JP2017193690A5 - - Google Patents

Claims (13)

(A) An epoxy resin, (B) a cyanate resin, (C) an inorganic filler, and (D) a resin film for an interlayer insulating layer formed using a thermosetting resin composition containing a phosphorus-containing compound,
(D) the phosphorus-containing compound is at least one selected from the group consisting of an aromatic phosphate ester, an aromatic condensed phosphate ester and a cyclic phosphazene;
(C) The resin film for interlayer insulation layers whose content of an inorganic filler is 50-85 mass parts with respect to 100 mass parts of solid content of the said thermosetting resin composition. The content of (D) phosphorus-containing compound in the thermosetting resin composition is 0.1 to 20 parts by mass with respect to 100 parts by mass of the solid content of the thermosetting resin composition. The resin film for interlayer insulation layers as described in 2. (D) The resin film for interlayer insulation layers of Claim 1 or 2 in which a phosphorus containing compound does not contain a hydroxyl group and an amino group. (D) The resin film for interlayer insulation layers of any one of Claims 1-3 whose phosphorus containing compound is a compound represented by following General formula (1).

(Wherein R ^D1 Each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, each n independently represents an integer of 1 to 5, Ar ^D1 Represents an arylene group having 6 to 20 carbon atoms. ) (D) The resin film for interlayer insulation layers of any one of Claims 1-3 whose phosphorus containing compound is a compound represented by following General formula (2).

(Wherein R ^D2 Each independently represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms or an aryloxy group having 6 to 20 carbon atoms. ) (D) The phosphorus-containing compound is a compound represented by the general formula (2), and R in the general formula (2) ^D2 The resin film for interlayer insulation layers according to claim 5, wherein is a phenoxy group. The resin film for interlayer insulation layers according to any one of claims 1 to 6, wherein the thermosetting resin composition further contains (E) a phenoxy resin. The resin film for interlayer insulation layers according to any one of claims 1 to 7, wherein the thermosetting resin composition further contains (F) an active ester curing agent. The resin film for interlayer insulation layers according to any one of claims 1 to 8, which is used for forming a buildup layer of a multilayer printed wiring board. The multilayer resin film which has the resin film for interlayer insulation layers of any one of Claims 1-9, and an organic resin film. The thickness of the said organic resin film is 10-70 micrometers, The multilayer resin film of Claim 10 whose thickness of the said resin film for interlayer insulation layers is 1-70 micrometers. The multilayer printed wiring board obtained using the resin film for interlayer insulation layers of any one of Claims 1-9, or the multilayer resin film of Claim 10 or Claim 11. The manufacturing method of a multilayer printed wiring board which has following process (1)-(5).
(1) The interlayer insulating layer resin film according to any one of claims 1 to 9 or the interlayer insulating layer resin film of the multilayer resin film according to claim 10 or claim 11 is provided on one side of a circuit board or Lamination on both sides.
(2) A step of thermally curing the interlayer insulating layer resin film laminated in step (1) to form an insulating layer.
(3) A step of drilling the circuit board on which the insulating layer is formed in step (2).
(4) A step of roughening the surface of the insulating layer with an oxidizing agent.
(5) A step of forming a conductor layer by plating on the surface of the roughened insulating layer.
(6) A step of forming a circuit in the conductor layer by a semi-additive method.