JP2015010118A5 - - Google Patents

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Publication number
JP2015010118A5
JP2015010118A5 JP2013134609A JP2013134609A JP2015010118A5 JP 2015010118 A5 JP2015010118 A5 JP 2015010118A5 JP 2013134609 A JP2013134609 A JP 2013134609A JP 2013134609 A JP2013134609 A JP 2013134609A JP 2015010118 A5 JP2015010118 A5 JP 2015010118A5
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Japan
Prior art keywords
resin
resin composition
cal
resins
phase separation
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JP2013134609A
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Japanese (ja)
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JP6201452B2 (en
JP2015010118A (en
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Priority claimed from JP2013134609A external-priority patent/JP6201452B2/en
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上記課題を解決するため、本発明は以下の構成を有するものである。
(1)溶解度パラメータの差が0.5(cal/cm1/2以上4.5(cal/cm1/2以下である少なくとも2種の樹脂を含み、少なくとも一方の樹脂が、樹脂前駆体(A)光重合した樹脂であることを特徴とする樹脂組成物。
(2)前記樹脂前駆体(A)が2つ以上の不飽和炭化水素基を含むことを特徴とする(1)に記載の樹脂組成物。
(3)無機組成物積層用である(1)または(2)に記載の樹脂組成物。
(4)(1)〜(3)のいずれかに記載の樹脂組成物からなる、表面に構造周期0.001μm以上1μm以下の相分離構造を有する成形品。
(5)樹脂組成物を構成する前記樹脂前駆体(A)と他の樹脂を相溶後、所望の構造に成形し、光照射することにより前記前駆体(A)を光重合させて表面に構造周期0.001μm以上1μm以下の相分離構造を形成することを特徴とする(4)に記載の成形品の製造方法。
(6)前記相分離構造を、スピノーダル分解による相分離によって形成することを特徴とする(5)に記載の成形品の製造方法。
In order to solve the above problems, the present invention has the following configuration.
(1) It includes at least two kinds of resins having a solubility parameter difference of 0.5 (cal / cm 3 ) 1/2 or more and 4.5 (cal / cm 3 ) 1/2 or less, and at least one resin is resin composition, wherein the resin precursor (a) is a photopolymerizable resin.
(2) The resin composition according to (1), wherein the resin precursor (A) contains two or more unsaturated hydrocarbon groups.
(3) The resin composition according to (1) or (2), which is used for laminating an inorganic composition.
(4) A molded article comprising a resin composition according to any one of (1) to (3) and having a phase separation structure with a structural period of 0.001 μm to 1 μm on the surface.
(5) After the resin precursor (A) constituting the resin composition and another resin are compatible, the resin precursor is molded into a desired structure and irradiated with light to photopolymerize the precursor (A) on the surface. The method for producing a molded article according to (4), wherein a phase separation structure having a structure period of 0.001 μm to 1 μm is formed.
(6) The method for producing a molded article according to (5), wherein the phase separation structure is formed by phase separation by spinodal decomposition.

Claims (2)

溶解度パラメータの差が0.5(cal/cm1/2以上4.5(cal/cm1/2以下である少なくとも2種の樹脂を含み、少なくとも一方の樹脂が、樹脂前駆体(A)光重合した樹脂であることを特徴とする樹脂組成物。 It includes at least two resins having a solubility parameter difference of 0.5 (cal / cm 3 ) 1/2 or more and 4.5 (cal / cm 3 ) 1/2 or less, and at least one of the resins is a resin precursor. (a) a resin composition which is a photopolymerizable resin. 請求項1〜3のいずれかに記載の樹脂組成物からなる、表面に構造周期0.001μm以上1μm以下の相分離構造を有する成形品。 A molded article comprising the resin composition according to any one of claims 1 to 3 and having a phase separation structure having a structural period of 0.001 µm to 1 µm on the surface.
JP2013134609A 2013-06-27 2013-06-27 Resin composition and molded article using the same Active JP6201452B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013134609A JP6201452B2 (en) 2013-06-27 2013-06-27 Resin composition and molded article using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013134609A JP6201452B2 (en) 2013-06-27 2013-06-27 Resin composition and molded article using the same

Publications (3)

Publication Number Publication Date
JP2015010118A JP2015010118A (en) 2015-01-19
JP2015010118A5 true JP2015010118A5 (en) 2016-06-23
JP6201452B2 JP6201452B2 (en) 2017-09-27

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Family Applications (1)

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JP2013134609A Active JP6201452B2 (en) 2013-06-27 2013-06-27 Resin composition and molded article using the same

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JP (1) JP6201452B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018154760A (en) * 2017-03-17 2018-10-04 東芝メモリ株式会社 Pattern formation material and pattern formation method
WO2019027019A1 (en) * 2017-08-04 2019-02-07 三洋化成工業株式会社 Electrolytic capacitor additive, conductive polymer dispersion, electrolytic solution and electrolytic capacitor
WO2019131597A1 (en) * 2017-12-27 2019-07-04 株式会社ネオス Acrylic block copolymer and anti-fogging film containing same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001329027A (en) * 2000-05-19 2001-11-27 Kawamura Inst Of Chem Res Resin composite, composition, and their production methods
JP2003286409A (en) * 2002-03-28 2003-10-10 Toray Ind Inc Resin composition for high surface hardness member and method for producing the same
JP5033740B2 (en) * 2007-10-26 2012-09-26 帝人株式会社 Transparent conductive laminate and touch panel

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