WO2008133246A1 - エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板 - Google Patents

エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板 Download PDF

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Publication number
WO2008133246A1
WO2008133246A1 PCT/JP2008/057753 JP2008057753W WO2008133246A1 WO 2008133246 A1 WO2008133246 A1 WO 2008133246A1 JP 2008057753 W JP2008057753 W JP 2008057753W WO 2008133246 A1 WO2008133246 A1 WO 2008133246A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
composition
prepreg
circuit board
Prior art date
Application number
PCT/JP2008/057753
Other languages
English (en)
French (fr)
Inventor
Mao Yamaguchi
Tomoaki Watanabe
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Priority to JP2009511877A priority Critical patent/JP5259580B2/ja
Publication of WO2008133246A1 publication Critical patent/WO2008133246A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

【課題】エポキシ樹脂組成物の硬化物からなる表面粗度が低い基材表面にめっきを形成する場合において、エポキシ樹脂組成物にハロゲン系難燃剤を含有させなくとも、難燃性を維持でき、優れためっきの密着性を維持する基材を得ることができるエポキシ樹脂組成物、この組成物から得られる樹脂フィルム及びプリプレグ、この組成物から樹脂絶縁層が形成された多層プリント配線板を提供することを目的とする。 【解決手段】平均のエポキシ当量が４５０未満のビフェニル型エポキシ樹脂（Ａ）と、平均のエポキシ当量が４５０以上のビスフェノールＡ型エポキシ樹脂（Ｂ）と、分子中にトリアジン環を有するフェノール系ノボラック樹脂（Ｃ）とを含み、前記ビフェニル型エポキシ樹脂（Ａ）に対する前記ビスフェノールＡ型エポキシ樹脂（Ｂ）の質量比が、０．２５～２であることを特徴とするエポキシ樹脂組成物を用いる。
PCT/JP2008/057753 2007-04-24 2008-04-22 エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板 WO2008133246A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009511877A JP5259580B2 (ja) 2007-04-24 2008-04-22 エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007113885 2007-04-24
JP2007-113885 2007-04-24
JP2007-247883 2007-09-25
JP2007247883 2007-09-25

Publications (1)

Publication Number Publication Date
WO2008133246A1 true WO2008133246A1 (ja) 2008-11-06

Family

ID=39925696

Family Applications (1)

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PCT/JP2008/057753 WO2008133246A1 (ja) 2007-04-24 2008-04-22 エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板

Country Status (3)

Country Link
JP (1) JP5259580B2 (ja)
TW (1) TWI396717B (ja)
WO (1) WO2008133246A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010184952A (ja) * 2009-02-10 2010-08-26 Toagosei Co Ltd フレキシブル印刷配線板用難燃性接着剤組成物及びそれを用いたフレキシブル印刷配線板
WO2011055850A1 (ja) * 2009-11-05 2011-05-12 新日鐵化学株式会社 リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物
WO2011078372A1 (ja) * 2009-12-25 2011-06-30 新日鐵化学株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2013194060A (ja) * 2012-03-15 2013-09-30 Denki Kagaku Kogyo Kk エポキシ樹脂組成物、エポキシ樹脂シート、金属ベース回路基板
KR101415448B1 (ko) * 2011-02-02 2014-07-04 세키스이가가쿠 고교가부시키가이샤 조화 경화물 및 적층체
JP2014153581A (ja) * 2013-02-12 2014-08-25 Panasonic Corp 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法
JP2015106118A (ja) * 2013-12-02 2015-06-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0959346A (ja) * 1995-08-28 1997-03-04 Matsushita Electric Works Ltd 積層板用エポキシ樹脂組成物
JP2001254001A (ja) * 2000-03-09 2001-09-18 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JP2002249641A (ja) * 2001-02-23 2002-09-06 Matsushita Electric Works Ltd エポキシ樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ及び積層板
JP2003096158A (ja) * 2001-09-19 2003-04-03 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、プリプレグ及び炭素繊維強化複合材料
JP2004027043A (ja) * 2002-06-26 2004-01-29 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物及び繊維強化複合材料
JP2004083671A (ja) * 2002-08-26 2004-03-18 Kyocera Chemical Corp ハロゲンフリーの難燃性エポキシ樹脂組成物、並びにそれを含有するプリプレグ、積層板、銅張積層板およびプリント配線板
JP2008007575A (ja) * 2006-06-27 2008-01-17 Matsushita Electric Works Ltd エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板
JP2008063361A (ja) * 2006-09-04 2008-03-21 Fujikura Ltd エポキシ系接着剤、カバーレイ、プリプレグ、金属張積層板、プリント配線基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785749B2 (ja) * 1997-04-17 2006-06-14 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法
JP5099801B2 (ja) * 1999-06-28 2012-12-19 Ｄｉｃ株式会社 エポキシ樹脂組成物及び電気積層板
JP2002241590A (ja) * 2001-02-20 2002-08-28 Ajinomoto Co Inc 難燃性エポキシ樹脂組成物
JP2003105167A (ja) * 2001-07-27 2003-04-09 Toray Ind Inc 難燃性樹脂組成物とそれを用いた半導体装置用接着剤シート、カバーレイフィルム並びにフレキシブルプリント配線基板
JP2005347701A (ja) * 2004-06-07 2005-12-15 Kyocera Chemical Corp 多層プリント配線板の製造方法
JP2007001291A (ja) * 2005-05-27 2007-01-11 Hitachi Chem Co Ltd 接着補助剤付金属箔、およびこれを用いたプリント配線板およびその製造方法
US20070088134A1 (en) * 2005-10-13 2007-04-19 Ajinomoto Co. Inc Thermosetting resin composition containing modified polyimide resin

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0959346A (ja) * 1995-08-28 1997-03-04 Matsushita Electric Works Ltd 積層板用エポキシ樹脂組成物
JP2001254001A (ja) * 2000-03-09 2001-09-18 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JP2002249641A (ja) * 2001-02-23 2002-09-06 Matsushita Electric Works Ltd エポキシ樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ及び積層板
JP2003096158A (ja) * 2001-09-19 2003-04-03 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、プリプレグ及び炭素繊維強化複合材料
JP2004027043A (ja) * 2002-06-26 2004-01-29 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物及び繊維強化複合材料
JP2004083671A (ja) * 2002-08-26 2004-03-18 Kyocera Chemical Corp ハロゲンフリーの難燃性エポキシ樹脂組成物、並びにそれを含有するプリプレグ、積層板、銅張積層板およびプリント配線板
JP2008007575A (ja) * 2006-06-27 2008-01-17 Matsushita Electric Works Ltd エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板
JP2008063361A (ja) * 2006-09-04 2008-03-21 Fujikura Ltd エポキシ系接着剤、カバーレイ、プリプレグ、金属張積層板、プリント配線基板

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010184952A (ja) * 2009-02-10 2010-08-26 Toagosei Co Ltd フレキシブル印刷配線板用難燃性接着剤組成物及びそれを用いたフレキシブル印刷配線板
WO2011055850A1 (ja) * 2009-11-05 2011-05-12 新日鐵化学株式会社 リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物
JP2011099019A (ja) * 2009-11-05 2011-05-19 Nippon Steel Chem Co Ltd リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物
WO2011078372A1 (ja) * 2009-12-25 2011-06-30 新日鐵化学株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP5793086B2 (ja) * 2009-12-25 2015-10-14 新日鉄住金化学株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
KR101415448B1 (ko) * 2011-02-02 2014-07-04 세키스이가가쿠 고교가부시키가이샤 조화 경화물 및 적층체
JP2013194060A (ja) * 2012-03-15 2013-09-30 Denki Kagaku Kogyo Kk エポキシ樹脂組成物、エポキシ樹脂シート、金属ベース回路基板
JP2014153581A (ja) * 2013-02-12 2014-08-25 Panasonic Corp 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法
JP2015106118A (ja) * 2013-12-02 2015-06-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
JPWO2008133246A1 (ja) 2010-07-29
TWI396717B (zh) 2013-05-21
JP5259580B2 (ja) 2013-08-07
TW200927825A (en) 2009-07-01

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