WO2008114858A8 - プリント配線板の絶縁層構成用の樹脂組成物 - Google Patents

プリント配線板の絶縁層構成用の樹脂組成物 Download PDF

Info

Publication number
WO2008114858A8
WO2008114858A8 PCT/JP2008/055222 JP2008055222W WO2008114858A8 WO 2008114858 A8 WO2008114858 A8 WO 2008114858A8 JP 2008055222 W JP2008055222 W JP 2008055222W WO 2008114858 A8 WO2008114858 A8 WO 2008114858A8
Authority
WO
WIPO (PCT)
Prior art keywords
resin
resin composition
component
epoxy
bisphenol
Prior art date
Application number
PCT/JP2008/055222
Other languages
English (en)
French (fr)
Other versions
WO2008114858A1 (ja
Inventor
佐藤　哲朗
敏文 松島
Original Assignee
三井金属鉱業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to US12/530,534 priority Critical patent/US8431224B2/en
Priority to KR1020097019319A priority patent/KR101196855B1/ko
Priority to CN2008800088848A priority patent/CN101842408B/zh
Priority to JP2008521668A priority patent/JP5704793B2/ja
Priority to EP08722586A priority patent/EP2135885A4/en
Publication of WO2008114858A1 publication Critical patent/WO2008114858A1/ja
Publication of WO2008114858A8 publication Critical patent/WO2008114858A8/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　半硬化状態の樹脂膜（層）の吸湿による品質劣化を大きく低減したプリント配線板製造用のハロゲンフリー系の樹脂組成物、樹脂付銅箔等の提供を目的とする。この目的を達成するため、当該樹脂組成物は、Ａ成分（エポキシ当量が２００以下で、２５°Cで液状のビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂の群から選ばれる１種又は２種以上）、Ｂ成分（架橋可能な官能基を有する線状ポリマー）、Ｃ成分（架橋剤）、Ｄ成分（イミダゾール系エポキシ樹脂硬化剤）、Ｅ成分（リン含有エポキシ樹脂）を含み、樹脂組成物重量を１００重量％としたときリン原子を０．５重量％～３．０重量％の範囲で含有したことを特徴とするものを採用する。また、この樹脂組成物で樹脂層を形成した樹脂付銅箔等を提供する。
PCT/JP2008/055222 2007-03-20 2008-03-21 プリント配線板の絶縁層構成用の樹脂組成物 WO2008114858A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/530,534 US8431224B2 (en) 2007-03-20 2008-03-21 Resin composition for forming insulating layer of printed wiring board
KR1020097019319A KR101196855B1 (ko) 2007-03-20 2008-03-21 프린트 배선판의 절연층 구성용 수지 조성물
CN2008800088848A CN101842408B (zh) 2007-03-20 2008-03-21 用于形成印刷布线板的绝缘层的树脂组合物
JP2008521668A JP5704793B2 (ja) 2007-03-20 2008-03-21 プリント配線板の絶縁層構成用の樹脂組成物
EP08722586A EP2135885A4 (en) 2007-03-20 2008-03-21 RESIN COMPOSITION FOR FORMING AN INSULATING LAYER OF PRINTED CIRCUIT BOARD

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-073703 2007-03-20
JP2007073703 2007-03-20

Publications (2)

Publication Number Publication Date
WO2008114858A1 WO2008114858A1 (ja) 2008-09-25
WO2008114858A8 true WO2008114858A8 (ja) 2010-02-18

Family

ID=39765958

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055222 WO2008114858A1 (ja) 2007-03-20 2008-03-21 プリント配線板の絶縁層構成用の樹脂組成物

Country Status (8)

Country Link
US (1) US8431224B2 (ja)
EP (1) EP2135885A4 (ja)
JP (1) JP5704793B2 (ja)
KR (1) KR101196855B1 (ja)
CN (1) CN101842408B (ja)
MY (1) MY162444A (ja)
TW (1) TWI451816B (ja)
WO (1) WO2008114858A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI432510B (zh) * 2008-05-26 2014-04-01 Mitsui Mining & Smelting Co And a resin composition for forming a layer of a multilayer flexible wiring board
KR101172113B1 (ko) * 2008-11-14 2012-08-10 엘지이노텍 주식회사 터치스크린 및 그 제조방법
KR101055683B1 (ko) 2008-12-26 2011-08-09 제일모직주식회사 신규한 포스포네이트계 화합물 및 이를 포함하는 난연성 스티렌계 수지 조성물
JPWO2010098296A1 (ja) * 2009-02-27 2012-08-30 Dic株式会社 ポリイミド樹脂、ポリイミド樹脂の製造方法、ポリイミド樹脂組成物及びその硬化物
JP5720118B2 (ja) * 2009-06-01 2015-05-20 三菱レイヨン株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
JP5947504B2 (ja) * 2011-08-23 2016-07-06 三光株式会社 高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法
CN103965245B (zh) * 2013-01-28 2016-06-08 中国科学院宁波材料技术与工程研究所 一种含磷生物基二酸二缩水甘油酯及其制备方法和应用
KR101851882B1 (ko) 2013-07-23 2018-04-24 제이엑스금속주식회사 표면 처리 동박, 캐리어가 형성된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
TWI645755B (zh) 2013-07-24 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101852671B1 (ko) 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
EP3290455B1 (en) * 2015-04-28 2020-01-29 TDK Corporation Resin composition, resin sheet, resin cured product and resin substrate
JP2017193778A (ja) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6806488B2 (ja) * 2016-07-29 2021-01-06 株式会社Adeka 硬化性樹脂組成物、及び該組成物を用いた構造材料接合用接着剤

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366804A (ja) * 1986-09-06 1988-03-25 株式会社フジクラ 集合絶縁電線
JP3268498B2 (ja) * 1990-05-01 2002-03-25 東都化成株式会社 リン含有難燃性エポキシ樹脂
US6132851A (en) * 1994-06-28 2000-10-17 Ga-Tek Inc. Adhesive compositions and copper foils and copper clad laminates using same
US6165617A (en) * 1995-07-04 2000-12-26 Mitsui Mining & Smelting Co., Ltd. Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
TW315580B (ja) * 1995-10-31 1997-09-11 Sumitomo Bakelite Co
JPH11348177A (ja) 1998-06-05 1999-12-21 Elna Co Ltd 樹脂付銅箔およびその製造方法並びにこの樹脂付銅箔を用いた多層プリント配線板
TW528769B (en) * 1998-06-19 2003-04-21 Nat Science Council Flame retardant advanced epoxy resins and cured epoxy resins, and preparation thereof
JP3320670B2 (ja) * 1999-03-10 2002-09-03 松下電工株式会社 エポキシ樹脂組成物、その製造方法、および樹脂付き金属箔、ならびにそれを用いた多層プリント配線板
JP2001024324A (ja) 1999-07-09 2001-01-26 Nippon Avionics Co Ltd ビルドアッププリント配線板の製造方法
JP3552621B2 (ja) * 1999-12-22 2004-08-11 松下電工株式会社 エポキシ樹脂組成物、樹脂付き金属箔及び多層板
JP2001244589A (ja) 2000-02-28 2001-09-07 Hitachi Ltd プリント配線板及びその製造方法
JP2001191475A (ja) 2000-03-21 2001-07-17 Think Laboratory Co Ltd グラビア製版方法
JP2002003702A (ja) * 2000-06-21 2002-01-09 Matsushita Electric Works Ltd エポキシ樹脂組成物、絶縁フィルム、樹脂付き金属箔及び多層プリント配線板
TW498084B (en) * 2000-07-19 2002-08-11 Chang Chun Plastics Co Ltd Flame-retardant resin and flame retardant composition containing the same
JP2002179772A (ja) 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
JP2002194313A (ja) * 2000-12-22 2002-07-10 Shin Etsu Chem Co Ltd 難燃性樹脂接着剤
JP2002241473A (ja) * 2001-02-16 2002-08-28 Taiyo Ink Mfg Ltd 熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板
JP3434808B2 (ja) 2001-05-31 2003-08-11 三井金属鉱業株式会社 樹脂付銅箔及びその樹脂付銅箔を用いたプリント配線板
JP2003298230A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
JP2004092347A (ja) 2002-09-04 2004-03-25 Nippo Corporation:Kk 建設機械の安全装置
US7608336B2 (en) * 2002-11-28 2009-10-27 Nippon Kayaku Kabushiki Kaisha Flame-retardant epoxy resin composition and cured product obtained therefrom
JP2005002294A (ja) * 2003-06-16 2005-01-06 Shin Etsu Chem Co Ltd 接着剤組成物、それを用いたカバーレイフィルムおよびフレキシブル印刷配線板
JP2005353918A (ja) * 2004-06-11 2005-12-22 Hitachi Cable Ltd プリント配線板用銅箔及びその製造方法

Also Published As

Publication number Publication date
WO2008114858A1 (ja) 2008-09-25
US20100108368A1 (en) 2010-05-06
CN101842408A (zh) 2010-09-22
JPWO2008114858A1 (ja) 2010-07-08
EP2135885A4 (en) 2012-08-01
TW200850084A (en) 2008-12-16
CN101842408B (zh) 2013-10-16
US8431224B2 (en) 2013-04-30
KR101196855B1 (ko) 2012-11-01
TWI451816B (zh) 2014-09-01
EP2135885A1 (en) 2009-12-23
MY162444A (en) 2017-06-15
KR20100014423A (ko) 2010-02-10
JP5704793B2 (ja) 2015-04-22

Similar Documents

Publication Publication Date Title
WO2008114858A8 (ja) プリント配線板の絶縁層構成用の樹脂組成物
MY150635A (en) Resin composition and resin coated copper foil obtained by using the resin composition
TW200504146A (en) Resin composition for interlayer insulation of multilayer printed circuit board, adhesive film and prepreg
TW200641036A (en) Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC property
MY155358A (en) Resin compound for forming adhesive layer of multilayered flexible printed wiring board
EP3053963A1 (en) Halogen-free resin composition and use thereof
WO2012020713A3 (ja) 樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法
KR20070089053A (ko) 열경화성 수지조성물, ｂ-스테이지화된 수지필름 및 다층빌드업 기판
KR20060108507A (ko) 난연성 접착제 조성물 및 그것을 이용한 접착 시트,커버레이 필름 및 가요성 동장 적층판
MY157363A (en) Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition
WO2008087890A1 (ja) 熱硬化性樹脂組成物
JP2009019081A5 (ja)
EP1275695A4 (en) CURABLE COMPOSITION AND MULTILAYERED SUBSTRATE MADE THEREOF
CN103665762A (zh) 热固性树脂组合物、b阶化树脂膜、金属箔、覆铜板以及多层积层基板
TW200833745A (en) Prepreg, laminate and printed wiring board
CN102143645A (zh) 覆盖膜及具有该覆盖膜的印刷电路板
CA2507630A1 (en) Flame-retardant epoxy resin composition and cured object obtained therefrom
TW200641035A (en) Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy
JP2004216870A (ja) 非透過性ポリイミドカバーレイフィルム及び非透過性エポキシ樹脂接着剤
US20120121913A1 (en) Adhesive composition
JP2009127031A (ja) 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
US20140162072A1 (en) Thermosetting resin compositions, resin films in b-stage, metal foils, copper clad boards and multi layer build-up boards
EP3992262A1 (en) Adhesive composition, coverlay film comprising same, and printed circuit board
KR20110085969A (ko) 열경화성 수지 조성물
KR20140145779A (ko) 인쇄회로기판용 수지 조성물, 빌드업필름, 프리프레그 및 인쇄회로기판

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880008884.8

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2008521668

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722586

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: PI20093838

Country of ref document: MY

WWE Wipo information: entry into national phase

Ref document number: 1020097019319

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008722586

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12530534

Country of ref document: US