TW201613991A - Dry film, cured product and printed wiring board - Google Patents
Dry film, cured product and printed wiring boardInfo
- Publication number
- TW201613991A TW201613991A TW104125415A TW104125415A TW201613991A TW 201613991 A TW201613991 A TW 201613991A TW 104125415 A TW104125415 A TW 104125415A TW 104125415 A TW104125415 A TW 104125415A TW 201613991 A TW201613991 A TW 201613991A
- Authority
- TW
- Taiwan
- Prior art keywords
- dry film
- cured product
- wiring board
- printed wiring
- resin layer
- Prior art date
Links
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
Abstract
The present invention provides a dry film having a resin layer, which is used to produce a cured product having heat resistance, low warpage and excellent fracture resistance, excellent in peeling off from a carrier film and capable of preventing fractures and dust falling, and a printed wiring board which comprises the cured product obtained by curing the dry film. The solution provided by the present invention is a dry film having a resin layer. The resin layer contains a thermosetting resin component, at least one of curing agent and curing accelerator, a maleimide compound, fillers and at least two solvents characterized in that the boiling points of the solvents are higher than 100 DEG C and the difference between the boiling points is more than 5 DEG C.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014207328A JP2016074849A (en) | 2014-10-08 | 2014-10-08 | Dry film, cured product, and printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201613991A true TW201613991A (en) | 2016-04-16 |
Family
ID=55713002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104125415A TW201613991A (en) | 2014-10-08 | 2015-08-05 | Dry film, cured product and printed wiring board |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2016074849A (en) |
KR (1) | KR20160041788A (en) |
CN (1) | CN105504677A (en) |
TW (1) | TW201613991A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI732055B (en) * | 2016-10-17 | 2021-07-01 | 日商三鍵有限公司 | Curable resin composition |
TWI752057B (en) * | 2016-07-20 | 2022-01-11 | 日商昭和電工材料股份有限公司 | Composite film for electronic equipment, printed wiring board, and manufacturing method using high-frequency signal |
TWI765028B (en) * | 2017-06-30 | 2022-05-21 | 日商琳得科股份有限公司 | Resin sheet, laminate, and method for producing resin sheet |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018012777A (en) * | 2016-07-20 | 2018-01-25 | 日立化成株式会社 | Insulation resin material, resin film for interlayer insulation and production method of the same, composite film and production method of the same, and printed wiring board and production method of the same |
JP6789030B2 (en) * | 2016-08-09 | 2020-11-25 | 京セラ株式会社 | Encapsulating resin composition and semiconductor device |
JP2018125378A (en) * | 2017-01-31 | 2018-08-09 | 太陽インキ製造株式会社 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
CN108219371B (en) * | 2017-12-29 | 2020-08-18 | 广东生益科技股份有限公司 | Epoxy resin composition, prepreg, laminate, and printed wiring board |
JP6999459B2 (en) * | 2018-03-22 | 2022-01-18 | 太陽インキ製造株式会社 | Dry films, cured products, and electronic components |
JP7169076B2 (en) * | 2018-03-22 | 2022-11-10 | 太陽インキ製造株式会社 | Thermosetting resin composition, dry film, cured product, and electronic component |
JP7057905B2 (en) * | 2018-03-29 | 2022-04-21 | Dic株式会社 | Curable composition and its cured product |
JP6940833B2 (en) * | 2018-03-29 | 2021-09-29 | Dic株式会社 | Curable composition and its cured product |
KR20210005579A (en) * | 2018-04-26 | 2021-01-14 | 린텍 가부시키가이샤 | Resin composition, resin sheet and laminate |
SG11202012017VA (en) * | 2018-06-12 | 2021-01-28 | Showa Denko Materials Co Ltd | Curable resin composition and electronic component device |
JP2020094089A (en) * | 2018-12-10 | 2020-06-18 | 積水化学工業株式会社 | Resin material and multilayer printed wiring board |
CN112955319A (en) * | 2018-12-12 | 2021-06-11 | 松下知识产权经营株式会社 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board |
TW202128418A (en) * | 2019-09-30 | 2021-08-01 | 日商太陽油墨製造股份有限公司 | Laminated structure |
JP7409262B2 (en) * | 2020-08-24 | 2024-01-09 | 味の素株式会社 | resin composition |
CN116396678A (en) * | 2021-12-27 | 2023-07-07 | 山东工业陶瓷研究设计院有限公司 | Normal-temperature curing radiation coating slurry, radiation coating and preparation method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008133353A (en) * | 2006-11-28 | 2008-06-12 | Hitachi Chem Co Ltd | Thermosetting resin composition, and prepreg and laminate using the resin composition |
JP5396805B2 (en) * | 2008-10-07 | 2014-01-22 | 味の素株式会社 | Epoxy resin composition |
JP5740941B2 (en) * | 2010-11-30 | 2015-07-01 | 住友ベークライト株式会社 | Prepreg, metal-clad laminate, printed wiring board, and semiconductor device |
CN102977551B (en) * | 2011-09-02 | 2014-12-10 | 广东生益科技股份有限公司 | Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition |
CN103937156A (en) * | 2014-03-05 | 2014-07-23 | 浙江华正新材料股份有限公司 | Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition |
-
2014
- 2014-10-08 JP JP2014207328A patent/JP2016074849A/en active Pending
-
2015
- 2015-08-05 TW TW104125415A patent/TW201613991A/en unknown
- 2015-10-05 KR KR1020150139514A patent/KR20160041788A/en unknown
- 2015-10-08 CN CN201510646506.4A patent/CN105504677A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI752057B (en) * | 2016-07-20 | 2022-01-11 | 日商昭和電工材料股份有限公司 | Composite film for electronic equipment, printed wiring board, and manufacturing method using high-frequency signal |
US11331888B2 (en) | 2016-07-20 | 2022-05-17 | Showa Denko Materials Co., Ltd. | Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor |
TWI732055B (en) * | 2016-10-17 | 2021-07-01 | 日商三鍵有限公司 | Curable resin composition |
US11091676B2 (en) | 2016-10-17 | 2021-08-17 | Threebond Co., Ltd. | Curable resin composition |
TWI765028B (en) * | 2017-06-30 | 2022-05-21 | 日商琳得科股份有限公司 | Resin sheet, laminate, and method for producing resin sheet |
Also Published As
Publication number | Publication date |
---|---|
CN105504677A (en) | 2016-04-20 |
JP2016074849A (en) | 2016-05-12 |
KR20160041788A (en) | 2016-04-18 |
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