WO2009001850A1 - Composition de résine et feuille de cuivre comprenant de la résine obtenue en utilisant la composition de résine - Google Patents
Composition de résine et feuille de cuivre comprenant de la résine obtenue en utilisant la composition de résine Download PDFInfo
- Publication number
- WO2009001850A1 WO2009001850A1 PCT/JP2008/061529 JP2008061529W WO2009001850A1 WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1 JP 2008061529 W JP2008061529 W JP 2008061529W WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- resin
- resin composition
- copper foil
- disclosed
- Prior art date
Links
- 0 C*1(C)C=CC(**([U](*[U](O)=IC)(O)=C)=C)=CC1 Chemical compound C*1(C)C=CC(**([U](*[U](O)=IC)(O)=C)=C)=CC1 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800220983A CN101687981B (zh) | 2007-06-25 | 2008-06-25 | 树脂组合物以及使用该树脂组合物得到的带树脂铜箔 |
KR1020097026807A KR101249479B1 (ko) | 2007-06-25 | 2008-06-25 | 수지 조성물 및 그 수지 조성물을 이용하여 얻어진 수지부착 동박 |
JP2009520611A JP5650908B2 (ja) | 2007-06-25 | 2008-06-25 | 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-166869 | 2007-06-25 | ||
JP2007166869 | 2007-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009001850A1 true WO2009001850A1 (fr) | 2008-12-31 |
Family
ID=40185663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061529 WO2009001850A1 (fr) | 2007-06-25 | 2008-06-25 | Composition de résine et feuille de cuivre comprenant de la résine obtenue en utilisant la composition de résine |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5650908B2 (fr) |
KR (1) | KR101249479B1 (fr) |
CN (1) | CN101687981B (fr) |
MY (1) | MY150635A (fr) |
TW (1) | TW200916525A (fr) |
WO (1) | WO2009001850A1 (fr) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012007091A (ja) * | 2010-06-25 | 2012-01-12 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
WO2012017909A1 (fr) * | 2010-08-03 | 2012-02-09 | 三井金属鉱業株式会社 | Procédé de production de carte de câblage imprimé, et carte de câblage imprimé |
CN102585440A (zh) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物 |
WO2015012376A1 (fr) | 2013-07-24 | 2015-01-29 | Jx日鉱日石金属株式会社 | Feuille de cuivre traitée en surface, feuille de cuivre comprenant un transporteur, substrat, substrat de résine, carte de circuit imprimé, stratifié plaqué cuivre, et procédé de production de carte de circuit imprimé |
WO2015012327A1 (fr) | 2013-07-23 | 2015-01-29 | Jx日鉱日石金属株式会社 | Feuille de cuivre traitée en surface, feuille de cuivre avec support, substrat, substrat de résine, carte à circuit imprimé, stratifié cuivré, et procédé de fabrication d'une carte à circuit imprimé |
EP3046400A2 (fr) | 2015-01-16 | 2016-07-20 | JX Nippon Mining & Metals Corporation | Feuille de cuivre comportant support, stratifié, carte de câblage imprimé, dispositif électronique et procédé de fabrication de carte de câblage imprimée |
EP3048864A2 (fr) | 2015-01-21 | 2016-07-27 | JX Nippon Mining & Metals Corporation | Feuille de cuivre avec support, stratifié, carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé |
EP3054751A2 (fr) | 2015-02-06 | 2016-08-10 | JX Nippon Mining & Metals Corporation | Feuille de cuivre comportant support, stratifié, carte de câblage imprimé, dispositif électronique et procédé de fabrication de carte de câblage imprimée |
JPWO2014106955A1 (ja) * | 2013-01-07 | 2017-01-19 | 株式会社ニコン | 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法 |
WO2017161120A1 (fr) * | 2016-03-17 | 2017-09-21 | Qed Labs Inc. | Articles présentant des propriétés améliorées d'ininflammabilité et/ou d'égouttage à l'état fondu |
EP3232747A1 (fr) | 2016-04-15 | 2017-10-18 | JX Nippon Mining & Metals Corp. | Feuille de cuivre, feuille de cuivre pour circuit haute fréquence, feuille de cuivre fixée à un support, feuille de cuivre fixée à un support pour circuit haute fréquence, stratifié, procédé de fabrication de carte de circuit imprimé et procédé de fabrication d'un dispositif électronique |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101439496B1 (ko) * | 2009-12-22 | 2014-09-12 | 에스케이이노베이션 주식회사 | 폴리아믹산 수지 조성물과 이의 제조방법 및 이를 이용한 폴리이미드 금속적층체 |
CN102504197B (zh) * | 2011-10-10 | 2013-08-21 | 北京新福润达绝缘材料有限责任公司 | 具有高耐漏电起痕指数的无卤环氧树脂组合物及其应用 |
CN102585663B (zh) * | 2012-02-06 | 2013-11-20 | 苏州太湖电工新材料股份有限公司 | 一种电机用无卤阻燃耐高温绝缘漆 |
KR102113190B1 (ko) * | 2013-12-20 | 2020-05-20 | 엘지이노텍 주식회사 | 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
KR102135414B1 (ko) * | 2013-12-20 | 2020-07-17 | 엘지이노텍 주식회사 | 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
KR102172298B1 (ko) * | 2014-03-17 | 2020-10-30 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄회로기판 |
KR102172297B1 (ko) * | 2014-04-17 | 2020-10-30 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄회로기판 |
JP7312931B2 (ja) * | 2016-09-28 | 2023-07-24 | 東特塗料株式会社 | 電気絶縁電線 |
CN106564240B (zh) * | 2016-11-07 | 2018-08-31 | 北京新福润达绝缘材料有限责任公司 | 一种高耐漏电起痕玻璃毡层压板的制备方法 |
US10899871B2 (en) * | 2019-04-23 | 2021-01-26 | Chang Chun Plastics Co., Ltd. | Phosphorous containing epoxy resins and process for synthesis |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08193188A (ja) * | 1995-01-18 | 1996-07-30 | Mitsui Mining & Smelting Co Ltd | 銅箔用接着剤および該接着剤付き銅箔 |
JPH11186724A (ja) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | 多層プリント配線板の製造方法 |
JPH11186723A (ja) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | 多層プリント配線板の製造方法 |
JPH11279258A (ja) * | 1998-01-27 | 1999-10-12 | Toto Kasei Co Ltd | リン含有エポキシ樹脂組成物 |
JP2001181593A (ja) * | 1999-12-28 | 2001-07-03 | Kashima Oil Co Ltd | 熱硬化性接着剤及びそれを用いたフレキシブルプリント配線板材料 |
JP2002128867A (ja) * | 2000-10-20 | 2002-05-09 | Nikko Materials Co Ltd | エポキシ樹脂用フェノール系硬化剤及びそれを用いたエポキシ樹脂組成物 |
JP2005132925A (ja) * | 2003-10-29 | 2005-05-26 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、それを用いたプリプレグ、金属箔張積層板、及び金属箔付き樹脂シート |
JP2005213352A (ja) * | 2004-01-29 | 2005-08-11 | Arisawa Mfg Co Ltd | プリプレグ用樹脂組成物およびこれを用いたプリプレグ |
JP2005314449A (ja) * | 2004-04-27 | 2005-11-10 | Nikko Materials Co Ltd | 樹脂用添加剤 |
JP2006328214A (ja) * | 2005-05-26 | 2006-12-07 | Tamura Kaken Co Ltd | 熱硬化性樹脂組成物、樹脂フィルムおよびフィルム付き製品 |
JP2007099956A (ja) * | 2005-10-06 | 2007-04-19 | Tamura Kaken Co Ltd | 熱硬化性樹脂組成物、樹脂フィルムおよび構造体 |
-
2008
- 2008-06-25 KR KR1020097026807A patent/KR101249479B1/ko active IP Right Grant
- 2008-06-25 TW TW097123681A patent/TW200916525A/zh not_active IP Right Cessation
- 2008-06-25 WO PCT/JP2008/061529 patent/WO2009001850A1/fr active Application Filing
- 2008-06-25 CN CN2008800220983A patent/CN101687981B/zh not_active Expired - Fee Related
- 2008-06-25 MY MYPI20095421 patent/MY150635A/en unknown
- 2008-06-25 JP JP2009520611A patent/JP5650908B2/ja active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08193188A (ja) * | 1995-01-18 | 1996-07-30 | Mitsui Mining & Smelting Co Ltd | 銅箔用接着剤および該接着剤付き銅箔 |
JPH11186724A (ja) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | 多層プリント配線板の製造方法 |
JPH11186723A (ja) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | 多層プリント配線板の製造方法 |
JPH11279258A (ja) * | 1998-01-27 | 1999-10-12 | Toto Kasei Co Ltd | リン含有エポキシ樹脂組成物 |
JP2001181593A (ja) * | 1999-12-28 | 2001-07-03 | Kashima Oil Co Ltd | 熱硬化性接着剤及びそれを用いたフレキシブルプリント配線板材料 |
JP2002128867A (ja) * | 2000-10-20 | 2002-05-09 | Nikko Materials Co Ltd | エポキシ樹脂用フェノール系硬化剤及びそれを用いたエポキシ樹脂組成物 |
JP2005132925A (ja) * | 2003-10-29 | 2005-05-26 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、それを用いたプリプレグ、金属箔張積層板、及び金属箔付き樹脂シート |
JP2005213352A (ja) * | 2004-01-29 | 2005-08-11 | Arisawa Mfg Co Ltd | プリプレグ用樹脂組成物およびこれを用いたプリプレグ |
JP2005314449A (ja) * | 2004-04-27 | 2005-11-10 | Nikko Materials Co Ltd | 樹脂用添加剤 |
JP2006328214A (ja) * | 2005-05-26 | 2006-12-07 | Tamura Kaken Co Ltd | 熱硬化性樹脂組成物、樹脂フィルムおよびフィルム付き製品 |
JP2007099956A (ja) * | 2005-10-06 | 2007-04-19 | Tamura Kaken Co Ltd | 熱硬化性樹脂組成物、樹脂フィルムおよび構造体 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012007091A (ja) * | 2010-06-25 | 2012-01-12 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
WO2012017909A1 (fr) * | 2010-08-03 | 2012-02-09 | 三井金属鉱業株式会社 | Procédé de production de carte de câblage imprimé, et carte de câblage imprimé |
JP2012038772A (ja) * | 2010-08-03 | 2012-02-23 | Mitsui Mining & Smelting Co Ltd | プリント配線板の製造方法及びプリント配線板 |
US9144157B2 (en) | 2010-08-03 | 2015-09-22 | Mitsui Mining & Smelting Co., Ltd. | Manufacturing method of printed wiring board and printed wiring board |
CN102585440A (zh) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物 |
CN102585440B (zh) * | 2012-01-16 | 2013-09-04 | 广州宏仁电子工业有限公司 | 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物 |
JPWO2014106955A1 (ja) * | 2013-01-07 | 2017-01-19 | 株式会社ニコン | 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法 |
US10510460B2 (en) | 2013-01-07 | 2019-12-17 | Nikon Corporation | Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor |
WO2015012327A1 (fr) | 2013-07-23 | 2015-01-29 | Jx日鉱日石金属株式会社 | Feuille de cuivre traitée en surface, feuille de cuivre avec support, substrat, substrat de résine, carte à circuit imprimé, stratifié cuivré, et procédé de fabrication d'une carte à circuit imprimé |
WO2015012376A1 (fr) | 2013-07-24 | 2015-01-29 | Jx日鉱日石金属株式会社 | Feuille de cuivre traitée en surface, feuille de cuivre comprenant un transporteur, substrat, substrat de résine, carte de circuit imprimé, stratifié plaqué cuivre, et procédé de production de carte de circuit imprimé |
EP3046400A2 (fr) | 2015-01-16 | 2016-07-20 | JX Nippon Mining & Metals Corporation | Feuille de cuivre comportant support, stratifié, carte de câblage imprimé, dispositif électronique et procédé de fabrication de carte de câblage imprimée |
EP3048864A2 (fr) | 2015-01-21 | 2016-07-27 | JX Nippon Mining & Metals Corporation | Feuille de cuivre avec support, stratifié, carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé |
EP3054751A2 (fr) | 2015-02-06 | 2016-08-10 | JX Nippon Mining & Metals Corporation | Feuille de cuivre comportant support, stratifié, carte de câblage imprimé, dispositif électronique et procédé de fabrication de carte de câblage imprimée |
US9839124B2 (en) | 2015-02-06 | 2017-12-05 | Jx Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board |
WO2017161120A1 (fr) * | 2016-03-17 | 2017-09-21 | Qed Labs Inc. | Articles présentant des propriétés améliorées d'ininflammabilité et/ou d'égouttage à l'état fondu |
US11008458B2 (en) | 2016-03-17 | 2021-05-18 | Qed Labs Inc. | Articles with improved flame retardancy and/or melt dripping properties |
EP3232747A1 (fr) | 2016-04-15 | 2017-10-18 | JX Nippon Mining & Metals Corp. | Feuille de cuivre, feuille de cuivre pour circuit haute fréquence, feuille de cuivre fixée à un support, feuille de cuivre fixée à un support pour circuit haute fréquence, stratifié, procédé de fabrication de carte de circuit imprimé et procédé de fabrication d'un dispositif électronique |
Also Published As
Publication number | Publication date |
---|---|
CN101687981A (zh) | 2010-03-31 |
CN101687981B (zh) | 2012-04-04 |
JP5650908B2 (ja) | 2015-01-07 |
KR101249479B1 (ko) | 2013-03-29 |
TWI374909B (fr) | 2012-10-21 |
JPWO2009001850A1 (ja) | 2010-08-26 |
TW200916525A (en) | 2009-04-16 |
KR20100024949A (ko) | 2010-03-08 |
MY150635A (en) | 2014-02-14 |
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