CN109206903A - Resin combination and resin sheet - Google Patents
Resin combination and resin sheet Download PDFInfo
- Publication number
- CN109206903A CN109206903A CN201810698508.1A CN201810698508A CN109206903A CN 109206903 A CN109206903 A CN 109206903A CN 201810698508 A CN201810698508 A CN 201810698508A CN 109206903 A CN109206903 A CN 109206903A
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- China
- Prior art keywords
- resin
- resin combination
- ingredient
- present
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920005989 resin Polymers 0.000 title claims abstract description 247
- 239000011347 resin Substances 0.000 title claims abstract description 247
- 239000004615 ingredient Substances 0.000 claims abstract description 77
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 46
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000004305 biphenyl Substances 0.000 claims abstract description 23
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 23
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims description 57
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 15
- 239000011256 inorganic filler Substances 0.000 claims description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 14
- 229910002601 GaN Inorganic materials 0.000 claims description 13
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 12
- 239000007822 coupling agent Substances 0.000 claims description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 12
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 description 20
- -1 imide compound Chemical class 0.000 description 20
- 239000000463 material Substances 0.000 description 16
- 239000010410 layer Substances 0.000 description 15
- 238000001723 curing Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 11
- 238000003860 storage Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 239000005056 polyisocyanate Substances 0.000 description 7
- 229920001228 polyisocyanate Polymers 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229920000180 alkyd Polymers 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 239000013034 phenoxy resin Substances 0.000 description 4
- 229920006287 phenoxy resin Polymers 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 150000002466 imines Chemical group 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical class C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 1
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- KLIYQWXIWMRMGR-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate Chemical compound C=CC=C.COC(=O)C(C)=C KLIYQWXIWMRMGR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- XXKOQQBKBHUATC-UHFFFAOYSA-N cyclohexylmethylcyclohexane Chemical compound C1CCCCC1CC1CCCCC1 XXKOQQBKBHUATC-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 239000002552 dosage form Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ceramic Engineering (AREA)
Abstract
Resin combination of the invention is the resin combination containing (A) Thermocurable ingredient, wherein, described (A) the Thermocurable ingredient contains (A1) maleimide resin and (A2) allyl resin with biphenyl backbone.
Description
Technical field
The present invention relates to resin combination and resin sheets.
Background technique
As the sealing material of power semiconductor etc., the resin combination with high-fire resistance can be used.
For example, disclosing a kind of resin combination in document 1 (Japanese Unexamined Patent Publication 2015-147849 bulletin), contain: horse
Come imide compound, compound, amine compounds at least either in allyl and epoxy group and spreads out comprising acetophenone
At least one kind of free-radical generating agent in biology and tetraphenyl ethane derivative.
But it in the case where containing maleimide compound as the resin combination as recorded in document 1, deposits
Heat resistance improve and cementability reduce the problem of.
Summary of the invention
The purpose of the present invention is to provide a kind of resin combinations compared with the past for having had both high-fire resistance and high adhesiveness
Object and resin sheet.
The resin combination of one embodiment of the present invention is the resin combination containing (A) Thermocurable ingredient, feature
It is, (A) the Thermocurable ingredient contains (A1) maleimide resin and (A2) allyl resin with biphenyl backbone.
In the resin combination of one embodiment of the present invention, (A1) has the maleimide resin of biphenyl backbone
Mass ratio (A1/A2) relative to (A2) allyl resin is preferably 4.5 or more.
In the resin combination of one embodiment of the present invention, preferably described (A1) has the maleimide of biphenyl backbone
Resin is indicated with the following general formula (1).
In the following general formula (1), the integer that k is 1 or more, m1 and m2 are separately 1~6 integer, n1 and n2 points
It independently is not 0~4 integer, R1And R2It is separately the alkyl of carbon atom number 1~6.
In the resin combination of one embodiment of the present invention, preferably also contain (B) adhesive ingredients.
In the resin combination of one embodiment of the present invention, with (A) the Thermocurable ingredient and (B) adhesive
On the basis of the total amount of the solid component of ingredient, it is preferably 20 that (A1), which has the content of the maleimide resin of biphenyl backbone,
Quality % or more and 80 mass % or less.
In the resin combination of one embodiment of the present invention, preferably also contain (C) inorganic filler.
In the resin combination of one embodiment of the present invention, preferably also contain (D) coupling agent.
The resin combination of one embodiment of the present invention is preferred for sealing power semiconductor or is clipped in the function
Between rate semiconductor element and other electronic components.
The resin combination of one embodiment of the present invention is preferred for any one in silicon carbide and gallium nitride to having used
Kind or more semiconductor element be sealed or be clipped in any one used in silicon carbide and gallium nitride or more
Between semiconductor element and other electronic components.
The resin sheet of one embodiment of the present invention is characterized in that the resin group containing above-mentioned one embodiment of the present invention
Close object.
According to the present invention it is possible to provide the resin combination compared with the past for having had both high-fire resistance and high adhesiveness and tree
Rouge piece.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the laminated body of an embodiment.
Specific embodiment
[resin combination]
The resin combination of present embodiment contains (A) Thermocurable ingredient.It is somebody's turn to do (A) Thermocurable ingredient and contains (A1) tool
There are the maleimide resin and (A2) allyl resin of biphenyl backbone.
Complex viscosity η of the resin combination of present embodiment before curing at 90 DEG C is preferably 1.0 × 102Pa·s
Above and 1.0 × 105Pas or less.From the sight of the mobility when heating before curing of the resin combination of present embodiment
Point considers that complex viscosity η is more preferably 1.0 × 103Pas or more and 1.0 × 105Pas hereinafter, particularly preferably 1.0 ×
103Pas or more and 1.0 × 104Pas or less.By keeping mobility when resin combination heating before curing,
When resin combination is applied to by application object, increase to by the followability of the surface shape of application object.Especially in resin group
In the case where closing the form that object is resin sheet, when being applied to resin combination heating by application object, to by application object
The followability of surface shape increases.
The complex viscosity η of the resin combination of present embodiment for example can by adjusting used in resin combination at
Point or use level be adjusted to above range.
Complex viscosity η in this specification is coating resin combination and makes it dry, and makes resin sheet, uses viscoplasticity
Value obtained from measurement device is measured the resin sheet in the complex viscosity (unit: Pas) at 90 DEG C.
((A) Thermocurable ingredient)
(A) it is formed three-dimensional netted when Thermocurable ingredient (hereinafter, sometimes referred to simply as " (A) ingredient ") is heated, had
It is adhered to the property of adherend securely.(A) Thermocurable ingredient in present embodiment contains (A1) with biphenyl backbone
Maleimide resin and (A2) allyl resin.Contain the horse that (A1) has biphenyl backbone by (A) Thermocurable ingredient
Resin combination can be improved to the cementability of adherend in bismaleimide resin, and the complex viscosity of resin combination holds
Easily reduce.Especially in (A) Thermocurable ingredient, though (A1) have biphenyl backbone maleimide resin relative to
(A2) in the case that the mass ratio (A1/A2) of allyl resin is high, the complex viscosity of resin combination is also easily reduced.
(A1) in present embodiment as long as the maleimide resin with biphenyl backbone has connection in 1 molecule
The resin of benzene skeleton and dimaleoyl imino, is not particularly limited, and 1 or more biphenyl is contained preferably in 1 molecule
The maleimide resin of skeleton and 2 or more dimaleoyl imino.
From the viewpoint of heat resistance and cementability, (A1) preferably in present embodiment has the Malaysia acyl of biphenyl backbone
Imide resin is indicated with the following general formula (1).
In above-mentioned general formula (1), the integer that k is 1 or more, the average value of k is preferably 1 or more and 10 hereinafter, more preferably 1
Above and 5 hereinafter, further preferably 1 or more and 3 or less.M1 and m2 is separately 1~6 integer, preferably 1~3
Integer, more preferably 1.N1 and n2 is separately 0~4 integer, preferably 0~2 integer, more preferably 0.R1And
R2It is separately the alkyl of carbon atom number 1~6, the preferably alkyl of carbon atom number 1~3, more preferably methyl.
There is the maleimide resin of biphenyl backbone as (A1) in present embodiment, can specifically arrange and be exemplified below
State general formula (2) or the following general formula (3) compound represented.
In above-mentioned general formula (2) and (3), k is identical as the k of above-mentioned general formula (1).In above-mentioned general formula (2), n1, n2, R1And
R2With n1, n2, R of above-mentioned general formula (1)1And R2It is identical.
As the product of maleimide resin shown in above-mentioned general formula (3), Nippon Kayaku K. K's manufacture can be enumerated
" MIR-3000-70MT " etc..
(A2) in present embodiment is not particularly limited as long as allyl resin has the resin of allyl.
The allyl resin preferably allyl resin containing 2 or more allyls in 1 molecule in present embodiment.
Allyl resin in present embodiment more preferably uses the following general formula (4) to indicate.
In above-mentioned general formula (4), R3And R4It is separately alkyl, the preferably alkyl of carbon atom number 1~10 is more excellent
It is selected as the alkyl of carbon atom number 1~4, the further preferably alkyl selected from methyl and ethyl.
As (A2) allyl resin, can specifically enumerate such as diallyl bisphenol.
As long as not damaging the purpose of the present invention, (A) the Thermocurable ingredient of present embodiment can containing (A1) ingredient with
Curing agent other than outer thermosetting resin and (A2) ingredient.
As the thermosetting resin other than (A1) ingredient, as long as the thermosetting resin with high-fire resistance, it can be with
It enumerates for example: maleimide resin, epoxy resin, benzo in addition to (A1) ingredientPiperazine resin, cyanate ester resin, with
And melamine resin etc..These thermosetting resins can be used alone, or two or more is applied in combination.
It as the curing agent other than (A2) ingredient, can enumerate for example: phenolic resin and having in addition to (A2) ingredient
The resinaes such as the resin of C=C double bond and amine, acid anhydrides and formaldehyde etc..These curing agent can be used alone, or combination
Use two or more.
In the case where the curing agent other than the thermosetting resin or (A2) ingredient other than use (A1) ingredient, with (A) at
On the basis of (that is, when the solid component of (A) ingredient in addition to solvent is set as 100 mass %) total amount of the solid component divided,
Their content is preferably 10 mass % hereinafter, more preferably 5 mass % or less.
In the present embodiment, (that is, by complete in addition to solvent on the basis of the total amount of the solid component of resin combination
When portion's solid component is set as 100 mass %), the content of (A) Thermocurable ingredient in resin combination be preferably 2 mass % with
Upper and 75 mass % are hereinafter, more preferably 5 mass % or more and 70 mass % or less.
In the present embodiment, (A1) has the maleimide resin of biphenyl backbone relative to (A2) allyl resin
Mass ratio (A1/A2) is preferably 4.5 or more.When mass ratio (A1/A2) is 4.5 or more, cementability can be kept, and into one
Step improves the storage modulus of resin cured matter made of solidifying resin combination.Furthermore, it is possible to improve the resistance to of resin combination
It is hot.Furthermore it is also possible to which (A2) allyl resin is inhibited to ooze out from resin combination.It should be noted that mass ratio (A1/
A2 upper limit value) is not particularly limited.For example, mass ratio (A1/A2) can be 50 or less.
In the present embodiment, (A) Thermocurable ingredient can contain curing accelerator.
As curing accelerator, can enumerate such as imidazolium compounds (for example, 2-ethyl-4-methylimidazole) etc..
(that is, by all solids in addition to solvent at being divided on the basis of the total amount of the solid component of resin combination
When 100 mass %), the content of the curing accelerator in resin combination be preferably 0.005 mass % or more and 12 mass % with
Under, more preferably 0.01 mass % or more and 10 mass % or less.
((B) adhesive ingredients)
In the present embodiment, in addition to (A) ingredient, resin combination preferably also containing (B) adhesive ingredients (hereinafter,
Sometimes referred to simply as " (B) ingredient ").Using (B) ingredient, film forming can be assigned, can be easy resin combination being shaped to piece
Shape.
(B) adhesive ingredients of present embodiment is the resin in addition to (A) ingredient, has engagement (A) ingredient or other
The function of ingredient.(B) ingredient is preferably thermoplastic resin etc..(B) ingredient can be the resin with functional group.In the situation
Under, though (B) adhesive ingredients can participate in by heat carry out resin combination solidification, in the present invention, (B) adhesive at
Divide and is also distinguished with (A) Thermocurable ingredient.
No matter (B) adhesive ingredients is aliphatic compound or aromatic compound, can be selected extensively.(B) adhesive
Ingredient is preferably selected from such as phenoxy resin, acrylic resin, methacrylic resin, polyester resin, carbamate tree
At least any one resin in rouge and polyamide-imide resin is more preferably selected from benzene from the viewpoint of heat resistance
At least any one resin in oxygroup resin, polyamide-imide resin and polyester resin.It should be noted that polyester resin
Preferably Wholly aromatic polyester resin.(B) adhesive ingredients can be used alone, or two or more is applied in combination.
As phenoxy resin, it is however preferred to have selected from bisphenol A skeleton (hereinafter, bisphenol-A is known as " BisA " sometimes), double
The phenoxy group tree of one or more of phenol F skeleton (hereinafter, Bisphenol F is known as " BisF " sometimes), biphenyl backbone and naphthalene skeleton skeleton
Rouge, the more preferably phenoxy resin with bisphenol A skeleton and Bisphenol F skeleton.
(B) weight average molecular weight (Mw) of adhesive ingredients be preferably 100 or more and 1,000,000 hereinafter, more preferably 1000 with
Above and 800,000 hereinafter, particularly preferably 10,000 or more and 100,000 or less.Weight average molecular weight in this specification is to utilize gel infiltration
Chromatography (GelPermeation Chromatography；GPC) method measures and is scaled the value of standard polystyren.
In the present embodiment, (that is, by complete in addition to solvent on the basis of the total amount of the solid component of resin combination
When portion's solid component is set as 100 mass %), the content of (B) adhesive ingredients in resin combination be preferably 0.1 mass % with
Upper and 50 mass % are hereinafter, more preferably 1 mass % or more and 40 mass % or less.By keeping (B) in resin combination viscous
The content of mixture ingredient is above range, and the complex viscosity for being easy to the resin combination by resin sheet before curing is adjusted to it is expected
Range, operability, the piece formative of resin sheet can be improved.
In the present embodiment, on the basis of the total amount of (A) ingredient and the solid component of (B) ingredient, (A1) ingredient contains
Amount is preferably 20 mass % or more and 80 mass % or less.It (A1), can be further when the content of ingredient is 20 mass % or more
Improve the heat resistance of resin combination.On the other hand, it when the content of (A1) ingredient is 80 mass % or less, may be easy to resin
Composition molding is sheet.
((C) inorganic filler)
In the present embodiment, in addition to (A) ingredient and (B) ingredient, resin combination preferably comprises (C) inorganic filler
(hereinafter, sometimes referred to simply as " (C) ingredient ").Using (C) ingredient, the linear expansion coefficient of resin combination can be reduced, and
It can be improved the storage modulus of resin combination.
It as (C) inorganic filler, can enumerate: silica filler, alumina packing and boron nitride filler etc..Wherein,
Preferably silica filler.
As silica filler, can enumerate for example: fused silica and spherical silicon dioxide etc..
(C) inorganic filler can be used alone, or two or more is applied in combination.In addition, (C) inorganic filler can be into
Row surface treatment.
(C) average grain diameter of inorganic filler is not particularly limited.With the value found out using common grain-distribution detection instrument
Meter, the average grain diameter of (C) inorganic filler is preferably 0.1nm or more and 10 μm or less.(C) inorganic filler in this specification it is flat
Equal partial size is using particle size distribution device (Nikkiso Company Limited manufactures, ProductName " NANOTRACK Wave-UT151 ")
Pass through the value of dynamic light scattering determination.
(that is, by all solids in addition to solvent at being divided on the basis of the total amount of the solid component of resin combination
When 100 mass %), the content of (C) inorganic filler in resin combination be preferably 10 mass % or more and 90 mass % hereinafter,
More preferably 20 mass % or more and 80 mass % or less.
((D) coupling agent)
In the present embodiment, in addition to (A)~(C) ingredient, resin combination preferably also contains (D) coupling agent.
Coupling agent preferably has and functional group possessed by above-mentioned (A) Thermocurable ingredient or (B) adhesive ingredients institute
The group that the functional group having reacts more preferably has and reacts with functional group possessed by (A) Thermocurable ingredient
Group.
By using (D) coupling agent, the heat resistance of resin cured matter can not be damaged and improve cementability and adaptation, and
And also improve water resistance (humidity resistance).
As (D) coupling agent, consider that preferably silanes is (silane coupled from its versatility and cost advantage etc.
Agent).These coupling agents can be used alone, or two or more is applied in combination.In addition, relative to (A) Thermocurable ingredient
100 mass parts, usually with more than 0.1 mass parts and 20 below the mass, preferably with it is more than 0.3 mass parts and 15 mass parts with
Under, more preferably with more than 0.5 mass parts and the 10 above-mentioned such coupling agent of ratio cooperation below the mass.
An example of resin combination as present embodiment can be enumerated and only be bonded containing (A) Thermocurable ingredient, (B)
The resin combination of agent ingredient, (C) inorganic filler and (D) coupling agent.
In addition, other an example of the resin combination as present embodiment can be enumerated containing (A) thermosetting as described below
The property changed ingredient, (B) adhesive ingredients, (C) inorganic filler, (D) coupling agent and the ingredient in addition to above-mentioned (A)~(D) ingredient
Resin combination.
(other ingredients)
In the present embodiment, resin combination can be further containing selected from such as crosslinking agent, pigment, dyestuff, defoaming
At least any one ingredient in agent, levelling agent, ultraviolet absorbing agent, foaming agent, antioxidant, fire retardant and ion capturing agent.
For example, in order to adjust initial bond before curing and coherency, resin combination can be further containing crosslinking
Agent.
It as crosslinking agent, can enumerate for example: organic polyisocyanate compound and organic more group with imine moiety etc..These
Crosslinking agent can be used alone, or two or more is applied in combination.
As organic polyisocyanate compound, can enumerate for example: aromatic polyisocyanate compound, aliphatic are more
Isocyanate compound, alicyclic polyisocyanates compound and these polyisocyanate compounds trimer and make this
Isocyanate-terminated carbamate prepolymer obtained from a little polyisocyanate compounds are reacted with polyol compound etc..
As the more specific example of organic polyisocyanate compound, can enumerate for example: 2,4- toluene diisocynates
Ester, 2,6- toluene di-isocyanate(TDI), 1,3- benzene dimethylene diisocyanate, 1,4- benzene dimethylene diisocyanate, hexichol
Methylmethane -4,4 '-diisocyanate, diphenyl methane -2,4 '-diisocyanate, 3- Dimethyl diphenylmethane diisocyanate,
Hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexyl methyl hydride -4,4 '-diisocyanate, dicyclohexyl first
Alkane -2,4 '-diisocyanate and lysine isocyanates etc..These compounds can be used alone, or combination makes
Use two or more.
As the specific example of organic more group with imine moiety, can enumerate for example: N, N '-diphenyl methane -4,4 '-two
(1- aziridine formamide), trimethylolpropane tris (β-'-aziridino) propionic ester, tetramethylol methane three (β-'-aziridino)
Propionic ester and N, N '-Toluene-2,4-diisocyanate, 4- bis- (1- '-aziridino formamide) triethylenemelanin etc..
Relative to above-mentioned 100 mass parts of (B) adhesive ingredients, usually with it is more than 0.01 mass parts and 12 mass parts with
Under, preferably with more than 0.1 mass parts and the 10 above-mentioned such crosslinking agent of ratio cooperation below the mass.
The resin combination of present embodiment is preferred for semiconductor element.Specifically, the resin group of present embodiment
It closes object and is preferred for sealing semiconductor element.In addition, the resin combination of present embodiment is preferred for being clipped in semiconductor element
Between other electronic components.
Semiconductor element is preferably power semiconductor.
In addition, the resin combination of present embodiment is preferred for any one used in silicon carbide and gallium nitride
Above semiconductor element is sealed or is clipped in the semiconductor of any one used in silicon carbide and gallium nitride or more
Between element and other electronic components.
As other electronic components, can enumerate for example: printed circuit board and lead frame etc..
[resin sheet]
The resin sheet of present embodiment contains the resin combination of present embodiment.
The resin sheet of present embodiment can be obtained by the way that piece is made in the resin combination of present embodiment.By making
Resin combination is sheet, becomes easy to the application of adherend, application when especially adherend is large area becomes
It is easy.If resin combination is sheet, it can be pre-formed the shape of shape after meeting packaging process to a certain extent, because
This can only maintain the sealing material of uniformity to a certain degree by application with regard to supplying.In addition, due to there is no mobility,
Operability is excellent.
Allow the sheet of method of resin combination using conventionally known sheet of method, is not particularly limited.This reality
The resin sheet for applying mode can be band-like piece, can also be provided with the state being rolled into a roll.The present embodiment being rolled into a roll
Resin sheet can be sent out from volume and cut into desired size etc. to use.
The thickness of the resin sheet of present embodiment is for example preferably 10 μm or more, more preferably 20 μm or more.In addition, the thickness
Degree preferably 500 μm hereinafter, more preferably 400 μm hereinafter, further preferably 300 μm or less.
The resin sheet of present embodiment is preferably disposably applied to multiple semiconductor elements.For example, being in resin combination
When sheet, it can be used for so-called face Board level packaging (Panel Level Package), the face Board level packaging is for equipped with more
The structural body application resin sheet of semiconductor element is configured in each gap of the frame in a gap, and to frame and semiconductor element
Disposably it is packaged.
The excellent heat resistance of the resin sheet of present embodiment can for example be indicated by measuring the storage modulus E ' after solidifying.
For the storage modulus E ' of the resin sheet of present embodiment after hardening, at 250 DEG C of temperature, preferably 1.0 ×
102MPa or more, more preferably 2.0 × 102MPa or more.It is believed that the storage modulus E ' at 250 DEG C of temperature is above-mentioned model
When enclosing, even if the use used at high temperature is on the way, solidfied material will not be become too soft, and be preferred for the height at 200 DEG C or more
In the case where lower sealing of power semiconductor of GaN or SiC system to work of temperature etc., the reliability of encapsulation also can be improved.Gu
The upper limit of storage modulus E ' after change at 250 DEG C of temperature is not particularly limited, and preferably 2.0 × 103MPa is hereinafter, more preferably
It is 1.0 × 103MPa is hereinafter, further preferably 0.8 × 103MPa or less.
The storage modulus E ' of resin sheet after hardening can be measured by the method recorded in embodiment.
Storage modulus E ' after solidification can for example reach by adjusting ingredient used in resin combination or use level
To above range.
[laminated body]
The diagrammatic cross-section of the laminated body 1 of present embodiment is shown in Fig. 1.
The laminated body 1 of present embodiment has the first release liner 2, the second release liner 4 and is set to the first removing
Resin sheet 3 between material 2 and the second release liner 4.Resin combination of the resin sheet 3 containing present embodiment.
First release liner 2 and the second release liner 4 preferably have fissility, and the first release liner 2 is to resin sheet 3
There are difference with peeling force of second release liner 4 to resin sheet 3 for peeling force.First release liner 2 and the second release liner 4
Material is not particularly limited.The ratio between peeling force P1 of the peeling force P2 of second release liner 4 relative to the first release liner 2 (P2/
It P1) is preferably 0.02≤P2/P1 < 1 or 1 P2/P1≤50 <.
First release liner 2 and the second release liner 4 for example can be release liner itself have fissility component, with
And it implements the component of lift-off processing or is laminated with the component etc. of peeling agent layer.In the first release liner 2 and the second removing material
In the case that material 4 does not carry out lift-off processing, as its material, it can enumerate such as olefine kind resin and fluororesin.
First release liner 2 and the second release liner 4 can be the release liner for having peeling base and peeling agent layer, institute
Stating peeling agent layer is to be coated with remover in peeling base and formed.Has the stripping of peeling base and peeling agent layer by being formed
From material, operation is become easy.In addition, the first release liner 2 and the second release liner 4 can be only in a masks of peeling base
Standby peeling agent layer, can also have peeling agent layer on the two sides of peeling base.
As peeling base, can enumerate for example: paper base material is laminated with the thermoplastic resins such as polyethylene on the paper base material
Made of laminated paper and plastic foil etc..As paper base material, can enumerate for example: glassine paper, coated paper and cast-coated paper etc..Make
For plastic foil, can enumerate for example: polyester film (for example, polyethylene terephthalate, polybutylene terephthalate (PBT) and
Polyethylene naphthalate etc.) and polyolefin film (for example, polypropylene and polyethylene etc.) etc..Wherein, preferably polyester
Film.
It as remover, can enumerate for example: the organic silicon remover being made of organic siliconresin；By polyvinyl ammonia
The remover of class containing long chain alkyl compound that the compound containing chain alkyl such as carbamate and alkyl urea derivative is constituted；By
The alkyd resin class remover that alkyd resin (for example, non-transformed property alkyd resin and convertibility alkyd resin etc.) is constituted；By alkene
Hydrocarbon resin is (for example, polyethylene (for example, high density polyethylene (HDPE), low density polyethylene (LDPE) and straight-chain low density polyethylene (LDPE) etc.), have
The crystalline polypropylene resin etc. of the Noblen and propylene-alpha-olefin copolymers of isotactic structure or syndiotactic structure etc.) it constitutes
Olefin resin class remover；By natural rubber and synthetic rubber (for example, butadiene rubber, isoprene rubber, butylbenzene rubber
Glue, methyl methacrylate butadiene rubber and nitrile rubber etc.) etc. rubber constitute rubber remover；And by (first
Base) the various removers such as the crylic acid resin remover that constitutes of the acrylic resins such as acrylic acid esters co-polymer, these removings
Agent can be used alone, or two or more is applied in combination.Wherein, preferably organic silicon remover.
The thickness of first release liner 2 and the second release liner 4 is not particularly limited.First release liner 2 and the second stripping
Thickness from material 4 is usually 1 μm or more and 500 μm hereinafter, preferably 3 μm or more and 100 μm or less.
The thickness of peeling agent layer is not particularly limited.The case where solution of the coating containing remover forms peeling agent layer
Under, the thickness of peeling agent layer is preferably 0.01 μm or more and 3 μm hereinafter, more preferably 0.03 μm or more and 1 μm or less.
The manufacturing method of laminated body 1 is not particularly limited.For example, laminated body 1 can be manufactured by process as described below.
Firstly, being coated with resin combination on the first release liner 2, film is formed.Then, make the dried coating film and form resin sheet 3.
Then, by being bonded resin sheet 3 at normal temperature with the second release liner 4, laminated body 1 is obtained.
[semiconductor device]
The semiconductor device of present embodiment has partly is led with what the resin combination of present embodiment or resin sheet sealed
Volume elements part.
Having used the sealing of the semiconductor element of the resin sheet of present embodiment can for example carry out as follows.Place resin sheet
So that it is covered semiconductor element, is crimped using vacuum layer platen press, thus sealing semiconductor element.
Using laminated body 1 of present embodiment, after having removed a release liner of laminated body 1, put
Setting resin sheet makes it cover semiconductor element.Then, another release liner is removed.Then, it is crimped using vacuum layer platen press,
Thus sealing semiconductor element.
Having used the engagement of the semiconductor element of the resin sheet of present embodiment can for example carry out as follows.In other electronics
Resin sheet is placed on component, semiconductor element is further placed on resin sheet, then, by resin combination and semiconductor element
It after part temporarily crimps, is heated, makes its solidification.Resin combination is set to be clipped in semiconductor element and other electronic components as a result,
Between, semiconductor element is engaged with other electronic components.
[effect of embodiment]
Resin combination and resin sheet according to the present embodiment, can be improved heat resistance and cementability.By using this
The resin combination and resin sheet of embodiment, can and cementability high by heat resistance compared with the past also high sealing tree
Rouge layer carrys out sealing semiconductor element, and the adhesive strength of semiconductor element and sealing resin layer can be made to improve.
The resin combination and resin sheet of present embodiment are it may be preferable to be used for power semiconductor.Separately
Outside, the resin combination and resin sheet of present embodiment can be preferably used at least any one in silicon carbide and gallium nitride
The semiconductor element of kind.
As described above, the resin combination of present embodiment can be preferred for power semiconductor.In other words, at this
In the semiconductor device of embodiment, semiconductor element is preferably power semiconductor.Power semiconductor is imagined 200
DEG C or more at a high temperature of work.Material requirements heat resistance used in semiconductor device with power semiconductor.This reality
The resin combination of mode and the excellent heat resistance of resin sheet are applied, therefore, can be preferred for coating function in semiconductor devices
It rate semiconductor element or is clipped between power semiconductor and other components.
As described above, the resin combination of present embodiment can be preferably used for times in silicon carbide and gallium nitride
It anticipates more than one semiconductor element.In other words, in the semiconductor device of present embodiment, semiconductor element is preferably used
Semiconductor element more than any one in silicon carbide and gallium nitride.From the aspect of the characteristic different from silicon semiconductor,
Use that the semiconductor element of any one in silicon carbide and gallium nitride or more can be preferred for power semiconductor, base station is used
High-output power equipment, sensor, detector or Schottky barrier diode etc..At these on the way, it is conceived to and has used carbon
The heat resistance of any a kind or more of semiconductor element in SiClx and gallium nitride, the resin combination and resin of present embodiment
The excellent heat resistance of piece, thus can preferably with used any a kind or more of semiconductor element in silicon carbide and gallium nitride
It is applied in combination.
[deformation of embodiment]
The present invention is not limited to the embodiments, deformation or improvement in the range of can be realized the object of the invention
Etc. being also included in the present invention.
In the above-described embodiment, material is removed first to the first release liner, the second release liner and setting
Expect to be illustrated the laminated body of resin sheet between the second release liner, in addition it is also possible to be the only one side in resin sheet
Laminated body with release liner.
In addition, semiconductor seal applications are illustrated in the embodiment of above-mentioned semiconductor device, but the present invention
Resin combination and resin sheet be also used as circuit board use insulating materials in addition to this (for example, hard printed wiring board
Material, flexible printed circuit board material and lamination (build-up) substrate interlayer dielectic etc.), lamination adhesive film,
And bonding agent etc..
Embodiment
The present invention is illustrated in further detail hereinafter, enumerating embodiment, but the present invention is not by these embodiments
Any restriction.
The preparation of resin combination
The material of preparation for resin combination is as described below.
(Thermocurable ingredient)
BMI resin -1: maleimide resin (the maleimide tree shown in above-mentioned general formula (3) with xenyl
" MIR-3000-70MT " that rouge, Nippon Kayaku K. K manufacture)
Bis- [4- (4- maleimidephenoxy) phenyl] propane of BMI resin -2:2,2-
BMI resin -3: bis- (3- ethyl -5- methyl -4- maleimide phenyl) methane
Allyl resin: diallyl bisphenol
Epoxy resin: biphenyl type epoxy resin (" NC3000H " of Nippon Kayaku K. K's manufacture)
Phenolic resin: biphenyl type phenolic resin (bright and the manufacture of chemical conversion Co., Ltd. " MEH-7851-H ")
Curing accelerator: 2-ethyl-4-methylimidazole
(adhesive ingredients)
Adhesive resin: BisA/BisF mixed type phenoxy resin be (Nippon Steel & Sumitomo Metal Corporation's manufacture
" ZX-1356-2 ", weight average molecular weight 65,000)
(inorganic filler)
Silica filler: fused silica (epoxy silane modification, 0.5 μm of average grain diameter, 2.0 μm of maximum particle diameter)
(other additives)
Coupling agent: 3- epoxy propoxy propyl triethoxysilane
[preparation of resin combination]
According to mixing ratio shown in table 1 (quality % (ratio for being scaled solid component)) be prepared for Examples 1 to 5 and
The resin combination of comparative example 1~4.
[production of resin sheet]
Resin combination (is dissolved in methyl ethyl ketone with 40 mass % of solid component concentration and is made by resin varnish with die coating machine
At coating solution) to be coated on the first release liner (poly- to benzene equipped with the peeling layer formed by alkyd resin class remover
38 μm of naphthalate, thickness) on so that resin combination after dry with a thickness of 20 μm, dry 2 at 100 DEG C
Minute.Immediately by resin combination and the second release liner after drying (equipped with being shelled by organic silicon after being taken out in drying oven
From dosage form at peeling layer 38 μm of polyethylene terephthalate, thickness) be bonded at normal temperature, made and be sequentially laminated with
The resin sheet of first release liner, the resin sheet and the second release liner that are formed by resin combination.
The evaluation > of < resin combination before curing
[complex viscosity]
Obtained resin combination is coated on release liner, it is 2 minutes dry at 100 DEG C, it has made with a thickness of 20 μ
The resin sheet of m.2 resin sheets are laminated, the resin sheet sandwich of 40 μ m thicks has been made.Further by 2 resin sheets
Sandwich stacking, has made 80 μm of resin sheet sandwich, repeats the step, has thus made the measurement examination of 1280 μ m thicks
Sample.For the measurement sample, the complex viscosity determined at 90 DEG C under determining instrument and determination condition as described below is (single
Position: Pas).The obtained results are shown in tables 1.
Determining instrument: " MCR301 " that determination of viscoelasticity device, Anton Paar company manufacture
Determination condition: frequency 1Hz, 30~150 DEG C of temperature range, 5 DEG C/minute of heating rate
< solidify after resin combination evaluation >
The heat cure condition of resin combination: 200 DEG C, 4 hours of temperature
[storage modulus E ']
Obtained resin combination is coated on release liner, it is 2 minutes dry at 100 DEG C, make 20 μm of thickness
Resin sheet.10 resin sheets are laminated, reaches 200 μm of thickness, then, is removed from release liner, sample is made.?
Solidify the sample under above-mentioned heat cure condition (200 DEG C, 4 hours of temperature), measurement sample has been made.The measurement is used
Sample, " DMAQ800 " manufactured using TA Instruments company, in 3 DEG C/minute of heating rate, temperature range 30~300
DEG C, the value (unit: MPa) of storage modulus E ' at 250 DEG C is determined under conditions of frequency 11Hz.The obtained results are shown in tables
1。
[peel strength]
By carrying out decompression crimping at 90 DEG C of laminating temperature, a face of obtained resin sheet (condition: is reached into pressure
100Pa, time 60 seconds) fit in pre- 6 inch Si wafers (800 μm of thickness) for being first cut into 4 equal parts, then, by with it is upper
It states and carries out decompression crimping under the same conditions, close copper foil (size 30mm × 10mm, 350 μ of thickness in another face paste of resin sheet
M, 3100 specification of JIS H).It should be noted that the first release liner and the second release liner of resin sheet are being pasted on respectively
It is removed before Si chip and copper sheet.Then, make resin combination under above-mentioned heat cure condition (200 DEG C, 4 hours of temperature)
Object solidification, is made sample.For the sample, the cupping machine (" Autograph of Shimadzu Scisakusho Ltd's manufacture is used
AG-IS "), copper foil is shelled from the resin combination after solidification under conditions of peeling rate 50mm/ points, 90 degree of peel angle
From the adhesive strength (unit: N/10mm) of the resin combination after determining copper foil and solidifying.The obtained results are shown in tables 1.
It should be noted that, since resin cured matter is not be bonded with copper foil, can not be measured about comparative example 2.
It confirmed, compared with the resin combination of comparative example 1 and 4, the resin combination of Examples 1 to 5 can make energy storage
Modulus and peel strength improve.In addition confirmed, compared with the resin combination of comparative example 2 and 3, the resin of Examples 1 to 5
Peel strength can be improved in composition.In addition, containing the maleimide resin with biphenyl backbone, such as
In embodiment 4, the mass ratio of maleimide resin and allyl resin is 78: 22, compared with 70: 30 in comparative example 3, horse
The ratio of bismaleimide resin is more.Nevertheless, in example 4, complex viscosity is lower than comparative example 3, can be confirmed by making
And have the effect of complex viscosity brought by the maleimide resin of biphenyl backbone reduction.Thus it is confirmed that compared with
The resin combination of example 1~4 is compared, and the heat resistance and cementability of the resin combination of Examples 1 to 5 are high, even if in Malaysia acyl
In the case that the use level of imide resin is more, complex viscosity can also be kept as it is lower, can be improved to by application object with
It is casual.
Claims (10)
1. a kind of resin combination contains (A) Thermocurable ingredient, wherein
(A) the Thermocurable ingredient contains (A1) maleimide resin and (A2) allyl resin with biphenyl backbone.
2. resin combination according to claim 1, wherein
(A1) has mass ratio (A1/ of the maleimide resin of biphenyl backbone relative to (A2) allyl resin
It A2) is 4.5 or more.
3. resin combination according to claim 1, wherein
(A1) there is the maleimide resin of biphenyl backbone to be indicated with the following general formula (1),
In the general formula (1), the integer that k is 1 or more, m1 and m2 are separately 1~6 integer, and n1 and n2 difference are only
It is on the spot 0~4 integer, R1And R2It is separately the alkyl of carbon atom number 1~6.
4. resin combination according to claim 1 also contains (B) adhesive ingredients.
5. resin combination according to claim 4, wherein
On the basis of the total amount of (A) the Thermocurable ingredient and the solid component of (B) adhesive ingredients, (A1) tool
The content for having the maleimide resin of biphenyl backbone is 20 mass % or more and 80 mass % or less.
6. resin combination according to claim 1 also contains (C) inorganic filler.
7. resin combination according to claim 1 also contains (D) coupling agent.
8. resin combination according to any one of claims 1 to 7, be used to seal power semiconductor or
It is clipped between the power semiconductor and other electronic components.
9. resin combination according to any one of claims 1 to 7, it is used for having used in silicon carbide and gallium nitride
Any one more than semiconductor element be sealed or be clipped in it is described used it is any one in silicon carbide and gallium nitride
Kind or more semiconductor element and other electronic components between.
10. a kind of resin sheet contains resin combination according to any one of claims 1 to 9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-129400 | 2017-06-30 | ||
| JP2017129400 | 2017-06-30 |
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| CN109206903A true CN109206903A (en) | 2019-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810698508.1A Pending CN109206903A (en) | 2017-06-30 | 2018-06-29 | Resin combination and resin sheet |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20190003349A (en) |
| CN (1) | CN109206903A (en) |
| TW (1) | TWI758489B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109943072A (en) * | 2019-02-26 | 2019-06-28 | 南亚新材料科技股份有限公司 | A kind of compositions of thermosetting resin |
| CN111548625A (en) * | 2019-02-08 | 2020-08-18 | 味之素株式会社 | Resin composition |
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| JPS63193924A (en) * | 1987-02-09 | 1988-08-11 | Mitsui Toatsu Chem Inc | Thermosetting resin composition |
| US20060014860A1 (en) * | 1997-03-31 | 2006-01-19 | Hitachi Chemical Co., Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
| CN104479130A (en) * | 2014-12-02 | 2015-04-01 | 中国科学院化学研究所 | Fluorine-containing low-dielectric-loss bismaleimide resin, and preparation method and application thereof |
| JP2015147849A (en) * | 2014-02-05 | 2015-08-20 | 住友ベークライト株式会社 | Resin composition and semiconductor device |
| WO2016072404A1 (en) * | 2014-11-06 | 2016-05-12 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6168259B1 (en) * | 2015-12-25 | 2017-07-26 | 住友ベークライト株式会社 | Resin composition for sealing, and semiconductor device |
-
2018
- 2018-06-07 TW TW107119581A patent/TWI758489B/en active
- 2018-06-19 KR KR1020180070389A patent/KR20190003349A/en not_active Application Discontinuation
- 2018-06-29 CN CN201810698508.1A patent/CN109206903A/en active Pending
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| JPS63193924A (en) * | 1987-02-09 | 1988-08-11 | Mitsui Toatsu Chem Inc | Thermosetting resin composition |
| US20060014860A1 (en) * | 1997-03-31 | 2006-01-19 | Hitachi Chemical Co., Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
| JP2015147849A (en) * | 2014-02-05 | 2015-08-20 | 住友ベークライト株式会社 | Resin composition and semiconductor device |
| WO2016072404A1 (en) * | 2014-11-06 | 2016-05-12 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board |
| CN104479130A (en) * | 2014-12-02 | 2015-04-01 | 中国科学院化学研究所 | Fluorine-containing low-dielectric-loss bismaleimide resin, and preparation method and application thereof |
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| 郭飞: "一种新型耐热环氧树脂固化剂的合成与动力学研究", 《中国优秀博硕士学位论文全文数据库(硕士)工程科技Ⅰ辑》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111548625A (en) * | 2019-02-08 | 2020-08-18 | 味之素株式会社 | Resin composition |
| CN111548625B (en) * | 2019-02-08 | 2024-04-05 | 味之素株式会社 | Resin composition |
| CN109943072A (en) * | 2019-02-26 | 2019-06-28 | 南亚新材料科技股份有限公司 | A kind of compositions of thermosetting resin |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI758489B (en) | 2022-03-21 |
| KR20190003349A (en) | 2019-01-09 |
| TW201920456A (en) | 2019-06-01 |
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