JP5947504B2 - 高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法 - Google Patents
高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法 Download PDFInfo
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- JP5947504B2 JP5947504B2 JP2011181435A JP2011181435A JP5947504B2 JP 5947504 B2 JP5947504 B2 JP 5947504B2 JP 2011181435 A JP2011181435 A JP 2011181435A JP 2011181435 A JP2011181435 A JP 2011181435A JP 5947504 B2 JP5947504 B2 JP 5947504B2
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- 239000003063 flame retardant Substances 0.000 title claims description 155
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims description 152
- 229920000647 polyepoxide Polymers 0.000 title claims description 102
- 239000003822 epoxy resin Substances 0.000 title claims description 100
- 239000013078 crystal Substances 0.000 title claims description 85
- 239000000203 mixture Substances 0.000 title claims description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000002844 melting Methods 0.000 claims description 83
- 230000008018 melting Effects 0.000 claims description 83
- 239000000843 powder Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 23
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 15
- -1 benzyl alcohol, acetic acid ester Chemical class 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 9
- 238000002411 thermogravimetry Methods 0.000 claims description 9
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 claims description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 239000012442 inert solvent Substances 0.000 claims description 4
- 238000000746 purification Methods 0.000 claims description 4
- 238000001953 recrystallisation Methods 0.000 claims description 4
- 239000005711 Benzoic acid Substances 0.000 claims description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 3
- 235000010233 benzoic acid Nutrition 0.000 claims description 3
- 239000006227 byproduct Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000012046 mixed solvent Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 40
- 238000010521 absorption reaction Methods 0.000 description 38
- 238000009835 boiling Methods 0.000 description 28
- 238000012360 testing method Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 239000002966 varnish Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 230000007774 longterm Effects 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 9
- 230000002829 reductive effect Effects 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000003792 electrolyte Substances 0.000 description 8
- 239000012535 impurity Substances 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 6
- 238000002485 combustion reaction Methods 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000032798 delamination Effects 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229940022663 acetate Drugs 0.000 description 3
- 229940007550 benzyl acetate Drugs 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001559 benzoic acids Chemical class 0.000 description 1
- 150000005130 benzoxazines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/06—Organic materials
- C09K21/12—Organic materials containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
- C07F9/6564—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
- C07F9/6571—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
- C07F9/657163—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom
- C07F9/657172—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom the ring phosphorus atom and one oxygen atom being part of a (thio)phosphinic acid ester: (X = O, S)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Description
さらに、高密度化したプリント基板は大気中の水分など異物の悪影響を受けやすく、長期信頼性を増す上で水分など異物の侵入を最小限に抑える必要がある。
特許文献5には本発明に使用する難燃剤と同一分子構造の特許文献1の難燃剤使用を記載しているが、これは示差熱・熱重量測定によって測定される溶け始め温度が280℃未満かつ融点が291℃未満のものであり、更に積層板に加工した際には難燃剤すべてがエポキシ樹脂と反応しており結晶性を失っているため、非結晶化した難燃剤部分が外部からの水分など異物混入の影響を受けやすく、鉛フリーはんだ対応に要求される耐熱性、高温信頼性に関しては不十分なものであった。
工程1:9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキシドと、1,4‐ナフトキノンとを、誘電率10以下の不活性溶媒中で反応させることで副生物の含量を低減し、反応組成物を高収率で得る工程、
工程2:工程1で得られた反応組成物をエチレングリコール、プロピレングリコール、ジエチレングリコール、シクロヘキサノン、ベンジルアルコール、酢酸エステル、安息香酸エステルから選ばれる1種の溶媒又は2種以上の混合溶媒に溶解し、再結晶精製することによって、次式(1)
とを有することを特徴とする高融点難燃剤結晶の製造方法を提供する。
この製造方法により得られる本発明の高融点難燃剤結晶は、融点がはんだ耐熱温度よりも高いため、樹脂組成物中に難燃剤として配合して用いた際に、鉛フリーハンダで溶着する場合にも難燃剤粉末の結晶構造が維持され、高温下での熱膨張による基板のひび割れや断線を生じさせることがなく、長期使用に際しても水分や電解質などの影響を生じ難い樹脂組成物を提供し得る。
本発明に係る高融点難燃剤結晶(以下、難燃剤と記す場合がある。)は、前記式(1)で表される9−ヒドロ−10−〔2−(1,4−ジヒドロキシナフチル)〕−9−オキサ−10−ホスファフェナントレン−10−オキシド(以下、HCA=NQと記す。)であり、特に、示差熱・熱重量測定によって測定される溶け始め温度が280℃以上であり、かつ融点が291℃以上である高純度結晶(以下、HCA=NQ高純度結晶と記す。)である。
そして、結晶中に不純物や異性体の含量が増えれば溶け始め温度と融点が低下し、その両温度の間隔も大きい。融点だけ高い物を使用しても、この不純物含有などによる溶け始め温度が低ければ、得られたプリント基板の極細で高密度な配線上に各種部品を鉛フリーハンダで溶着する場合に、高温下での熱膨張による基板のひび割れや断線が生じ易くなる。
純度が高くなれば溶け始め温度と融点が共に高くなり、またその温度間隔も小さくなるため、鉛フリーハンダで溶着する場合にも、高温下での熱膨張による基板のひび割れや断線が生じ難い。また、不純物は分子の結晶構造を乱す作用もあり、外部から水分などの異物侵入も招きやすい。
その結果、融点が295℃のHCA=NQ高純度結晶を使用した積層板の吸水率は約15%低下し、265℃の吸水はんだ耐熱試験でも熱膨張に伴うふくれ等の不具合は観察されなかった。一方、融点250℃のHCA−HQは、はんだ耐熱時に融解による熱膨張に伴うふくれ等の外観不良と一部の層間剥離が観察された。
その結果、融点が295℃のHCA=NQ高純度結晶を使用した積層板の吸水率は約15%低下し、265℃の吸水はんだ耐熱試験でも吸水した水分蒸発に伴うふくれ等の不具合は観察されなかった。一方、融点290℃のHCA=NQ汎用品は、はんだ耐熱時に吸水した水分蒸発に伴うふくれ等の外観不良と一部の層間剥離が観察された。
本発明に係る高融点難燃剤結晶の製造方法は、以下の工程1,2を行って、前記HCA=NQ高純度結晶を得ることを特徴としている。
また、工程1の反応は、温度80〜140℃中、1〜12時間程度行うことが好ましい。
本発明の難燃剤含有エポキシ樹脂組成物は、未硬化のエポキシ樹脂に、前記HCA=NQ高純度結晶からなる難燃剤粉末を、未硬化のエポキシ樹脂に反応しない状態で全樹脂固形分100質量部中1〜35質量部分散させたものである。
本発明のプリプレグは、前記難燃剤含有エポキシ樹脂組成物を含み、フィルム状又は板状をなすものである。
図1は、本発明のプリプレグの一例を示す模式図である。このプリプレグ1は、未硬化のエポキシ樹脂2A中にHCA=NQ高純度結晶からなる難燃剤粉末3Aが均一に分散された構造になっている。未硬化のエポキシ樹脂2A中に分散された難燃剤粉末3Aは、溶融することなく、結晶状態を維持している。
本発明の難燃性積層板は、前記フイルム又は板状のプリプレグと基板とを重ね合わせ、これらを熱プレスして積層一体化したものである。
基板としては、銅箔、合成樹脂フィルム、銅箔と樹脂層とが積層された銅張積層板、回路形成済みの銅張積層板などが挙げられる。
煮沸吸水率(%):100℃煮沸水中2時間浸漬後の吸水率=(吸水後の質量−吸水前の質量)×100/吸水前の質量。
煮沸はんだ耐熱性:100℃煮沸水中6時間浸漬後、265℃のはんだ浴に20秒間浸漬し、ふくれなどの外観異常を目視により観察した。
9−ヒドロ−10−〔2−(1,4−ジヒドロキシナフチル)〕−9−オキサ−10−ホスファフェナントレン−10−オキシド(HCA=NQ高純度結晶)の製造。
10リットルの四ツ口フラスコに9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキシド(三光(株)製HCA) 1296gと酢酸ベンジル3888gを仕込み、反応釜には温度計、滴下ロートとコンデンサーを取り付けた。
20リットルの四ツ口フラスコに工程1で得られた反応組成物2625gと酢酸ベンジル13125gを仕込み、再結晶精製により白色結晶性粉末のHCA=NQ高純度結晶1997gを得た。収率89.0% 、溶け始め温度292℃、融点295℃であった。
実施例1で作製したHCA=NQ高純度結晶(溶け始め温度292℃、融点295℃)25質量部、ビスフェノールA型エポキシ樹脂(ジャパンエポキシレジン(株)製「エピコート1001」)75質量部、フェノールノボラックエポキシ樹脂(ダウケミカル社製「DEN438」)20質量部、ジシアンジアミド3質量部、水酸化アルミニウム45質量部、2−エチル−4−メチルイミダゾール0.3質量部、メチルエチルケトン72質量部を均一に混合しワニスを調整した。
実施例1で作製したHCA=NQ高純度結晶(溶け始め温度292度、融点295℃)25質量部、クレゾールノボラック型エポキシ樹脂(DIC(株)製「N−673」)75質量部、フェノールノボラック樹脂(群栄化学(株)製「PSM6200」)24質量部、グリオキサール−フェノール重縮合物(ボーデンケミカル社製「DuriteSD−375B」)1質量部、水酸化アルミニウム45質量部、2−エチル−4−メチルイミダゾール0.3質量部、メチルエチルケトン72質量部を均一に混合しワニスを調整した。
実施例2の処方でHCA=NQ高純度結晶を55質量部(全樹脂固形分中37%)に変更して評価を行った。
実施例2の処方において、難燃剤を市販品である「9−ヒドロ−10−(2,5−ジヒドロキシフェニル)−9−オキサ−10−ホスファフェナントレン−10−オキシド(三光(株)製「HCA−HQ」、溶け始め温度246℃、融点250℃)25質量部に変更して評価を行った。
難燃剤として、実施例1で作製したHCA=NQ高純度結晶(9−ヒドロ−10−〔2−(1,4−ジヒドロキシナフチル)〕−9−オキサ−10−ホスファフェナントレン−10−オキシド(三光(株)製「HCA−NQ」)25質量部を用い、これにビスフェノールA型エポキシ樹脂(ジャパンエポキシレジン(株)製「エピコート1001」)75質量部、溶剤としてシクロヘキサノン100質量部にトリフェニルホスフィン0.3質量部を加え、150℃で5時間反応し、非結晶性のHCA=NQを含むリン変性エポキシ樹脂を調整した。
実施例2の処方において、難燃剤を9−ヒドロ−10−〔2−(1,4−ジヒドロキシナフチル)〕−9−オキサ−10−ホスファフェナントレン−10−オキシド(三光(株)製「HCA=NQ汎用品」、溶け始め温度277℃、融点290℃)25質量部に変更して評価を行った。
図3に示す通り、実施例1において製造したHCA=NQ高純度結晶は、HCA=NQ汎用品と比べ、溶け始め温度及び融点が明らかに高くなっていた。
Claims (4)
- 工程1:9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキシドと、1,4‐ナフトキノンとを、誘電率10以下の不活性溶媒中で反応させることで副生物の含量を低減し、反応組成物を高収率で得る工程、
工程2:工程1で得られた反応組成物をエチレングリコール、プロピレングリコール、ジエチレングリコール、シクロヘキサノン、ベンジルアルコール、酢酸エステル、安息香酸エステルから選ばれる1種の溶媒又は2種以上の混合溶媒に溶解し、再結晶精製することによって、次式(1)
とを有することを特徴とする高融点難燃剤結晶の製造方法。 - 請求項2に記載の難燃剤含有エポキシ樹脂組成物の製造方法により得られた難燃剤含有エポキシ樹脂組成物を一成分として、フイルム又は板状に加工するプリプレグの製造方法。
- 請求項3に記載のプリプレグの製造方法により得られた、フイルム又は板状のプリプレグと基板とを重ね合わせ、これらを熱プレスして積層一体化する難燃性積層板の製造方法。
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US13/587,067 US9371438B2 (en) | 2011-08-23 | 2012-08-16 | High melting point flame retardant crystal and method for manufacturing the same, epoxy resin composition containing the flame retardant, and prepreg and flame retardant laminate using the composition |
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JP2011181435A (ja) | 2010-03-03 | 2011-09-15 | Sumitomo Wiring Syst Ltd | コネクタ及びコネクタの嵌合方法 |
JP6074883B2 (ja) * | 2010-10-29 | 2017-02-08 | パナソニックIpマネジメント株式会社 | プリプレグ、積層板、金属箔張積層板、回路基板及びledモジュール |
JP5559674B2 (ja) * | 2010-12-21 | 2014-07-23 | パナソニック株式会社 | フレキシブルプリント配線板及びフレキシブルプリント配線板製造用積層物 |
CN102964775B (zh) * | 2012-10-16 | 2015-09-16 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
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2011
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2012
- 2012-07-10 KR KR1020120075046A patent/KR20130023061A/ko not_active Application Discontinuation
- 2012-07-12 TW TW101125069A patent/TWI534254B/zh active
- 2012-08-16 US US13/587,067 patent/US9371438B2/en active Active
- 2012-08-22 DE DE102012214931A patent/DE102012214931A1/de not_active Withdrawn
- 2012-08-23 CN CN2012103028368A patent/CN102952160A/zh active Pending
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Publication number | Publication date |
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KR20130023061A (ko) | 2013-03-07 |
CN102952160A (zh) | 2013-03-06 |
TW201309785A (zh) | 2013-03-01 |
US20130053473A1 (en) | 2013-02-28 |
DE102012214931A1 (de) | 2013-02-28 |
US9371438B2 (en) | 2016-06-21 |
TWI534254B (zh) | 2016-05-21 |
JP2013043910A (ja) | 2013-03-04 |
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