JP2011219674A5 - - Google Patents
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- JP2011219674A5 JP2011219674A5 JP2010092205A JP2010092205A JP2011219674A5 JP 2011219674 A5 JP2011219674 A5 JP 2011219674A5 JP 2010092205 A JP2010092205 A JP 2010092205A JP 2010092205 A JP2010092205 A JP 2010092205A JP 2011219674 A5 JP2011219674 A5 JP 2011219674A5
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- tetraphenylphosphonium
- volley
- bets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
（実施例３）
実施例１で用いた０．１５質量部のテトラフェニルホスホニウムテトラフェニルボレートを、０．１７質量部のテトラフェニルホスホニウムテトラ（ｐ−エチルフェニル）ボレートに替えて用いた以外は、実施例１と同様にして樹脂ワニスを調製し、プリプレグ、積層板、樹脂シート、プリント配線板、及び半導体装置を得た。
(Example 3)
Tetraphenylphosphonium tetraphenylborate 0.15 parts by weight used in Example 1, except for using in place of 0.17 parts by weight of tetraphenylphosphonium tetra (p- ethylphenyl) volley bets, as in Example 1 Similarly, a resin varnish was prepared to obtain a prepreg, a laminate, a resin sheet, a printed wiring board, and a semiconductor device.
（実施例４）
実施例１で用いた０．１５質量部のテトラフェニルホスホニウムテトラフェニルボレートを、０．１８質量部のテトラフェニルホスホニウムテトラ（ｐ−エトキシフェニル）ボレートに替えて用いた以外は、実施例１と同様にして樹脂ワニスを調製し、プリプレグ、積層板、樹脂シート、プリント配線板、及び半導体装置を得た。
Example 4
Tetraphenylphosphonium tetraphenylborate 0.15 parts by weight used in Example 1, except for using in place of 0.18 parts by weight of tetraphenylphosphonium tetra (p- ethoxyphenyl) volley bets, as in Example 1 Similarly, a resin varnish was prepared to obtain a prepreg, a laminate, a resin sheet, a printed wiring board, and a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010092205A JP2011219674A (en) | 2010-04-13 | 2010-04-13 | Thermosetting resin composition for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010092205A JP2011219674A (en) | 2010-04-13 | 2010-04-13 | Thermosetting resin composition for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011219674A JP2011219674A (en) | 2011-11-04 |
| JP2011219674A5 true JP2011219674A5 (en) | 2013-02-28 |
Family
ID=45037061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010092205A Pending JP2011219674A (en) | 2010-04-13 | 2010-04-13 | Thermosetting resin composition for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011219674A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012041386A (en) * | 2010-08-12 | 2012-03-01 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition for circuit board |
| KR101507528B1 (en) * | 2010-10-29 | 2015-03-31 | 에아.워타 가부시키가이샤 | Resin composition, and prepreg and laminate using same |
| KR101920106B1 (en) * | 2012-01-31 | 2018-11-19 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same |
| JP5717698B2 (en) * | 2012-07-31 | 2015-05-13 | 株式会社有沢製作所 | Epoxy resin composition |
| JP2014111719A (en) * | 2012-11-12 | 2014-06-19 | Panasonic Corp | Laminate, metal-clad laminate, printed wiring board, and multilayer printed wiring board |
| JP6248524B2 (en) * | 2013-10-07 | 2017-12-20 | 日立化成株式会社 | Thermosetting resin composition, prepreg, laminate and printed wiring board using the same |
| WO2018021548A1 (en) | 2016-07-29 | 2018-02-01 | 北興化学工業株式会社 | Novel phosphonium compound |
| CN112105677B (en) * | 2018-04-26 | 2023-03-28 | 琳得科株式会社 | Resin composition, resin sheet, and laminate |
| JP6978472B2 (en) * | 2018-08-27 | 2021-12-08 | 積水化学工業株式会社 | Manufacturing method of multi-layer printed wiring board, resin film and multi-layer printed wiring board |
| JP6978471B2 (en) * | 2018-08-27 | 2021-12-08 | 積水化学工業株式会社 | Manufacturing method of multi-layer printed wiring board, resin film and multi-layer printed wiring board |
| JP7412413B2 (en) * | 2019-03-27 | 2024-01-12 | 三井金属鉱業株式会社 | Resin compositions, resin-coated copper foils, dielectric layers, copper-clad laminates, capacitor elements, and printed wiring boards with built-in capacitors |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61255926A (en) * | 1985-05-10 | 1986-11-13 | Hitachi Ltd | Heat-resistant resin composition |
| JPS61293251A (en) * | 1985-05-22 | 1986-12-24 | Sumitomo Chem Co Ltd | Epoxy resin composition |
| JPH03177057A (en) * | 1989-12-05 | 1991-08-01 | Hitachi Ltd | Semiconductor coated with resin composition |
| JP2870903B2 (en) * | 1989-12-26 | 1999-03-17 | 三井化学株式会社 | Resin composition for semiconductor encapsulation |
| JP3232683B2 (en) * | 1992-09-09 | 2001-11-26 | 住友化学工業株式会社 | Thermosetting resin composition and use thereof |
| JPH0693051A (en) * | 1992-09-14 | 1994-04-05 | Sumitomo Chem Co Ltd | Thermosetting resin composition and use thereof |
| JPH06145259A (en) * | 1992-11-11 | 1994-05-24 | Sumitomo Chem Co Ltd | Thermosetting resin composition and its use |
| JPH0710893A (en) * | 1993-06-23 | 1995-01-13 | Hokko Chem Ind Co Ltd | Novel phosphonium tetraphenyl borate and epoxy resin hardening promoter |
| JPH0925334A (en) * | 1995-07-13 | 1997-01-28 | Hitachi Ltd | Epoxy resin composition |
| JP4026036B2 (en) * | 1997-07-31 | 2007-12-26 | 日立化成工業株式会社 | Resin composition curable by heat or light, and film and laminate using the same |
| JP2003335925A (en) * | 2002-05-23 | 2003-11-28 | Mitsui Chemicals Inc | Modified polyimide resin composition and prepreg and laminated sheet using the same |
| JP4603774B2 (en) * | 2003-05-29 | 2010-12-22 | 日東電工株式会社 | Adhesive composition and adhesive film using the same |
| JP2005325178A (en) * | 2004-05-12 | 2005-11-24 | Hokko Chem Ind Co Ltd | Epoxy resin composition for sealing optical semiconductor |
| JP2006008788A (en) * | 2004-06-24 | 2006-01-12 | Nissan Motor Co Ltd | Resin composition for printed board and manufacturing method of printed board and metal substrate using the same |
| JP2006199812A (en) * | 2005-01-20 | 2006-08-03 | Nichias Corp | Conductive epoxy resin composition and separator for fuel cell |
| JP2007326956A (en) * | 2006-06-07 | 2007-12-20 | Kaneka Corp | Prepreg, laminate, and printed circuit board comprising the same |
| JP2009013224A (en) * | 2007-07-02 | 2009-01-22 | Air Water Inc | Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| JP2009227992A (en) * | 2008-02-29 | 2009-10-08 | Sekisui Chem Co Ltd | Film and printed circuit board |
| JP2009260232A (en) * | 2008-03-26 | 2009-11-05 | Hitachi Chem Co Ltd | Film-like adhesive for sealing semiconductor, and semiconductor apparatus and method of manufacturing the same |
-
2010
- 2010-04-13 JP JP2010092205A patent/JP2011219674A/en active Pending
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