FI20020190A0 - Menetelmõ komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi - Google Patents

Menetelmõ komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi

Info

Publication number
FI20020190A0
FI20020190A0 FI20020190A FI20020190A FI20020190A0 FI 20020190 A0 FI20020190 A0 FI 20020190A0 FI 20020190 A FI20020190 A FI 20020190A FI 20020190 A FI20020190 A FI 20020190A FI 20020190 A0 FI20020190 A0 FI 20020190A0
Authority
FI
Finland
Prior art keywords
base
conductive pattern
semiconductor components
component
contact
Prior art date
Application number
FI20020190A
Other languages
English (en)
Swedish (sv)
Other versions
FI20020190A (fi
FI115285B (fi
Inventor
Risto Tuominen
Original Assignee
Aspocomp Group Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aspocomp Group Oyj filed Critical Aspocomp Group Oyj
Publication of FI20020190A0 publication Critical patent/FI20020190A0/fi
Priority to FI20020190A priority Critical patent/FI115285B/fi
Priority to DE60300619T priority patent/DE60300619T2/de
Priority to AT03700815T priority patent/ATE295064T1/de
Priority to KR1020107023652A priority patent/KR20100126546A/ko
Priority to US10/502,340 priority patent/US6991966B2/en
Priority to JP2003565216A priority patent/JP2005517287A/ja
Priority to BRPI0307364A priority patent/BRPI0307364B1/pt
Priority to KR1020047011833A priority patent/KR101013325B1/ko
Priority to EP03700815A priority patent/EP1474959B1/en
Priority to CNB038031353A priority patent/CN100566511C/zh
Priority to RU2004126137/09A priority patent/RU2297736C2/ru
Priority to PCT/FI2003/000064 priority patent/WO2003065778A1/en
Publication of FI20020190A publication Critical patent/FI20020190A/fi
Priority to IL163238A priority patent/IL163238A/en
Application granted granted Critical
Publication of FI115285B publication Critical patent/FI115285B/fi
Priority to HK05108993.5A priority patent/HK1077151A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82035—Reshaping, e.g. forming vias by heating means
    • H01L2224/82039—Reshaping, e.g. forming vias by heating means using a laser
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01029—Copper [Cu]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/01061—Promethium [Pm]
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
FI20020190A 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi FI115285B (fi)

Priority Applications (14)

Application Number Priority Date Filing Date Title
FI20020190A FI115285B (fi) 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi
BRPI0307364A BRPI0307364B1 (pt) 2002-01-31 2003-01-28 método para embutir um componente em uma base e produzir um contato, e módulo eletrônico fabricado usando o referido método
EP03700815A EP1474959B1 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
KR1020107023652A KR20100126546A (ko) 2002-01-31 2003-01-28 베이스에 부품을 삽입하고 콘택을 형성하는 방법
US10/502,340 US6991966B2 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
JP2003565216A JP2005517287A (ja) 2002-01-31 2003-01-28 構成要素をベースに埋め込み接触を形成する方法
DE60300619T DE60300619T2 (de) 2002-01-31 2003-01-28 Verfahren zum einbetten einer komponente in eine basis und zur bildung eines kontakts
KR1020047011833A KR101013325B1 (ko) 2002-01-31 2003-01-28 베이스에 부품을 삽입하고 콘택을 형성하는 방법
AT03700815T ATE295064T1 (de) 2002-01-31 2003-01-28 Verfahren zum einbetten einer komponente in eine basis und zur bildung eines kontakts
CNB038031353A CN100566511C (zh) 2002-01-31 2003-01-28 用于将元件置入于基座中并且形成接触的方法
RU2004126137/09A RU2297736C2 (ru) 2002-01-31 2003-01-28 Способ встраивания компонента в основание и формирования электрического контакта с компонентом
PCT/FI2003/000064 WO2003065778A1 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
IL163238A IL163238A (en) 2002-01-31 2004-07-27 Method for embedding a component in a base and forming a contact
HK05108993.5A HK1077151A1 (en) 2002-01-31 2005-10-12 Method for embedding a component in a base and forming a contact

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20020190 2002-01-31
FI20020190A FI115285B (fi) 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi

Publications (3)

Publication Number Publication Date
FI20020190A0 true FI20020190A0 (fi) 2002-01-31
FI20020190A FI20020190A (fi) 2003-08-01
FI115285B FI115285B (fi) 2005-03-31

Family

ID=8563006

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20020190A FI115285B (fi) 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi

Country Status (13)

Country Link
US (1) US6991966B2 (fi)
EP (1) EP1474959B1 (fi)
JP (1) JP2005517287A (fi)
KR (2) KR20100126546A (fi)
CN (1) CN100566511C (fi)
AT (1) ATE295064T1 (fi)
BR (1) BRPI0307364B1 (fi)
DE (1) DE60300619T2 (fi)
FI (1) FI115285B (fi)
HK (1) HK1077151A1 (fi)
IL (1) IL163238A (fi)
RU (1) RU2297736C2 (fi)
WO (1) WO2003065778A1 (fi)

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FI115601B (fi) 2003-04-01 2005-05-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
US8222723B2 (en) 2003-04-01 2012-07-17 Imbera Electronics Oy Electric module having a conductive pattern layer
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
US7547975B2 (en) * 2003-07-30 2009-06-16 Tdk Corporation Module with embedded semiconductor IC and method of fabricating the module
FI20031201A (fi) * 2003-08-26 2005-02-27 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
FI20031341A (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI20040592A (fi) 2004-04-27 2005-10-28 Imbera Electronics Oy Lämmön johtaminen upotetusta komponentista
FI117814B (fi) 2004-06-15 2007-02-28 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI117812B (fi) * 2004-08-05 2007-02-28 Imbera Electronics Oy Komponentin sisältävän kerroksen valmistaminen
US8487194B2 (en) 2004-08-05 2013-07-16 Imbera Electronics Oy Circuit board including an embedded component
JP4148201B2 (ja) * 2004-08-11 2008-09-10 ソニー株式会社 電子回路装置
US7615856B2 (en) * 2004-09-01 2009-11-10 Sanyo Electric Co., Ltd. Integrated antenna type circuit apparatus
TWI241007B (en) * 2004-09-09 2005-10-01 Phoenix Prec Technology Corp Semiconductor device embedded structure and method for fabricating the same
TW200618705A (en) 2004-09-16 2006-06-01 Tdk Corp Multilayer substrate and manufacturing method thereof
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US7410907B2 (en) * 2005-03-31 2008-08-12 Lucent Technologies Inc. Fabricating integrated devices using embedded masks
KR100651562B1 (ko) * 2005-06-14 2006-11-29 삼성전기주식회사 전자부품 내장형 회로기판의 제조방법
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JP2005517287A (ja) 2005-06-09
EP1474959A1 (en) 2004-11-10
KR101013325B1 (ko) 2011-02-09
FI20020190A (fi) 2003-08-01
BRPI0307364B1 (pt) 2017-02-21
RU2297736C2 (ru) 2007-04-20
KR20100126546A (ko) 2010-12-01
CN1625927A (zh) 2005-06-08
KR20040073606A (ko) 2004-08-19
HK1077151A1 (en) 2006-02-03
RU2004126137A (ru) 2005-06-10
BR0307364A (pt) 2004-12-14
IL163238A (en) 2009-06-15
US20050124148A1 (en) 2005-06-09
EP1474959B1 (en) 2005-05-04
WO2003065778A1 (en) 2003-08-07
ATE295064T1 (de) 2005-05-15
US6991966B2 (en) 2006-01-31
DE60300619D1 (de) 2005-06-09
FI115285B (fi) 2005-03-31
CN100566511C (zh) 2009-12-02

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