WO2008114858A1 - プリント配線板の絶縁層構成用の樹脂組成物 - Google Patents

プリント配線板の絶縁層構成用の樹脂組成物 Download PDF

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Publication number
WO2008114858A1
WO2008114858A1 PCT/JP2008/055222 JP2008055222W WO2008114858A1 WO 2008114858 A1 WO2008114858 A1 WO 2008114858A1 JP 2008055222 W JP2008055222 W JP 2008055222W WO 2008114858 A1 WO2008114858 A1 WO 2008114858A1
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WO
WIPO (PCT)
Prior art keywords
resin
resin composition
component
epoxy
bisphenol
Prior art date
Application number
PCT/JP2008/055222
Other languages
English (en)
French (fr)
Other versions
WO2008114858A8 (ja
Inventor
Tetsuro Sato
Toshifumi Matsushima
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to CN2008800088848A priority Critical patent/CN101842408B/zh
Priority to EP08722586A priority patent/EP2135885A4/en
Priority to KR1020097019319A priority patent/KR101196855B1/ko
Priority to JP2008521668A priority patent/JP5704793B2/ja
Priority to US12/530,534 priority patent/US8431224B2/en
Publication of WO2008114858A1 publication Critical patent/WO2008114858A1/ja
Publication of WO2008114858A8 publication Critical patent/WO2008114858A8/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　半硬化状態の樹脂膜（層）の吸湿による品質劣化を大きく低減したプリント配線板製造用のハロゲンフリー系の樹脂組成物、樹脂付銅箔等の提供を目的とする。この目的を達成するため、当該樹脂組成物は、Ａ成分（エポキシ当量が２００以下で、２５°Cで液状のビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂の群から選ばれる１種又は２種以上）、Ｂ成分（架橋可能な官能基を有する線状ポリマー）、Ｃ成分（架橋剤）、Ｄ成分（イミダゾール系エポキシ樹脂硬化剤）、Ｅ成分（リン含有エポキシ樹脂）を含み、樹脂組成物重量を１００重量％としたときリン原子を０．５重量％～３．０重量％の範囲で含有したことを特徴とするものを採用する。また、この樹脂組成物で樹脂層を形成した樹脂付銅箔等を提供する。
PCT/JP2008/055222 2007-03-20 2008-03-21 プリント配線板の絶縁層構成用の樹脂組成物 WO2008114858A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800088848A CN101842408B (zh) 2007-03-20 2008-03-21 用于形成印刷布线板的绝缘层的树脂组合物
EP08722586A EP2135885A4 (en) 2007-03-20 2008-03-21 RESIN COMPOSITION FOR FORMING AN INSULATING LAYER OF PRINTED CIRCUIT BOARD
KR1020097019319A KR101196855B1 (ko) 2007-03-20 2008-03-21 프린트 배선판의 절연층 구성용 수지 조성물
JP2008521668A JP5704793B2 (ja) 2007-03-20 2008-03-21 プリント配線板の絶縁層構成用の樹脂組成物
US12/530,534 US8431224B2 (en) 2007-03-20 2008-03-21 Resin composition for forming insulating layer of printed wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-073703 2007-03-20
JP2007073703 2007-03-20

Publications (2)

Publication Number Publication Date
WO2008114858A1 true WO2008114858A1 (ja) 2008-09-25
WO2008114858A8 WO2008114858A8 (ja) 2010-02-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055222 WO2008114858A1 (ja) 2007-03-20 2008-03-21 プリント配線板の絶縁層構成用の樹脂組成物

Country Status (8)

Country Link
US (1) US8431224B2 (ja)
EP (1) EP2135885A4 (ja)
JP (1) JP5704793B2 (ja)
KR (1) KR101196855B1 (ja)
CN (1) CN101842408B (ja)
MY (1) MY162444A (ja)
TW (1) TWI451816B (ja)
WO (1) WO2008114858A1 (ja)

Cited By (9)

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Publication number Priority date Publication date Assignee Title
WO2010074384A1 (ko) 2008-12-26 2010-07-01 제일모직주식회사 신규한 포스포네이트계 화합물 및 이를 포함하는 난연성 스티렌계 수지 조성물
WO2010098296A1 (ja) * 2009-02-27 2010-09-02 Dic株式会社 ポリイミド樹脂、ポリイミド樹脂の製造方法、ポリイミド樹脂組成物及びその硬化物
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
EP2282622A4 (en) * 2008-05-26 2015-12-09 Mitsui Mining & Smelting Co RESIN COMPOSITION FOR FORMING THE HAFT LAYERS OF A MULTILAYER FLEXIBLE PCB
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device

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KR101172113B1 (ko) * 2008-11-14 2012-08-10 엘지이노텍 주식회사 터치스크린 및 그 제조방법
JP5720118B2 (ja) * 2009-06-01 2015-05-20 三菱レイヨン株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
JP5947504B2 (ja) * 2011-08-23 2016-07-06 三光株式会社 高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法
CN103965245B (zh) * 2013-01-28 2016-06-08 中国科学院宁波材料技术与工程研究所 一种含磷生物基二酸二缩水甘油酯及其制备方法和应用
WO2016175295A1 (ja) * 2015-04-28 2016-11-03 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および樹脂基板
JP6806488B2 (ja) * 2016-07-29 2021-01-06 株式会社Adeka 硬化性樹脂組成物、及び該組成物を用いた構造材料接合用接着剤

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See also references of EP2135885A4

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2282622A4 (en) * 2008-05-26 2015-12-09 Mitsui Mining & Smelting Co RESIN COMPOSITION FOR FORMING THE HAFT LAYERS OF A MULTILAYER FLEXIBLE PCB
WO2010074384A1 (ko) 2008-12-26 2010-07-01 제일모직주식회사 신규한 포스포네이트계 화합물 및 이를 포함하는 난연성 스티렌계 수지 조성물
US8329791B2 (en) 2008-12-26 2012-12-11 Cheil Industries Inc. Phosphonate compound and flame retardant styrenic resin composition including the same
WO2010098296A1 (ja) * 2009-02-27 2010-09-02 Dic株式会社 ポリイミド樹脂、ポリイミド樹脂の製造方法、ポリイミド樹脂組成物及びその硬化物
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US9839124B2 (en) 2015-02-06 2017-12-05 Jx Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device

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KR20100014423A (ko) 2010-02-10
KR101196855B1 (ko) 2012-11-01
EP2135885A4 (en) 2012-08-01
JPWO2008114858A1 (ja) 2010-07-08
TW200850084A (en) 2008-12-16
CN101842408A (zh) 2010-09-22
CN101842408B (zh) 2013-10-16
US8431224B2 (en) 2013-04-30
MY162444A (en) 2017-06-15
WO2008114858A8 (ja) 2010-02-18
US20100108368A1 (en) 2010-05-06
TWI451816B (zh) 2014-09-01
EP2135885A1 (en) 2009-12-23
JP5704793B2 (ja) 2015-04-22

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