JP2021113247A - Resin composition and resin sheet - Google Patents

Abstract

To provide a resin composition having sufficiently high resistance to repeated temperature changes.SOLUTION: A resin composition contains (A) thermosetting component and (B) binder component, the (A) thermosetting component containing (A1) maleimide resin, and the (B) binder component having a glass transition temperature of 25°C or lower. The (A1) maleimide resin is preferably represented by general formula (1).SELECTED DRAWING: None

Description

The present invention relates to a resin composition and a resin sheet.

As a sealing material for power semiconductor devices and the like, a resin composition having high heat resistance is used.
For example, Patent Document 1 describes a resin composition containing (A) a thermoplastic component, (B) a thermosetting component, and (C) an inorganic filler, and the cured product of the resin composition. A resin composition having a 5% weight loss temperature of 440 ° C. or higher is described.

International Publication No. 2018/168005

In the resin composition described in Patent Document 1, maleimide resin is used as a thermosetting component in order to improve heat resistance. However, when a thermosetting resin composition using a maleimide resin is used, the result of a temperature cycle test (a test for evaluating resistance to repeated temperature changes) performed after curing may be insufficient. It turned out that there was.

An object of the present invention is to provide a thermosetting resin composition and a resin sheet having sufficiently high resistance to repeated temperature changes after curing.

The resin composition according to one aspect of the present invention is a resin composition containing (A) a thermosetting component and (B) a binder component, and the (A) thermosetting component is (A1). It contains a maleimide resin and has a glass transition temperature of the binder component (B) of 25 ° C. or lower.

In the resin composition according to one aspect of the present invention, the maleimide resin (A1) has two or more maleimide groups in one molecule, and a binding group that links at least one pair of two maleimide groups is a main component. It is preferable to contain a maleimide resin having four or more methylene groups in the chain.

In the resin composition according to one aspect of the present invention, it is preferable that the binder component (B) contains a rubber-based thermoplastic resin.

The resin sheet according to one aspect of the present invention is characterized by being formed from the resin composition according to one aspect of the present invention.

In the resin sheet according to one aspect of the present invention, it is preferable to use it for sealing a power semiconductor element or for interposing it between the power semiconductor element and another electronic component.

In the resin sheet according to one aspect of the present invention, it is used for encapsulating a semiconductor element using a compound semiconductor or for interposing between a semiconductor element using the compound semiconductor and another electronic component. Is preferable.

According to one aspect of the present invention, it is possible to provide a resin composition and a resin sheet having sufficiently high resistance to repeated temperature changes.

It is sectional drawing of the laminated body which concerns on one Embodiment. It is a figure for demonstrating the manufacturing method of the package part which is a test piece of a temperature cycle test. It is a figure which shows the package part which is a test piece of a temperature cycle test, FIG. 3A is a top view, and FIG. 3B is a sectional view.

[Resin composition]
First, the resin composition according to this embodiment will be described.
The resin composition according to the present embodiment contains (A) a thermosetting component and (B) a binder component. The (A) thermosetting component according to the present embodiment contains (A1) maleimide resin.

((A) Thermosetting component)
The thermosetting component (A) (hereinafter, may be simply referred to as “component (A)”) has a property of forming a three-dimensional network when heated and firmly adhering an adherend. As described above, the (A) thermosetting component in the present embodiment contains (A1) maleimide resin (hereinafter, may be simply referred to as “(A1) component”).

(A1) Maleimide Resin The (A1) maleimide resin in the present embodiment is not particularly limited as long as it is a maleimide resin containing two or more maleimide groups in one molecule.

From the viewpoint of heat resistance, the maleimide resin (A1) in the present embodiment preferably contains, for example, a benzene ring, and more preferably contains a structure in which a maleimide group is linked to the benzene ring. Further, the maleimide compound preferably includes two or more structures in which a maleimide group is linked to a benzene ring.

The (A1) maleimide resin in the present embodiment is a maleimide resin containing two or more maleimide groups and one or more biphenyl skeletons in one molecule (hereinafter, may be simply referred to as "biphenyl maleimide resin"). Is preferable.

The maleimide resin (A1) in the present embodiment is preferably represented by the following general formula (1) from the viewpoint of heat resistance and adhesiveness.

In the general formula (1), k is an integer of 1 or more, and the average value of k is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and 1 or more and 3 or less. It is more preferable to have. m1 and m2 are independently integers of 1 or more and 2 or less, and more preferably 1. However, the total of m1 and m2 is 3 or less. n1 and n2 are independently integers of 0 or more and 4 or less, preferably 0 or more and 2 or less, and more preferably 0. R ¹ and R ² are independently alkyl groups having 1 or more and 6 or less carbon atoms, preferably alkyl groups having 1 or more and 3 or less carbon atoms, and more preferably methyl groups. A plurality of R ¹ may or different are identical to one another. A plurality of R ² is, or different are identical to one another.

Specific examples of the maleimide resin represented by the general formula (1) in the present embodiment include compounds represented by the following general formula (2) or the following general formula (3).

In the general formulas (2) and (3), k is the same as k in the general formula (1). In the general formula (2), n1, n2, ^{R 1} and ^{R 2} are the same as n1, n2, ^{R 1} and ^{R 2} in the general formula (1).
Examples of the maleimide resin product represented by the general formula (3) include "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.

Further, the maleimide resin (A1) in the present embodiment is preferably a maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule. It is preferable to have a substituent on the phenylene group from the viewpoint of increasing the solubility in a solvent and improving the sheet formability. Examples of the substituent include an alkyl group such as a methyl group and an ethyl group, an alkylene group and the like.
Further, the maleimide resin (A1) in the present embodiment is preferably a maleimide resin having an ether bond between the maleimide group and the phenylene group from the viewpoint of sheet formability.

The maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule is represented by, for example, the following general formula (4).

In the general formula (4), R ³ to R ⁶ are independently hydrogen atoms or alkyl groups having 1 to 6 carbon atoms, and L ¹ is an alkylene group having 1 to 3 carbon atoms. L ² and L ³ are independently alkylene groups having 1 or more and 2 or less carbon atoms or arylene groups having 6 or more and 10 or less carbon atoms, and p and q are independently 0 or 1, respectively. However, the total number of carbon atoms ^{in L 1} , L ² and L ^{3 is 3 or less.}

The maleimide resin represented by the general formula (4) in the present embodiment is specifically represented by, for example, the following general formula (5) or the following general formula (6).

In the general formulas (5) and (6), L ¹ is an alkylene group having 1 or more carbon atoms and 3 or less carbon atoms.
In the general formula (5), R ³ to R ⁶ are independently hydrogen atoms or alkyl groups having 1 or more and 6 or less carbon atoms.

Further, the maleimide resin (A1) in the present embodiment has two or more maleimide groups in one molecule from the viewpoint of flexibility and heat resistance of the resin sheet formed from the resin composition, and has at least one pair. The binding group that connects the two maleimide groups is preferably a maleimide resin having four or more methylene groups in the main chain.
Here, the bonding group linking the two maleimide groups preferably has 6 or more methylene groups in the main chain, and 8 in the main chain, from the viewpoint of the flexibility of the resin sheet formed from the resin composition. It is more preferable to have the above methylene group, and it is particularly preferable to have 10 or more methylene groups in the main chain. Further, it is more preferable that these methylene groups are linked to form an alkylene group having 4 or more carbon atoms. In this alkylene group, at least one −CH ₂ − may be replaced by _{−CH 2} −O− or −O−CH _2−.
Further, the bonding group connecting the two maleimide groups preferably has one or more side chains from the viewpoint of the flexibility of the resin sheet formed from the resin composition. Examples of this side chain include an alkyl group and an alkoxy group. Further, when there are two or more side chains, the side chains may be bonded to each other to form an alicyclic structure.

As the (A1) maleimide resin in the present embodiment, one molecule has two or more maleimide groups, and at least one pair of binding groups connecting the two maleimide groups has four or more methylene groups in the main chain. When a maleimide resin having a maleimide resin is used, the content of such a maleimide resin is based on the total amount of the solid content of the component (A1) (that is, when the amount of the non-volatile content of the component (A1) excluding the solvent is 100% by mass). It is preferably 25% by mass or more and 70% by mass or less, more preferably 30% by mass or more and 65% by mass or less, and particularly preferably 40% by mass or more and 60% by mass or less. When the content of such a maleimide resin is at least the above lower limit, the flexibility of the resin sheet formed from the resin composition can be further improved. On the other hand, when the content of such maleimide is not more than the above upper limit, the resistance to repeated temperature changes after the resin sheet is cured can be further improved.

Further, such (A1) maleimide resin is preferably a liquid maleimide resin at a temperature of 25 ° C.

Such a maleimide resin (A1) is preferably represented by the following general formula (7) from the viewpoint of flexibility and heat resistance of the resin sheet formed from the resin composition.

In the general formula (7), n is an integer of 0 or more, preferably an integer of 1 or more and 10 or less, and more preferably an integer of 1 or more and 5 or less. The average value of n is preferably 0.5 or more and 5 or less, and more preferably 1 or more and 2 or less.
L ⁴ and L ⁵ are independently substituted or unsubstituted alkylene groups having 4 or more carbon atoms, and in this alkylene group, at least one −CH ₂ − is −CH ₂ −O− or −O−. It may be replaced by _{CH 2-.} From the viewpoint of the flexibility of the resin sheet formed from the resin composition, the carbon number of the alkylene group is preferably 6 or more, more preferably 8 or more, and particularly preferably 10 or more and 30 or less. preferable. When the hydrogen of the alkylene group is substituted, the substituent is an alkyl group having 1 to 10 carbon atoms or an alkoxy group having 1 to 10 carbon atoms. Further, these substituents may be bonded to each other to form an alicyclic structure.
X includes each independently having a substituted or unsubstituted alkylene group having 4 or more carbon atoms (at least one −CH ₂ − is _{substituted with −CH 2} −O− or −O−CH ₂₋ . ), And further preferably a divalent group having a phthalimide group. The phthalimide group also includes a group derived from phthalimide. Specific examples of X include a group represented by the following structural formula (7-1) or the following general formula (7-2).

In the general formula (7-2), Y ¹ and Y ² are independently hydrogen, methyl group or ethyl group, and are preferably methyl groups.
The maleimide resin represented by the general formula (7) in the present embodiment is specifically represented by, for example, the following general formula (7-1-1) or the following general formula (7-2-1). Compounds include.

In the general formulas (7-1-1) and (7-2-1), n is an integer of 1 or more and 5 or less. The average value of n is 1 or more and 2 or less.
Examples of the maleimide resin product represented by the general formula (7-1-1) include Designer Moleculars Inc. Examples thereof include "BMI-1500" manufactured by Shin-Etsu Chemical Co., Ltd. and "SLK1500" manufactured by Shin-Etsu Chemical Co., Ltd.
Examples of the maleimide resin product represented by the general formula (7-2-1) include Designer Moleculars Inc. Examples thereof include "BMI-1700" manufactured by the company.

Specific examples of the (A1) maleimide resin in the present embodiment include the maleimide resin and the screw (3) represented by the general formula (3) from the viewpoint of obtaining a cured product having high sheet formability and heat resistance. -Ethyl-5-methyl-4-maleimidephenyl) methane, N, N'-1,3-phenylenedimaleimide, 4-methyl-1,3-phenylenebismaleimide, polyphenylmethanemaleimide, or 2,2-bis [4- (4-Maleimidephenoxy) phenyl] propane is preferable, and from the viewpoint of sheet formability, the maleimide resin represented by the general formula (3) or bis (3-ethyl-5-methyl-4-maleimide) is preferable. Phenyl) methane is more preferable, and the maleimide resin represented by the general formula (3) is further preferable from the viewpoint of lowering the complex viscosity at a high temperature before curing of the resin sheet according to the present embodiment.
The maleimide resin (A1) in the present embodiment is specifically represented by the general formula (7) from the viewpoint of, for example, the flexibility and heat resistance of the resin sheet formed from the resin composition. Maleimide resin is more preferred. In addition, these maleimide resins can be used individually by 1 type or in combination of 2 or more types. Then, the maleimide resin represented by the general formula (3) and the maleimide resin represented by the general formula (7) may be used in combination.

When the maleimide resin represented by the general formula (3) and the maleimide resin represented by the general formula (7) are used in combination, the resistance to repeated temperature changes after curing of the resin composition shall be ensured. When the content of the maleimide resin represented by the general formula (3) based on the mass is set to 1, the content of the maleimide resin represented by the general formula (7) based on the mass is set to 1. The amount is preferably 2 or less, more preferably 1.5 or less. Further, from the viewpoint of further improving the flexibility of the resin sheet formed from the resin composition, when the mass-based content of the maleimide resin represented by the general formula (3) is set to 1, the general formula ( The mass-based content of the maleimide resin represented by 7) is preferably 0.3 or more, and more preferably 0.5 or more.

In the present embodiment, the content of the component (A1) in the component (A) is based on the total amount of the solid content of the component (A) (that is, the amount of the non-volatile content of the component (A) excluding the solvent is 100% by mass. When), it is preferably 60% by mass or more, more preferably 65% by mass or more, and particularly preferably 70% by mass or more. When the content of the component (A1) in the component (A) is in such a range, the heat resistance of the resin composition according to the present embodiment after curing can be improved.

(A2) Allyl Resin The (A) thermosetting component contained in the resin composition in the present embodiment preferably further contains (A2) an allyl resin. The (A2) allyl resin (hereinafter, may be simply referred to as “component (A2)”) is preferably liquid at room temperature. Since the thermosetting component (A) contains an allyl resin, it becomes easier to improve the peel strength of the resin sheet after curing while lowering the reaction temperature of the resin sheet according to the present embodiment.

In the present embodiment, the mass ratio (A1 / A2) of the maleimide resin as the component (A1) to the (A2) allyl resin is preferably 1.5 or more, and more preferably 3 or more.
When the mass ratio (A1 / A2) is in the above range, the storage elastic modulus E'at 250 ° C. of the cured product of the resin sheet tends to increase.
Further, when the mass ratio (A1 / A2) is in the above range, the heat resistance of the resin sheet can be improved.
When the mass ratio (A1 / A2) is within the above range, the complex viscosity η of the resin sheet is appropriately adjusted to ensure the fluidity of the resin sheet when applied to an adherend, and the resin sheet is cured. Later, further improvement in heat resistance is realized. Further, when the mass ratio (A1 / A2) is in the above range, bleeding out of the allyl resin from the resin sheet is also suppressed. The upper limit of the mass ratio (A1 / A2) is not particularly limited. For example, the mass ratio (A1 / A2) may be 50 or less, and preferably 10 or less.

The (A2) allyl resin in the present embodiment is not particularly limited as long as it is a resin having an allyl group. The (A2) allyl resin in the present embodiment is preferably, for example, an allyl resin containing two or more allyl groups in one molecule.
The allyl resin in the present embodiment is more preferably represented by the following general formula (8), the following general formula (9), or the following general formula (10).

In the general formula (8), R ⁷ and R ⁸ are independently alkyl groups, preferably alkyl groups having 1 to 10 carbon atoms, and preferably alkyl groups having 1 to 4 carbon atoms. More preferably, it is an alkyl group selected from the group consisting of a methyl group and an ethyl group.
In the general formula (9), n3 is 1 or more and 4 or less, preferably 1 or more and 3 or less, and more preferably 1 or more and 2 or less. Further, in the allyl resin represented by the general formula (9), the ratio of the component having n3 of 1 is preferably 90 mol% or more.

The (A2) allyl resin in the present embodiment is specifically represented by, for example, diallyl bisphenol A (2,2-bis (3-allyl-4-hydroxyphenyl) propane), which is represented by the general formula (9). Examples thereof include an allylphenol resin and an allylphenol resin represented by the general formula (10). These allyl resins can be used alone or in combination of two or more.

(A3) Curing Catalyst In the resin sheet according to the present embodiment, when the resin composition contains a thermosetting resin, it is preferable that the resin sheet further contains a curing catalyst. As a result, the curing reaction of the thermosetting resin can be effectively advanced, and the resin sheet can be cured satisfactorily. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

Specific examples of the imidazole-based curing catalyst include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-Phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl Examples thereof include -2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4,5-di (hydroxymethyl) imidazole. From the viewpoint of reactivity, it is preferable to use 2-ethyl-4-methylimidazole. When an imidazole compound having a triazine skeleton is used as the (E) adhesion-imparting agent described later, it also acts as a curing catalyst.

Specific examples of the amine-based curing catalyst include tertiary amine compounds such as 1,8-diazabicyclo [5,4,0] undecene-7 (DBU), triethylenediamine, benzyldimethylamine, and triethanolamine.

Specific examples of the phosphorus-based curing catalyst include triphenylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, and tri (nonylphenyl) phosphine.

The (A) thermosetting component of the present embodiment is a thermosetting resin other than the (A1) component, a curable resin other than the (A2) component, and a non-(A3) component as long as the object of the present invention is not impaired. It may contain a curing catalyst.
The thermosetting resin other than the component (A1) may be a thermosetting resin having high heat resistance, and examples thereof include an epoxy resin, a benzoxazine resin, a cyanate resin, and a melamine resin. These thermosetting resins can be used alone or in combination of two or more. However, from the viewpoint of high heat resistance, it is preferable that the (A) thermosetting component does not substantially contain an epoxy resin.
Examples of the cured resin other than the component (A2) include phenol resins, resins such as resins having a C = C double bond other than the component (A2), acid anhydrides, and resins containing formaldehyde. Be done. These cured resins can be used alone or in combination of two or more.
Examples of the curing catalyst other than the component (A3) include triazole-based compounds and thiazole-based compounds. These curing catalysts can be used alone or in combination of two or more.
When a thermosetting resin other than the component (A1), a curing resin other than the component (A2), and a curing catalyst other than the component (A3) are used, the content thereof is based on the total amount of the solid content of the component (A). (That is, when the amount of the non-volatile content of the component (A) excluding the solvent is 100% by mass), it is preferably 10% by mass or less, and more preferably 5% by mass or less.

In the present embodiment, the content of the (A) thermosetting component in the resin composition is based on the total amount of the solid content of the resin composition (that is, the total amount of the non-volatile content of the resin composition excluding the solvent is 100% by mass). When), it is preferably 2% by mass or more and 75% by mass or less, more preferably 5% by mass or more and 60% by mass or less, and particularly preferably 10% by mass or more and 40% by mass or less. When the content of the thermosetting component (A) is within the above range, the handleability of the resin sheet, the sheet shape retention property, and the heat resistance of the resin composition are improved.

((B) Binder component)
The (B) binder component (hereinafter, may be simply referred to as “(B) component”) in the present embodiment is a resin component other than the (A) component, and has a function of joining the (A) component or other components. Has. (B) The binder component is an oligomer or polymer containing repeating structures, and is preferably a polymer. By including the binder component (B), film-forming property can be imparted and the resin composition can be easily formed into a sheet.
Further, in the present embodiment, it is necessary that the glass transition temperature of the binder component (B) is 25 ° C. or lower. The glass transition temperature can be measured using a differential scanning calorimeter. For example, in a dry nitrogen atmosphere, the measurement sample is heated from −70 ° C. to 35 ° C. at a heating rate of 10 ° C./min, the amount of heat absorbed is measured, and the temperature at which the inflection point is determined in the measurement result is glass. Let it be the transition temperature. When the binder component (B) is an amorphous polymer, the inflection point that appears on the lowest temperature side is the glass transition temperature. Further, the binder component (B) may be liquid at a temperature of 25 ° C. With such a component (B), resistance to repeated temperature changes after curing of the resin sheet can be improved.

The binder component (B) is preferably a rubber-based thermoplastic resin. Rubber-based thermoplastic resins include rubber-based natural rubber, isoprene rubber, styrene-butadiene rubber, butadiene rubber, ethylene-propylene rubber, butyl rubber, chloroprene rubber, nitrile rubber (acrylonitrile butadiene resin), epichlorohydrin rubber, and chlorosulfonated. Examples thereof include polyethylene, polysulfide rubber, rubber-based acrylic resin, rubber-based urethane resin, rubber-based silicone resin, and rubber-based fluororesin. Among these, a rubber-based acrylonitrile butadiene resin is preferable from the viewpoint of the glass transition temperature. (B) The binder component may be used alone or in combination of two or more.
Examples of the rubber-based acrylonitrile butadiene resin include "DN601" manufactured by Zeon Corporation.

The binder component (B) may contain a binder component other than the rubber-based thermoplastic resin as long as the glass transition temperature is 25 ° C. or lower. Examples of other binder components include olefin resin, acrylic resin, methacrylic resin, urethane resin and the like.

In the present embodiment, the content of the (B) binder component in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total amount of the non-volatile content of the resin composition excluding the solvent is 100% by mass). ), It is preferably 1.5% by mass or more and 50% by mass or less, more preferably 2% by mass or more and 30% by mass or less, and particularly preferably 2% by mass or more and 15% by mass or less. By setting the content of the binder component (B) in the resin composition to the above range, it becomes easy to adjust the complex viscosity of the resin sheet before curing to a desired range, and the handleability and sheet formability of the resin sheet are improved. improves.

The resin composition of the present embodiment contains a binder component other than the (B) binder component, that is, a (B') high Tg binder component having a glass transition temperature of more than 25 ° C., as long as the object of the present invention is not impaired. You may. Examples of the (B') high Tg binder component include phenoxy resin, polyamide-imide resin, polyvinyl acetal resin, polycarbonate resin, polysulfone resin and the like. When the total amount of the (B) binder component and the (B') high Tg binder component in the resin composition is 100% by mass, the content of the (B) binder component is preferably 70% by mass or more, preferably 80. It is more preferably mass% or more, and further preferably 90 mass% or more.

((C) Inorganic filler)
In the present embodiment, the resin composition preferably contains (C) an inorganic filler (hereinafter, may be simply referred to as “component (C)”) in addition to the component (A) and the component (B). With this component (C), at least one of the thermal properties and the mechanical properties of the resin composition can be improved.
Examples of the (C) inorganic filler include silica filler, alumina filler, and boron nitride filler. Among these, silica filler is preferable.
Examples of the silica filler include molten silica and spherical silica.
(C) The inorganic filler may be used alone or in combination of two or more. Further, the inorganic filler (C) may be surface-treated.

(C) The average particle size of the inorganic filler is not particularly limited. The average particle size of the inorganic filler (C) is preferably 0.1 nm or more and 100 μm or less, and more preferably 10 nm or more and 10 μm or less, as a value obtained from a general particle size distribution meter. In the present specification, the average particle size of the (C) inorganic filler is a value measured by a dynamic light scattering method using a particle size distribution measuring device (manufactured by Nikkiso Co., Ltd., product name “Nanotrack Wave-UT151”). do.

The content of the (C) inorganic filler in the resin composition is 10% by mass based on the total amount of solid content of the resin composition (that is, when the total amount of non-volatile content of the resin composition excluding the solvent is 100% by mass). % Or more and 90% by mass or less, more preferably 20% by mass or more and 85% by mass or less, further preferably 40% by mass or more and 80% by mass or less, and 60% by mass or more and 80% by mass or less. Is particularly preferable. By setting the content of the (C) inorganic filler in the resin composition within the above range, the coefficient of linear expansion of the resin composition can be lowered, and for example, an object to be sealed such as silicon carbide and the resin composition or the resin sheet can be used. The difference in the coefficient of linear expansion of can be reduced.

((D) Coupling agent)
In the present embodiment, the resin composition preferably further contains (D) a coupling agent in addition to the components (A) to (C).
The coupling agent preferably has a functional group of the compound contained in the above-mentioned (A) thermosetting component or a group that reacts with the functional group of the binder component, and (A) the thermosetting component. It is more preferable to have a group that reacts with the functional group of the compound contained in.

(D) By using the coupling agent, the peel strength between the cured product of the resin sheet and the adherend is improved.
As the coupling agent (D), a silane-based (silane coupling agent) is preferable because of its versatility and cost merit. (D) The coupling agent may be used alone or in combination of two or more.

In the present embodiment, the content of the (D) coupling agent in the resin composition is based on the total amount of the solid content of the resin composition (that is, the total amount of the non-volatile content of the resin composition excluding the solvent is 100% by mass). When), it is preferably 0.01% by mass or more and 5% by mass or less, and more preferably 0.1% by mass or more and 3% by mass or less. By setting the content of the (D) coupling agent in the resin composition within the above range, the peel strength of the resin composition after curing can be further improved.

((E) Adhesion imparting agent)
In the present embodiment, the resin composition preferably further contains (E) an adhesion-imparting agent in addition to the components (A) to (D).
Examples of the adhesion-imparting agent include compounds having a triazine skeleton. The compound having a triazine skeleton is preferably an imidazole compound having a triazine skeleton.
Examples of the imidazole compound having a triazine skeleton include a compound represented by the following general formula (11).

In the general formula (11), R ¹¹ and R ¹² are each independently a hydrogen atom, an alkyl group having 1 or more and 20 or less carbon atoms, a hydroxymethyl group, or a phenyl group, and have a hydrogen atom or 1 or more carbon atoms. It is preferably an alkyl group of 10 or less, and more preferably a hydrogen atom or an alkyl group having 1 or more and 3 or less carbon atoms. R ¹³ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a phenyl group, or an allyl group, preferably an alkyl group having 1 to 10 carbon atoms, and an alkyl group having 1 to 3 carbon atoms. Is more preferable. L ⁶ is an alkylene group having 1 or more and 5 or less carbon atoms, preferably an alkylene group having 2 or more and 4 or less carbon atoms, and more preferably an ethylene group.

Specific examples of the imidazole compound having a triazine skeleton in the present embodiment include 2,4-diamino-6- [2- (2-methyl-1-imidazolyl) ethyl] -1,3,5-triazine, 2 , 4-Diamino-6- [2- (2-ethyl-4-methyl-1-imidazolyl) ethyl] -1,3,5-triazine, and 2,4-diamino-6- [2- (2-undecyl) -1-imidazolyl) ethyl] -1,3,5-triazine and the like can be mentioned. Among these compounds, 2,4-diamino-6- [2- (2-methyl-1-imidazolyl) ethyl] -1,3,5 from the viewpoint of peeling strength and reaction temperature of the resin composition and the resin sheet. -Triazine or 2,4-diamino-6- [2- (2-ethyl-4-methyl-1-imidazolyl) ethyl] -1,3,5-triazine is preferred.

In the present embodiment, the content of the (E) adhesion-imparting agent in the resin composition is based on the total amount of the solid content of the resin composition (that is, the total amount of the non-volatile content of the resin composition excluding the solvent is 100% by mass). It is preferably 0.01% by mass or more and 5% by mass or less, and more preferably 0.03% by mass or more and 3% by mass or less. When the content of the adhesion-imparting agent is within the above range, the peel strength of the resin composition after curing can be further improved.

As an example of the resin composition according to the present embodiment, a resin composition containing only the component (A), the component (B) and the component (C), the component (A), the component (B), the component (C) and Examples thereof include a resin composition containing only the component (D), and a resin composition containing only the component (A), the component (B), the component (C), the component (D) and the component (E).
Further, as another example of the resin composition according to the present embodiment, as described below, the component (A), the component (B), the component (C), the component (D) and the component (E), and (A). ) Component to (E) A resin composition containing a component other than the component (E) can be mentioned.

(Other ingredients)
In the present embodiment, the resin composition may further contain other components. Other components are selected from the group consisting of, for example, cross-linking agents, pigments, dyes, defoamers, leveling agents, UV absorbers, foaming agents, antioxidants, flame retardants, ion trapping agents, and ion scavengers. At least one of the components can be mentioned.
For example, the resin composition may further contain a cross-linking agent in order to adjust the initial adhesiveness and cohesiveness of the resin sheet before curing.
Examples of the cross-linking agent include organic polyvalent isocyanate compounds and amino resins. The cross-linking agent may be used alone or in combination of two or more.

Examples of the organic polyvalent isocyanate compound include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimerics of these polyvalent isocyanate compounds, and Examples thereof include a terminal isocyanate urethane prepolymer obtained by reacting these polyvalent isocyanate compounds with a polyol compound.
More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, and 1,4-xylylene. Isocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4 '-Diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysocyanate and the like can be mentioned. The organic multivalent isocyanate compound may be used alone or in combination of two or more.

As the amino resin, a urea resin, a melamine resin, a guanamine resin, a copolymer resin thereof, or the like can be used.

The above-mentioned cross-linking agent is usually blended in a proportion of 0.01 parts by mass or more and 12 parts by mass or less, preferably 0.1 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the binder component (B) described above. NS.

In the present embodiment, when the resin sheet is formed by coating, the resin composition preferably contains a solvent. As the solvent, in addition to general solvents such as toluene, ethyl acetate and methyl ethyl ketone, cyclohexanone (boiling point: 155.6 ° C.), dimethylformamide (boiling point: 153.6 ° C.), dimethyl sulfoxide (boiling point: 189.0 ° C.), ethylene Examples thereof include high boiling point solvents such as glycol ethers (cellosolve) (boiling point: about 120 to 310 ° C.) and ortho-xylene (boiling point: 144.4 ° C.).

[Resin sheet]
The resin sheet according to the present embodiment is formed from the above-mentioned resin composition according to the present embodiment. According to the resin sheet according to the present embodiment, a resin sheet having sufficiently high resistance to repeated temperature changes can be obtained.
The present embodiment of the present embodiment, from the viewpoint of sealing the semiconductor element and the ability to follow the unevenness of the adherend to be attached when the resin sheet is used for interposing between the semiconductor element and other electronic components. It is preferable that it comprises only the resin composition according to the above. That is, it is preferable that the resin sheet is not a composite material such as a combination of a resin composition and a fiber sheet, such as a prepreg.

The peel strength of the resin sheet according to the present embodiment after thermosetting is preferably 2.0 N / 10 mm or more, more preferably 3.0 N / 10 mm or more and 50 N / 10 mm or less, 4.0 N / 10 mm. It is more preferably 50 N / 10 mm or more, and particularly preferably 6.0 N / 10 mm or more and 40 N / 10 mm or less.
When the peel strength of the resin sheet according to the present embodiment after thermosetting is 2.0 N / 10 mm or more, high adhesiveness to the adherend is maintained when the resin sheet is used as a sealing material. It is possible.
For the peel strength of the resin sheet according to the present embodiment after thermosetting, for example, a component used in the resin composition is selected, and at least one selected from an allyl resin and an adhesion imparting agent is preferably blended in the resin composition. However, it can be adjusted within the above range by adjusting the type and blending amount.
The peel strength of the resin sheet according to the present embodiment after thermosetting is subjected to a peeling test at a peel angle of 90 degrees between the thermosetting resin sheet and the adherend by using the measurement method described later. Asked by doing. Specifically, a test piece was prepared as follows and a peeling test was performed.
(I) Preparation method of test piece ・ Adhesive body: Copper foil (size 50 mm × 10 mm, thickness 150 μm, JIS H 3100 specifications)
-Laminating device: "V-130" manufactured by Nikko Materials Co., Ltd.
・ Crimping conditions: Laminating temperature 130 ℃, ultimate pressure 200Pa, time 40 seconds ・ Thermosetting condition of resin sheet: Thermosetting temperature 200 ℃, heat curing time 4 hours (ii) Peeling test method ・ Equipment used: Tension tester ("Autograph AG-100NXplus" manufactured by Shimadzu Corporation)
-Peeling method: Peel off the cured resin sheet from the adherend-Peeling speed: 50 mm / min-Peeling angle: 90 degrees-Measurement environment: 23 ° C and 50% relative humidity environment In the resin sheet according to this embodiment Since the resin composition is made into a sheet, it is easy to apply it to an adherend, and especially when the adherend has a large area, it is easy to attach it.
If the resin composition is in the form of a sheet, it is formed in advance in a shape suitable for the shape after the sealing step, so that it can be supplied as a sealing material having a certain degree of uniformity just by applying it. Further, if the resin composition is in the form of a sheet, it has no fluidity and is excellent in handleability.

The storage elastic modulus E'at 250 ° C. after thermosetting of the resin sheet according to the present embodiment is preferably 150 MPa or more, preferably 300 MPa or more, from the viewpoint of improving the heat resistance of the cured product of the resin sheet. More preferably, it is more preferably 500 MPa or more. The storage elastic modulus E'at 250 ° C. after thermosetting the resin sheet is a value measured for a test piece obtained by curing the resin sheet under the conditions of 200 ° C. for 4 hours.

The method for forming the resin composition into a sheet can be a conventionally known method for forming a sheet, and is not particularly limited. When a resin sheet is formed from the resin composition by applying the resin composition containing a solvent, the solvent may be completely volatilized in the drying step after the application, or a part of the solvent may remain in the resin sheet. You may let me. The resin sheet according to the present embodiment may be a strip-shaped sheet or may be provided in a rolled state. The resin sheet according to the present embodiment, which is wound into a roll, can be used by being unwound from the roll and cut into a desired size.

The thickness of the resin sheet according to the present embodiment is, for example, preferably 10 μm or more, and more preferably 20 μm or more. The thickness is preferably 500 μm or less, more preferably 400 μm or less, and further preferably 300 μm or less.

The resin sheet according to this embodiment is preferably used for a semiconductor element. Specifically, the resin sheet according to the present embodiment is preferably used for sealing the semiconductor element. Further, the resin sheet according to the present embodiment is preferably used for interposing between the semiconductor element and other electronic components.
The semiconductor element is preferably a power semiconductor element.
Since the resin sheet according to this embodiment has excellent heat resistance, it is intended to enclose a power semiconductor element that is expected to operate at a high temperature of 200 ° C. or higher, or to interpose it between the power semiconductor element and other electronic components. Can be used for.

Further, it is preferable that the resin sheet according to the present embodiment is collectively applied to a plurality of semiconductor elements. For example, if the resin composition is in the form of a sheet, a resin sheet is applied to a structure in which semiconductor elements are arranged in each gap of a frame provided with a plurality of gaps, and the frame and the semiconductor element are collectively combined. It can be used for sealing, so-called panel level packages.

Further, the resin sheet according to the present embodiment is preferably used for sealing a semiconductor element using a compound semiconductor. Alternatively, the resin sheet according to the present embodiment is preferably used for interposing between a semiconductor element using a compound semiconductor and another electronic component. Examples of other electronic components include a printed wiring board, a lead frame, and the like.
Since the upper limit of the operating temperature of the silicon semiconductor element is about 175 ° C., it is preferable to use a semiconductor element using a compound semiconductor capable of high temperature operation as the power semiconductor element. Examples of the compound semiconductor include silicon carbide, gallium nitride, gallium nitride, gallium oxide, gallium arsenide and the like, and it is preferable that any one or more of silicon carbide, gallium nitride, gallium aluminum nitride and gallium oxide is used.
Since the resin sheet according to this embodiment has excellent heat resistance, it can seal a semiconductor element using a compound semiconductor that is expected to operate at a high temperature of 200 ° C. or higher, or a semiconductor element using a compound semiconductor and other electrons. It can be used to intervene between parts.

(Thermosetting conditions)
Under the thermosetting conditions of the resin sheet according to the present embodiment, the heating temperature is preferably 50 ° C. or higher and 300 ° C. or lower, and preferably 100 ° C. or higher and 250 ° C. or lower.
Under the thermosetting conditions of the resin sheet according to the present embodiment, the heating time is preferably 10 minutes or more and 10 hours or less, and more preferably 20 minutes or more and 7 hours or less.
When the thermosetting condition of the resin sheet is within the above range, the thermosetting of the resin sheet can be realized.

[Laminate]
FIG. 1 shows a schematic cross-sectional view of the laminated body 1 according to the present embodiment.
The laminate 1 according to the present embodiment has a first release material 2, a second release material 4, and a resin sheet 3 provided between the first release material 2 and the second release material 4. The resin sheet 3 is a resin sheet according to the present embodiment.

The first release material 2 and the second release material 4 have a release property, and there is a difference between the release force of the first release material 2 against the resin sheet 3 and the release force of the second release material 4 against the resin sheet 3. Is preferable. The materials of the first release material 2 and the second release material 4 are not particularly limited. The ratio (P2 / P1) of the peeling force P2 of the second peeling material 4 to the peeling force P1 of the first peeling material 2 is preferably 0.02 ≦ P2 / P1 <1 or 1 <P2 / P1 ≦ 50. ..

The first release material 2 and the second release material 4 may be, for example, a member having a release property in the release material itself, a member having been subjected to a release treatment, a member having a release agent layer laminated, or the like. good. When the first release material 2 and the second release material 4 have not been subjected to the release treatment, examples of the material of the first release material 2 and the second release material 4 include an olefin resin and a fluororesin. Be done.
The first release material 2 and the second release material 4 can be a release material including a release base material and a release agent layer formed on the release base material. By using a release material having a release base material and a release agent layer, handling becomes easy. Further, the first release material 2 and the second release material 4 may have a release agent layer on only one side of the release base material, or may have a release agent layer on both sides of the release base material. The release agent can be formed, for example, by applying a release agent.

Examples of the release base material include a paper base material, a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on the paper base material, a plastic film, and the like. Examples of the paper base material include glassine paper, coated paper, cast coated paper and the like. Examples of the plastic film include a polyester film (for example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), a polyolefin film (for example, polypropylene, polyethylene, etc.) and the like. Of these, polyester film is preferable.

Examples of the release agent include a silicone-based release agent composed of a silicone resin; a long-chain alkyl group-containing compound-based release agent composed of a compound containing a long-chain alkyl group such as polyvinyl carbide and an alkylurea derivative; An alkyd resin-based release agent composed of a resin (for example, a non-convertible alkyd resin, a convertible alkyd resin, etc.); an olefin resin (for example, polyethylene (for example, high-density polyethylene, low-density polyethylene, and linear low-density)). Olefin resin-based release agent composed of (polyethylene, etc.), a propylene homopolymer having an isotactic structure or a syndiotactic structure, and a crystalline polypropylene resin such as a propylene-α-olefin copolymer, etc.); natural rubber , And rubber-based release agents composed of rubbers such as synthetic rubbers (eg, butadiene rubbers, isopene rubbers, styrene-butadiene rubbers, methyl methacrylate-butadiene rubbers, and acrylonitrile-butadiene rubbers); and (meth) acrylic acid esters. Examples thereof include various release agents such as an acrylic resin-based release agent composed of an acrylic resin such as a system copolymer, and these can be used alone or in combination of two or more. Of these, silicone-based release agents and alkyd resin-based release agents are preferable.

The thickness of the first release material 2 and the second release material 4 is not particularly limited. Usually, it is 1 μm or more and 500 μm or less, and preferably 3 μm or more and 100 μm or less.
The thickness of the release agent layer is not particularly limited. When a solution containing a release agent is applied to form a release agent layer, the thickness of the release agent layer is preferably 0.01 μm or more and 3 μm or less, and more preferably 0.03 μm or more and 1 μm or less.

The method for producing the laminated body 1 is not particularly limited. For example, the laminated body 1 is manufactured through the following steps. First, a resin composition containing a solvent is applied onto the first release material 2 to form a coating film. Next, this coating film is dried to form the resin sheet 3. Next, the laminated body 1 is obtained by laminating the resin sheet 3 and the second release material 4 at room temperature. In this case, when the types of the release materials of the first release material 2 and the second release material 4 are the same, the ratio of the release force P2 of the second release material 4 to the release force P1 of the first release material 2 (P2). / P1) is likely to have P2 / P1 <1, and even if the release materials of the first release material 2 and the second release material 4 are different, it is first to apply the resin composition. Due to the release material 2, the value of P2 / P1 tends to be small.

[Effect of Embodiment]
According to the resin composition and the resin sheet according to the present embodiment, it is possible to obtain a resin composition and a resin sheet having excellent heat resistance and sufficiently high resistance to repeated temperature changes after thermosetting.

As described above, the resin sheet according to this embodiment can be suitably used for a power semiconductor device. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a power semiconductor element. Power semiconductor devices are also expected to operate at high temperatures of 200 ° C. or higher. Therefore, the material used for the semiconductor device having the power semiconductor element is required to have heat resistance. Since the resin sheet according to the present embodiment has excellent heat resistance, it is suitably used for covering a power semiconductor element in a semiconductor device or for interposing it between a power semiconductor element and another component.

As described above, the resin sheet according to the present embodiment can be suitably used for a semiconductor device using a compound semiconductor. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a semiconductor element using a compound semiconductor. Since semiconductor devices using compound semiconductors have characteristics different from those of silicon semiconductor devices, they are preferably used in applications such as power semiconductor devices, high-power devices for base stations, sensors, detectors, and Schottky barrier diodes. In these applications, attention is also paid to the heat resistance of the semiconductor element using the compound semiconductor, and since the resin sheet of the present embodiment has excellent heat resistance, it is suitably used in combination with the semiconductor element using the compound semiconductor. Be done.

[Modification of Embodiment]
The present invention is not limited to the above-described embodiment, and modifications and improvements within the range in which the object of the present invention can be achieved are included in the present invention.

In the above embodiment, the laminate having the first release material, the second release material, and the resin sheet provided between the first release material and the second release material has been described, but in addition, the resin sheet has been described. It may be a laminate having a release material on only one surface.

Further, although the semiconductor encapsulation application has been described in the embodiment of the semiconductor device, the resin sheet of the present invention also has an insulating material for a circuit board (for example, a hard printed wiring board material, a flexible wiring board material, and a material for a flexible wiring board). It can be used as an interlayer insulating material for a build-up substrate, etc.), an adhesive film for build-up, an adhesive, and the like.

Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited to these examples.

[Preparation of resin composition]
Examples 1 and 2 and Comparative Example 1 by dissolving or dispersing each component in a solvent at the compounding ratio shown in Table 1 (mass% (ratio in terms of solid content for a compound containing a solvent)). And the resin composition according to No. 2 was prepared.
The materials used to prepare the resin composition are as follows.

(Thermosetting component)
-Maleimide resin-1: Maleimide resin having a biphenyl group (maleimide resin represented by the general formula (3), "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.)
-Maleimide resin-2: Long-chain alkyl type maleimide resin (maleimide resin represented by the general formula (7-2-1), "BMI-1700" manufactured by Designer Molecules Inc.).
-Allyl resin: Diallyl bisphenol A ("DABPA" manufactured by Daiwa Kasei Kogyo Co., Ltd.)
-Curing catalyst (adhesion-imparting agent): 2,4-diamino-6- [2- (2-ethyl-4-methyl-1-imidazolyl) ethyl] -1,3,5-triazine (manufactured by Shikoku Chemicals Corporation) "2E4MZ-A")

(Binder component)
Binder resin-1: Acrylonitrile butadiene resin (glass transition temperature: -38 ° C, "DN601" manufactured by Zeon Corporation)
-Binder resin-2: BisA type phenoxy resin (glass transition temperature: 150 ° C., diluted with a solvent because it is solid at room temperature, "YX7200B35" manufactured by Mitsubishi Chemical Co., Ltd.)

(Coupling agent)
-Silane coupling agent: 3-glycidoxypropyltriethoxysilane

(Inorganic filler)
-Silica filler: Fused silica (modified with epoxy silane, average particle size 0.5 μm, maximum particle size 2.0 μm)

<Evaluation of resin composition and resin sheet>
[Preparation of laminate including resin sheet]
Resin varnish (cyclohexanone and methyl ethyl ketone) on the first release material (polyethylene terephthalate film provided with a release layer formed from an alkyd resin-based release agent, PET38AL-5 manufactured by Lintec Co., Ltd., thickness 38 μm) with a knife coater. A coating solution in which each component of the resin composition was dissolved or dispersed, and a solid content concentration of 60% by mass) was applied to the mixed solvent, dried at 90 ° C. for 1 minute, and then dried at 115 ° C. for 1 minute. The thickness of the resin composition after drying was 25 μm. Immediately after taking out from the drying furnace, the resin composition after drying and the second release material (polyethylene terephthalate film provided with a release layer formed from a silicone-based release agent, manufactured by Lintec Corporation, SP-PET382150, thickness 38 μm) ) At room temperature to prepare a laminate in which the first release material, the resin sheet made of the resin composition, and the second release material are laminated in this order.

[Temperature cycle test]
A copper-clad laminate (“MCL-E-705G” manufactured by Hitachi Kasei Co., Ltd., thickness 200 μm) was etched to obtain a substrate on which markers (copper) were formed near each apex on both sides. The substrate thus obtained is processed by using a router processing machine to form a square through hole having a size of 4.56 mm × 4.56 mm, and the frame 5 as shown in FIG. 2 (A) is subjected to processing. Was produced. Further, an adhesive tape 6 (“ADWILL H-231F” manufactured by Lintec Corporation) is attached to one side 5A of the frame 5 as shown in FIG. 2 (A), and then as shown in FIG. 2 (B). On the adhesive surface exposed from the hole, the mirror-polished surface of the square mirror-polished chip 7 (size 4.26 mm x 4.26 mm, thickness 200 μm) is mounted on the mounting machine (Panasonic Factory Solutions Co., Ltd. "NM-". It was installed in "EJM1D"). Next, a resin sheet 3 (thickness 60 μm) from which the release material on one side was peeled off was placed on the opposite surface 5B of the frame 5, and pressed by a vacuum laminator (“7024HP5” manufactured by ROHM & HAAS) at a temperature of 100 ° C. and an ultimate pressure of 30 Pa. The opposite surface 5B of the frame 5 was sealed under the conditions of 3 bar and a pressing time of 40 seconds. Next, the other release material of the resin sheet 3 was peeled off, the sealed frame and the chip 7 were brought into the state shown in FIG. 2C, and the resin sheet 3 was thermally cured under the condition of a temperature of 200 ° C. for 4 hours. rice field. Thereafter, as shown in FIG. 2 (D), the adhesive tape 6 is peeled off, the plasma cleaning process on one 5A of the frame 5 (Panasonic Factory Solutions Co., Ltd., "NM-EFP1A"), output 500 W, gas species _{O 2} , The gas flow rate was 10 sccm, and the treatment time was 60 seconds. Then, as shown in FIG. 2 (E), one side 5A of the frame 5 was sealed and thermosetting was performed. The sealing conditions and thermosetting conditions are the same as described above. Finally, using a dicing device (“DFD-6362” manufactured by Disco Corporation), as shown in FIG. 2 (F), the substrate is divided into squares having a size of 6 mm × 6 mm centering on the chip 7, and FIG. A package component 8 as shown was obtained. Then, the following temperature cycle test was performed using the package component 8 as a test piece.
First, the test piece was preconditioned at a temperature of 125 ° C. for 24 hours. Next, the test piece after the preconditioning treatment was put into a temperature cycle test device (“TSE-11” manufactured by ESPEC), and under the conditions of −55 ° C. on the low temperature side, + 200 ° C. on the high temperature side, and an exposure time of 10 minutes. A temperature cycle test was performed. Then, the appearance of the test piece after 300, 500, and 1000 cycles was observed, and the presence or absence of cracks was evaluated. Those in which no cracks were not generated were determined to be A, and those in which cracks were generated were determined to be C. The results obtained are shown in Table 1.

[Evaluation of resin sheet flexibility (three-point bending test)]
The release material was peeled from the resin sheets obtained in Examples and Comparative Examples, and eight sheets were laminated to obtain a thickness of 200 μm, and then peeled from the release material to prepare a sample. The sample was cured at a temperature of 200 ° C. under the thermosetting condition for 4 hours, and then cut to prepare a thermosetting resin sheet having a size of 20 mm × 10 mm, which was used as a test piece for evaluating flexibility. A wedge-shaped jig from the upper center of the test piece placed horizontally on two fulcrums under the following conditions using a tensile tester (“Autograph AG-IS” manufactured by Shimadzu Corporation) for this test piece. Was lowered, a three-point bending test was carried out, and the displacement amount (jig pushing amount, unit: mm) of the test piece at the time of breaking was measured. The results obtained are shown in Table 1. The larger the displacement, the better the flexibility.
Distance between fulcrums: 6 mm
Jig descent speed: 0.5 mm / min

It was found that the resin compositions according to Examples 1 and 2 had a good evaluation in the temperature cycle test. Further, Comparative Examples 1 and 2 differed from Example 1 and the like in that a binder component solid at room temperature was used, but it was found that the results of the temperature cycle test were inferior to those of Example 1 and the like. Therefore, it was confirmed that the resin compositions according to Examples 1 and 2 have sufficiently high resistance to repeated temperature changes. Further, the resin composition according to Example 1 has a large displacement amount and is excellent in flexibility.

1 ... Laminated body, 2 ... First release material, 3 ... Resin sheet, 4 ... Second release material.

Claims (6)

A resin composition containing (A) a thermosetting component and (B) a binder component.
The (A) thermosetting component contains (A1) maleimide resin,
The glass transition temperature of the binder component (B) is 25 ° C. or lower.
Resin composition. In the resin composition according to claim 1,
The (A1) maleimide resin has two or more maleimide groups in one molecule, and the bonding group connecting at least one pair of two maleimide groups has four or more methylene groups in the main chain. Contains,
Resin composition. In the resin composition according to claim 1 or 2.
The binder component (B) contains a rubber-based thermoplastic resin.
Resin composition. It is formed from the resin composition according to any one of claims 1 to 3.
Resin sheet. In the resin sheet according to claim 4,
It is used to seal a power semiconductor element or to intervene between the power semiconductor element and another electronic component.
Resin sheet. In the resin sheet according to claim 4,
It is used to seal a semiconductor element using a compound semiconductor, or to intervene between a semiconductor element using the compound semiconductor and another electronic component.
Resin sheet.

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