ATE398656T1 - Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat - Google Patents

Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat

Info

Publication number
ATE398656T1
ATE398656T1 AT01917732T AT01917732T ATE398656T1 AT E398656 T1 ATE398656 T1 AT E398656T1 AT 01917732 T AT01917732 T AT 01917732T AT 01917732 T AT01917732 T AT 01917732T AT E398656 T1 ATE398656 T1 AT E398656T1
Authority
AT
Austria
Prior art keywords
layer circuit
film
curable composition
layer substrate
produced therefrom
Prior art date
Application number
AT01917732T
Other languages
English (en)
Inventor
Yasuhiro Wakizaka
Kanji Yuyama
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Application granted granted Critical
Publication of ATE398656T1 publication Critical patent/ATE398656T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C08G65/485—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
AT01917732T 2000-03-30 2001-03-30 Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat ATE398656T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000095184A JP4231976B2 (ja) 2000-03-30 2000-03-30 硬化性組成物及び多層回路基板

Publications (1)

Publication Number Publication Date
ATE398656T1 true ATE398656T1 (de) 2008-07-15

Family

ID=18610117

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01917732T ATE398656T1 (de) 2000-03-30 2001-03-30 Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat

Country Status (7)

Country Link
US (1) US6955848B2 (de)
EP (1) EP1275695B1 (de)
JP (1) JP4231976B2 (de)
KR (1) KR20020086732A (de)
AT (1) ATE398656T1 (de)
DE (1) DE60134467D1 (de)
WO (1) WO2001072902A1 (de)

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* Cited by examiner, † Cited by third party
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JP4300382B2 (ja) * 2000-03-30 2009-07-22 日本ゼオン株式会社 絶縁材料、絶縁材料の製造方法および多層回路基板の製造方法
JP4770004B2 (ja) * 2000-06-30 2011-09-07 日立化成工業株式会社 樹脂組成物、積層板及び配線板
WO2003087235A1 (en) * 2002-04-15 2003-10-23 Zeon Corporation Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particle and varnish
JP3887357B2 (ja) * 2003-07-30 2007-02-28 日本油脂株式会社 めっき可能な架橋性樹脂組成物、架橋性樹脂成形品および架橋樹脂成形品
JP4694162B2 (ja) * 2004-07-21 2011-06-08 富士フイルム株式会社 硬化性樹脂組成物並びにこれを用いたカラーフィルタ用樹脂皮膜およびカラーフィルタ
US20090151984A1 (en) * 2005-08-26 2009-06-18 Zeon Corporation Composite resin molded article, laminate, multi-layer circuit board, and electronic device
US7758964B2 (en) * 2006-02-10 2010-07-20 3M Innovative Properties Company Flame resistant covercoat for flexible circuit
JP5092315B2 (ja) * 2006-08-24 2012-12-05 日本化成株式会社 イソシアヌレート誘導体、架橋剤、架橋性エラストマー組成物およびその成形体、架橋性熱可塑性樹脂組成物およびその成形体
JP4984743B2 (ja) * 2006-08-24 2012-07-25 日本化成株式会社 架橋剤、架橋性エラストマー組成物およびその成形体、架橋性熱可塑性樹脂組成物およびその成形体
CN101522795A (zh) * 2006-09-29 2009-09-02 日本瑞翁株式会社 固化性树脂组合物、复合体、成形体、层压体及多层电路基板
JP2010077333A (ja) * 2008-09-29 2010-04-08 Fuji Electric Fa Components & Systems Co Ltd 難燃性樹脂組成物
WO2010042422A2 (en) * 2008-10-07 2010-04-15 3M Innovative Properties Company Composition, method of making the same, and use thereof
WO2012044499A1 (en) * 2010-09-30 2012-04-05 Dow Global Technologies Llc Method for manufacturing flexible multilayer electrical articles with improved layer adhesion
KR101228734B1 (ko) 2010-11-05 2013-02-01 삼성전기주식회사 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판
JP5323033B2 (ja) * 2010-12-06 2013-10-23 富士フイルム株式会社 カラーフィルタ用樹脂皮膜およびカラーフィルタ
US20140295159A1 (en) * 2011-08-23 2014-10-02 Zeon Corporation Curable resin composition, film, prepreg, laminate, cured article, and composite article
CN102926202B (zh) * 2012-09-25 2014-12-03 台州学院 一种阻燃涂层及其制备方法和应用
KR20150094633A (ko) * 2012-12-13 2015-08-19 제온 코포레이션 경화성 수지 조성물, 절연 필름, 프리프레그, 경화물, 복합체, 및 전자 재료용 기판
TWI540944B (zh) * 2014-07-14 2016-07-01 啟碁科技股份有限公司 基板結構的製造方法、基板結構以及金屬構件
CN105307378B (zh) * 2014-07-18 2018-10-19 启碁科技股份有限公司 基板结构的制造方法、基板结构以及金属构件
TWI526129B (zh) * 2014-11-05 2016-03-11 Elite Material Co Ltd Multilayer printed circuit boards with dimensional stability
CN113150484B (zh) * 2021-03-23 2022-05-13 浙江大学 一种用于高频覆铜板的coc基复合基板材料及制备方法

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JPS5572304A (en) * 1978-11-28 1980-05-31 Teijin Ltd Insulating material
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JPH01174552A (ja) 1987-12-28 1989-07-11 Sakai Chem Ind Co Ltd 塩素含有樹脂組成物
JPH01174522A (ja) * 1987-12-28 1989-07-11 Hitachi Chem Co Ltd 感光性樹脂組成物
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JPH0726014B2 (ja) 1989-03-08 1995-03-22 旭化成工業株式会社 難燃化樹脂組成物
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Also Published As

Publication number Publication date
US20030146421A1 (en) 2003-08-07
WO2001072902A1 (en) 2001-10-04
EP1275695A4 (de) 2003-08-06
EP1275695A1 (de) 2003-01-15
US6955848B2 (en) 2005-10-18
EP1275695B1 (de) 2008-06-18
JP4231976B2 (ja) 2009-03-04
DE60134467D1 (de) 2008-07-31
KR20020086732A (ko) 2002-11-18
JP2001279087A (ja) 2001-10-10

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Legal Events

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