermosetting resin composition of any one of Claims 1-11. The resin film for interlayer insulation layers according to claim 12, which is for forming a buildup layer of a multilayer printed wiring board. The multilayer resin film which contains the resin composition layer for interlayer insulation layers which consists of a thermosetting resin composition of any one of Claims 1-11, and an adhesion auxiliary layer. A multilayer resin film comprising the resin film for an interlayer insulating layer according to claim 12 or the multilayer resin film according to claim 14, and an organic resin film subjected to a mold release treatment. A multilayer printed wiring board obtained using at least one selected from the group consisting of the resin film for an interlayer insulating layer according to claim 12 and the multilayer resin film according to claim 14 or 15. It is a manufacturing method of the multilayer printed wiring board using the multilayer resin film of Claim 15, Comprising: The manufacturing method of the multilayer printed wiring board which has the following processes.
(1) A step of laminating at least one selected from the group consisting of a resin film for an interlayer insulating layer with a support and a multilayer resin film with a support on one side or both sides of a circuit board.
(2) A step of heat curing the resin film laminated in the step (1) to form an insulating layer.
(3) A step of drilling a circuit board on which the insulating layer is formed in the step (2).
(4) A step of roughening the surface of the insulating layer with an oxidizing agent.
(5) A step of forming a conductor layer by plating on the surface of the roughened insulating layer.
(6) A step of forming a circuit on the conductor layer by a semi-additive method. The method for manufacturing a multilayer printed wiring board according to claim 17, wherein the support is a support subjected to release treatment. 19. The multilayer printed wiring board according to claim 18, wherein the resin film laminated in step (1) is thermally cured in the step (2) with the support subjected to the release treatment being attached. Method. The manufacturing method of the multilayer printed wiring board of Claim 18 which peel-removes the support body to which the mold release process was performed before any of the said process (2)-(5). The manufacturing method of the multilayer printed wiring board of Claim 19 which peel-removes the support body to which the mold release process was performed before any of the said process (3)-(5).