[樹脂組成物] 關於本實施形態的樹脂組成物係含有(A)熱硬化性成分。此(A)熱硬化性成分係含有(A1)具有聯苯骨架的馬來醯亞胺樹脂與(A2)烯丙基樹脂。 在關於本實施形態的樹脂組成物之硬化前之在90℃的複數黏度η為1.0×102
Pa・s以上、1.0×105
Pa・s以下為較佳。由關於本實施形態的樹脂組成物之硬化前之加熱時之流動性之觀點視之，該複數黏度η係1.0×103
Pa・s以上、1.0×105
Pa・s以下為更佳，1.0×103
Pa・s以上、1.0×104
Pa・s以下為特別佳。藉由保持樹脂組成物之硬化前之加熱時之流動性，在將樹脂組成物適用於被適用物時，向被適用物之表面形狀之追隨性變高。特別是在樹脂組成物為樹脂薄片之形態的情況，在加熱樹脂組成物而適用於被適用物時，向被適用物之表面形狀之追隨性變高。 關於本實施形態的樹脂組成物之複數黏度η係例如藉由調整樹脂組成物所使用的成分或調配量，可調整至上述範圍。 在本說明書的複數黏度η係塗布及乾燥樹脂組成物而製作樹脂薄片，使用黏彈性測定裝置而測定此樹脂薄片之在90℃的複數黏度(單位：Pa‧s)者。 ((A)熱硬化性成分) (A)熱硬化性成分(以下，有僅稱為「(A)成分」的情況)係若進行加熱則三維網狀化，具有強固地接著被黏物的性質。在本實施形態的(A)熱硬化性成分係含有(A1)具有聯苯骨架的馬來醯亞胺樹脂與(A2)烯丙基樹脂。(A)熱硬化性成分係以含有(A1)具有聯苯骨架的馬來醯亞胺樹脂，可提昇樹脂組成物之對於被黏物的接著性，同時樹脂組成物之複數黏度變得容易降低。特別是，在(A)熱硬化性成分中，在(A1)具有聯苯骨架的馬來醯亞胺樹脂之相對於(A2)烯丙基樹脂而言的質量比(A1／A2)為高的情況，樹脂組成物之複數黏度亦容易降低。 在本實施形態的(A1)具有聯苯骨架的馬來醯亞胺樹脂係如為於1分子中具有聯苯骨架及馬來醯亞胺基的樹脂，則無特別限定，但於1分子中包含1個以上之聯苯骨架及2個以上之馬來醯亞胺基的馬來醯亞胺樹脂為較佳。 在本實施形態的(A1)具有聯苯骨架的馬來醯亞胺樹脂係由耐熱性及接著性之觀點視之，以下述通式(1)表示為較佳。在前述通式(1)中，k係1以上之整數，但k之平均值係1以上、10以下為較佳，1以上、5以下為更佳，1以上、3以下為進而佳。m1及m2係各自獨立的1~6之整數，而1~3之整數為較佳，1為更佳。n1及n2係各自獨立的0~4之整數，而0~2之整數為較佳，0為更佳。R1
及R2
係各個獨立的碳數1~6之烷基，而碳數1~3之烷基為較佳，甲基為更佳。 作為在本實施形態的(A1)具有聯苯骨架的馬來醯亞胺樹脂係具體而言，例如可舉出以下述通式(2)或下述通式(3)所示的化合物。在前述通式(2)及(3)中，k係與前述通式(1)之k相同。在前述通式(2)中，n1、n2、R1
及R2
係與前述通式(1)之n1、n2、R1
及R2
相同。 作為以前述通式(3)所示的馬來醯亞胺樹脂之製品係可舉出日本化藥公司製之「MIR-3000-70MT」等。 在本實施形態的(A2)烯丙基樹脂係如為具有烯丙基的樹脂，則無特別限定。在本實施形態的烯丙基樹脂係於1分子中包含2個以上之烯丙基的烯丙基樹脂為較佳。 在本實施形態的烯丙基樹脂係以下述通式(4)表示為更佳。在前述通式(4)中，R3
及R4
係各個獨立的烷基，碳數1~10之烷基為較佳，碳數1~4之烷基為更佳，由甲基及乙基所構成的群中所選擇的烷基為進而佳。 作為(A2)烯丙基樹脂係具體而言，例如可舉出二烯丙基雙酚A等。 本實施形態之(A)熱硬化性成分係只要在不損及本發明之目的下，亦可含有(A1)成分以外之熱硬化性樹脂、以及(A2)成分以外之硬化劑。 作為(A1)成分以外之熱硬化性樹脂，亦可為具有高耐熱性的熱硬化性樹脂，例如可舉出(A1)成分以外之馬來醯亞胺樹脂、環氧樹脂、苯并噁嗪樹脂、氰酸酯樹脂、以及三聚氰胺樹脂等。此等之熱硬化性樹脂係可單獨1種、或組合2種以上來使用。 作為(A2)成分以外之硬化劑係例如可舉出酚樹脂、以及具有(A2)成分以外之C=C雙鍵的樹脂等之樹脂類、以及胺、酸酐、及甲醛等。此等之硬化劑係可單獨1種、或組合2種以上來使用。 在使用(A1)成分以外之熱硬化性樹脂或(A2)成分以外之硬化劑的情況，此等之含量係在(A)成分之固體成分之全量基準(亦即，將除去溶媒的(A)成分之固體成分設為100質量%時)，10質量%以下為較佳，5質量%以下為更佳。 在本實施形態中，樹脂組成物中之(A)熱硬化性成分之含量係在樹脂組成物之固體成分之全量基準(亦即，將除去溶媒的全固體成分設為100質量%時)，2質量%以上、75質量%以下為較佳，5質量%以上、70質量%以下為更佳。 在本實施形態中，(A1)具有聯苯骨架的馬來醯亞胺樹脂之相對於(A2)烯丙基樹脂而言的質量比(A1／A2)為4.5以上為較佳。質量比(A1／A2)為4.5以上，則可一面維持接著性、一面更提昇已使樹脂組成物硬化的樹脂硬化物之儲存彈性模數。又，可使樹脂組成物之耐熱性提昇。進而，亦可抑制來自樹脂組成物之(A2)烯丙基樹脂之滲出。尚，質量比(A1／A2)之上限值係無特別限制。例如，質量比(A1／A2)亦可為50以下。 在本實施形態中，(A)熱硬化性成分亦可含有硬化促進劑。 作為硬化促進劑，例如可舉出咪唑化合物(例如，2-乙基-4-甲基咪唑等)等。 樹脂組成物中之硬化促進劑之含量係在樹脂組成物之固體成分之全量基準(亦即，將除去溶媒的全固體成分設為100質量%時)，0.005質量%以上、12質量%以下為較佳，0.01質量%以上、10質量%以下為更佳。 ((B)黏合劑成分) 在本實施形態中，樹脂組成物係除了(A)成分以外，包含(B)黏合劑成分(以下，有僅稱為「(B)成分」的情況)為較佳。藉由此(B)成分，賦與造膜性，可將樹脂組成物容易地成形至薄片狀。 本實施形態之(B)黏合劑成分係(A)成分以外之樹脂，具有接合(A)成分或其他成分的機能。(B)成分係熱可塑性樹脂等為較佳。(B)成分係亦可為具有官能基的樹脂。在此情況，即使是(B)黏合劑成分為藉由熱而可參與於樹脂組成物之硬化，在本發明中，(B)黏合劑成分係與(A)熱硬化性成分有區別。 (B)黏合劑成分係不問其為脂肪族化合物、或芳香族化合物而可廣泛地選定。(B)黏合劑成分係例如由苯氧基樹脂、丙烯酸樹脂、甲基丙烯酸樹脂、聚酯樹脂、胺基甲酸酯樹脂及聚醯胺醯亞胺樹脂所構成的群中選擇的至少任一之樹脂為較佳，由耐熱性之觀點視之由苯氧基樹脂、聚醯胺醯亞胺樹脂及聚酯樹脂所構成的群中選擇的至少任一之樹脂為更佳。尚，聚酯樹脂係全芳香族聚酯樹脂為較佳。(B)黏合劑成分係可單獨1種、或組合2種以上來使用。 作為苯氧基樹脂係由雙酚A骨架(以下有將雙酚A稱為「BisA」的情況)、雙酚F骨架(以下有將雙酚F稱為「BisF」的情況)、聯苯骨架及萘骨架所構成的群中選擇1種以上之骨架的苯氧基樹脂為較佳，具有雙酚A骨架及雙酚F骨架的苯氧基樹脂為更佳。 (B)黏合劑成分之重量平均分子量(Mw)係100以上、100萬以下為較佳，1000以上、80萬以下為更佳，1萬以上、10萬以下為特別佳。在本說明書的重量平均分子量係藉由凝膠‧滲透‧層析(Gel Permeation Chromatography; GPC)法而測定的標準聚苯乙烯換算值。 在本實施形態中，樹脂組成物中之(B)黏合劑成分之含量係在樹脂組成物之固體成分之全量基準(亦即，將除去溶媒的全固體成分設為100質量%時)，0.1質量%以上、50質量%以下為較佳，1質量%以上、40質量%以下為更佳。以將樹脂組成物中之(B)黏合劑成分之含量作為上述範圍，成為容易將樹脂薄片之硬化前之樹脂組成物之複數黏度調整為所期望之範圍，提昇樹脂薄片之操作性、薄片形成性。 在本實施形態中，(A1)成分之含量係在(A)成分及(B)成分之固體成分之合計量基準，係20質量%以上、80質量%以下為較佳。(A1)成分之含量為20質量%以上，則可更提昇樹脂組成物之耐熱性。另一方面，(A1)成分之含量為80質量%以下，則可將樹脂組成物容易地成形至薄片狀。 ((C)無機填料) 在本實施形態中，樹脂組成物係除了(A)成分及(B)成分以外，包含(C)無機填料(以下，有僅稱為「(C)成分」的情況)為較佳。藉由此(C)成分，可使樹脂組成物之線膨脹係數降低，又，提昇樹脂組成物之儲存彈性模數。 作為(C)無機填料係可舉出二氧化矽填料、氧化鋁填料及氮化硼填料等。在此等之中，二氧化矽填料為較佳。 作為二氧化矽填料係例如可舉出熔融二氧化矽、及球狀二氧化矽等。 (C)無機填料係可單獨1種或組合2種以上而使用。又，無機填料係亦可被表面處理。 (C)無機填料之平均粒徑係無特別限制。(C)無機填料之平均粒徑係由一般性的粒度分布計求出的值，且0.1nm以上、10μm以下為較佳。在本說明書中，(C)無機填料之平均粒徑係設為使用粒度分布測定裝置(日機裝公司製，製品名「Nanotrac Wave-UT151」)，藉由動態光散射法而測定的值。 樹脂組成物中之(C)無機填料之含量係在樹脂組成物之固體成分之全量基準(亦即，將除去溶媒的全固體成分設為100質量%時)，10質量%以上、90質量%以下為較佳，20質量%以上、80質量%以下為更佳。 ((D)偶合劑) 在本實施形態中，樹脂組成物係除了(A)~(C)成分以外，更包含(D)偶合劑為較佳。 偶合劑係具有與前述之(A)熱硬化性成分所具有的官能基、或(B)黏合劑成分所具有的官能基反應的基為較佳，具有與(A)熱硬化性成分所具有的官能基反應的基為更佳。 以使用(D)偶合劑，可不損及樹脂硬化物之耐熱性，而使接著性以及密著性提昇，進而耐水性(耐濕熱性)亦提昇。 作為(D)偶合劑係由該泛用性及成本優勢等，矽烷系(矽烷偶合劑)為較佳。此等係可單獨1種或組合2種以上而使用。又，如上述的偶合劑係相對於(A)熱硬化性成分100質量份而言，通常以0.1質量份以上、20質量份以下，較佳為以0.3質量份以上、15質量份以下，更佳為以0.5質量份以上、10質量份以下之比例調配。 作為有關本實施形態的樹脂組成物之一例係可舉出僅含有(A)熱硬化性成分、(B)黏合劑成分、(C)無機填料及(D)偶合劑的樹脂組成物。 又，作為有關本實施形態的樹脂組成物之其他之一例係可舉出依以下所述，含有(A)熱硬化性成分、(B)黏合劑成分、(C)無機填料、(D)偶合劑及前述(A)~(D)成分以外之成分的樹脂組成物。 (其他之成分) 在本實施形態中，樹脂組成物係進而亦可包含例如由交聯劑、顏料、染料、消泡劑、整平劑、紫外線吸收劑、發泡劑、防氧化劑、難燃劑及離子捕捉劑所構成的群中選擇的至少任一成分。 例如，樹脂組成物係為了調節硬化前之初期接著性、及凝聚性，所以進而亦可包含交聯劑。 作為交聯劑係例如可舉出有機多元異氰酸酯化合物、及有機多元亞胺化合物等。此等係可單獨1種或組合2種以上而使用。 作為有機多元異氰酸酯化合物係例如可舉出芳香族多元異氰酸酯化合物、脂肪族多元異氰酸酯化合物、脂環族多元異氰酸酯化合物、及此等之多元異氰酸酯化合物之三聚物、以及使此等多元異氰酸酯化合物與多元醇化合物反應而得到的末端異氰酸酯胺基甲酸酯預聚物等。 作為有機多元異氰酸酯化合物之更具體的例子係例如可舉出2,4-伸甲苯基二異氰酸酯、2,6-伸甲苯基二異氰酸酯、1,3-苯二甲基二異氰酸酯、1,4-二甲苯二異氰酸酯、二苯基甲烷-4,4’-二異氰酸酯、二苯基甲烷-2,4’-二異氰酸酯、3-甲基二苯基甲烷二異氰酸酯、六亞甲基二異氰酸酯、異佛酮二異氰酸酯、二環己基甲烷-4,4’-二異氰酸酯、二環己基甲烷-2,4’-二異氰酸酯、及離胺酸異氰酸酯等。此等係可單獨1種或組合2種以上而使用。 作為有機多元亞胺化合物之具體例係例如可舉出N,N’-二苯基甲烷-4,4’-雙(1-氮丙啶羧基醯胺)、三羥甲基丙烷-三-β-氮丙啶基丙酸酯、四羥甲基甲烷-三-β-氮丙啶基丙酸酯、及N,N’-甲苯-2,4-雙(1-氮丙啶基羧基醯胺)三乙烯三聚氰胺等。 如上述般的交聯劑係相對於前述之(B)黏合劑成分100質量份而言，通常以0.01質量份以上、12質量份以下，較佳為以0.1質量份以上、10質量份以下之比例調配。 關於本實施形態的樹脂組成物係被使用於半導體元件為較佳。具體而言，關於本實施形態的樹脂組成物係被使用於密封半導體元件為較佳。又，關於本實施形態的樹脂組成物係被使用在中介存在於半導體元件與其他電子零件之間為較佳。 半導體元件係功率半導體為較佳。 又，關於本實施形態的樹脂組成物係被使用於密封已使用碳化矽及氮化鎵之任1種以上的半導體元件、或是使用於中介存在於已使用碳化矽及氮化鎵之任1種以上的半導體元件與其他電子零件之間為較佳。 作為其他電子零件係例如可舉出印刷電路板及導線架等。 [樹脂薄片] 關於本實施形態的樹脂薄片係含有關於本實施形態的樹脂組成物。 藉由將關於本實施形態的樹脂組成物薄片化，可得到關於本實施形態的樹脂薄片。以樹脂組成物為薄片狀，向被黏物之適用成為簡便，特別是被黏物為大面積的情況之適用成為簡便。如樹脂組成物為薄片狀，則對於密封步驟後之形狀，因為事先形成某程度、且適合的形狀，所以適用，可供給作為保持某程度之均勻性的密封劑。又，因為無流動性所以操作性優異。 將樹脂組成物薄片化的方法係可採用先前一般周知之薄片化的方法，無特別限定。關於本實施形態的樹脂薄片係可為帶狀之薄片，亦可以已捲取為輥狀的狀態提供。關於已捲取為輥狀的本實施形態的樹脂薄片係可由輥送出而切斷為所期望之尺寸等而使用。 關於本實施形態的樹脂薄片之厚度係例如10μm以上為較佳，20μm以上為更佳。又，該厚度係500μm以下為較佳、400μm以下為更佳、進而300μm以下為較佳。 關於本實施形態的樹脂薄片係匯集於複數之半導體元件而適用為較佳。例如，樹脂組成物為薄片狀，則對於每個已設置複數之間隙的框架之間隙已配置半導體元件的構造體，適用樹脂薄片，且將框架和半導體元件一起密封，可使用於所謂的面板級封裝。 關於本實施形態的樹脂薄片為耐熱性優異之情事係例如藉由測定硬化後之儲存彈性模數E’而顯現。關於本實施形態的樹脂薄片之硬化後之儲存彈性模數E’係在溫度250℃，較佳為1.0×102
MPa以上為較佳，2.0×102
MPa以上為更佳。如在溫度250℃的儲存彈性模數E’為上述範圍，則即使在高溫被使用的用途，硬化物亦不過度地軟化，即使在合適地使用於在200℃以上之高溫下動作的GaN或SiC系之功率半導體元件之密封等的情況，亦可認為提昇封裝之信賴性。在硬化後之溫度250℃的儲存彈性模數E’之上限係無特別限定，但2.0×103
MPa以下為較佳，1.0×103
MPa以下為更佳，0.8×103
MPa以下為進而佳。 樹脂薄片之硬化後之儲存彈性模數E’係可以實施例所記載之方法而測定。 硬化後之儲存彈性模數E’係例如藉由調製樹脂組成物所使用的成分或調配量，可達成上述範圍。 [層合體] 第1圖係表示關於本實施形態的層合體1之剖面概略圖。 本實施形態之層合體1係具有第一剝離材2、與第二剝離材4、與已設置於第一剝離材2及第二剝離材4之間的樹脂薄片3。樹脂薄片3係含有關於本實施形態的樹脂組成物。 第一剝離材2及第二剝離材4係具有剝離性，第一剝離材2之對於樹脂薄片3的剝離力與第二剝離材4之對於樹脂薄片3的剝離力有差異為較佳。第一剝離材2及第二剝離材4之材質係無特別限定。相對於第一剝離材2之剝離力P1而言的第二剝離材4之剝離力P2之比(P2／P1)係0.02≦P2／P1＜1或1＜P2／P1≦50為較佳。 第一剝離材2及第二剝離材4係例如除了剝離材本身有剝離性的構件以外，亦可為已施加剝離處理的構件或已層合剝離劑層的構件等。在第一剝離材2及第二剝離材4未被進行剝離處理的情況，作為該材質係例如可舉出烯烴系樹脂及氟樹脂等。 第一剝離材2及第二剝離材4係可設為具備剝離基材、與塗布剝離劑於剝離基材之上而形成的剝離劑層的剝離材。以設為具備剝離基材和剝離劑層的剝離材之情事，而操作成為容易。又，第一剝離材2、及第二剝離材4係可僅於剝離基材之單面具備剝離劑層，且亦可於剝離基材之兩面具備剝離劑層。 作為剝離基材係例如可舉出紙基材、於此紙基材經層合聚乙烯等之熱可塑性樹脂的層合紙、及塑膠薄膜等。作為紙基材係例如可舉出玻璃紙、塗布紙、及鑄塗紙等。作為塑膠薄膜係例如可舉出聚酯薄膜(例如，聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯及聚萘二甲酸乙二酯等)、以及聚烯烴薄膜(例如，聚丙烯及聚乙烯等)等。在此等之中，聚酯薄膜為較佳。 作為剝離劑係例如可舉出以聚矽氧樹脂所構成的聚矽氧系剝離劑；以聚乙烯胺甲酸酯、及烷基脲衍生物等之含有長鏈烷基的化合物所構成的含長鏈烷基之化合物系剝離劑；以醇酸樹脂(例如，非轉化性醇酸樹脂、及轉化性醇酸樹脂等)所構成的醇酸樹脂系剝離劑；以烯烴樹脂(例如，聚乙烯(例如，高密度聚乙烯、低密度聚乙烯、及直鏈狀低密度聚乙烯等)、具有等規構造、或是間規構造的丙烯均聚物、及丙烯-α-烯烴共聚物等之結晶性聚丙烯樹脂等)所構成的烯烴樹脂系剝離劑；天然橡膠、及合成橡膠(例如，丁二烯橡膠、異戊二烯橡膠、苯乙烯-丁二烯橡膠、甲基丙烯酸甲酯-丁二烯橡膠、及丙烯腈-丁二烯橡膠等)等之橡膠所構成的橡膠系剝離劑；以及以(甲基)丙烯酸酯系共聚物等之丙烯酸樹脂所構成的丙烯酸樹脂系剝離劑等之各種剝離劑，可將此等以單獨1種或組合2種以上而使用。在此等之中，聚矽氧系剝離劑為較佳。 第一剝離材2及第二剝離材4之厚度係無特別限定。第一剝離材2及第二剝離材4之厚度係通常為1μm以上、500μm以下，3μm以上、100μm以下為較佳。 剝離劑層之厚度係無特別限定。在塗布包含剝離劑的溶液而形成剝離劑層的情況，剝離劑層之厚度係0.01μm以上、3μm以下為較佳為，0.03μm以上、1μm以下為更佳。 層合體1之製造方法係無特別限定。例如，層合體1係經由如以下的步驟而製造。首先，於第一剝離材2之上，塗布樹脂組成物，形成塗膜。接著，使此塗膜乾燥，形成樹脂薄片3。接著，以將樹脂薄片3與第二剝離材4在常溫貼合，而得到層合體1。 [半導體裝置] 關於本實施形態的半導體裝置係具有以關於本實施形態的樹脂組成物、或是樹脂薄片所密封的半導體元件。 經使用本實施形態之樹脂薄片的半導體元件之密封係例如可用以下之方式進行。以覆蓋半導體元件之方式載置樹脂薄片，藉由真空層疊法而壓接，密封半導體元件。 在使用本實施形態之層合體1的情況係剝離層合體1之一方之剝離材後，以覆蓋半導體元件之方式載置樹脂薄片。之後，剝離另一方之剝離材。之後，藉由真空層疊法而壓接，密封半導體元件。 已使用本實施形態之樹脂薄片的半導體元件之接合係例如可用以下之方式進行。於其他電子零件上，載置樹脂薄片，進而，於樹脂薄片上載置半導體元件，之後，暫時壓接樹脂組成物和半導體元件後，加熱而使其硬化。以如此的方式進行，使樹脂組成物中介存在於半導體元件與其他電子零件之間，接合半導體元件與其他電子零件。 [實施形態之效果] 藉由關於本實施形態的樹脂組成物、及樹脂薄片，則可使耐熱性和接著性提昇。以使用關於本實施形態的樹脂組成物及樹脂薄片，可藉由相較於先前而言耐熱性較高、且接著性亦較高的封裝樹脂層而密封半導體元件，可使半導體元件與封裝樹脂層之接著強度提昇。 關於本實施形態的樹脂組成物及樹脂薄片係按照上述，可合適地使用於功率半導體元件。又，關於本實施形態的樹脂組成物、及樹脂薄片係可合適地使用於已使用碳化矽及氮化鎵之至少任一者的半導體元件。 按照上述，關於本實施形態的樹脂組成物係可合適地使用於功率半導體元件。換言之，在關於本實施形態的半導體裝置中，半導體元件係功率半導體元件為較佳。功率半導體元件亦被想定在200℃以上之高溫下動作。於使用在具有功率半導體元件的半導體裝置係被要求耐熱性。關於本實施形態的樹脂組成物、及樹脂薄片係因為耐熱性優異，所以可合適地使用於在半導體裝置覆蓋功率半導體元件、或是中介存在於功率半導體元件與其他零件之間。 依照上述，關於本實施形態的樹脂組成物係可合適地使用於已使用碳化矽及氮化鎵之任1種以上的半導體元件。換言之，在關於本實施形態的半導體裝置中，半導體元件係已使用碳化矽及氮化鎵之任1種以上的半導體元件為較佳。已使用碳化矽及氮化鎵之任1種以上的半導體元件係因為與矽半導體為不同的特性，所以較佳地使用於功率半導體、基地台用高輸出裝置、感測器、檢測器、或蕭特基障壁二極體等。在此等之用途係亦著眼於已使用碳化矽及氮化鎵之任1種以上的半導體元件之耐熱性，本實施形態之樹脂組成物及樹脂薄片係因為耐熱性優異，所以與已使用碳化矽及氮化鎵之任1種以上的半導體元件組合而可合適地使用。 [實施形態之變形] 本發明係不限定於前述實施形態，在可達成本發明之目的的範圍之變形或改良等係包含於本發明。 在前述實施形態係關於具有第一剝離材、第二剝離材、與已設置於第一剝離材及第二剝離材之間的樹脂薄片的層合體而說明，但此外亦可為僅樹脂薄片之一方之面具有剝離材的層合體。 又，在前述半導體裝置之實施形態係關於半導體密封用途而說明，但本發明之樹脂組成物及樹脂薄片，其係除此之外亦可使用作為電路基板用絕緣材料(例如，硬質印刷電路板材料、可撓性配線基板用材料、及增層基板用層間絕緣材料等)、增層用接著薄膜以及接著劑等。 實施例 以下，舉出實施例而更詳細地說明本發明。本發明係不因此等實施例而受到任何限定。 ‧樹脂組成物之調製 使用於樹脂組成物之調製的材料係依照以下所述。 (熱硬化性成分) ‧BMI樹脂-1：具有聯苯基的馬來醯亞胺樹脂(以前述通式(3)所示的馬來醯亞胺樹脂，日本化藥公司製之「MIR-3000-70MT」) ‧BMI樹脂-2：2,2-雙[4-(4-馬來醯亞胺苯氧基)苯基]丙烷 ‧BMI樹脂-3：雙(3-乙基-5-甲基-4-馬來醯亞胺苯基)甲烷 ‧烯丙基樹脂：二烯丙基雙酚A ‧環氧樹脂：聯苯型環氧樹脂(日本化藥公司製「NC3000H」) ‧苯酚樹脂：聯苯型苯酚酚醛清漆(明和化成公司製「MEH-7851-H」) ‧硬化促進劑：2-乙基-4-甲基咪唑 (黏合劑成分) ‧黏合劑樹脂：BisA／BisF混合型苯氧基樹脂(新日鐵住金化學公司製「ZX-1356-2」、重量平均分子量65,000) (無機填料) ・二氧化矽填料：熔融二氧化矽(環氧矽烷修飾，平均粒徑0.5μm、最大粒徑2.0μm) (其他添加劑) ‧偶合劑：3-環氧丙氧基丙基三乙氧基矽烷 [樹脂組成物之調製] 以表1所示的搭配比例(質量%(固體成分換算之比例))調製關於實施例1~5以及比較例1~4的樹脂組成物。 [樹脂薄片之製作] 於第一剝離材(設置由醇酸樹脂系剝離劑所形成的剝離層的聚對苯二甲酸乙二酯，厚度38μm)上，以乾燥後之樹脂組成物之厚度成為20μm之方式，以模具塗布機塗布樹脂清漆(將樹脂組成物以固體成分濃度40質量%溶解於甲基乙基酮而調製的塗布用溶液)，以100℃乾燥2分鐘。由乾燥爐拿出之後，將乾燥後之樹脂組成物、與第二剝離材(設置由聚矽氧系剝離劑所形成的剝離層的聚對苯二甲酸乙二酯，厚度38μm)在常溫貼合，製作以第一剝離材、由樹脂組成物所構成的樹脂薄片及第二剝離材之順序層合的樹脂薄片。 ＜硬化前之樹脂組成物之評估＞ [複數黏度] 將已得到的樹脂組成物塗布於剝離材上，以100℃乾燥2分鐘，製作厚度為20μm之樹脂薄片。層合2片此樹脂薄片，製作40μm之厚度之樹脂薄片層合物。更進一步，層合2片此樹脂薄片層合物而製作80μm之樹脂薄片層合物，藉由重複此順序，製作1280μm之厚度之測定用試料。關於此測定用試料，以依照下述之測定機器及測定條件，測定在90℃的複數黏度(單位：Pa‧s)。將所得到的結果表示於表1。 測定機器：黏彈性測定裝置，anton-paar公司製「MCR301」 測定條件：頻率1Hz，溫度範圍30~150℃，昇溫速度5℃/min ＜硬化後之樹脂組成物之評估＞ ‧樹脂組成物之熱硬化條件：溫度200℃，4小時 [儲存彈性模數E’] 將已得到的樹脂組成物塗布於剝離材上，以100℃乾燥2分鐘，製作厚度20μm之樹脂薄片。將此樹脂薄片層合10片而設為200μm之厚度，之後，由剝離材剝離，設為試料。使此試料以上述之熱硬化條件(溫度200℃，4小時)硬化，設為測定用試料。關於此測定用試料，使用TA Instruments公司製「DMA Q800」，以昇溫速度3℃/min，溫度範圍30~300℃，頻率11Hz之條件，測定在250℃的儲存彈性模數E’之值(單位：MPa)。將所得到的結果表示於表1。 [剝離強度] 於事先已切為4等分的6吋Si晶圓(厚度800μm)，將已得到樹脂薄片之一方之面，以層合溫度90℃，用減壓壓接而貼合(條件：到達壓力100Pa，時間60 sec)，接下來，於樹脂薄片之另一方之面，將銅箔(大小30mm×10mm，厚度350μm，JIS H 3100規格)，以與上述相同條件減壓壓接而貼合。尚，樹脂薄片之第一剝離材及第二剝離材係分別於貼附至Si晶圓及銅板之前進行剝離。之後，以上述之熱硬化條件(溫度200℃，4小時)使樹脂組成物硬化，設為試料。關於此試料，使用拉伸試驗機(島津製作所公司製「AUtograph AG-IS」)，以剝離速度50mm/min、剝離角度90度之條件由硬化後之樹脂組成物撕下銅箔，測定銅箔與硬化後之樹脂組成物之接著強度(單位：N／10mm)。將所得到的結果表示於表1。尚，關於比較例2係樹脂硬化物與銅箔未接著，所以無法測定。關於實施例1~5的樹脂組成物係可確認到相較於關於比較例1及4的樹脂組成物而言，可使儲存彈性模數及剝離強度均提昇。又，關於實施例1~5的樹脂組成物係可確認到相較於關於比較例2及3的樹脂組成物而言，可使剝離強度提昇。又，在含有具備聯苯骨架的馬來醯亞胺樹脂的情況，例如在實施例4係馬來醯亞胺樹脂與烯丙基樹脂之質量比為78：22，相較於在比較例3的70：30而言，馬來醯亞胺樹脂之比率較多。不僅於該處，在實施例4係複數黏度成為低於比較例3，可確認藉由使用具有聯苯骨架的馬來醯亞胺樹脂所致的複數黏度之降低效果。因而，關於實施例1~5的樹脂組成物係可確認到耐熱性及接著性為相較於關於比較例1~4的樹脂組成物而言較高，即使馬來醯亞胺樹脂之調配量多的情況亦可低地維持複數黏度，可使向被適用物之追隨性提昇。[Resin Composition] The resin composition of the present embodiment contains (A) a thermosetting component. This (A) thermosetting component contains (A1) a maleimide resin having a biphenyl skeleton and (A2) an allyl resin. The complex viscosity η at 90° C. before curing of the resin composition of the present embodiment is preferably 1.0×10 2 Pa·s or more and 1.0×10 5 Pa·s or less. From the viewpoint of fluidity during heating before curing of the resin composition of the present embodiment, the complex viscosity η is 1.0×10 3 Pa·s or more, more preferably 1.0×10 5 Pa·s or less, and 1.0 It is particularly preferable that ×10 3 Pa·s or more and 1.0 × 10 4 Pa·s or less. By maintaining the fluidity at the time of heating before curing of the resin composition, when the resin composition is applied to the object to be applied, the followability to the surface shape of the object to be applied becomes high. In particular, when the resin composition is in the form of a resin sheet, when the resin composition is heated and applied to an object to be applied, the followability to the surface shape of the object to be applied becomes high. The complex viscosity η of the resin composition of the present embodiment can be adjusted to the above-mentioned range by, for example, adjusting the components used in the resin composition or the amount of the mixture. The complex viscosity η in this specification refers to coating and drying the resin composition to produce a resin sheet, and measuring the complex viscosity (unit: Pa·s) of the resin sheet at 90° C. using a viscoelasticity measuring device. ((A) Thermosetting component) (A) Thermosetting component (hereinafter, only referred to as "(A) component") is a three-dimensional network when heated, and has the ability to firmly adhere to the adherend. nature. The (A) thermosetting component in this embodiment contains (A1) a maleimide resin having a biphenyl skeleton and (A2) an allyl resin. (A) The thermosetting component contains (A1) a maleimide resin having a biphenyl skeleton, which improves the adhesiveness of the resin composition to the adherend, and at the same time, the complex viscosity of the resin composition is easily reduced . In particular, in the thermosetting component (A), the mass ratio (A1/A2) of the maleimide resin having a biphenyl skeleton in (A1) with respect to the (A2) allyl resin is high In this case, the complex viscosity of the resin composition is also easily reduced. (A1) The maleimide resin having a biphenyl skeleton in this embodiment is not particularly limited as long as it is a resin having a biphenyl skeleton and a maleimide group in 1 molecule, but in 1 molecule Maleimide resins containing one or more biphenyl skeletons and two or more maleimide groups are preferred. The maleimide resin having a biphenyl skeleton in (A1) of the present embodiment is preferably represented by the following general formula (1) from the viewpoints of heat resistance and adhesiveness. In the aforementioned general formula (1), k is an integer of 1 or more, but the average value of k is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and even more preferably 1 or more and 3 or less. m1 and m2 are each independent integers of 1 to 6, and an integer of 1 to 3 is preferable, and 1 is more preferable. n1 and n2 are independent integers from 0 to 4, and an integer from 0 to 2 is preferred, and 0 is more preferred. R 1 and R 2 are each independently an alkyl group with 1 to 6 carbon atoms, and an alkyl group with 1 to 3 carbon atoms is preferable, and a methyl group is more preferable. Specific examples of the maleimide resin system having a biphenyl skeleton in (A1) of the present embodiment include compounds represented by the following general formula (2) or the following general formula (3). In the aforementioned general formulae (2) and (3), k is the same as k in the aforementioned general formula (1). In the aforementioned general formula (2), n1, n2, R 1 and R 2 are the same as n1, n2, R 1 and R 2 in the aforementioned general formula (1). As a product system of the maleimide resin represented by the aforementioned general formula (3), "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., etc. can be mentioned. The (A2) allyl resin of the present embodiment is not particularly limited as long as it is a resin having an allyl group. The allyl resin of the present embodiment is preferably an allyl resin containing two or more allyl groups in one molecule. The allyl resin system in this embodiment is more preferably represented by the following general formula (4). In the aforementioned general formula (4), R 3 and R 4 are independent alkyl groups, preferably alkyl groups with 1 to 10 carbon atoms, and more preferably alkyl groups with 1 to 4 carbon atoms. The alkyl group selected from the group constituted by the group is further preferred. (A2) Specifically, diallyl bisphenol A etc. are mentioned, for example. The thermosetting component (A) of the present embodiment may contain thermosetting resins other than the component (A1) and curing agents other than the component (A2) as long as the object of the present invention is not impaired. Thermosetting resins other than the component (A1) may be thermosetting resins having high heat resistance, and examples thereof include maleimide resins other than the component (A1), epoxy resins, and benzoxazine. resin, cyanate ester resin, and melamine resin, etc. These thermosetting resins can be used alone or in combination of two or more. Examples of curing agent systems other than the component (A2) include resins such as phenol resins and resins having C=C double bonds other than the component (A2), amines, acid anhydrides, and formaldehyde. These curing agents can be used alone or in combination of two or more. In the case of using a thermosetting resin other than the component (A1) or a curing agent other than the component (A2), the content of these is based on the total amount of the solid content of the component (A) (that is, the amount of (A) to be removed from the solvent. ) When the solid content of the component is 100 mass %), 10 mass % or less is preferable, and 5 mass % or less is more preferable. In this embodiment, the content of the (A) thermosetting component in the resin composition is based on the total solid content of the resin composition (that is, when the total solid content excluding the solvent is 100% by mass), 2 mass % or more and 75 mass % or less are preferable, and 5 mass % or more and 70 mass % or less are more preferable. In this embodiment, it is preferable that the mass ratio (A1/A2) of (A1) the maleimide resin having a biphenyl skeleton with respect to the (A2) allyl resin is 4.5 or more. When the mass ratio (A1/A2) is 4.5 or more, the storage elastic modulus of the cured resin product in which the resin composition has been cured can be further improved while maintaining the adhesiveness. Moreover, the heat resistance of a resin composition can be improved. Furthermore, the bleed-out of the (A2) allyl resin from the resin composition can also be suppressed. However, the upper limit value of the mass ratio (A1/A2) is not particularly limited. For example, the mass ratio (A1/A2) may be 50 or less. In this embodiment, (A) thermosetting component may contain a hardening accelerator. As a hardening accelerator, an imidazole compound (for example, 2-ethyl-4-methylimidazole etc.) etc. are mentioned, for example. The content of the hardening accelerator in the resin composition is based on the total solid content of the resin composition (that is, when the total solid content excluding the solvent is 100% by mass), 0.005% by mass or more and 12% by mass or less: Preferably, it is 0.01 mass % or more and 10 mass % or less is more preferable. ((B) Binder component) In the present embodiment, the resin composition system contains the (B) binder component (hereinafter, only referred to as "(B) component") in addition to the (A) component. good. By this component (B), film-forming property is imparted, and the resin composition can be easily formed into a sheet shape. The (B) adhesive component of the present embodiment is a resin other than the (A) component, and has a function of bonding the (A) component or other components. The component (B) is preferably a thermoplastic resin or the like. (B) component system may be resin which has a functional group. In this case, even if the (B) binder component can participate in the hardening of the resin composition by heat, in the present invention, the (B) binder component is distinguished from the (A) thermosetting component. (B) The binder component can be widely selected regardless of whether it is an aliphatic compound or an aromatic compound. (B) The binder component is, for example, at least one selected from the group consisting of phenoxy resins, acrylic resins, methacrylic resins, polyester resins, urethane resins, and polyamidoimide resins The resin is preferable, and at least one resin selected from the group consisting of a phenoxy resin, a polyimide resin, and a polyester resin is more preferable from the viewpoint of heat resistance. Furthermore, the polyester resin is preferably a wholly aromatic polyester resin. (B) Binder component system can be used individually by 1 type, or in combination of 2 or more types. The phenoxy resin is composed of a bisphenol A skeleton (hereinafter, bisphenol A may be referred to as "BisA"), a bisphenol F skeleton (hereinafter, bisphenol F may be referred to as "BisF"), and a biphenyl skeleton It is preferable to select the phenoxy resin of 1 or more types of skeletons from the group which consists of a naphthalene skeleton, and the phenoxy resin which has a bisphenol A skeleton and a bisphenol F skeleton is more preferable. (B) The weight average molecular weight (Mw) of the binder component is preferably 100 or more and 1 million or less, more preferably 1,000 or more and 800,000 or less, and particularly preferably 10,000 or more and 100,000 or less. The weight average molecular weight in this specification is a standard polystyrene conversion value measured by a gel permeation chromatography (Gel Permeation Chromatography; GPC) method. In this embodiment, the content of the binder component (B) in the resin composition is based on the total solid content of the resin composition (that is, when the total solid content excluding the solvent is 100% by mass), 0.1 The content is preferably not less than 50% by mass and not more than 1% by mass and not more than 40% by mass. By setting the content of the binder component (B) in the resin composition as the above range, the complex viscosity of the resin composition before curing of the resin sheet can be easily adjusted to a desired range, and the handleability of the resin sheet and sheet formation can be improved. sex. In the present embodiment, the content of the component (A1) is based on the total amount of the solid content of the components (A) and (B), and is preferably 20% by mass or more and 80% by mass or less. When the content of the component (A1) is 20% by mass or more, the heat resistance of the resin composition can be further improved. On the other hand, when the content of the component (A1) is 80% by mass or less, the resin composition can be easily formed into a sheet shape. ((C) Inorganic filler) In this embodiment, the resin composition system contains (C) inorganic filler (hereinafter, it may be simply referred to as "(C) component") in addition to (A) component and (B) component. ) is better. By this component (C), the linear expansion coefficient of the resin composition can be lowered, and the storage elastic modulus of the resin composition can be increased. As (C) inorganic filler system, a silica filler, an alumina filler, a boron nitride filler, etc. are mentioned. Among these, silica fillers are preferred. As a silica filler system, molten silica, spherical silica, etc. are mentioned, for example. (C) Inorganic filler system can be used individually by 1 type or in combination of 2 or more types. In addition, the inorganic filler system may be surface-treated. (C) The average particle diameter of the inorganic filler is not particularly limited. (C) The average particle diameter of the inorganic filler is a value determined by a general particle size distribution meter, and is preferably 0.1 nm or more and 10 μm or less. In this specification, the average particle diameter of the (C) inorganic filler is a value measured by a dynamic light scattering method using a particle size distribution analyzer (manufactured by Nikkiso Co., Ltd., product name "Nanotrac Wave-UT151"). The content of the (C) inorganic filler in the resin composition is based on the total solid content of the resin composition (that is, when the total solid content excluding the solvent is 100 mass %), 10 mass % or more, 90 mass % The content is preferably less than or equal to 20% by mass or more and more preferably less than or equal to 80% by mass. ((D) Coupling agent) In this embodiment, it is preferable that the resin composition system further contains (D) coupling agent in addition to (A)-(C) component. The coupling agent preferably has a group reactive with the functional group possessed by the above-mentioned (A) thermosetting component or the functional group possessed by the (B) binder component, and preferably has a functional group possessed by the (A) thermosetting component. The functional group of the reactive group is more preferable. By using the coupling agent (D), the heat resistance of the resin cured product can be improved, and the adhesiveness and the adhesiveness can be improved, and the water resistance (moisture and heat resistance) can also be improved. As the (D) coupling agent, a silane-based (silane coupling agent) is preferable because of the versatility and cost advantage. These systems can be used individually by 1 type or in combination of 2 or more types. Moreover, the above-mentioned coupling agent is usually 0.1 parts by mass or more and 20 parts by mass or less, preferably 0.3 parts by mass or more and 15 parts by mass or less, with respect to 100 parts by mass of the (A) thermosetting component. It is preferable to mix|blend in the ratio of 0.5 mass part or more and 10 mass parts or less. As an example of the resin composition concerning this embodiment, the resin composition containing only (A) thermosetting component, (B) binder component, (C) inorganic filler, and (D) coupling agent is mentioned. Moreover, as another example of the resin composition which concerns on this embodiment, the following is mentioned, which contains (A) thermosetting component, (B) binder component, (C) inorganic filler, (D) coupler A mixture and a resin composition of components other than the aforementioned (A) to (D) components. (Other components) In the present embodiment, the resin composition may further contain, for example, a crosslinking agent, a pigment, a dye, a defoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant At least one component selected from the group consisting of an agent and an ion scavenger. For example, the resin composition may further contain a crosslinking agent in order to adjust the initial adhesion and cohesion before curing. As a crosslinking agent system, an organic polyvalent isocyanate compound, an organic polyvalent imine compound, etc. are mentioned, for example. These systems can be used individually by 1 type or in combination of 2 or more types. Examples of the organic polyvalent isocyanate compound include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, and trimers of these polyvalent isocyanate compounds, and the combination of these polyvalent isocyanate compounds with polyvalent isocyanate compounds. A terminal isocyanate urethane prepolymer obtained by reacting an alcohol compound, etc. More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4- Xylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, iso phorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate and the like. These systems can be used individually by 1 type or in combination of 2 or more types. Specific examples of the organic polyimine compound include N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxyamide), trimethylolpropane-tri-β -Aziridine propionate, tetramethylolmethane-tri-β-aziridine propionate, and N,N'-toluene-2,4-bis(1-aziridinecarboxyamide) ) triethylene melamine, etc. The above-mentioned crosslinking agent is usually 0.01 parts by mass or more and 12 parts by mass or less, preferably 0.1 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the aforementioned (B) binder component. Proportional allocation. It is preferable that the resin composition system concerning this embodiment is used for a semiconductor element. Specifically, it is preferable that the resin composition system of this embodiment is used for sealing a semiconductor element. In addition, it is preferable that the resin composition of this embodiment is used in the interposition between the semiconductor element and other electronic components. Preferably, the semiconductor element is a power semiconductor. In addition, the resin composition of the present embodiment is used for sealing a semiconductor element using any one or more of silicon carbide and gallium nitride, or for use in any one of silicon carbide and gallium nitride that is interposed therebetween. More than one type of semiconductor element and other electronic components are preferred. As another electronic component system, a printed wiring board, a lead frame, etc. are mentioned, for example. [Resin Sheet] The resin sheet of the present embodiment contains the resin composition of the present embodiment. The resin sheet according to the present embodiment can be obtained by thinning the resin composition according to the present embodiment into sheets. When the resin composition is in the form of a sheet, the application to the adherend is easy, especially when the adherend is large in size. If the resin composition is in the form of a sheet, since the shape after the sealing step is formed to a certain extent and has a suitable shape, it is suitable and can be supplied as a sealant that maintains a certain degree of uniformity. Moreover, since it has no fluidity, it is excellent in workability. The method of thinning the resin composition into a sheet can be a generally known method of thinning, and is not particularly limited. The resin sheet of the present embodiment may be a tape-shaped sheet, or may be provided in a state of being wound up in a roll shape. The resin sheet of the present embodiment that has been wound into a roll shape can be used by being fed out from a roll and cut into a desired size or the like. The thickness of the resin sheet of the present embodiment is preferably, for example, 10 μm or more, and more preferably 20 μm or more. Moreover, the thickness is preferably 500 μm or less, more preferably 400 μm or less, and still more preferably 300 μm or less. It is preferable that the resin sheet of this embodiment is applied to a plurality of semiconductor elements. For example, if the resin composition is in the form of a sheet, a resin sheet is applied to a structure in which semiconductor elements are arranged in the gaps of a frame with a plurality of gaps provided, and the frame and the semiconductor elements are sealed together, which can be used for a so-called panel level. package. The fact that the resin sheet of the present embodiment is excellent in heat resistance is revealed by, for example, measuring the storage elastic modulus E' after curing. The storage elastic modulus E' after curing of the resin sheet of the present embodiment is at a temperature of 250° C., preferably 1.0×10 2 MPa or more, more preferably 2.0×10 2 MPa or more. If the storage elastic modulus E' at a temperature of 250°C is in the above range, the cured product will not be softened excessively even in the application used at high temperature, even if GaN or GaN or GaN which is suitably used for operation at a high temperature of 200°C or higher is used. In the case of encapsulation of SiC-based power semiconductor elements, etc., it can also be considered that the reliability of the encapsulation is improved. The upper limit of the storage elastic modulus E' at a temperature of 250°C after hardening is not particularly limited, but is preferably 2.0×10 3 MPa or less, more preferably 1.0×10 3 MPa or less, and furthermore, 0.8×10 3 MPa or less good. The storage elastic modulus E' after the hardening of the resin sheet can be measured by the method described in the Examples. The storage elastic modulus E' after curing can be achieved in the above-mentioned range by, for example, adjusting the components used in the resin composition or the amount to be mixed. [Laminated body] FIG. 1 is a schematic cross-sectional view showing a laminated body 1 according to the present embodiment. The laminate 1 of the present embodiment includes the first release material 2 , the second release material 4 , and the resin sheet 3 provided between the first release material 2 and the second release material 4 . The resin sheet 3 contains the resin composition according to the present embodiment. The first peeling material 2 and the second peeling material 4 have peelability, and it is preferable that the peeling force of the first peeling material 2 to the resin sheet 3 and the peeling force of the second peeling material 4 to the resin sheet 3 are different. The material system of the first release material 2 and the second release material 4 is not particularly limited. The ratio (P2/P1) of the peeling force P2 of the second peeling material 4 with respect to the peeling force P1 of the first peeling material 2 is preferably 0.02≦P2/P1<1 or 1<P2/P1≦50. The 1st peeling material 2 and the 2nd peeling material 4 may be a member to which a peeling process was given, a member to which a release agent layer was laminated|stacked, etc., for example, besides the member which the peeling material itself has peelability. When the first peeling material 2 and the second peeling material 4 are not subjected to peeling treatment, examples of the material system include olefin-based resins, fluororesins, and the like. The first release material 2 and the second release material 4 can be a release material provided with a release base material and a release agent layer formed by applying a release agent on the release base material. When the release material is provided with a release base material and a release agent layer, handling becomes easy. Moreover, the 1st release material 2 and the 2nd release material 4 may have a release agent layer only on the single side|surface of a release base material, and may have a release agent layer on both surfaces of a release base material. As a release base material, a paper base material, the laminated paper which laminated|stacked the thermoplastic resin, such as polyethylene, and a plastic film etc. are mentioned, for example. As a paper base material system, a cellophane, a coated paper, a cast-coated paper, etc. are mentioned, for example. Examples of plastic films include polyester films (eg, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), and polyolefin films (eg, polyethylene terephthalate). propylene and polyethylene, etc.), etc. Among these, polyester films are preferred. Examples of the release agent include polysiloxane-based release agents composed of polysiloxane resins; polysiloxane-based release agents composed of polyvinyl urethane and long-chain alkyl group-containing compounds such as alkyl urea derivatives. Long-chain alkyl compound-based release agents; alkyd resin-based release agents composed of alkyd resins (eg, non-converted alkyd resins, and inverting alkyd resins, etc.); olefin resins (eg, polyethylene resins) (for example, high-density polyethylene, low-density polyethylene, linear low-density polyethylene, etc.), propylene homopolymers with isotactic or syndiotactic structures, and propylene-α-olefin copolymers, etc. Olefin resin-based release agents composed of crystalline polypropylene resin, etc.); natural rubber, and synthetic rubber (for example, butadiene rubber, isoprene rubber, styrene-butadiene rubber, methyl methacrylate- Butadiene rubber, acrylonitrile-butadiene rubber, etc. rubber-based release agents; and acrylic resin-based release agents composed of acrylic resins such as (meth)acrylate-based copolymers, etc. These various release agents can be used individually by 1 type or in combination of 2 or more types. Among these, polysiloxane-based release agents are preferred. The thickness of the 1st peeling material 2 and the 2nd peeling material 4 is not specifically limited. The thickness of the first release material 2 and the second release material 4 is usually 1 μm or more and 500 μm or less, preferably 3 μm or more and 100 μm or less. The thickness of the release agent layer is not particularly limited. When forming a release agent layer by applying a solution containing a release agent, the thickness of the release agent layer is preferably 0.01 μm or more and 3 μm or less, and more preferably 0.03 μm or more and 1 μm or less. The manufacturing method of the laminated body 1 is not specifically limited. For example, the laminate 1 is manufactured through the following steps. First, a resin composition is applied on the first release material 2 to form a coating film. Next, the coating film is dried to form the resin sheet 3 . Next, the laminated body 1 is obtained by bonding the resin sheet 3 and the 2nd peeling material 4 at normal temperature. [Semiconductor Device] The semiconductor device according to the present embodiment includes a semiconductor element sealed with the resin composition or resin sheet according to the present embodiment. The sealing system of the semiconductor element using the resin sheet of this embodiment can be performed in the following manner, for example. The resin sheet is placed so as to cover the semiconductor element, and is press-bonded by a vacuum lamination method to seal the semiconductor element. In the case of using the laminate 1 of the present embodiment, after peeling off one of the release materials of the laminate 1, a resin sheet is placed so as to cover the semiconductor element. After that, peel off the other release material. After that, the semiconductor element is sealed by pressure bonding by a vacuum lamination method. The bonding of semiconductor elements using the resin sheet of the present embodiment can be performed, for example, in the following manner. On other electronic components, a resin sheet is placed, and a semiconductor element is placed on the resin sheet. After that, the resin composition and the semiconductor element are temporarily pressure-bonded, and then heated and cured. In this way, the resin composition is interposed between the semiconductor element and other electronic components, and the semiconductor element and other electronic components are joined. [Effect of the embodiment] With the resin composition and resin sheet according to the present embodiment, heat resistance and adhesiveness can be improved. By using the resin composition and resin sheet according to the present embodiment, the semiconductor element can be sealed by the encapsulation resin layer having higher heat resistance and higher adhesiveness than before, and the semiconductor element and the encapsulation resin can be sealed. Layer strength increased. The resin composition and resin sheet of the present embodiment can be suitably used for power semiconductor elements as described above. Moreover, the resin composition and resin sheet concerning this embodiment can be used suitably for the semiconductor element which used at least any one of silicon carbide and gallium nitride. As described above, the resin composition system of the present embodiment can be suitably used for power semiconductor elements. In other words, in the semiconductor device of this embodiment, it is preferable that the semiconductor element is a power semiconductor element. Power semiconductor devices are also supposed to operate at high temperatures above 200°C. Heat resistance is required for use in semiconductor devices having power semiconductor elements. Since the resin composition and resin sheet of the present embodiment are excellent in heat resistance, they can be suitably used for covering power semiconductor elements in semiconductor devices, or intervening between power semiconductor elements and other components. As described above, the resin composition of the present embodiment can be suitably used for a semiconductor device using any one or more of silicon carbide and gallium nitride. In other words, in the semiconductor device according to the present embodiment, it is preferable that the semiconductor element is a semiconductor element using any one or more of silicon carbide and gallium nitride. Semiconductor elements using any one or more of silicon carbide and gallium nitride have different characteristics from silicon semiconductors, so they are preferably used in power semiconductors, high-output devices for base stations, sensors, detectors, or Schottky barrier diodes, etc. In these applications, attention is also paid to the heat resistance of semiconductor elements using any one or more of silicon carbide and gallium nitride. The resin composition and resin sheet of this embodiment are excellent in heat resistance, so they are different from those using carbon dioxide. Any one or more semiconductor elements of silicon and gallium nitride can be suitably used in combination. [Modification of the embodiment] The present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the scope of achieving the object of the present invention are included in the present invention. In the above-mentioned embodiment, the laminate having the first release material, the second release material, and the resin sheet provided between the first release material and the second release material has been described, but the resin sheet alone may be used. On the one hand, it has a laminate of a release material. In addition, the above-mentioned embodiment of the semiconductor device has been described with regard to the semiconductor sealing application, but the resin composition and resin sheet of the present invention can also be used as an insulating material for circuit boards (for example, a rigid printed circuit board). materials, materials for flexible wiring boards, interlayer insulating materials for build-up boards, etc.), adhesive films for build-up, adhesives, and the like. EXAMPLES Hereinafter, an Example is given and this invention is demonstrated in detail. The present invention is not limited in any way by these embodiments. ‧Preparation of resin composition The materials used for the preparation of the resin composition are as follows. (Thermosetting component) BMI resin-1: maleimide resin having biphenyl group (maleimide resin represented by the aforementioned general formula (3), "MIR- 3000-70MT”) ‧BMI resin-2: 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane ‧BMI resin-3: bis(3-ethyl-5- Methyl-4-maleimidophenyl)methane ‧Allyl resin: Diallylbisphenol A ‧Epoxy resin: Biphenyl type epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd.) ‧Phenol Resin: Biphenyl-type phenol novolac ("MEH-7851-H" manufactured by Meiwa Chemical Co., Ltd.) ‧Cure accelerator: 2-ethyl-4-methylimidazole (binder component) ‧Binder resin: BisA/BisF blend Type phenoxy resin ("ZX-1356-2" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., weight average molecular weight 65,000) (inorganic filler) ・Silica filler: fused silica (modified with epoxy silane, average particle size 0.5 μm, maximum particle size 2.0μm) (other additives) ‧Coupling agent: 3-glycidoxypropyltriethoxysilane [Preparation of resin composition] In the mixing ratio shown in Table 1 (mass % (solids) Component conversion ratio)) The resin compositions of Examples 1 to 5 and Comparative Examples 1 to 4 were prepared. [Preparation of resin sheet] On the first release material (polyethylene terephthalate provided with a release layer formed of an alkyd resin-based release agent, thickness 38 μm), the thickness of the resin composition after drying was A resin varnish (a coating solution prepared by dissolving a resin composition in methyl ethyl ketone at a solid content concentration of 40% by mass) was applied with a die coater to a thickness of 20 μm, and dried at 100° C. for 2 minutes. After taking it out from the drying furnace, the dried resin composition and the second release material (polyethylene terephthalate with a release layer formed of a polysiloxane-based release agent, thickness 38 μm) were pasted at room temperature. Then, a resin sheet in which the first release material, the resin sheet composed of the resin composition, and the second release material are laminated in this order is produced. <Evaluation of the resin composition before hardening> [Complex viscosity] The obtained resin composition was apply|coated to the peeling material, it dried at 100 degreeC for 2 minutes, and the resin sheet of thickness 20 micrometers was produced. Two sheets of this resin sheet were laminated to prepare a resin sheet laminate having a thickness of 40 μm. Furthermore, two sheets of this resin sheet laminate were laminated to prepare a resin sheet laminate of 80 μm, and by repeating this procedure, a sample for measurement of a thickness of 1280 μm was prepared. About this measurement sample, the complex viscosity (unit: Pa·s) at 90 degreeC was measured according to the following measurement apparatus and measurement conditions. The obtained results are shown in Table 1. Measuring equipment: Viscoelasticity measuring device, "MCR301" manufactured by Anton-Paar Co., Ltd. Measuring conditions: Frequency 1 Hz, temperature range 30~150°C, heating rate 5°C/min <Evaluation of resin composition after curing> ‧Resin composition Thermosetting conditions: temperature 200°C, 4 hours [storage elastic modulus E'] The obtained resin composition was coated on a release material, and dried at 100°C for 2 minutes to prepare a resin sheet with a thickness of 20 μm. Ten sheets of this resin sheet were laminated to have a thickness of 200 μm, and then peeled off with a release material to obtain a sample. This sample was hardened under the above-mentioned thermal hardening conditions (temperature of 200° C., 4 hours), and used as a sample for measurement. For this measurement sample, using "DMA Q800" manufactured by TA Instruments, the value of the storage elastic modulus E' at 250°C was measured under the conditions of a heating rate of 3°C/min, a temperature range of 30 to 300°C, and a frequency of 11 Hz ( Unit: MPa). The obtained results are shown in Table 1. [Peel strength] A 6-inch Si wafer (thickness 800 μm) that has been cut into 4 equal parts in advance, one side of the obtained resin sheet is bonded by pressure reduction under reduced pressure at a lamination temperature of 90°C (conditions : reaching pressure 100Pa, time 60 sec), then, on the other side of the resin sheet, copper foil (size 30mm×10mm, thickness 350μm, JIS H 3100 standard) was pressure-bonded under reduced pressure under the same conditions as the above. fit. Furthermore, the first peeling material and the second peeling material of the resin sheet are peeled off before being attached to the Si wafer and the copper plate, respectively. After that, the resin composition was cured under the above-mentioned thermosetting conditions (temperature of 200° C., 4 hours) to prepare a sample. For this sample, using a tensile tester ("AUtograph AG-IS" manufactured by Shimadzu Corporation), the copper foil was peeled off from the cured resin composition under the conditions of a peeling speed of 50 mm/min and a peeling angle of 90 degrees, and the copper foil was measured. Adhesion strength to the cured resin composition (unit: N/10mm). The obtained results are shown in Table 1. In addition, since the resin cured product of Comparative Example 2 was not bonded to the copper foil, it could not be measured. Regarding the resin compositions of Examples 1 to 5, it was confirmed that both the storage elastic modulus and the peel strength were improved compared to the resin compositions of Comparative Examples 1 and 4. Moreover, about the resin composition system of Examples 1-5, compared with the resin composition about the comparative example 2 and 3, it was confirmed that peeling strength can be improved. In addition, in the case of containing maleimide resin with biphenyl skeleton, for example, the mass ratio of maleimide resin and allyl resin in Example 4 is 78:22, compared with that in Comparative Example 3 In terms of 70:30, the ratio of maleimide resin is more. In addition to this, the complex viscosity of Example 4 is lower than that of Comparative Example 3, and the effect of reducing the complex viscosity by using the maleimide resin having a biphenyl skeleton can be confirmed. Therefore, it was confirmed that the heat resistance and adhesiveness of the resin compositions of Examples 1 to 5 were higher than those of the resin compositions of Comparative Examples 1 to 4, even if the amount of maleimide resin was added. In many cases, the complex viscosity can be maintained at a low level, and the followability to the object to be applied can be improved.
