JP2018125378A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018125378A5 JP2018125378A5 JP2017015448A JP2017015448A JP2018125378A5 JP 2018125378 A5 JP2018125378 A5 JP 2018125378A5 JP 2017015448 A JP2017015448 A JP 2017015448A JP 2017015448 A JP2017015448 A JP 2017015448A JP 2018125378 A5 JP2018125378 A5 JP 2018125378A5
- Authority
- JP
- Japan
- Prior art keywords
- dry film
- resin
- resin layer
- film
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 13
- 229920005989 resin Polymers 0.000 claims 13
- 229920001187 thermosetting polymer Polymers 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000004643 cyanate ester Substances 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000005011 phenolic resin Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Claims (7)
前記樹脂層が、熱硬化性樹脂および硬化剤を含有する熱硬化性の樹脂層であり、
前記フィルムの縦方向と横方向の長さの熱変化率（％）の差が、２．７％以下であり、
前記硬化剤として、フェノール樹脂、シアネートエステル樹脂および活性エステル樹脂から選ばれる少なくとも何れか２種以上を含むドライフィルムであり、
ドライフィルムの前記樹脂層を回路形成された基板にラミネートし、前記フィルムを剥がさずに熱硬化して硬化物を得、前記フィルムを剥離した後、デスミア処理を施すプリント配線板の製造方法に用いられることを特徴とするドライフィルム。 A dry film in which a resin layer is laminated on a film,
The resin layer is a thermosetting resin layer containing a thermosetting resin and a curing agent,
The difference in the rate of thermal change (%) in the longitudinal and transverse lengths of the film is 2.7% or less;
A dry film containing at least any two or more selected from the group consisting of a phenol resin, a cyanate ester resin and an active ester resin as the curing agent ,
Laminating the resin layer of the dry film on the circuit-formed substrate, thermosetting without peeling the film to obtain a cured product, after peeling the film, used in the method of manufacturing a printed wiring board to perform desmear treatment A dry film characterized in that it can be used.
A process for laminating the resin layer of the dry film according to any one of claims 1 to 4 on a substrate, and thermally curing without peeling the film to obtain a cured product. Method.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017015448A JP2018125378A (en) | 2017-01-31 | 2017-01-31 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
| PCT/JP2017/047140 WO2018142827A1 (en) | 2017-01-31 | 2017-12-27 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
| KR1020197024921A KR20190113852A (en) | 2017-01-31 | 2017-12-27 | Dry film, hardened | cured material, printed wiring board, and manufacturing method of hardened | cured material |
| CN201780076241.6A CN110050514A (en) | 2017-01-31 | 2017-12-27 | The manufacturing method of dry film, solidfied material, printed circuit board and solidfied material |
| TW107101482A TW201839040A (en) | 2017-01-31 | 2018-01-16 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017015448A JP2018125378A (en) | 2017-01-31 | 2017-01-31 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018125378A JP2018125378A (en) | 2018-08-09 |
| JP2018125378A5 true JP2018125378A5 (en) | 2020-01-16 |
Family
ID=63040521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017015448A Pending JP2018125378A (en) | 2017-01-31 | 2017-01-31 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2018125378A (en) |
| KR (1) | KR20190113852A (en) |
| CN (1) | CN110050514A (en) |
| TW (1) | TW201839040A (en) |
| WO (1) | WO2018142827A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7258453B2 (en) * | 2017-03-31 | 2023-04-17 | 住友ベークライト株式会社 | Thermosetting resin composition, resin film with carrier, prepreg, printed wiring board and semiconductor device |
| JP7119290B2 (en) * | 2017-05-30 | 2022-08-17 | 住友ベークライト株式会社 | Thermosetting resin composition, resin film with carrier, prepreg, printed wiring board and semiconductor device |
| JP7123731B2 (en) * | 2018-10-11 | 2022-08-23 | 積水化学工業株式会社 | Resin materials and multilayer printed wiring boards |
| JP7221064B2 (en) * | 2019-01-30 | 2023-02-13 | 太陽インキ製造株式会社 | Dry films, cured products and electronic components |
| TW202144187A (en) * | 2020-03-31 | 2021-12-01 | 日商太陽油墨製造股份有限公司 | Structure body |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252458A (en) * | 2001-02-26 | 2002-09-06 | Mitsubishi Polyester Film Copp | Polyester film used for manufacturing multilayer printed wiring board |
| JP2004122433A (en) * | 2002-09-30 | 2004-04-22 | Nippon Zeon Co Ltd | Release film for manufacturing printed circuit board and its manufacturing method |
| JPWO2008133293A1 (en) * | 2007-04-25 | 2010-07-29 | 日立化成工業株式会社 | Adhesive sheet |
| JP6322885B2 (en) * | 2012-11-01 | 2018-05-16 | 味の素株式会社 | Method for manufacturing printed wiring board |
| JP5624184B1 (en) * | 2013-06-28 | 2014-11-12 | 太陽インキ製造株式会社 | Dry film and printed wiring board |
| JP2016074849A (en) * | 2014-10-08 | 2016-05-12 | 太陽インキ製造株式会社 | Dry film, cured product, and printed wiring board |
| JP2016203379A (en) * | 2015-04-15 | 2016-12-08 | 東レ株式会社 | Adhesive laminated film, adhesive laminated film with protective film, and multilayer printed wiring board |
-
2017
- 2017-01-31 JP JP2017015448A patent/JP2018125378A/en active Pending
- 2017-12-27 KR KR1020197024921A patent/KR20190113852A/en not_active Application Discontinuation
- 2017-12-27 CN CN201780076241.6A patent/CN110050514A/en active Pending
- 2017-12-27 WO PCT/JP2017/047140 patent/WO2018142827A1/en active Application Filing
-
2018
- 2018-01-16 TW TW107101482A patent/TW201839040A/en unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018125378A5 (en) | ||
| TW201613991A (en) | Dry film, cured product and printed wiring board | |
| JP2015173104A5 (en) | Peeling method | |
| US20150371932A1 (en) | Thin film rdl for nanochip package | |
| MY155358A (en) | Resin compound for forming adhesive layer of multilayered flexible printed wiring board | |
| JP2014110390A5 (en) | ||
| JP2017193691A5 (en) | ||
| JP2016029161A5 (en) | ||
| JP2012515671A5 (en) | ||
| JP2012136570A5 (en) | ||
| JP2007059892A5 (en) | ||
| JP2013163812A5 (en) | ||
| JP2014208764A5 (en) | ||
| EP3290453A4 (en) | Epoxy resin composition, thermoconductive material precursor, b-stage sheet, prepreg, heat-dissipating material, laminated plate, metal substrate, and printed circuit board | |
| MY184907A (en) | Metal foil, metal foil having release layer, laminated material, printed wiring board, semiconductor package, electronic device, and method for producing printed wiring board | |
| WO2014131071A3 (en) | Semi-finished product for the production of a printed circuit board and method for producing the same | |
| TW200746967A (en) | Conductor-clad laminate, wiring circuit board, and processes for producing the same | |
| SG11201808371UA (en) | Method for manufacturing semiconductor device | |
| JP2015024515A5 (en) | Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board | |
| JP2016111359A (en) | Printed circuit board with embedded electronic component and method of manufacturing the same | |
| TWI456012B (en) | Wafer backside coating process with pulsed uv light source | |
| JP2015084420A (en) | Method of manufacturing printed circuit board | |
| JP2015010118A5 (en) | ||
| EP3584276A4 (en) | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate | |
| JP2014201830A5 (en) | Copper foil with carrier and manufacturing method thereof, ultrathin copper layer, manufacturing method of copper clad laminate, and manufacturing method of printed wiring board |