KR20210005579A - Resin composition, resin sheet and laminate - Google Patents

Abstract

(A) A resin composition containing a thermosetting component, wherein the (A) thermosetting component contains (A1) a maleimide resin, and (A2) a phosphorus curing accelerator, and is formed from the resin composition and has a thickness of 25 μm. A resin composition having a peel strength of 2.0 N/10 mm or more after heat curing.

Description

Resin composition, resin sheet and laminate

The present invention relates to a resin composition, a resin sheet, and a laminate.

As a sealing material such as a power semiconductor, a resin composition having high heat resistance is used.

For example, Patent Document 1 contains a radical generator comprising a maleimide compound, a compound having at least any of an allyl group and an epoxy group, an amine compound, and at least one of an acetophenone derivative and a tetraphenylethane derivative. A resin composition is disclosed.

Japanese Unexamined Patent Publication No. 2015-147849

However, the resin composition described in Patent Document 1 was not cured under low temperature and short-time thermosetting conditions. In addition, in the resin composition described in Patent Document 1, there is a concern that the peel strength after thermosetting decreases.

It is an object of the present invention to provide a resin composition, a resin sheet, and a laminate that can achieve both low temperature and short time thermosetting conditions and peel strength after thermosetting.

A resin composition according to an aspect of the present invention is a resin composition containing (A) a thermosetting component, wherein the (A) thermosetting component contains (A1) a maleimide resin, and (A2) a phosphorus-based curing accelerator, A sheet-like article having a thickness of 25 µm formed of the resin composition is characterized in that the peel strength after thermosetting is 2.0 N/10 mm or more.

In the resin composition according to an aspect of the present invention, the (A2) phosphorus-based curing accelerator is preferably a compound having a structure in which a phosphorus atom and an aryl group are bonded.

In the resin composition according to an aspect of the present invention, it is preferable that the (A2) phosphorus-based curing accelerator is a phosphonium salt.

In the resin composition according to an aspect of the present invention, the content of the phosphorus-based curing accelerator (A2) is preferably 1% by mass or less based on the total amount of the solid content of the resin composition.

In the resin composition according to an aspect of the present invention, the content of the phosphorus-based curing accelerator (A2) is preferably 2% by mass or less based on the total amount of the solid content of the (A) thermosetting component.

In the resin composition according to an aspect of the present invention, it is preferable to further contain (A3) allyl resin.

In the resin composition according to an aspect of the present invention, it is preferable to further contain the (B) binder component.

In the resin composition according to an aspect of the present invention, the (B) binder component is preferably a phenoxy resin.

In the resin composition according to an aspect of the present invention, it is preferable to further contain (C) an inorganic filler.

In the resin composition according to an aspect of the present invention, it is preferable to further contain (D) a coupling agent.

The resin composition according to an aspect of the present invention is preferably used for sealing a semiconductor element or for interposing the semiconductor element and other electronic components.

The resin composition according to an aspect of the present invention is preferably used for sealing a power semiconductor element or for interposing the power semiconductor element and other electronic components.

The resin composition according to an aspect of the present invention is to encapsulate a semiconductor device using at least one of silicon carbide and gallium nitride, or a semiconductor device and other electronic component using at least one of the above silicon carbide and gallium nitride. It is preferably used for intervening.

A resin sheet according to an aspect of the present invention is a resin sheet formed of a resin composition containing (A) a thermosetting component, wherein the (A) thermosetting component is (A1) a maleimide resin, and (A2) a phosphorus-based curing accelerator Containing, and characterized in that the peel strength after heat curing is 2.0 N/10 mm or more.

A laminate according to an aspect of the present invention is characterized in that it has a resin sheet and a release material according to one aspect of the present invention described above, and the release material has a release agent layer containing an alkyd resin-based release agent.

According to an aspect of the present invention, it is possible to provide a resin composition, a resin sheet, and a laminate that can achieve both low temperature and short time thermosetting conditions and peel strength after thermosetting.

1 is a schematic cross-sectional view of a laminate according to an embodiment.

[Resin composition]

The resin composition according to the present embodiment contains (A) a thermosetting component. The (A) thermosetting component according to the present embodiment contains (A1) maleimide resin and (A2) phosphorus-based curing accelerator. The peel strength after thermosetting of a 25 µm-thick sheet-like article formed from the resin composition according to the present embodiment is 2.0 N/10 mm or more.

In the resin composition according to the present embodiment, thermosetting under low temperature and short time thermosetting conditions is possible, and process suitability can be improved.

When the peel strength after thermosetting of a sheet-like article having a thickness of 25 µm formed from the resin composition according to the present embodiment is less than 2.0 N/10 mm, when the resin composition is used as a sealing material or the like, peeling against an adherend such as a metal surface The intensity becomes insufficient.

The peel strength of the sheet-like article formed from the resin composition according to the present embodiment after heat curing can be adjusted within the above range by adjusting the type of component used in the resin composition (particularly, the type of phosphorus curing accelerator) and the blending amount. have.

In addition, the peel strength after thermosetting of a sheet-like article having a thickness of 25 µm formed of the resin composition according to the present embodiment is a sheet after thermosetting with respect to a sheet-like article formed of a sheet-like resin composition using a measurement method described later. It was calculated|required by carrying out a peeling test with a peeling angle of 90 degrees between an upper object and an adherend. Specifically, as follows, a test piece was prepared and a peel test was performed.

(i) Method for preparing the test piece

·Adhesive: Copper foil (size 50 ㎜ × 10 ㎜, thickness 150 ㎛, JIS H 3100: 2018 specification)

·Thickness of resin composition: 25 ㎛

Laminate device: "V-130" manufactured by Nikko-Materials

·Compression conditions: laminate temperature 130 ℃, reached pressure 100 Pa, time 60 seconds

·Heat curing conditions of the resin composition: heat curing temperature 180 ℃, heat curing time 1 hour

(ii) Method of peeling test

・Used equipment: Tensile tester ("Autograph AG-IS" manufactured by Shimadzu Corporation)

Peeling method: The adherend is peeled from the sheet-like article after curing.

Peeling speed: 50 ㎜/min

Peeling angle: 90 degrees

·Measurement environment: under 23 ℃, 50% relative humidity environment

((A) thermosetting component)

(A) The thermosetting component (hereinafter, simply referred to as "component (A)" in some cases) is a three-dimensional network when heated, and has a property of firmly adhering to an adherend. (A) thermosetting component in this embodiment, as described above, (A1) maleimide resin (hereinafter, simply referred to as ``(A1) component'') and (A2) phosphorus curing accelerator (hereinafter, It may be simply referred to as "(A2) component").

(A1) Maleimide resin

The maleimide resin (A1) in this embodiment is not particularly limited as long as it is a maleimide resin containing two or more maleimide groups in one molecule.

From the viewpoint of heat resistance, the (A1) maleimide resin in the present embodiment preferably contains, for example, a benzene ring, and more preferably contains a structure in which a maleimide group is connected to the benzene ring. Moreover, it is preferable that a maleimide compound has two or more structures in which a maleimide group is connected to a benzene ring.

(A1) maleimide resin in this embodiment is a maleimide resin containing two or more maleimide groups and one or more biphenyl skeletons in one molecule (hereinafter, simply referred to as ``biphenylmaleimide resin'' Is preferably).

It is preferable that the (A1) maleimide resin in this embodiment is represented by the following general formula (1) from the viewpoint of heat resistance and adhesiveness.

[Formula 1]

In the general formula (1), k is an integer of 1 or more, and the average value of k is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and still more preferably 1 or more and 3 or less. m1 and m2 are each independently an integer of 1 or more and 6 or less, preferably an integer of 1 or more and 3 or less, and more preferably 1. Each of n1 and n2 is independently an integer of 0 or more and 4 or less, preferably an integer of 0 or more and 2 or less, and more preferably 0. R ¹ and R ² are each independently an alkyl group having 1 to 6 carbon atoms, preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group. A plurality of R ¹ 's are the same as or different from each other. A plurality of R ² is the same as or different from each other.

Specific examples of the maleimide resin represented by the general formula (1) in the present embodiment include, for example, a compound represented by the following general formula (2) or the following general formula (3).

[Formula 2]

[Formula 3]

In the general formulas (2) and (3), k is the same as k in the general formula (1). Wherein in the formula (2), n1, n2, R ¹ and R ² are the same as n1, n2, R ¹ and R ² in the formula (1).

As a product of the maleimide resin represented by the said general formula (3), "MIR-3000-70MT" by a Nippon Explosives Company, etc. are mentioned.

Moreover, it is also preferable that (A1) maleimide resin in this embodiment is a maleimide resin containing 2 or more maleimide groups and 2 or more phenylene groups in 1 molecule. It is preferable to have a substituent on the phenylene group from the viewpoint of increasing the solubility in a solvent and improving the sheet formation property. As a substituent, an alkyl group, such as a methyl group and an ethyl group, and an alkylene group, etc. are mentioned, for example.

In addition, the maleimide resin (A1) in the present embodiment is preferably a maleimide resin having an ether bond between a maleimide group and a phenylene group from the viewpoint of sheet formation.

A maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule is represented by, for example, the following general formula (4).

[Formula 4]

In the general formula (4), R ³ to R ⁶ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, L ¹ is an alkylene group having 1 to 6 carbon atoms, and L ² and L ³ are And each independently represent an alkylene group having 1 to 6 carbon atoms or an arylene group having 6 to 10 carbon atoms, and p and q are each independently 0 or 1.

Specifically, the maleimide resin represented by the general formula (4) in the present embodiment is represented by, for example, the following general formula (5) or the following general formula (6).

[Formula 5]

[Formula 6]

In the general formulas (5) and (6), L ¹ is an alkylene group having 1 to 6 carbon atoms.

In the general formula (5), R ³ to R ⁶ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Specifically, as (A1) maleimide resin in this embodiment, from the viewpoint of obtaining a cured product having high heat resistance in addition to sheet formation properties, bis(3-ethyl-5-methyl-4-maleimide Phenyl)methane, N,N'-1,3-phenylenedimaleimide, 4-methyl-1,3-phenylenebismaleimide, polyphenylmethanemaleimide, or 2,2-bis[4-(4- Maleimidephenoxy)phenyl]propane is preferable, and bis(3-ethyl-5-methyl-4-maleimidephenyl)methane is more preferable from the viewpoint of sheet formation.

In this embodiment, the content of the component (A1) in the component (A) is based on the total amount of the solid content of the component (A) (that is, the nonvolatile content of the component (A) excluding the solvent for dilution is 100% by mass. Time), it is preferable that it is 50 mass% or more, and it is more preferable that it is 55 mass% or more.

(A2) Phosphorus hardening accelerator

The (A2) phosphorus-based curing accelerator in the present embodiment is not particularly limited as long as it contains a phosphorus atom and accelerates the polymerization reaction of (A1) maleimide resin.

Examples of the phosphorus-based curing accelerator (A2) in the present embodiment include an alkylphosphine compound, an arylphosphine compound, an alkylarylphosphine compound, a phosphine oxide compound, and a phosphonium salt.

As the alkylphosphine compound, specifically, trimethylphosphine, triethylphosphine, tri(n-propyl)phosphine, tri(n-butyl)phosphine, tri(n-hexyl)phosphine, tri(n- Octyl)phosphine, and tricyclohexylphosphine, and the like.

Specific examples of the arylphosphine compound include triphenylphosphine, tri(p-tolyl)phosphine, tri(m-tolyl)phosphine, tri(o-tolyl)phosphine, tris(2,3-dimethylphenyl) )Phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine, tris(3,4-dimethylphenyl)phosphine Pin, tris(3,5-dimethylphenyl)phosphine, tribenzylphosphine, bis(diphenyl)phosphinoethane, and bis(diphenyl)phosphinobutane.

As the alkylarylphosphine compound, specifically, cyclohexyldiphenylphosphine, dicyclohexylphenylphosphine, butyldiphenylphosphine, dibutylphenylphosphine, n-octyldiphenylphosphine, and di(n- Octyl) phenylphosphine, and the like.

As a phosphine oxide compound, specifically, triethylphosphine oxide, tri(n-propyl)phosphine oxide, tri(n-butyl)phosphine oxide, tri(n-hexyl)phosphine oxide, tri(n- Octyl)phosphine oxide, triphenylphosphine oxide, and tris(3-hydroxypropyl)phosphine oxide.

The phosphonium salt is a salt composed of a cation represented by PR ₄ ⁺ and an anion represented by X ⁻ .

Cation as a whole indicated by PR ₄ ⁺ in the phosphonium salt is tetraethyl phosphonium ion, triethyl benzyl phosphonium ion, tetra (n- butyl) phosphonium ion, tri (n- butyl) methyl phosphonium ion, Tri(n-butyl)octylphosphonium ion, tri(n-butyl)hexadecylphosphonium ion, tetraphenylphosphonium ion, tri(n-butyl)allylphosphonium ion, tri(n-butyl)benzylphosphonium ion , Tri(n-octyl)ethylphosphonium ion, tetrakis(hydroxymethyl)phosphonium ion, and ethyltriphenylphosphonium ion.

Examples of the anion represented by X ⁻ in the phosphonium salt include bromide ion, chloride ion, iodide ion, o,o-diethylphosphorodithioate ion, hydrogenhexahydrophthalate ion, sulfate ion, Tetraphenyl borate ion, and tetrakis(4-methylphenyl)borate ion.

As a phosphonium salt, specifically, tetraethylphosphonium bromide, triethylbenzylphosphonium chloride, tetra(n-butyl)phosphonium bromide, tetra(n-butyl)phosphonium chloride, tetra(n-butyl)phospho Nium iodide, tri(n-butyl)methylphosphonium iodide, tri(n-butyl)octylphosphonium bromide, tri(n-butyl)hexadecylphosphonium bromide, tri(n-butyl)allylphosphonium bromide , Tri(n-butyl)benzylphosphonium chloride, tetraphenylphosphonium bromide, tetra(n-butyl)phosphonium-o,o-diethylphosphorodithioate, tetra(n-butyl)phosphoniumhydrogenhexa Hydrophthalate, tri(n-octyl)ethylphosphonium bromide, tetrakis(hydroxymethyl)phosphonium sulfate, ethyltriphenylphosphonium bromide, tetraphenylphosphonium tetraphenylborate, and tetraphenylphosphonium tetrakis (4 -Methylphenyl)borate, etc. are mentioned.

Examples of other (A2) phosphorus-based curing accelerators include tris(3-hydroxypropyl)phosphine, bisdiphenylphosphinoferrocene, and tri(n-butyl)phosphine sulfide.

(A2) The phosphorus-based curing accelerator in the present embodiment is preferably a compound having a structure in which a phosphorus atom and an aryl group are directly bonded from the viewpoint of increasing the peel strength of the cured product formed of the resin composition from the adherend. Do.

(A2) As the aryl group directly bonded to the phosphorus atom of the compound in the phosphorus curing accelerator, a substituted or unsubstituted aryl group having 6 to 30 ring carbon atoms is preferable, and among them, a phenyl group, a tolyl group and a xylyl group are more desirable.

As a compound having a structure in which a phosphorus atom and a phenyl group are directly bonded, specifically, the aforementioned triphenylphosphine, bisdiphenylphosphinoethane, bisdiphenylphosphinobutane, cyclohexyldiphenylphosphine, triphenylphosphine oxide , Tetraphenylphosphonium tetraphenyl borate, tetraphenylphosphonium tetrakis (4-methylphenyl) borate, and the like.

Specific examples of the compound having a structure in which a phosphorus atom and a tolyl group are directly bonded include the aforementioned tri-p-tolylphosphine.

Specific examples of the compound having a structure in which a phosphorus atom and a xylyl group are directly bonded include the aforementioned tris(2,3-dimethylphenyl)phosphine.

As the (A2) phosphorus-based curing accelerator in the present embodiment, it is preferable that it is a phosphonium salt from the viewpoint of the peel strength of the cured product of the sheet-like product formed from the resin composition and the reaction temperature.

(A2) When a phosphonium salt is used as the phosphorus curing accelerator, the peel strength is less likely to decrease even if the amount of the phosphorus curing accelerator (A2) is increased.

In the present embodiment, the content of the phosphorus-based curing accelerator (A2) in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass), 1 mass It is preferable that it is not more than %, and it is more preferable that it is 0.75 mass% or less. The content of the (A2) phosphorus-based curing accelerator in the resin composition is preferably 0.05% by mass or more, and more preferably 0.1% by mass or more based on the total amount of the solid content of the resin composition.

When the content of the (A2) phosphorus curing accelerator is within the above range, the peel strength is obtained regardless of the kind of the (A2) phosphorus curing accelerator.

From the same viewpoint, the content of the (A2) phosphorus-based curing accelerator is 0.1 based on the total amount of the solid content of the component (A) (that is, when the nonvolatile content of the component (A) excluding the solvent for dilution is 100% by mass). It is preferable that it is at least 2 mass%, and it is preferable that it is 0.3 mass% or more and 1.5 mass% or less.

In the present embodiment, the (A2) phosphorus-based curing accelerator in the resin composition can be used alone or in combination of two or more.

(A3) Allyl resin

It is preferable that the (A) thermosetting component contained in the resin composition in this embodiment further contains (A3) allyl resin. (A3) It is preferable that the allyl resin (hereinafter, simply referred to as "component (A3)" in some cases) is a liquid at room temperature. When the (A) thermosetting component contains an allyl resin, the network can be adjusted to an appropriate range after curing of the resin composition.

In this embodiment, the mass ratio (A1/A3) of the maleimide resin (A1) to the (A3) allyl resin is preferably 1.5 or more, and more preferably 4.5 or more.

When the mass ratio (A1/A3) is within the above range, the storage modulus E'at 250°C of the cured product of the resin composition tends to increase.

Moreover, when the mass ratio (A1/A3) is the said range, heat resistance of a resin composition can be improved.

In addition, when the mass ratio (A1/A3) is within the above range, the complex viscosity η of the resin composition is appropriately adjusted, while securing the fluidity of the resin composition upon application to an adherend, further improvement of heat resistance after curing of the resin composition is realized. do. In addition, when the mass ratio (A1/A3) is within the above range, bleeding out of the allyl resin from the resin composition is also suppressed. In addition, the upper limit of the mass ratio (A1/A3) is not particularly limited. For example, the mass ratio (A1/A3) should just be 50 or less.

The allyl resin (A3) in this embodiment is not particularly limited as long as it is a resin having an allyl group. It is preferable that (A3) allyl resin in this embodiment is an allyl resin containing two or more allyl groups in 1 molecule, for example.

It is more preferable that the allyl resin in this embodiment is represented by the following general formula (7).

[Formula 7]

In the general formula (7), R ⁷ and R ⁸ are each independently an alkyl group, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms, and a methyl group and an ethyl group. It is more preferable that it is an alkyl group selected from the group consisting of.

Specific examples of the (A3) allyl resin in the present embodiment include diallylbisphenol A (2,2-bis(3-allyl-4-hydroxyphenyl)propane) and the like.

The (A) thermosetting component of the present embodiment is a thermosetting resin other than the component (A1), a curing accelerator other than the component (A2), and a cured resin other than the component (A3), as long as the object of the present invention is not impaired. It may contain.

The thermosetting resin other than the component (A1) may be a thermosetting resin having high heat resistance, and examples thereof include an epoxy resin, a benzoxazine resin, a cyanate resin, and a melamine resin. These thermosetting resins can be used alone or in combination of two or more.

Examples of the curing accelerator other than the component (A2) include imidazole compounds (eg, 2-ethyl-4-methylimidazole, etc.). These hardening accelerators can be used individually by 1 type or in combination of 2 or more types.

Examples of the cured resin other than the component (A3) include resins such as a phenol resin and a resin having a C=C double bond other than the component (A3), and amines, acid anhydrides, and formaldehyde. have. These cured resins can be used alone or in combination of two or more.

When using a thermosetting resin other than component (A1), a curing accelerator other than component (A2), or a curing resin other than component (A3), their content is based on the total amount of solid content of component (A) (i.e., When the nonvolatile content of the component (A) excluding the solvent for dilution is 100% by mass), it is preferably 10% by mass or less, and more preferably 5% by mass or less.

In the present embodiment, the content of the thermosetting component (A) in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass), and is 2% by mass. It is preferable that it is 75 mass% or less, and it is more preferable that it is 5 mass% or more and 70 mass% or less. When the content of the (A) thermosetting component is within the above range, the handling property of the resin composition, sheet formation property, and heat resistance of the resin sheet are improved.

((B) binder component)

In the present embodiment, it is preferable that the resin composition includes, in addition to the component (A), a binder component (B) (hereinafter, simply referred to as "component (B)"). When the resin composition of the present embodiment further contains the (B) binder component, film forming properties are imparted, and the resin composition can be easily molded into a sheet.

The binder component (B) of the present embodiment is a resin component other than the component (A), and has a function of bonding the component (A) or other components. (B) It is preferable that the binder component is a thermoplastic resin or the like. Component (B) may have a functional group as long as it has a function of bonding component (A) or other components. As described above, when the (B) binder component has a functional group, even if the (B) binder component may be involved in curing the resin composition by heat, in the present invention, the (B) binder component is different from the (A) thermosetting component. Distinct.

(B) The binder component can be selected from various resins, and may be an aliphatic compound or an aromatic compound. (B) The binder component is preferably at least any resin selected from the group consisting of, for example, a phenoxy resin, an acrylic resin, a methacrylic resin, a polyester resin, a urethane resin, and a polyamideimide resin, and from the viewpoint of heat resistance It is more preferable that it is a phenoxy resin. Moreover, it is preferable that a polyester resin is a wholly aromatic polyester resin. (B) The binder component can be used individually by 1 type or in combination of 2 or more types.

As phenoxy resin, bisphenol A skeleton (hereinafter, bisphenol A may be referred to as ``BisA''), bisphenol F skeleton (hereinafter, bisphenol F may be referred to as ``BisF''), biphenyl skeleton, and naphthalene It is preferably a phenoxy resin having at least one skeleton selected from the group consisting of skeletons, and more preferably a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton.

The weight average molecular weight (Mw) of the (B) binder component is preferably 100 or more and 1 million or less, more preferably 1000 or more and 800,000 or less, 1 from the viewpoint of making it easy to adjust the complex viscosity of the resin composition to a desired range. More preferably, it is 10,000 or more and 100,000 or less. The weight average molecular weight in this specification is a standard polystyrene conversion value measured by a gel permeation chromatography (GPC) method.

In this embodiment, the content of the binder component (B) in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass), 0.1% by mass It is preferable that it is more than 50 mass %, and it is more preferable that it is 1 mass% or more and 40 mass% or less. By setting the content of the (B) binder component in the resin composition to the above range, it becomes easy to adjust the complex viscosity of the resin composition before curing to a desired range, and the sheet formability of the resin composition and the handling property of the resin sheet are improved.

In the present embodiment, the content of the component (A1) is based on the total amount of solid content of the component (A) and the component (B) (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass), 20 It is preferable that it is not less than 80 mass% by mass. When the content of the component (A1) is 20 mass% or more, the heat resistance of the resin composition can be further improved. On the other hand, when the content of the component (A1) is 80% by mass or less, the resin composition can be easily molded into a sheet.

((C) Inorganic filler)

In this embodiment, it is preferable that the resin composition contains the (C) inorganic filler (hereinafter, simply referred to as "(C) component" in some cases) in addition to the component (A) and the component (B). By this component (C), at least any of the thermal properties and mechanical properties of the resin composition can be improved.

(C) As an inorganic filler, a silica filler, an alumina filler, a boron nitride filler, etc. are mentioned. Among these, a silica filler is preferable.

As a silica filler, fused silica, spherical silica, etc. are mentioned, for example.

(C) Inorganic fillers can be used alone or in combination of two or more. Moreover, (C) inorganic filler may be surface-treated.

(C) The average particle diameter of the inorganic filler is not particularly limited. (C) The average particle diameter of the inorganic filler is preferably 0.1 nm or more and 100 µm or less, and more preferably 10 nm or more and 10 µm or less, as a value obtained from a general particle size distribution meter. In the present specification, the average particle diameter of the (C) inorganic filler is a value measured by a dynamic light scattering method using a particle size distribution measuring device (manufactured by Nikkiso Corporation, product name "Nanotrack Wave-UT151").

The content of the (C) inorganic filler in the resin composition is based on the total solid content of the resin composition (that is, when the total nonvolatile content excluding the dilution solvent is 100% by mass), and is 10% by mass or more and 90% by mass or less. It is preferable, and it is more preferable that it is 20 mass% or more and 80 mass% or less.

((D) coupling agent)

In this embodiment, it is preferable that the resin composition further contains (D) a coupling agent in addition to the components (A) to (C).

The coupling agent preferably has a group that reacts with the functional group of the above-described (A) thermosetting component or the functional group of the (B) binder component, and more preferably has a group that reacts with the functional group of (A) the thermosetting component .

(D) By using the coupling agent, the peel strength between the cured product of the sheet-like article formed of the resin composition and the adherend is improved.

(D) As the coupling agent, a silane-based (silane coupling agent) is preferable from its versatility and cost advantages. (D) The coupling agent can be used individually by 1 type or in combination of 2 or more types. In addition, the coupling agent as described above is usually 0.1 parts by mass or more and 20 parts by mass or less based on 100 parts by mass of the total amount of the solid content (non-volatile content excluding the dilution solvent) of the component (A) and the component (B). It is blended, preferably 0.3 parts by mass or more and 15 parts by mass or less, and more preferably 0.5 parts by mass or more and 10 parts by mass or less.

As an example of the resin composition according to the present embodiment, a resin composition containing only (A) a thermosetting component, (B) a binder component, (C) an inorganic filler, and (D) a coupling agent may be mentioned.

In addition, as another example of the resin composition according to the present embodiment, as follows, (A) a thermosetting component, (B) a binder component, (C) an inorganic filler, (D) a coupling agent, and the (A) to ( The resin composition containing components other than the component D) is mentioned.

(Other ingredients)

In this embodiment, the resin composition may further contain other components. Examples of other components include at least any component selected from the group consisting of a crosslinking agent, a pigment, a dye, an antifoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant, and an ion scavenger.

For example, the resin composition may further contain a crosslinking agent in order to adjust the initial adhesiveness and cohesiveness before hardening.

As a crosslinking agent, an organic polyvalent isocyanate compound, an organic polyvalent imine compound, etc. are mentioned, for example. The crosslinking agent may be used alone or in combination of two or more.

As an organic polyvalent isocyanate compound, for example, an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyhydric isocyanate compound, and a trimer of these polyvalent isocyanate compounds, and terminal isocyanate urethane obtained by reacting these polyvalent isocyanate compounds with a polyol compound And prepolymers.

More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, and diphenylmethane- 4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-di Isocyanate, dicyclohexylmethane-2,4'-diisocyanate, and lysine isocyanate. Organic polyvalent isocyanate compounds can be used singly or in combination of two or more.

Specific examples of the organic polyvalent imine compound include, for example, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxyamide), trimethylolpropane-tri-β-aziridinylpropio Acid, tetramethylolmethane-tri-β-aziridinylpropionate, and N,N'-toluene-2,4-bis(1-aziridinecarboxyamide)triethylene melamine. The organic polyvalent imine compounds can be used alone or in combination of two or more.

The crosslinking agent as described above is usually blended in a ratio of 0.01 parts by mass or more and 12 parts by mass or less, and preferably 0.1 parts by mass or more and 10 parts by mass or less, based on 100 parts by mass of the binder component (B).

It is preferable that the resin composition according to the present embodiment is used for a semiconductor device. Specifically, the resin composition according to the present embodiment is preferably used for sealing a semiconductor element. Moreover, it is preferable that the resin composition which concerns on this embodiment is used for interposing a semiconductor element and another electronic component.

It is preferable that the semiconductor element is a power semiconductor element.

Since the resin composition according to the present embodiment is excellent in heat resistance, it can be used for sealing a power semiconductor element that is assumed to operate at a high temperature of 200°C or higher, or for interposing a power semiconductor element and other electronic components.

In addition, the use of the resin composition according to the present embodiment is not limited to these uses.

In addition, it is preferable that the resin composition according to the present embodiment be used for sealing a semiconductor element using at least one of silicon carbide and gallium nitride. Alternatively, the resin composition according to the present embodiment is preferably used for interposing a semiconductor element using at least one of silicon carbide and gallium nitride and other electronic components. As other electronic components, a printed wiring board, a lead frame, etc. are mentioned, for example.

Since the upper limit of the operating temperature of the silicon semiconductor device is about 175°C, it is preferable to use a semiconductor device using at least one of silicon carbide and gallium nitride capable of high-temperature operation as the power semiconductor device.

Since the resin composition according to the present embodiment is excellent in heat resistance, sealing a semiconductor device using at least one of silicon carbide and gallium nitride, which is assumed to operate at a high temperature of 200° C. or higher, or one of silicon carbide and gallium nitride It can be used for interposing between a semiconductor device using more than one type and other electronic components.

(Peak exothermic temperature before heat curing)

In the resin composition according to the present embodiment, the resin composition before curing preferably has an exothermic peak temperature measured at a heating rate of 10°C/min by a differential scanning calorimetry (DSC) method of 170°C or more and 210°C or less. Do. In addition, the said exothermic peak temperature is the temperature which the exothermic peak with the greatest intensity shows in DSC measurement data of a resin composition before hardening. When the said exothermic peak temperature is in the above-mentioned range, when curing a resin composition, it is possible to realize low temperature and short time thermal curing. Therefore, since the time until the resin composition is cured is short, the tact time in the semiconductor manufacturing process can be effectively shortened. In the case of manufacturing a multilayer circuit by stacking a plurality of semiconductor chips, in order to increase the efficiency of the process, a plurality of semiconductor chips are stacked (temporarily mounted) and then a plurality of resin compositions existing between the semiconductor chips are cured at a time. There is. Even in such a case, since the exothermic peak temperature is within the above-described range, curing of the resin composition adhered to the stacked semiconductor chip at the beginning of the process in an unintended step such as before the stacking of the semiconductor chip is completed can be suppressed. I can.

In addition, the method of measuring the exothermic peak temperature by differential scanning calorimetry is as shown in Examples described later.

(Thermal curing conditions)

In the thermosetting conditions in the resin composition according to the present embodiment, the heating temperature is preferably 50°C or more and 200°C or less, and preferably 100°C or more and 190°C or less.

In the thermosetting conditions in the resin composition according to the present embodiment, the heating time is preferably 30 minutes or more and 2 hours or less, and more preferably 45 minutes or more and 1 hour and 30 minutes or less.

When the thermal curing conditions in the resin composition are within the above range, thermal curing of the resin composition at a low temperature and a short time can be realized.

(Peel strength after heat curing)

The peel strength after thermosetting of a 25 µm-thick sheet-like article formed from the resin composition according to the present embodiment is 2.0 N/10 mm or more. In addition, the peel strength after thermosetting is preferably 3.0 N/10 mm or more and 50 N/10 mm or less, and more preferably 3.0 N/10 mm or more and 40 N/10 mm or less.

When the peel strength of the resin composition after thermosetting is within the above range, it is possible to maintain high adhesiveness to the adherend.

[Resin sheet]

The resin sheet according to the present embodiment is formed of a resin composition containing (A) a thermosetting component, and the (A) thermosetting component contains (A1) a maleimide resin and (A2) a phosphorus-based curing accelerator. The (A) thermosetting component, (A1) maleimide resin, and (A2) phosphorus-based curing accelerator are the same as those described above. Moreover, at least any component selected from the group consisting of the above-mentioned (C) inorganic filler, (D) coupling agent, and other components may be blended in the resin composition. In the resin sheet according to the present embodiment, thermosetting under low temperature and short time thermosetting conditions is possible, and process suitability can be improved.

The peel strength of the resin sheet according to the present embodiment after thermosetting is 2.0 N/10 mm or more.

When the peel strength of the resin sheet according to the present embodiment after heat curing is less than 2.0 N/10 mm, when the resin composition is used as a sealing material, the peel strength with respect to an adherend such as a metal surface becomes insufficient.

The peel strength of the resin sheet according to the present embodiment after thermal curing can be adjusted within the above range by adjusting the type of component used in the resin composition (particularly, the type of phosphorus curing accelerator) and the compounding amount.

In addition, the peeling strength of the resin sheet according to the present embodiment after thermosetting was obtained by performing a peeling test at a peeling angle of 90 degrees between the resin sheet after thermosetting and the adherend using a measurement method described later. Specifically, as follows, a test piece was prepared and a peel test was performed.

(i) Method for preparing the test piece

·Adhesive: Copper foil (size 50 ㎜ × 10 ㎜, thickness 150 ㎛, JIS H 3100: 2018 specification)

Laminate device: "V-130" manufactured by Nikko-Materials

·Compression conditions: laminate temperature 130 ℃, reached pressure 100 Pa, time 60 seconds

·Heat curing conditions of the resin composition: heat curing temperature 180 ℃, heat curing time 1 hour

(ii) Method of peeling test

・Used equipment: Tensile tester ("Autograph AG-IS" manufactured by Shimadzu Corporation)

Peeling method: The adherend is peeled from the sheet-like article after curing.

Peeling speed: 50 ㎜/min

Peeling angle: 90 degrees

·Measurement environment: under 23 ℃, 50% relative humidity environment

In addition, the thickness of the test piece is measured without changing from the thickness in a state in which the resin sheet is provided.

The resin sheet according to the present embodiment obtained by forming a sheet of a resin composition is easy to apply to an adherend, and is particularly easy to apply to an adherend of a large area.

Since the resin composition can be formed in advance into a shape suitable for the shape after the sealing process when processing the resin composition into a sheet, the resin sheet functions as a sealing material maintaining the uniformity of thickness and component ratio by simply applying it to an adherend. . Moreover, when the resin composition is in the form of a sheet, since there is no fluidity, the handleability is excellent.

The method of forming a sheet of a resin composition can employ a conventionally known method of forming a sheet, and is not particularly limited. The resin sheet according to the present embodiment may be a belt-shaped sheet or may be provided in a state wound up in a roll shape. The resin sheet according to the present embodiment wound up in a roll shape can be used by unwinding from a roll and cutting into a desired size.

It is preferable that it is 10 micrometers or more, and, as for the thickness of the resin sheet concerning this embodiment, it is more preferable that it is 20 micrometers or more. Further, the thickness of the resin sheet according to the present embodiment is preferably 500 µm or less, more preferably 400 µm or less, and still more preferably 300 µm or less.

It is preferable that the resin sheet according to the present embodiment is used for sealing a semiconductor element, or for interposing a semiconductor element and other electronic components, similarly to the resin composition according to the other embodiments. In addition, it is preferable that the resin sheet according to the present embodiment is applied collectively to a plurality of semiconductor elements. For example, if the resin composition is in the form of a sheet, a resin sheet is applied to a structure in which semiconductor elements are arranged for each gap of a frame in which a plurality of gaps are formed, and the frame and semiconductor elements are collectively sealed, so that it can be used for a so-called panel level package I can.

In addition, the use of the resin sheet according to the present embodiment is not limited to these uses.

[Laminate]

1 shows a schematic cross-sectional view of a laminate 1 according to the present embodiment.

The laminate (1) of the present embodiment is a resin sheet formed between the first release material (2), the second release material (4), and the first release material (2) and the second release material (4) (3) has The resin sheet 3 is a resin sheet according to the present embodiment.

The 1st peeling material 2 and the 2nd peeling material 4 have peelability, the peeling force of the 1st peeling material 2 with respect to the resin sheet 3, and the resin of the 2nd peeling material 4 It is preferable that there is a difference in the peeling force with respect to the sheet 3. The material of the 1st peeling material 2 and the 2nd peeling material 4 is not specifically limited. The ratio (P2/P1) of the peeling force (P2) of the second peeling material 4 to the peeling force (P1) of the first peeling material 2 is 0.02≦P2/P1<1 or 1<P2/P1 It is preferably ≤ 50.

The 1st releasing material 2 and the 2nd releasing material 4 may be, for example, a member subjected to a peeling treatment, in addition to a member having a peelable property in the releasing material itself, or a member in which a releasing agent layer is laminated . When the first release material 2 and the second release material 4 are not subjected to a release treatment, the material of the first release material 2 and the second release material 4 is, for example, Olefin-based resins, and fluorine resins.

The first release material 2 and the second release material 4 can be used as a release material including a release base material and a release agent layer formed by applying a release agent on the release base material. The release material provided with the release base material and the release agent layer is easy to handle. Further, the first release material 2 and the second release material 4 may have a release agent layer only on one side of the release base material, or may have a release agent layer on both sides of the release base material.

Examples of the peeling substrate include a paper substrate, a laminate paper obtained by laminating a thermoplastic resin such as polyethylene on the paper substrate, and a plastic film. Examples of the paper substrate include glassine paper, coated paper, and cast coated paper. As a plastic film, for example, a polyester film (e.g., polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), and a polyolefin film (e.g., polypropylene, polyethylene, etc.) Can be lifted. Among these, a polyester film is preferable.

Examples of the release agent include a silicone release agent composed of a silicone resin; A long-chain alkyl group-containing compound-based release agent composed of a compound containing a long-chain alkyl group such as polyvinyl carbamate and an alkylurea derivative; Alkyd resin type release agent composed of an alkyd resin (for example, an invertible alkyd resin, an invertible alkyd resin, etc.); Olefin resin (e.g., polyethylene (e.g., high density polyethylene, low density polyethylene, and linear low density polyethylene, etc.), propylene homopolymer having an isotactic structure, or syndiotactic structure, and propylene-α-olefin Olefin resin-based release agents composed of crystalline polypropylene resins such as copolymers); Rubber-based release agents composed of rubbers such as natural rubber and synthetic rubber (eg, butadiene rubber, isoprene rubber, styrene-butadiene rubber, methyl methacrylate-butadiene rubber, and acrylonitrile-butadiene rubber); And various peeling agents, such as an acrylic resin type peeling agent comprised from acrylic resins, such as a (meth)acrylic acid ester type copolymer, are mentioned. These release agents may be used alone or in combination of two or more. Among these release agents, alkyd resin release agents are preferred. In particular, when a phenoxy resin is used as the binder component (B) of the resin composition included in the resin sheet 3, if a general silicone-based release agent is employed, the release material is unintentionally peeled before use of the resin sheet 3 Since there is a risk of being discarded, it is preferable to use an alkyd resin type release agent.

The thickness of the 1st peeling material 2 and the 2nd peeling material 4 is not specifically limited. It is preferable that the thickness of the 1st peeling material 2 and the 2nd peeling material 4 is usually 1 micrometer or more and 500 micrometers or less, and 3 micrometers or more and 100 micrometers or less.

The thickness of the release agent layer is not particularly limited. When forming a release agent layer by applying a solution containing a release agent, the thickness of the release agent layer is preferably 0.01 µm or more and 3 µm or less, and more preferably 0.03 µm or more and 1 µm or less.

The manufacturing method of the laminated body 1 is not specifically limited. For example, the laminated body 1 is manufactured through the following process. First, on the 1st peeling material 2, a resin composition is apply|coated, and a coating film is formed. Next, this coating film is dried, and the resin sheet 3 is formed. Next, the laminated body 1 is obtained by bonding the resin sheet 3 and the 2nd release material 4 together at normal temperature.

[Effect of embodiment]

According to the resin composition, resin sheet, and laminate according to the present embodiment, it is possible to achieve both low temperature and short time thermosetting conditions and peel strength after thermosetting.

As described above, the resin composition according to the present embodiment can be preferably used for a power semiconductor device. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a power semiconductor element. The power semiconductor device is also expected to operate at a high temperature of 200°C or higher. Heat resistance is required for a material used for a semiconductor device having a power semiconductor element. Since the resin composition and the resin sheet according to the present embodiment are excellent in heat resistance, they are preferably used for covering a power semiconductor element in a semiconductor device, or for interposing a power semiconductor element and other components.

As described above, the resin composition according to the present embodiment can be preferably used for a semiconductor device using at least one of silicon carbide and gallium nitride. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a semiconductor element using at least one of silicon carbide and gallium nitride. Semiconductor devices using one or more of silicon carbide and gallium nitride have characteristics different from those of silicon semiconductor devices, and are therefore suitable for applications such as power semiconductor devices, high-power devices for base stations, sensors, detectors, and Schottky barrier diodes. Is used. In these applications, attention is also paid to the heat resistance of a semiconductor element using at least one of silicon carbide and gallium nitride, and the resin composition and resin sheet of the present embodiment are excellent in heat resistance, so that any one of silicon carbide and gallium nitride It is preferably used in combination with a semiconductor device using more than one species.

[Modification of the embodiment]

The present invention is not limited to the above-described embodiments, and modifications and improvements within a range capable of achieving the object of the present invention are included in the present invention.

In the above embodiment, a laminate having a first release material, a second release material, and a resin sheet formed between the first release material and the second release material was described, but the present invention is a laminate of such an aspect. Not limited. As another aspect, for example, a laminate having a resin sheet and a release material formed only on one surface of the resin sheet may be used.

In addition, in the embodiment of the semiconductor device described above, the use of semiconductor encapsulation has been described, but the resin composition and the resin sheet of the present invention are also used as insulating materials for circuit boards (e.g., rigid printed wiring board materials, flexible wiring boards Materials, interlayer insulating materials for build-up substrates, etc.), adhesive films for build-up, and adhesives. The use of the resin composition of the present invention and the resin sheet is not limited to these uses.

Example

Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited at all to these examples.

[Preparation of resin composition]

Resin compositions according to Examples 1 to 6 and Comparative Examples 1 to 7 were prepared in the blending ratio (mass% (ratio in terms of solid content)) shown in Table 1.

The materials used for preparation of the resin composition are as follows.

(Thermosetting component)

Maleimide resin: Maleimide resin having a biphenyl group (maleimide resin represented by the above general formula (3), "MIR-3000-70MT" manufactured by Nippon Explosives)

Curing accelerator-1: Tetraphenylphosphonium tetrakis(4-methylphenyl)borate (“TPP-MK” manufactured by Hokko Chemical Industries, and “TPP-MK” are registered trademarks)

Curing accelerator-2: Triphenylphosphine (“Hokko TPP” manufactured by Hokko Chemical Industries, and “Hokko TPP” are registered trademarks)

Curing accelerator-3: tetrabutylphosphonium hydrogenhexahydrophthalate ("TBP-3S" manufactured by Hokko Chemical Industries, Ltd.)

Curing accelerator-4: 2-ethyl-4-methylimidazole (Shikoku Chemical Industry Co., Ltd. "2E4MZ")

-Allyl resin: Diallylbisphenol A (Daisawa Chemical Industries, Ltd. ``DABPA'')

(Binder ingredient)

Binder resin: BisA/BisF mixed phenoxy resin (``ZX-1356-2'' manufactured by Shinnittetsu Jugeum Chemicals, weight average molecular weight 65,000)

(Inorganic filler)

Silica filler: fused silica (epoxysilane formula, average particle diameter 0.5 μm, maximum particle diameter 2.0 μm)

(Coupling agent)

·Coupling agent: 3-glycidoxypropyltriethoxysilane

<Evaluation of resin composition before thermosetting>

[Production of a laminate comprising a resin sheet]

On the first release material (polyethylene terephthalate film having a release layer formed of an alkyd resin release agent, thickness 38 µm), a resin varnish (a solution for coating prepared by dissolving a resin composition in methyl ethyl ketone) with a die coater, solid content The concentration was changed in the range of 51% by mass or more and 62% by mass or less in each Example and Comparative Example.) was applied and dried at 100°C for 2 minutes in a drying furnace. The thickness of the resin composition after drying was 25 µm. Immediately after taking the first release material and the resin composition out of the drying furnace, the dried resin composition and the second release material (a polyethylene terephthalate film having a release layer formed from a silicon-based release agent, thickness 38 µm) were bonded at room temperature, A laminate in which a first release material, a resin sheet made of a resin composition, and a second release material were laminated in this order was produced.

[Measurement of exothermic peak temperature by differential scanning calorimetry (DSC) method]

Two obtained resin sheets were laminated to produce a 50 µm-thick resin sheet laminate. Further, two resin sheet laminates were laminated to prepare a 100 µm resin sheet laminate, and this procedure was repeated to prepare a 200 µm thick measurement sample. DSC curve obtained by performing measurement in a temperature range of 50°C to 400°C at a temperature increase rate of 10°C/min using a differential scanning calorimeter ("DSC(Q2000)" manufactured by TA Instruments) for the obtained sample for measurement From, the exothermic peak temperature was obtained. Table 1 shows the obtained results.

<Evaluation of resin composition after thermosetting>

[Production of a laminate comprising a resin sheet]

A laminate was produced in the same manner as the method for producing a laminate described in the item of the evaluation of the resin composition before heat curing.

[Measurement of peeling strength]

One surface of the resin sheet in the obtained laminate was bonded to a wafer piece (800 µm in thickness) which had previously cut a 6-inch Si wafer into four equal parts by pressure-pressure bonding under the following bonding conditions.

<Coupling conditions>

Laminating device: "V-130" manufactured by Nikko Materials;

Compression conditions: laminate temperature 130 ℃, reached pressure 100 Pa, time 60 seconds

Next, copper foil (size 50 mm x 10 mm, thickness 150 µm, JIS H 3100 specification) was bonded to the other side of the resin sheet by pressure-pressure bonding under the same conditions as the above <bonding conditions>. In addition, the 1st peeling material and the 2nd peeling material of the resin sheet in a laminated body were peeled before sticking to the Si wafer and the copper plate, respectively. Thereafter, the resin composition was cured under the thermosetting conditions of Table 1 to obtain a sample. For this sample, using a tensile tester ("Autograph AG-IS" manufactured by Shimadzu Corporation), copper foil was peeled from the resin sheet after curing under conditions of a peeling rate of 50 mm/min and a peeling angle of 90 degrees, and cured with copper foil. The peel strength (unit: N/10 mm) of the subsequent resin sheet was measured. The measurement was performed in an environment of 25°C and 50% relative humidity. Table 1 shows the obtained results. In addition, for Comparative Example 1, since the adhesion was not performed under the thermosetting conditions at 180°C for 1 hour, curing was performed under the thermosetting conditions at 200°C for 4 hours. In addition, about Comparative Examples 2, 4, 6, and 7, the peel strength of the cured resin and copper foil was so low that it could not be measured.

It was confirmed that the resin composition according to Examples 1 to 6 can achieve both low temperature and short time thermosetting conditions and the peel strength after thermosetting compared with the resin composition according to Comparative Examples 1 to 7.

1: laminate,
2: first release material,
3: resin sheet,
4: 2nd peeling material.

Claims (15)

(A) As a resin composition containing a thermosetting component,
The (A) thermosetting component contains (A1) a maleimide resin, and (A2) a phosphorus-based curing accelerator,
A resin composition, characterized in that the peel strength of a sheet-like article having a thickness of 25 µm formed from the resin composition after thermosetting is 2.0 N/10 mm or more. The method of claim 1,
The resin composition characterized in that the (A2) phosphorus-based curing accelerator is a compound having a structure in which a phosphorus atom and an aryl group are bonded. The method according to claim 1 or 2,
The (A2) phosphorus-based curing accelerator is a phosphonium salt. The method according to any one of claims 1 to 3,
The resin composition, wherein the content of the phosphorus-based curing accelerator (A2) is 1% by mass or less based on the total amount of the solid content of the resin composition. The method according to any one of claims 1 to 3,
The resin composition, wherein the content of the phosphorus-based curing accelerator (A2) is 2% by mass or less based on the total amount of the solid content of the (A) thermosetting component. The method according to any one of claims 1 to 5,
The resin composition further containing (A3) an allyl resin. The method according to any one of claims 1 to 6,
The resin composition, further comprising (B) a binder component. The method of claim 7,
The resin composition, wherein the binder component (B) is a phenoxy resin. The method according to any one of claims 1 to 8,
The resin composition further containing (C) an inorganic filler. The method according to any one of claims 1 to 9,
The resin composition further contains (D) a coupling agent. The method according to any one of claims 1 to 10,
A resin composition, characterized in that it is used for sealing a semiconductor element or for interposing the semiconductor element and other electronic components. The method according to any one of claims 1 to 11,
A resin composition, characterized in that it is used for sealing a power semiconductor element or for interposing the power semiconductor element and other electronic components. The method according to any one of claims 1 to 11,
Characterized in that it is used to encapsulate a semiconductor device using at least one of silicon carbide and gallium nitride, or to interpose a semiconductor device using at least one of the above silicon carbide and gallium nitride and other electronic components. Resin composition. (A) As a resin sheet formed of a resin composition containing a thermosetting component,
The (A) thermosetting component contains (A1) a maleimide resin, and (A2) a phosphorus-based curing accelerator,
A resin sheet having a peel strength of 2.0 N/10 mm or more after heat curing. Having the resin sheet according to claim 14 and a release material,
The layered product, wherein the release material has a release agent layer containing an alkyd resin release agent.

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