WO2022210187A1 - Resin sheet - Google Patents

Abstract

A resin sheet (1) formed from a resin composition containing a resin component (A), wherein the resin component (A) contains a first maleimide resin (A1), the first maleimide resin (A1) has two or more maleimide groups per molecule, a binding group that links at least a pair of the two maleimide groups has 4 or more methylene groups in the main chain, and the contained amount of the first maleimide resin (A1) is 30-58 mass% when the total amount of the resin component (A) in the resin composition is defined as 100 mass%.

Description

resin sheet

The present invention relates to resin sheets.

The incorporation of inorganic fillers such as silica into resin sheets used for semiconductors is being considered. In Patent Document 1, a support such as polyethylene terephthalate, a resin composition layer formed on the support, and a protective film such as a polypropylene film for protecting the resin composition layer are laminated in this order. An adhesive film is disclosed. The resin composition described in Patent Document 1 contains a polyfunctional epoxy resin, a curing agent, a phenoxy resin, and an inorganic filler.

JP 2010-168470 A

However, the resin composition described in Patent Document 1 cannot be said to have sufficient heat resistance when applied to power semiconductor devices that are expected to operate at high temperatures of 200°C or higher. Therefore, use of a maleimide resin as a thermosetting component has been studied in order to improve heat resistance. However, it has been found that when a thermosetting resin composition using a maleimide resin is used, the embedding property when encapsulating a semiconductor element may be insufficient.

An object of the present invention is to provide a resin sheet that can improve embedding properties.

According to one aspect of the present invention, there is provided a resin sheet formed from a resin composition containing (A) a resin component, wherein the (A) resin component contains (A1) a first maleimide resin, The (A1) first maleimide resin has two or more maleimide groups in one molecule, and at least one pair of linking groups connecting two maleimide groups has four or more methylene groups in the main chain. and the content of the (A1) first maleimide resin is 30% by mass or more and 58% by mass or less when the total amount of the (A) resin component of the resin composition is 100% by mass. A resin sheet is provided.

In the resin sheet according to one aspect of the present invention, the (A) resin component further contains (A2) a second maleimide resin, and the (A2) second maleimide resin is (A1) the first maleimide. It is preferably a maleimide resin that has a different chemical structure from the resin.

In the resin sheet according to one aspect of the present invention, the (A2) second maleimide resin is preferably a maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule.

In the resin sheet according to one aspect of the present invention, it is preferable that the resin composition further contains (B) an adhesion-imparting agent.

In the resin sheet according to one aspect of the present invention, the (B) adhesion-imparting agent preferably contains (B1) a compound having a triazine skeleton.

In the resin sheet according to one aspect of the present invention, the (B1) compound having a triazine skeleton is preferably a compound having a basic group and a triazine skeleton in one molecule.

In the resin sheet according to one aspect of the present invention, the (B1) compound having a triazine skeleton is preferably a compound having a triazine skeleton and an imidazole structure in one molecule.

In the resin sheet according to one aspect of the present invention, the (B) adhesion-imparting agent preferably contains (B2) a coupling agent.

In the resin sheet according to one aspect of the present invention, the (A) resin component preferably further contains (A3) allyl resin.

In the resin sheet according to one aspect of the present invention, the resin sheet is preferably used for filling gaps.

In the resin sheet according to one aspect of the present invention, it is preferable that the resin sheet is used for encapsulating a semiconductor element or interposing it between a semiconductor element and another electronic component.

In the resin sheet according to one aspect of the present invention, it is preferable that the resin sheet is used for collectively encapsulating a plurality of semiconductor chips.

According to one aspect of the present invention, it is possible to provide a resin sheet that can improve embedding properties.

It is a cross-sectional schematic diagram of the laminated body which concerns on embodiment of this invention. It is a figure for demonstrating the manufacturing method of the package component which is an embeddable test piece. It is a figure for demonstrating the manufacturing method of the package component which is an embeddable test piece. It is a figure for demonstrating the manufacturing method of the package component which is an embeddable test piece. It is a figure for demonstrating the manufacturing method of the package component which is an embeddable test piece. It is a figure for demonstrating the manufacturing method of the package component which is an embeddable test piece. It is a figure for demonstrating the manufacturing method of the package component which is an embeddable test piece. It is a figure which shows the package component which is an embeddable test piece, Fig.3 (a) is a top view, FIG.3(b) is sectional drawing.

[Resin composition]
First, the resin composition for forming the resin sheet according to this embodiment will be described.
The resin composition according to the present embodiment contains (A) a resin component. The (A) resin component according to the present embodiment contains (A1) a first maleimide resin.

((A) resin component)
(A) The resin component (hereinafter sometimes simply referred to as "(A)") has the property of controlling physical properties of the resin composition such as elastic modulus or glass transition point. As described above, the (A) resin component in the present embodiment contains (A1) the first maleimide resin (hereinafter sometimes simply referred to as "(A1)").

(A1) First maleimide resin (A1) The first maleimide resin in the present embodiment has two or more maleimide groups in one molecule, and at least one pair of bonding groups connecting two maleimide groups is , is a maleimide resin having 4 or more methylene groups in the main chain.
Here, the linking group that connects the two maleimide groups preferably has 6 or more methylene groups in the main chain from the viewpoint of the flexibility of the cured product, and preferably has 8 or more methylene groups in the main chain. is more preferable, and having 10 or more methylene groups in the main chain is particularly preferable. Moreover, these methylene groups are more preferably linked to form an alkylene group having 4 or more carbon atoms. In this alkylene group, at least one —CH ₂ — may be replaced with —CH ₂ —O— or —O—CH ₂ —.
Moreover, the linking group that links the two maleimide groups preferably has one or more side chains from the viewpoint of the flexibility of the cured product. This side chain includes an alkyl group, an alkoxy group, and the like. Furthermore, when there are two or more side chains, the side chains may bond together to form an alicyclic structure.

By using (A1), the heat resistance of the resin sheet can be improved, and the embedding property can also be improved. Further, (A1) has high compatibility with other maleimide resins.

The (A1) first maleimide resin in the present embodiment is preferably represented by the following general formula (1) from the viewpoint of the flexibility and heat resistance of the cured product.

In the general formula ( ¹ ), n1 is an integer of 0 or more, preferably an integer of 1 or more and 10 or less, and more preferably an integer of 1 or more and 5 or less. The ^average value of n1 is preferably 0.5 or more and 5 or less, more preferably 1 or more and 2 or less.
L ¹ and L ² are each independently a substituted or unsubstituted alkylene group having 4 or more carbon atoms, and in this alkylene group, at least one —CH ₂ — is —CH ₂ —O— or —O— CH ₂ — may be substituted. The number of carbon atoms in the alkylene group is preferably 6 or more, more preferably 8 or more, and particularly preferably 10 or more and 30 or less, from the viewpoint of the flexibility of the cured product. Further, when the hydrogen of the alkylene group is substituted, the substituent is an alkyl group having 1 to 14 carbon atoms or an alkoxy group having 1 to 14 carbon atoms. Furthermore, these substituents may combine to form an alicyclic structure or heterocyclic structure.
Each X ¹ is independently a substituted or unsubstituted alkylene group having 4 or more carbon atoms (including those in which at least one —CH ₂ — is replaced with —CH ₂ —O— or —O—CH ₂ — ) and more preferably a divalent group having a phthalimide group. The phthalimide group also includes groups derived from phthalimide. Specific examples of X ¹ include groups represented by the following structural formula (2), the following general formula (3), or the following general formula (4).

In the general formula (3), R ¹ and R ² are each independently hydrogen, a methyl group or an ethyl group, preferably a methyl group.
Specifically, the maleimide resin represented by the general formula (1) in the present embodiment is represented by, for example, the following general formula (5), the following general formula (6), or the following general formula (7). compound.

In the general formula (5), ⁿ² is an integer of 1 or more and 5 or less.
In the general formula (6), ⁿ³ is an integer of 1 or more and 5 or less. Moreover, the average value of n is 1 or more and 2 or less.
In the general formula (7), ⁿ⁴ is an integer of 1 or more and 5 or less. Moreover, the average value of n is 1 or more and 2 or less.
As a product of the maleimide resin represented by the general formula (5), Designer Molecules Inc. and "BMI-3000" manufactured by the company.
As a product of the maleimide resin represented by the general formula (6), Designer Molecules Inc. and "BMI-1700" manufactured by the company.
As a product of the maleimide resin represented by the general formula (7), Designer Molecules Inc. and "BMI-1500" manufactured by the company.

In the present embodiment, the content of the (A1) first maleimide resin is the content of the (A1) first maleimide resin when the total amount of the (A) resin component of the resin composition is 100% by mass. The amount should be 30% by mass or more and 58% by mass or less. If the content of (A1) is within the above range, the heat resistance of the resin sheet can be improved, and the embedding property can also be improved. From the same viewpoint, the lower limit of the content of (A1) is preferably 33% by mass or more, more preferably 40% by mass or more, and further preferably 45% by mass or more, Moreover, the upper limit of the content of (A1) is preferably 56% by mass or less.

(A2) Second maleimide resin The (A) resin component contained in the resin composition in the present embodiment further includes (A2) from the viewpoint of increasing the storage elastic modulus E′ of the cured product of the resin sheet at 250°C. A second maleimide resin having a chemical structure different from that of the (A1) first maleimide resin may be contained. The (A2) second maleimide resin (hereinafter sometimes simply referred to as “(A2)”) in the present embodiment has a chemical structure different from that of the (A1) first maleimide resin, and There is no particular limitation as long as it is a maleimide resin containing two or more maleimide groups in the molecule. That is, (A2) the second maleimide resin has two or more maleimide groups in one molecule, and the linking group connecting any two maleimide groups has four or more methylene groups in the main chain. It is a maleimide resin that does not By including (A2) in the resin sheet, the cohesiveness of the resin sheet after curing is improved. Therefore, it is possible to prevent a decrease in adhesiveness due to cohesive failure of the cured resin sheet.

From the viewpoint of heat resistance, the (A2) second maleimide resin in the present embodiment preferably contains, for example, a benzene ring, and more preferably contains a structure in which a maleimide group is linked to the benzene ring. Moreover, the maleimide compound preferably has two or more structures in which a maleimide group is linked to a benzene ring.

The (A2) second maleimide resin in the present embodiment preferably contains two or more maleimide groups and two or more phenylene groups in one molecule, and two or more maleimide groups and one maleimide group in one molecule. A maleimide resin containing the above biphenyl skeleton (hereinafter sometimes simply referred to as "biphenylmaleimide resin") is preferable.

The (A2) second maleimide resin in the present embodiment is preferably represented by the following general formula (8) from the viewpoint of heat resistance and adhesiveness.

In the general formula (8), ⁿ⁵ and ⁿ⁶ are each independently an integer of 1 or more and 2 or less, and 1 is more preferable. However, the sum of ⁿ⁵ and n6 is ³ or less.
R ³ and R ⁴ are each independently an alkyl group having 1 to 6 carbon atoms, preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group. A plurality of R3's ^are the same or different from each other. Plural R ^4s are the same or different from each other.
ⁿ⁷ and ⁿ⁸ are each independently an integer of 0 or more and 4 or less, preferably an integer of 0 or more and 2 or less, and more preferably 0.
ⁿ⁹ is an integer of ¹ or more, and the average value of n9 is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and even more preferably 1 or more and 3 or less.

Examples of the maleimide resin represented by the general formula (8) in the present embodiment include compounds represented by the following general formula (9).

In the general formula ( ⁹ ), n9 is the same as ⁿ⁹ in the general formula (8).
Examples of the maleimide resin product represented by the general formula (9) include "MIR-3000" manufactured by Nippon Kayaku Co., Ltd., and the like.

Also, (A2) the second maleimide resin in the present embodiment is preferably a maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule. From the viewpoint of increasing the solubility in a solvent and improving the sheet formability, it is preferable to have a substituent on the phenylene group. Examples of substituents include alkyl groups such as a methyl group and an ethyl group, and alkylene groups.
Moreover, the (A2) second maleimide resin in the present embodiment is preferably a maleimide resin having an ether bond between a maleimide group and a phenylene group from the viewpoint of sheet formability.

The maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule is represented by the following general formula (10), for example.

In the general formula (10), R ⁵ , R ⁶ , R ⁷ and R ⁸ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and L ³ is 1 to 3 carbon atoms. L ⁴ and L ⁵ are each independently an alkylene group having 1 to 2 carbon atoms or an arylene group having 6 to 10 carbon atoms, n ¹⁰ and n ¹¹ are each independently 0 or 1. However, among L ³ , L ⁴ and L ⁵ , the total number of carbon atoms of the alkylene group is 3 or less.

In the present embodiment, the content of the maleimide resin (total of (A1) and (A2)) in (A) is based on the total solid content of (A) (that is, the non-volatile content of (A) excluding the solvent). 100% by mass) is preferably 60% by mass or more, more preferably 65% by mass or more, and particularly preferably 70% by mass or more. The upper limit of the content of the maleimide resin in (A) is preferably 97% by mass or less, more preferably 95% by mass or less, based on the total solid content of (A), and 92.5% by mass. % by mass or less is more preferable. When the content of the maleimide resin in (A) is within such a range, the heat resistance of the resin sheet according to the present embodiment after curing can be further improved.

(A3) Allyl resin It is preferable that the (A) resin component contained in the resin composition in the present embodiment further contains (A3) an allyl resin. (A3) The allyl resin (hereinafter sometimes simply referred to as "(A3)") is preferably liquid at room temperature. (A) When the resin component contains an allyl resin, it becomes easier to improve the peel strength of the resin sheet after curing while lowering the reaction temperature of the resin sheet according to the present embodiment.

In the present embodiment, the mass ratio of the total amount (A1+A2) of maleimide resin to (A3) allyl resin (total amount of maleimide resin (A1+A2)/(A3)) is preferably 1.5 or more, and 3 or more. is more preferable, and 5 or more is particularly preferable.
Further, when the mass ratio (total amount of maleimide resin (A1+A2)/(A3)) is within the above range, the complex viscosity η of the resin sheet is appropriately adjusted, and the fluidity of the resin sheet when applied to the adherend is is ensured, the heat resistance of the resin sheet after curing is further improved. Furthermore, if the mass ratio (total amount of maleimide resin (A1+A2)/(A3)) is within the above range, bleeding out of the allyl resin from the resin sheet is also suppressed. The upper limit of the mass ratio (total amount of maleimide resin (A1+A2)/(A3)) is not particularly limited. For example, the mass ratio (total amount of maleimide resin (A1+A2)/(A3)) may be 50 or less, preferably 25 or less, more preferably 15 or less, and 10 or less. Especially preferred.

(A3) allyl resin in the present embodiment is not particularly limited as long as it is a resin having an allyl group. (A3) allyl resin in the present embodiment is preferably an allyl resin containing two or more allyl groups in one molecule, for example.
In addition, (A3) allyl resin preferably has an aromatic ring. Furthermore, the allyl group in the (A3) allyl resin is preferably directly bonded to an aromatic ring. Moreover, it is preferable that this (A3) allyl resin has a hydroxy group, and this hydroxy group is directly bonded to the aromatic ring.
Examples of the allyl resin in this embodiment include those represented by the following general formula (11).

In the general formula (11), R ⁹ and R ¹⁰ are each independently an alkyl group, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms. More preferably, it is an alkyl group selected from the group consisting of a methyl group and an ethyl group.
In the general formula ( ¹¹ ), n12 is 1 or more and 4 or less, preferably 1 or more and 3 or less, and more preferably 1 or more and 2 or less. Further, in the allyl resin represented by the general formula (14), it is preferable that the ratio of the component in which n12 is ¹ is 90 mol % or more.

The (A3) allyl resin in the present embodiment is preferably an allylphenol resin represented by the general formula (11). Among the compounds represented by the general formula (11), it is preferable to have a 4-hydroxyphenyl group having a hydroxy group at the 4-position of the phenyl group. Among the compounds represented by the general formula (11), it is preferable to have an allyl group at the 3- or 5-position of the phenyl group. Among the compounds represented by the general formula (11), it is preferable to have a hydroxy group at the ortho-position to the allyl group. Among the compounds represented by the general formula (11), diallylbisphenol A (2,2-bis(3-allyl-4-hydroxyphenyl)propane) is particularly preferred. These allyl resins can be used singly or in combination of two or more.

By using the above-described (A1), (A2), and (A3) as the (A) resin component, it is possible to obtain a cured resin material having desired physical properties by forming a three-dimensional network when heated.

(A4) Other resin components The (A) resin component of the present embodiment includes (A1), (A2), and (A3) other than (A4) other resin components ( hereinafter, may be simply referred to as "(A4)").
(A4) Other resin components include thermosetting resins other than (A1), (A2), and (A3), thermoplastic resins, cross-linking agents, and the like.
(A4) The use of other resin components to improve the peel strength of the resin sheet after curing; Alternatively, the handleability of the resin sheet or the sheet formability can be improved.

Examples of the thermosetting resin include phenol resin, epoxy resin, benzoxazine resin, cyanate resin, and melamine resin. These thermosetting resins can be used singly or in combination of two or more. By using a thermosetting resin as (A4), the peel strength after curing of the resin sheet can be further improved, and the heat resistance can be improved. However, from the viewpoint of high heat resistance, the resin component (A) preferably does not substantially contain an epoxy resin.

The thermoplastic resin is an aliphatic compound or It can be widely selected regardless of whether it is an aromatic compound. The thermoplastic resin is, for example, preferably at least one resin selected from the group consisting of phenoxy resins, acrylic resins, methacrylic resins, polyester resins, urethane resins, and polyamideimide resins. More preferably, it is at least one resin selected from the group consisting of resins and polyamideimide resins. Incidentally, the polyester resin is preferably a wholly aromatic polyester resin. As the polyamide-imide resin, a rubber-modified polyamide-imide resin is preferable from the viewpoint of improving the flexibility of the resin sheet. A thermoplastic resin can be used individually by 1 type or in combination of 2 or more types.

As the phenoxy resin, a bisphenol A skeleton (hereinafter, bisphenol A may be referred to as "BisA"), a bisphenol F skeleton (hereinafter, bisphenol F may be referred to as "BisF"), a biphenyl skeleton, and a naphthalene skeleton. It is preferably a phenoxy resin having one or more skeletons selected from the group consisting of, more preferably a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton.

The weight average molecular weight (Mw) of the thermoplastic resin is preferably 10,000 or more and 1,000,000 or less, preferably 15,000 or more, from the viewpoint of facilitating adjustment of the complex viscosity of the resin sheet to a desired range. It is more preferably 800,000 or less, and even more preferably 20,000 or more and 500,000 or less. The weight average molecular weight in this specification is a standard polystyrene equivalent value measured by a gel permeation chromatography (GPC) method.

When a thermoplastic resin is used as (A4) in the present embodiment, its content is based on the total solid content of the resin composition (that is, the total amount of non-volatile content of the resin composition excluding the solvent is 100% by mass. time), it is preferably 1.5% by mass or more, more preferably 2% by mass or more. The upper limit of the content of the resin composition is preferably 50% by mass or less, more preferably 30% by mass or less, and particularly preferably 15% by mass or less. By setting the content of the thermoplastic resin in the above range, film-forming properties can be imparted, and the resin composition can be easily molded into a sheet.
The thermoplastic resin may have functional groups in order to have the function of bonding (A1), (A2), (A3), or other components. When the thermoplastic resin has a functional group in this way, it can have both thermoplasticity and thermosetting properties.

Examples of the cross-linking agent include organic polyvalent isocyanate compounds. A crosslinking agent can be used individually by 1 type or in combination of 2 or more types. By using a cross-linking agent, the resin sheet can be bonded with (A1), (A2), (A3) or other components to improve the handleability, sheet formability, and heat resistance of the resin sheet, or before curing the resin sheet. initial adhesion and cohesiveness can be adjusted.

Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these polyvalent isocyanate compounds, and these polyvalent isocyanate compounds. and a terminal isocyanate retane prepolymer obtained by reacting with a polyol compound.
Further specific examples of organic polyisocyanate compounds include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane- 4,4′-diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, and lysine isocyanate and the like. An organic polyvalent isocyanate compound can be used individually by 1 type or in combination of 2 or more types.

When using the above-mentioned cross-linking agent, the content of the cross-linking agent is 0.01 parts by mass or more with respect to 100 parts by mass of the total amount of (A1), (A2), and (A3). is preferred, and 0.1 part by mass or more is more preferred. The upper limit of the content of the cross-linking agent is preferably 12 parts by mass or less, more preferably 10 parts by mass or less.

In the present embodiment, the content of the resin component (A) in the resin composition is based on the total solid content of the resin composition (that is, when the total nonvolatile content of the resin composition excluding the solvent is 100% by mass ), preferably at least 2% by mass, more preferably at least 5% by mass, and particularly preferably at least 10% by mass. The upper limit of the content of the resin component (A) is preferably 75% by mass or less, more preferably 60% by mass or less, and particularly preferably 40% by mass or less.
(A) When the content of the resin component is within the above range, the handleability of the resin sheet, the sheet shape retention property, and the heat resistance of the resin composition are improved.

(B) Adhesion Imparting Agent In the present embodiment, the resin composition preferably further contains (B) an adhesion imparting agent (hereinafter sometimes simply referred to as “(B)”). This (B) adhesion-imparting agent can further improve the peel strength of the cured resin composition.
Examples of the (B) adhesion promoter include (B1) a compound having a triazine skeleton and (B2) a coupling agent.

(B1) Compound Having a Triazine Skeleton As (B1) the compound having a triazine skeleton (hereinafter sometimes simply referred to as "(B1)"), the following compounds are preferred. That is, (B1) is preferably a compound having a basic group and a triazine skeleton in one molecule, and a compound having a nitrogen-containing heterocyclic ring and a triazine skeleton in one molecule. and preferably a compound having a triazine skeleton and an imidazole structure in one molecule.
Examples of compounds having a triazine skeleton and an imidazole structure include compounds represented by the following general formula (12).

In the general formula (12), R ¹¹ and R ¹² are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a hydroxymethyl group, or a phenyl group, and a hydrogen atom or 1 or more carbon atoms. An alkyl group of 10 or less is preferable, and a hydrogen atom or an alkyl group of 1 to 3 carbon atoms is more preferable. R ¹³ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a phenyl group, or an allyl group, preferably an alkyl group having 1 to 10 carbon atoms, and an alkyl group having 1 to 3 carbon atoms is more preferable. L ⁶ is an alkylene group having 1 to 5 carbon atoms, preferably an alkylene group having 2 to 4 carbon atoms, and more preferably an ethylene group.

Specific examples of the imidazole compound having a triazine skeleton in the present embodiment include 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine, 2 ,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine and 2,4-diamino-6-[2-(2-undecyl -1-imidazolyl)ethyl]-1,3,5-triazine and the like. Among these compounds, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5 is preferred from the viewpoint of the peel strength and reaction temperature of the resin composition and resin sheet. -triazine, or 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine.

(B2) Coupling agent (B2) Coupling agent (hereinafter sometimes simply referred to as "(B2)") is preferably the following compound.
(B2) The coupling agent preferably has a group that reacts with the functional group of the compound contained in the resin component (A). (B2) The use of a coupling agent improves the peel strength between the cured resin sheet and the adherend.

(B2) As the coupling agent, a silane-based (silane coupling agent) is preferable because of its ease of handling. (B2) Coupling agents can be used singly or in combination of two or more.
Examples of the silane coupling agent include a silane coupling agent having an amino group, a silane coupling agent having a mercapto group, and a silane coupling agent having an epoxy group.
Silane coupling agents having an amino group include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, 3-aminopropyldiethoxymethylsilane, [3-(N, N-dimethylamino)propyl]trimethoxysilane, [3-(phenylamino)propyl]trimethoxysilane and the like.
Silane coupling agents having a mercapto group include 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyldimethoxymethylsilane and the like.
Silane coupling agents having an epoxy group include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxy silane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like.
Among these compounds, a silane coupling agent having an epoxy group is more preferable, and 3-glycidoxypropyltrimethoxysilane is even more preferable, from the viewpoint of the peel strength of the resin composition and the resin sheet.

(B) The adhesion-imparting agent preferably has a total content of (B) of 0.1 parts by mass or more with respect to a total content of 100 parts by mass of (A) and (B), and 0.5 parts by mass. It is more preferably 1.0 parts by mass or more, and even more preferably 1.0 parts by mass or more. Also, it is preferably 15 parts by mass or less, more preferably 12 parts by mass or less, and even more preferably 8 parts by mass or less. With such a range, the peel strength between the cured product of the resin sheet and the adherend is improved.

(B) Adhesion-imparting agent is more preferably a combination of (B1) a compound having a triazine skeleton and (B2) a coupling agent. The combined use can further improve the peel strength of the resin composition after curing.

(B) When a compound having a triazine skeleton (B1) is used as the adhesion-imparting agent, the content of (B1) is 0.1 parts by mass with respect to the total content of (A) and (B) of 100 parts by mass. parts by mass or more, more preferably 0.5 parts by mass or more, and even more preferably 1.0 parts by mass or more. Also, it is preferably 15 parts by mass or less, more preferably 12 parts by mass or less, and even more preferably 8 parts by mass or less. With such a range, the peel strength between the cured product of the resin sheet and the adherend is improved.

(B) When the coupling agent (B2) is used as the adhesion imparting agent, the content of (B2) is 0.05 parts by mass or more with respect to the total content of 100 parts by mass of (A) and (B). is preferably 0.10 parts by mass or more, and even more preferably 0.50 parts by mass or more. Also, it is preferably 10 parts by mass or less, more preferably 8 parts by mass or less, and even more preferably 5 parts by mass or less. With such a range, the peel strength between the cured product of the resin sheet and the adherend is improved.

(C) Inorganic filler In the present embodiment, the resin composition may contain (C) an inorganic filler (hereinafter sometimes simply referred to as "(C)") in addition to (A) and (B). preferable. This (C) can improve at least one of the thermal properties and mechanical properties of the resin composition.
(C) Inorganic fillers include silica fillers, alumina fillers, boron nitride fillers, polytetrafluoroethylene fillers, and the like. Among these, silica filler is preferable.
Silica fillers include, for example, fused silica and spherical silica.
(C) An inorganic filler can be used individually by 1 type or in combination of 2 or more types. In addition, (C) the inorganic filler may be surface-treated.

(C) The average particle size of the inorganic filler is not particularly limited. The average particle diameter of (C) is preferably 0.1 nm or more, more preferably 10 nm or more, and particularly preferably 1 μm or more. The upper limit of the average particle diameter of (C) is preferably 100 µm or less, more preferably 10 µm or less, and particularly preferably 5 µm or less. In the present specification, the average particle size of (C) is a value measured with a laser diffraction particle size distribution analyzer.

The content of the inorganic filler (C) in the resin composition is 10 mass based on the total solid content of the resin composition (that is, when the total non-volatile content of the resin composition excluding the solvent is 100 mass%). % or more, more preferably 20 mass % or more, still more preferably 40 mass % or more, and particularly preferably 60 mass % or more. The upper limit of the content of (C) is preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 80% by mass or less.
By adjusting the content of the inorganic filler (C) in the resin composition to the above range, the coefficient of linear expansion of the resin composition can be lowered. can reduce the difference in coefficient of linear expansion between

(D) Curing Catalyst In the resin sheet according to the present embodiment, when the resin composition contains a resin component, it may further contain (D) a curing catalyst as long as the object of the present invention is not impaired. As a result, the curing reaction of the resin component can be effectively advanced, and the resin sheet can be cured satisfactorily. Examples of curing catalysts include imidazole-based curing catalysts, amine-based curing catalysts, phosphorus-based curing catalysts, triazole-based curing catalysts, thiazole-based curing catalysts, radical polymerization initiators, and the like.

Specific examples of imidazole curing catalysts include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl -2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4,5-di(hydroxymethyl)imidazole, etc. From the viewpoint of reactivity, it is preferable to use 2-ethyl-4-methylimidazole. When a compound having a triazine skeleton and an imidazole structure is used as the (B) adhesion-imparting agent, it also acts as a curing catalyst.

Specific examples of amine curing catalysts include 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), 1,4-diazabicyclo[2.2.2]octane, and N,N-dimethylbenzyl Amines include tertiary amine compounds such as triethylamine.

Specific examples of phosphorus-based curing catalysts include triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, and tri(nonylphenyl)phosphine.

Specific examples of triazole-based curing catalysts include benzotriazole-based compounds.

Specific examples of thiazole-based curing catalysts include benzothiazole-based compounds.

Specific examples of radical polymerization initiators include peroxides and azo compounds.

These (D) curing catalysts can be used singly or in combination of two or more. (D) When a curing catalyst is used, the content thereof is preferably 15 parts by mass or less, more preferably 12 parts by mass or less, when the total content of (A) is 100 parts by mass. It is preferably 8 parts by mass or less, and particularly preferably 8 parts by mass or less.

(E) Other Components In the present embodiment, the resin composition may further contain (E) other components as long as the object of the present invention is not impaired. (E) Other components are selected from the group consisting of, for example, coloring materials, antifoaming agents, leveling agents, ultraviolet absorbers, foaming agents, antioxidants, flame retardants, ion trapping agents, and ion trapping agents. At least one component is included.
These (E) other components can be used individually by 1 type or in combination of 2 or more types. (E) When other components are used, the content thereof is preferably 10 parts by mass, more preferably 5 parts by mass or less, when the total content of (A) is 100 parts by mass. preferable.

In the present embodiment, when the resin sheet is formed by coating, the resin composition preferably contains a solvent. Solvents include general solvents such as toluene, ethyl acetate, and methyl ethyl ketone, as well as cyclohexanone (boiling point: 155.6°C), dimethylformamide (boiling point: 153°C), dimethylsulfoxide (boiling point: 189.0°C), and ethylene. High boiling point solvents such as glycol ethers (cellosolve) (boiling point: about 120 to 310° C.) and ortho-xylene (boiling point: 144.4° C.) can be used.

[Resin sheet]
The resin sheet according to this embodiment is formed from the resin composition according to this embodiment described above. In the resin sheet according to this embodiment, it is possible to improve embedding properties while maintaining heat resistance. Therefore, for example, when a semiconductor element is sealed with a resin sheet, even if there is a gap in the structure in which the semiconductor element is arranged, it can be used to fill the gap.

The peel strength after thermosetting of the resin sheet according to the present embodiment is preferably 2.0 N/10 mm or more, more preferably 3.0 N/10 mm or more, and 4.0 N/10 mm or more. is more preferable, and 6.0 N/10 mm or more is particularly preferable. The upper limit of the peel strength after thermosetting is preferably 50 N/10 mm or less, particularly preferably 40 N/10 mm or less.
If the peel strength after thermosetting of the resin sheet according to the present embodiment is 2.0 N/10 mm or more, when the resin sheet is used as a sealing material, it maintains high adhesiveness to the adherend. It is possible.
The peel strength after thermosetting of the resin sheet according to the present embodiment is determined, for example, by selecting the components used in the resin composition, and preferably at least one selected from allyl resins and adhesion imparting agents is blended in the resin composition. However, it can be adjusted to the above range by adjusting the type and blending amount thereof.
The peel strength after thermosetting of the resin sheet according to the present embodiment is measured by a peeling test at a peel angle of 90 degrees between the thermosetting resin sheet and the adherend using the measurement method described later. sought by doing. Specifically, a test piece was prepared and a peeling test was performed as described in Examples.
In the resin sheet according to the present embodiment, since the resin composition is formed into a sheet, it can be easily applied to an adherend, and especially when the adherend has a large area, it can be easily attached.
If the resin composition is in the form of a sheet, it is preliminarily formed into a shape conforming to the shape after the sealing process, so that it can be supplied as a sealing material that maintains a certain degree of uniformity simply by applying it. Moreover, if the resin composition is in the form of a sheet, it is excellent in handleability because it lacks fluidity.

A conventionally known sheeting method can be adopted for the method of sheeting the resin composition, and is not particularly limited. When forming a resin sheet from a resin composition by coating a resin composition containing a solvent, the solvent may be completely volatilized in the drying step after coating, or part of the solvent may remain in the resin sheet. You may let The resin sheet according to the present embodiment may be a strip-shaped sheet, or may be provided in a rolled state. The resin sheet according to the present embodiment wound into a roll can be used by, for example, being unwound from the roll and cut into a desired size.

The thickness of the resin sheet according to this embodiment is, for example, preferably 10 μm or more, more preferably 20 μm or more. Also, the thickness is preferably 500 μm or less, more preferably 400 μm or less, and further preferably 300 μm or less.

The resin sheet according to this embodiment is preferably used for semiconductor elements. Specifically, the resin sheet according to the present embodiment is preferably used for encapsulating semiconductor elements. Also, the resin sheet according to the present embodiment is preferably used to interpose between a semiconductor element and another electronic component.
Preferably, the semiconductor element is a power semiconductor element.
Since the resin sheet according to the present embodiment has excellent heat resistance, it can be used to seal power semiconductor elements that are expected to operate at high temperatures of 200 ° C. or higher, or to be interposed between the power semiconductor elements and other electronic components. can be used for

Further, it is preferable that the resin sheet according to the present embodiment is applied collectively to a plurality of semiconductor elements. For example, with the resin sheet according to the present embodiment, the resin sheet is applied to a structure in which a semiconductor element is arranged for each gap of a frame provided with a plurality of gaps, and the frame and the semiconductor element are collectively integrated. It can be used for a so-called panel level package, which is sealed by

Moreover, the resin sheet according to the present embodiment is preferably used for encapsulating a semiconductor element using at least one of silicon carbide and gallium nitride. Alternatively, the resin sheet according to the present embodiment is preferably used to interpose between a semiconductor element using at least one of silicon carbide and gallium nitride and another electronic component. Other electronic components include, for example, printed wiring boards and lead frames.
Since the upper limit of the operating temperature of a silicon semiconductor device is about 175° C., it is preferable to use a semiconductor device using at least one of silicon carbide and gallium nitride, which are capable of high-temperature operation, as the power semiconductor device.
Since the resin sheet according to the present embodiment has excellent heat resistance, it is possible to seal a semiconductor element using at least one of silicon carbide and gallium nitride, which is expected to operate at a high temperature of 200 ° C. or higher, or silicon carbide. and gallium nitride.

(Thermal curing conditions)
In the thermosetting conditions for the resin sheet according to this embodiment, the heating temperature is preferably 50° C. or higher and 300° C. or lower, and preferably 100° C. or higher and 250° C. or lower.
In the thermosetting conditions for the resin sheet according to the present embodiment, the heating time is preferably 10 minutes or more and 10 hours or less, more preferably 20 minutes or more and 7 hours or less.
When the thermosetting conditions for the resin sheet are within the above range, thermosetting of the resin sheet can be achieved.

[Laminate]
FIG. 1 shows a schematic cross-sectional view of a laminate 1 according to this embodiment.
The laminate 1 according to this embodiment includes a first release material 2, a second release material 4, and a resin sheet 3 provided between the first release material 2 and the second release material 4. have. The resin sheet 3 is a resin sheet according to this embodiment.

The first release material 2 and the second release material 4 have releasability. It is preferable that there is a difference in The materials of the first release material 2 and the second release material 4 are not particularly limited. The ratio (P2/P1) of the release force P2 of the second release material 4 to the release force P1 of the first release material 2 is 0.02≤P2/P1<1 or 1<P2/P1≤50. is preferred.

The first release material 2 and the second release material 4 may be, for example, a member having release properties in itself, a member subjected to a release treatment, or a member laminated with a release agent layer. may When the first release material 2 and the second release material 4 are not subjected to the release treatment, the material of the first release material 2 and the second release material 4 may be, for example, olefin resin, fluorine, Resin etc. are mentioned.
The first release material 2 and the second release material 4 can be release materials comprising a release substrate and a release agent layer formed on the release substrate. A release material comprising a release base material and a release agent layer facilitates handling. Further, the first release material 2 and the second release material 4 may have a release agent layer on only one side of the release substrate, or may have a release agent layer on both sides of the release substrate. good. The release agent can be formed, for example, by applying the release agent.

Examples of release substrates include paper substrates, laminated paper obtained by laminating a thermoplastic resin such as polyethylene on this paper substrate, and plastic films. Examples of paper substrates include glassine paper, coated paper, and cast-coated paper. Examples of plastic films include polyester films (eg, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.) and polyolefin films (eg, polypropylene, polyethylene, etc.). Among these, a polyester film is preferred.

Release agents include, for example, silicone-based release agents composed of silicone resins; long-chain alkyl group-containing compound-based release agents composed of compounds containing long-chain alkyl groups such as polyvinyl carbamate and alkylurea derivatives; Alkyd resin release agents composed of resins (e.g., non-convertible alkyd resins, convertible alkyd resins, etc.); polyethylene, etc.), propylene homopolymers having an isotactic structure or syndiotactic structure, and crystalline polypropylene resins such as propylene-α-olefin copolymers, etc.); Natural rubber , and synthetic rubbers (e.g., butadiene rubber, isoprene rubber, styrene-butadiene rubber, methyl methacrylate-butadiene rubber, acrylonitrile-butadiene rubber, etc.); Examples include various release agents such as acrylic resin release agents composed of acrylic resins such as copolymers, and these can be used singly or in combination of two or more. Among these, alkyd resin release agents are preferred.

The thicknesses of the first release material 2 and the second release material 4 are not particularly limited. It is usually 1 μm or more and 500 μm or less, preferably 3 μm or more and 100 μm or less.
The thickness of the release agent layer is not particularly limited. When a solution containing a release agent is applied to form a release agent layer, the thickness of the release agent layer is preferably 0.01 μm or more and 3 μm or less, more preferably 0.03 μm or more and 1 μm or less.

The manufacturing method of the laminate 1 is not particularly limited. For example, the laminate 1 is manufactured through the following steps. First, a resin composition containing a solvent is applied onto the first release material 2 to form a coating film. Next, this coating film is dried to form the resin sheet 3 . Next, the laminate 1 is obtained by bonding the resin sheet 3 and the second release material 4 together.

[Effects of Embodiment]
According to the resin sheet according to the present embodiment, a resin sheet capable of improving embedding properties is obtained.

As described above, the resin sheet according to this embodiment can be suitably used for power semiconductor elements. In other words, in the semiconductor device according to this embodiment, the semiconductor element is preferably a power semiconductor element. Power semiconductor devices are also expected to operate at high temperatures of 200° C. or higher. Therefore, materials used in semiconductor devices having power semiconductor elements are required to have heat resistance. Since the resin sheet according to the present embodiment is excellent in heat resistance, it is suitably used for covering a power semiconductor element in a semiconductor device or interposing between the power semiconductor element and other components.

As described above, the resin sheet according to the present embodiment can be suitably used for semiconductor elements using one or more of silicon carbide and gallium nitride. In other words, in the semiconductor device according to this embodiment, the semiconductor element is preferably a semiconductor element using one or more of silicon carbide and gallium nitride. Semiconductor devices using at least one of silicon carbide and gallium nitride have characteristics different from those of silicon semiconductor devices. It is preferably used for the purpose of In these applications, attention is also paid to the heat resistance of a semiconductor element using one or more of silicon carbide and gallium nitride, and the resin sheet of the present embodiment has excellent heat resistance. It is preferably used in combination with a semiconductor device using one or more of the above.

[Modification of Embodiment]
The present invention is not limited to the above-described embodiments, and includes modifications, improvements, etc. within the scope of achieving the object of the present invention.

In the above embodiment, a laminate having a first release material, a second release material, and a resin sheet provided between the first release material and the second release material has been described. Alternatively, a laminate having a release material on only one surface of the resin sheet may be used.

In addition, although the semiconductor sealing application has been described in the embodiments of the semiconductor device, the resin sheet of the present invention can also be used as an insulating material for circuit boards (e.g., rigid printed wiring board material, flexible wiring board material, and It can be used as an interlayer insulating material for build-up substrates, etc.), an adhesive film for build-up, an adhesive, and the like.

The present invention will be described in more detail below with reference to examples. The present invention is by no means limited to these examples.

[Preparation of resin composition]
Resin compositions according to Examples 1 to 5 and Comparative Example 1 were prepared by dissolving or dispersing each component in a solvent at the blending ratio (% by mass (percentage in terms of solid content)) shown in Table 1. Table 1 shows the contents of (A), (B) and (C) in Examples and Comparative Examples.
The materials used for preparing the resin composition are as follows.

(A1) First maleimide resin BMI-3000: long-chain alkyl type maleimide resin (maleimide resin represented by the general formula (5), Designer Molecules Inc. "BMI-3000", solid at a temperature of 25 ° C. )
BMI-1700: long-chain alkyl type maleimide resin (maleimide resin represented by the general formula (6), Designer Molecules Inc. "BMI-1700", liquid at a temperature of 25 ° C.)
· BMI-1500: long-chain alkyl type maleimide resin (maleimide resin represented by the general formula (7), Designer Molecules Inc. "BMI-1500", liquid at a temperature of 25 ° C.)
(A2) Second maleimide resin MIR-3000: a maleimide resin having a biphenyl group (a maleimide resin represented by the general formula (3), "MIR-3000" manufactured by Nippon Kayaku Co., Ltd.)
(A3) Allyl resin/DABPA: diallyl bisphenol A ("DABPA" manufactured by Daiwa Kasei Kogyo Co., Ltd.)
(A4) Other resin components YX7200: BisA type phenoxy resin ("YX7200" manufactured by Mitsubishi Chemical Corporation)

(B1) Compound having a triazine skeleton 2E4MZ-A: 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine (Shikoku Kasei "2E4MZ-A" manufactured by Kogyo Co., Ltd.)
(B2) Coupling agent KBM403: 3-glycidoxypropyltriethoxysilane ("KBM403" manufactured by Shin-Etsu Chemical Co., Ltd.)

(C) Inorganic filler/silica filler: silica filler dispersion (“SC2050-HLJ” manufactured by Admatechs Co., Ltd., average particle size 0.50 μm)

<Evaluation of resin composition and resin sheet> [Preparation of laminate containing resin sheet]
As a first release material, a release sheet 1 (polyethylene terephthalate film provided with a release layer formed from an alkyd resin release agent, "PET38AL-5" manufactured by Lintec Corporation, thickness 38 μm) was coated with a resin using a knife coater. A varnish (a coating solution in which each component of the resin composition is dissolved or dispersed in cyclohexanone, the solid content concentration is 60% by mass) was applied, dried at 100 ° C. for 1 minute, and then dried at 110 ° C. for 1 minute. The thickness of the resin composition after drying was 30 μm. Immediately after taking out from the drying oven, the resin composition after drying and the release sheet 2 as the second release material (polyethylene terephthalate film provided with a release layer formed from a silicone release agent, manufactured by Lintec Corporation "SP- PET 382150", thickness 38 μm) were bonded together to prepare a laminate in which the first release material, the resin sheet made of the resin composition, and the second release material were laminated in this order.

[Embedability]
A copper-clad laminate (“MCL-E-705G” manufactured by Hitachi Chemical Co., Ltd., thickness 200 μm) was etched to obtain a substrate with markers (copper) formed near each vertex on both sides. Using a router processing machine, the substrate obtained in this manner was processed to form a square through-hole having a size of 4.56 mm×4.56 mm, thereby producing a frame 5 as shown in FIG. 2A. . Also, as shown in FIG. 2A, adhesive tape 6 ("ADWILL H-231F" manufactured by Lintec Co., Ltd.) is attached to one side 5α of the frame 5, and then, as shown in FIG. The mirror-polished surface of a square chip 7 (size 4.26 mm × 4.26 mm, thickness 200 μm), which is mirror-polished on the surface, is mounted with a mounting machine (“NM-EJM1D” manufactured by Panasonic Factory Solutions Co., Ltd.). equipped. Next, a resin sheet 3 (thickness 30 μm) from which the second release material has been removed is placed on the opposite surface 5β of the frame 5, and a laminator (manufactured by Nikko Materials Co., Ltd., "V-130") is used. , a lamination temperature of 130° C., an ultimate pressure of 100 Pa, and a time of 60 seconds. Next, the first release material of the resin sheet 3 is peeled off, and the sealed frame and chip 7 are brought into the state shown in FIG. 2C. In the state shown in FIG. 2D, a resin sheet 3 (thickness of 30 μm) is placed on the peeled surface, laminated under the same conditions as described above using a laminator, and the resin sheet 3 is thermally cured at a temperature of 200° C. for 4 hours. Then, one side 5α of the frame 5 was sealed to obtain the state shown in FIG. 2E. Finally, using a dicing machine (“DFD6362” manufactured by Disco Co., Ltd.), as shown in FIG. Part 8 was obtained. Then, using the package component 8 as a test piece, the following embeddability evaluation was performed.
First, a test piece was embedded in an acrylic resin, and the cross section of the central portion of the test piece was exposed by polishing. The cross section was observed with a digital microscope ("VHX-5000" manufactured by Keyence Corporation). The gap between the frame 5 and the chip 7 shown in FIG. 3 was observed. The width w of the gap was 100 μm, and the thickness t of the chip 7 was 200 μm.
Next, the digital image (JPEG format) of the obtained cross section is colored in red by using the image editing and processing software "GIMP" (free software), and the part embedded by the first sealing (see FIG. 2C) did. In addition, since the portion embedded by the first sealing is heat-cured twice, the color is different from that of the portion sealed by the second time, so that the portion can be distinguished. Then, using the function of color information, the embedded area ratio (unit: %) of the colored portion was obtained when the gap portion between the frame 5 and the chip 7 was assumed to be 100% (where w×t is 100%). The larger the embedding area ratio, the better the embedding property. Based on this embedding area ratio, the embedding properties were evaluated according to the following criteria. Table 1 shows the results obtained.
A: The embedded area ratio is 90% or more.
B: The embedded area ratio is 60% or more and less than 90%.
F: The embedded area ratio is less than 60%.

From the results shown in Table 1, it was confirmed that when the content of (A1) in the resin component was 30% by mass or more and 58% by mass or less (Examples 1 to 5), the embeddability was excellent. .

DESCRIPTION OF SYMBOLS 1... Laminate, 2... First release material, 3... Resin sheet, 4... Second release material, 5... Frame, 6... Adhesive tape, 7... Chip, 8... Package component, 5α... One side of frame, 5β... Opposite side of frame, w... Width of gap, t... Thickness of chip.

Claims (12)

1. (A) A resin sheet formed from a resin composition containing a resin component,
   The (A) resin component contains (A1) a first maleimide resin,
   The (A1) first maleimide resin has two or more maleimide groups in one molecule, and at least one pair of linking groups connecting two maleimide groups has four or more methylene groups in the main chain. is a maleimide resin having
   The content of the (A1) first maleimide resin when the total amount of the (A) resin component of the resin composition is 100% by mass is 30% by mass or more and 58% by mass or less.
   resin sheet.
2. In the resin sheet according to claim 1,
   The (A) resin component further contains (A2) a second maleimide resin,
   The (A2) second maleimide resin is a maleimide resin having a chemical structure different from that of the (A1) first maleimide resin.
   resin sheet.
3. In the resin sheet according to claim 2,
   The (A2) second maleimide resin is a maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule,
   resin sheet.
4. In the resin sheet according to any one of claims 1 to 3,
   The resin composition further contains (B) an adhesion imparting agent,
   resin sheet.
5. In the resin sheet according to claim 4,
   The (B) adhesion-imparting agent contains (B1) a compound having a triazine skeleton,
   resin sheet.
6. In the resin sheet according to claim 5,
   The (B1) compound having a triazine skeleton is a compound having a basic group and a triazine skeleton in one molecule,
   resin sheet.
7. In the resin sheet according to claim 6,
   (B1) the compound having a triazine skeleton is a compound having a triazine skeleton and an imidazole structure in one molecule,
   resin sheet.
8. In the resin sheet according to claim 4,
   The (B) adhesion-imparting agent contains (B2) a coupling agent,
   resin sheet.
9. In the resin sheet according to any one of claims 1 to 8,
   The (A) resin component further contains (A3) an allyl resin,
   resin sheet.
10. The resin sheet according to any one of claims 1 to 9,
    The resin sheet is used to fill the gap,
    resin sheet.
11. The resin sheet according to any one of claims 1 to 10,
    The resin sheet is used to seal the semiconductor element or interpose it between the semiconductor element and another electronic component,
    resin sheet.
12. In the resin sheet according to claim 11,
    The resin sheet is used to collectively seal a plurality of semiconductor chips,
    resin sheet.

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