WO2012020713A3 - 樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法 - Google Patents

樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法 Download PDF

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Publication number
WO2012020713A3
WO2012020713A3 PCT/JP2011/067984 JP2011067984W WO2012020713A3 WO 2012020713 A3 WO2012020713 A3 WO 2012020713A3 JP 2011067984 W JP2011067984 W JP 2011067984W WO 2012020713 A3 WO2012020713 A3 WO 2012020713A3
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WO
WIPO (PCT)
Prior art keywords
wiring board
manufacturing
resin composition
cured resin
resin product
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Application number
PCT/JP2011/067984
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English (en)
French (fr)
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WO2012020713A2 (ja
Inventor
正樹 森田
小夏 中村
高根沢　伸
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010179754A external-priority patent/JP5664008B2/ja
Priority claimed from JP2011171340A external-priority patent/JP5879801B2/ja
Priority claimed from JP2011171338A external-priority patent/JP5803399B2/ja
Priority claimed from JP2011171339A external-priority patent/JP5790272B2/ja
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to CN201180039372.XA priority Critical patent/CN103140537B/zh
Priority to US13/816,206 priority patent/US20130199830A1/en
Priority to KR1020137002993A priority patent/KR101807901B1/ko
Priority to EP11816378.1A priority patent/EP2604639A4/en
Publication of WO2012020713A2 publication Critical patent/WO2012020713A2/ja
Publication of WO2012020713A3 publication Critical patent/WO2012020713A3/ja
Priority to US16/365,237 priority patent/US11319457B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　（Ａ）１分子中に２個以上のエポキシ基を有し、ヘキサンジオール構造を含有したエポキシ樹脂、（Ｂ）紫外線活性型エステル基含有化合物、及び（Ｃ）エポキシ樹脂硬化促進剤を含む樹脂組成物とすることにより、絶縁樹脂層表面の凹凸形状が小さい状態でも、配線導体に対して容易に高い接着力を発現することができる。
PCT/JP2011/067984 2010-08-10 2011-08-05 樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法 WO2012020713A2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201180039372.XA CN103140537B (zh) 2010-08-10 2011-08-05 树脂组合物、树脂固化物、配线板及配线板的制造方法
US13/816,206 US20130199830A1 (en) 2010-08-10 2011-08-05 Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
KR1020137002993A KR101807901B1 (ko) 2010-08-10 2011-08-05 수지 조성물, 수지 경화물, 배선판 및 배선판의 제조 방법
EP11816378.1A EP2604639A4 (en) 2010-08-10 2011-08-05 Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
US16/365,237 US11319457B2 (en) 2010-08-10 2019-03-26 Support-provided insulating layer, laminate, and wiring board

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2010-179754 2010-08-10
JP2010179754A JP5664008B2 (ja) 2010-08-10 2010-08-10 樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法
JP2011-171340 2011-08-04
JP2011-171338 2011-08-04
JP2011171340A JP5879801B2 (ja) 2011-08-04 2011-08-04 配線板の製造方法
JP2011171338A JP5803399B2 (ja) 2011-08-04 2011-08-04 配線板の製造方法
JP2011171339A JP5790272B2 (ja) 2011-08-04 2011-08-04 配線板の製造方法
JP2011-171339 2011-08-04

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/816,206 A-371-Of-International US20130199830A1 (en) 2010-08-10 2011-08-05 Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
US16/365,237 Division US11319457B2 (en) 2010-08-10 2019-03-26 Support-provided insulating layer, laminate, and wiring board

Publications (2)

Publication Number Publication Date
WO2012020713A2 WO2012020713A2 (ja) 2012-02-16
WO2012020713A3 true WO2012020713A3 (ja) 2012-04-12

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PCT/JP2011/067984 WO2012020713A2 (ja) 2010-08-10 2011-08-05 樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法

Country Status (6)

Country Link
US (2) US20130199830A1 (ja)
EP (1) EP2604639A4 (ja)
KR (1) KR101807901B1 (ja)
CN (2) CN104797093B (ja)
TW (2) TWI618726B (ja)
WO (1) WO2012020713A2 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6144003B2 (ja) * 2011-08-29 2017-06-07 富士通株式会社 配線構造及びその製造方法並びに電子装置及びその製造方法
EP2803708B1 (en) * 2012-01-13 2019-09-18 Taica Corporation Method for producing transparent adhesive sheet for optical applications, transparent adhesive sheet for optical applications, and display device using same
TWI433632B (zh) * 2012-05-03 2014-04-01 Subtron Technology Co Ltd 基板結構的製作方法
TWI657730B (zh) * 2012-05-31 2019-04-21 日商味之素股份有限公司 多層印刷配線板之製造方法
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
KR101748054B1 (ko) * 2012-12-27 2017-06-15 우시오덴키 가부시키가이샤 디스미어 처리 방법 및 디스미어 처리 장치
US10057992B2 (en) * 2013-08-15 2018-08-21 Hitachi Metals, Ltd. Ceramic circuit substrate and its production method
JP5874720B2 (ja) * 2013-12-20 2016-03-02 ウシオ電機株式会社 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料
US9205455B2 (en) * 2014-01-09 2015-12-08 Nano And Advanced Materials Institute Limited Surface treatment of mirror finish
JP2016072419A (ja) * 2014-09-30 2016-05-09 日本ゼオン株式会社 積層体の製造方法
KR20160093403A (ko) * 2015-01-29 2016-08-08 엘지이노텍 주식회사 전자파차폐구조물
JP2016221953A (ja) * 2015-06-03 2016-12-28 日立化成株式会社 積層体の製造方法及び配線板の製造方法
JP2017011194A (ja) * 2015-06-25 2017-01-12 日立化成株式会社 アディティブ工法用プリント配線板
WO2017039624A1 (en) * 2015-08-31 2017-03-09 Robert Alan May Method of forming a via opening
JP6699148B2 (ja) * 2015-12-03 2020-05-27 日立化成株式会社 積層体及びその製造方法、並びに、プリント配線板の製造方法
JP6798140B2 (ja) * 2016-05-10 2020-12-09 昭和電工マテリアルズ株式会社 プリント配線板の製造方法
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
US10763031B2 (en) 2016-08-30 2020-09-01 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing an inductor
US11317522B2 (en) * 2017-03-21 2022-04-26 Mitsui Mining & Smelting Co., Ltd. Wiring board manufacturing method
KR102450598B1 (ko) * 2017-11-09 2022-10-07 삼성전기주식회사 지지체 부착 인쇄회로기판 및 지지체 부착 인쇄회로기판의 제조방법
US11523518B2 (en) * 2017-11-28 2022-12-06 Sumitomo Electric Printed Circuits, Inc. Method of making flexible printed circuit board and flexible printed circuit board
CN108215251A (zh) * 2017-12-26 2018-06-29 上海邦中新材料有限公司 一种环氧树脂玻璃钢复合材料界面粘接工艺
TWI746275B (zh) * 2020-11-20 2021-11-11 健鼎科技股份有限公司 具有非對稱結構的電路板的製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214597A (ja) * 2002-11-14 2004-07-29 Asahi Kasei Electronics Co Ltd 電子機器配線板の製造方法
JP2005005319A (ja) * 2003-06-09 2005-01-06 Toyota Motor Corp 配線形成方法および配線基板
JP2009144052A (ja) * 2007-12-14 2009-07-02 Sumitomo Bakelite Co Ltd プリント回路板用樹脂組成物、支持基材付き絶縁層、積層板およびプリント回路板
WO2010087526A1 (ja) * 2009-01-30 2010-08-05 味の素株式会社 樹脂組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3222660B2 (ja) * 1993-10-26 2001-10-29 松下電工株式会社 基材表面の処理方法
JPH0977937A (ja) * 1995-09-12 1997-03-25 Idemitsu Petrochem Co Ltd プリント配線板用プリプレグ及びプリント配線用基板
US5987739A (en) * 1996-02-05 1999-11-23 Micron Communications, Inc. Method of making a polymer based circuit
WO2001044342A1 (en) * 1999-12-14 2001-06-21 Mitsui Chemicals, Inc. Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element
JP4058672B2 (ja) * 2002-02-28 2008-03-12 大日本インキ化学工業株式会社 エポキシ樹脂組成物およびその硬化物
US6936336B2 (en) * 2002-03-15 2005-08-30 Kyocera Corporation Transfer sheet and production method of the same and wiring board and production method of the same
CN101160026B (zh) * 2003-05-21 2011-08-03 日立化成工业株式会社 底漆、带有树脂的导体箔、层叠板以及层叠板的制造方法
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP2009231790A (ja) * 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法
JP5322531B2 (ja) * 2008-05-27 2013-10-23 新光電気工業株式会社 配線基板の製造方法
JP5325462B2 (ja) * 2008-05-29 2013-10-23 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びプリント配線板
CN102137758B (zh) * 2008-09-01 2014-08-06 积水化学工业株式会社 层叠体及层叠体的制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214597A (ja) * 2002-11-14 2004-07-29 Asahi Kasei Electronics Co Ltd 電子機器配線板の製造方法
JP2005005319A (ja) * 2003-06-09 2005-01-06 Toyota Motor Corp 配線形成方法および配線基板
JP2009144052A (ja) * 2007-12-14 2009-07-02 Sumitomo Bakelite Co Ltd プリント回路板用樹脂組成物、支持基材付き絶縁層、積層板およびプリント回路板
WO2010087526A1 (ja) * 2009-01-30 2010-08-05 味の素株式会社 樹脂組成物

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