WO2008087890A1 - 熱硬化性樹脂組成物 - Google Patents

熱硬化性樹脂組成物 Download PDF

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Publication number
WO2008087890A1
WO2008087890A1 PCT/JP2008/050218 JP2008050218W WO2008087890A1 WO 2008087890 A1 WO2008087890 A1 WO 2008087890A1 JP 2008050218 W JP2008050218 W JP 2008050218W WO 2008087890 A1 WO2008087890 A1 WO 2008087890A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
thermosetting resin
film
epoxy
disclosed
Prior art date
Application number
PCT/JP2008/050218
Other languages
English (en)
French (fr)
Inventor
Katsuto Murata
Koshin Nakai
Makoto Hayashi
Original Assignee
Taiyo Ink Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg. Co., Ltd. filed Critical Taiyo Ink Mfg. Co., Ltd.
Priority to JP2008554016A priority Critical patent/JPWO2008087890A1/ja
Publication of WO2008087890A1 publication Critical patent/WO2008087890A1/ja
Priority to US12/503,210 priority patent/US20090308642A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/247—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using fibres of at least two types
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Abstract

　熱硬化性樹脂組成物は、（Ａ）１分子中に２個以上のエポキシ基を有するエポキシ樹脂、（Ｂ）フルオレン骨格を有する熱可塑性ポリヒドロキシポリエーテル樹脂、（Ｃ）エポキシ硬化剤、及び（Ｄ）フィラーを必須成分として含有する。該熱硬化性樹脂組成物の薄膜を支持ベースフィルム上に形成してなるドライフィルム、及びシート状繊維質基材に塗工及び/叉は含浸させてなるプリプレグも提供される。これらは、基材及び導体に対して優れた密着性を示し、その硬化皮膜は比較的低い熱膨張率と高いガラス転移点を有し、高耐熱性と粗化処理による粗化性を併せ有するため、多層プリント配線板の樹脂絶縁層（４，９）として有用である。
PCT/JP2008/050218 2007-01-15 2008-01-10 熱硬化性樹脂組成物 WO2008087890A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008554016A JPWO2008087890A1 (ja) 2007-01-15 2008-01-10 熱硬化性樹脂組成物
US12/503,210 US20090308642A1 (en) 2007-01-15 2009-07-15 Thermosetting resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-006365 2007-01-15
JP2007006365 2007-01-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/503,210 Continuation US20090308642A1 (en) 2007-01-15 2009-07-15 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
WO2008087890A1 true WO2008087890A1 (ja) 2008-07-24

Family

ID=39635894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050218 WO2008087890A1 (ja) 2007-01-15 2008-01-10 熱硬化性樹脂組成物

Country Status (6)

Country Link
US (1) US20090308642A1 (ja)
JP (1) JPWO2008087890A1 (ja)
KR (1) KR20090098983A (ja)
CN (1) CN101583647A (ja)
TW (1) TW200846411A (ja)
WO (1) WO2008087890A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009144954A1 (ja) * 2008-05-29 2009-12-03 太陽インキ製造株式会社 熱硬化性樹脂組成物及びプリント配線板
WO2011033739A1 (ja) * 2009-09-15 2011-03-24 太陽ホールディングス株式会社 熱硬化性樹脂組成物
WO2011083818A1 (ja) * 2010-01-08 2011-07-14 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および金属箔張積層板
WO2013118229A1 (ja) * 2012-02-10 2013-08-15 太陽インキ製造株式会社 配線回路、配線基板及び配線基板の製造方法
TWI470021B (zh) * 2008-10-07 2015-01-21 Ajinomoto Kk Resin composition

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717635B (zh) * 2011-07-19 2016-01-20 松下知识产权经营株式会社 树脂组合物、树脂清漆、预浸料、覆金属层压板及印刷线路板
JP5880213B2 (ja) * 2012-03-30 2016-03-08 住友ベークライト株式会社 透明シートおよび電子部品用基板
JP5635655B1 (ja) * 2013-06-28 2014-12-03 太陽インキ製造株式会社 熱硬化性組成物、ドライフィルムおよびプリント配線板
JP6937701B2 (ja) * 2016-01-13 2021-09-22 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
CN109522885A (zh) * 2019-01-08 2019-03-26 深圳市台技光电有限公司 适用于超声波指纹识别功能的钢化玻璃保护膜及制备方法
US11685828B2 (en) * 2019-08-12 2023-06-27 Laticrete International, Inc. Epoxy based moisture vapor barrier and primer
CN113429622B (zh) * 2021-06-28 2023-01-13 万华化学集团股份有限公司 快速制备具有低残单含量的双层结构泡沫的方法、泡沫材料及其应用
CN113831852A (zh) * 2021-09-15 2021-12-24 深圳市纽菲斯新材料科技有限公司 一种涂胶铜箔及其制备方法和应用

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WO1996034303A1 (fr) * 1995-04-27 1996-10-31 Nippon Steel Chemical Co., Ltd. Materiau permettant de realiser un film protecteur filtrant les couleurs et film protecteur filtrant ainsi les couleurs
JPH11279260A (ja) * 1998-03-25 1999-10-12 Toto Kasei Co Ltd エポキシ樹脂組成物
JP2005154727A (ja) * 2003-05-27 2005-06-16 Ajinomoto Co Inc 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ
JP2005264109A (ja) * 2004-03-22 2005-09-29 Hitachi Chem Co Ltd フィルム状接着剤およびこれを用いた半導体装置の製造方法
JP2005307169A (ja) * 2004-03-22 2005-11-04 Hitachi Chem Co Ltd フィルム状接着剤およびこれを用いた半導体装置の製造方法
JP2007146103A (ja) * 2005-11-04 2007-06-14 Fujifilm Corp エポキシ樹脂組成物、導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法
WO2007129662A1 (ja) * 2006-05-08 2007-11-15 Sekisui Chemical Co., Ltd. 絶縁材料、電子部品装置の製造方法及び電子部品装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996034303A1 (fr) * 1995-04-27 1996-10-31 Nippon Steel Chemical Co., Ltd. Materiau permettant de realiser un film protecteur filtrant les couleurs et film protecteur filtrant ainsi les couleurs
JPH11279260A (ja) * 1998-03-25 1999-10-12 Toto Kasei Co Ltd エポキシ樹脂組成物
JP2005154727A (ja) * 2003-05-27 2005-06-16 Ajinomoto Co Inc 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ
JP2005264109A (ja) * 2004-03-22 2005-09-29 Hitachi Chem Co Ltd フィルム状接着剤およびこれを用いた半導体装置の製造方法
JP2005307169A (ja) * 2004-03-22 2005-11-04 Hitachi Chem Co Ltd フィルム状接着剤およびこれを用いた半導体装置の製造方法
JP2007146103A (ja) * 2005-11-04 2007-06-14 Fujifilm Corp エポキシ樹脂組成物、導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法
WO2007129662A1 (ja) * 2006-05-08 2007-11-15 Sekisui Chemical Co., Ltd. 絶縁材料、電子部品装置の製造方法及び電子部品装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009144954A1 (ja) * 2008-05-29 2009-12-03 太陽インキ製造株式会社 熱硬化性樹脂組成物及びプリント配線板
TWI470021B (zh) * 2008-10-07 2015-01-21 Ajinomoto Kk Resin composition
WO2011033739A1 (ja) * 2009-09-15 2011-03-24 太陽ホールディングス株式会社 熱硬化性樹脂組成物
JP2011063653A (ja) * 2009-09-15 2011-03-31 Taiyo Holdings Co Ltd 熱硬化性樹脂組成物及びドライフィルム
WO2011083818A1 (ja) * 2010-01-08 2011-07-14 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および金属箔張積層板
JP5765232B2 (ja) * 2010-01-08 2015-08-19 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および金属箔張積層板
WO2013118229A1 (ja) * 2012-02-10 2013-08-15 太陽インキ製造株式会社 配線回路、配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
JPWO2008087890A1 (ja) 2010-05-06
KR20090098983A (ko) 2009-09-18
TW200846411A (en) 2008-12-01
US20090308642A1 (en) 2009-12-17
CN101583647A (zh) 2009-11-18

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