CN102585663B - 一种电机用无卤阻燃耐高温绝缘漆 - Google Patents
一种电机用无卤阻燃耐高温绝缘漆 Download PDFInfo
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- CN102585663B CN102585663B CN2012100249265A CN201210024926A CN102585663B CN 102585663 B CN102585663 B CN 102585663B CN 2012100249265 A CN2012100249265 A CN 2012100249265A CN 201210024926 A CN201210024926 A CN 201210024926A CN 102585663 B CN102585663 B CN 102585663B
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 16
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 6
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 17
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- 239000000203 mixture Substances 0.000 claims description 12
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 claims description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 5
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 claims description 4
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- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 4
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- -1 boron amines Chemical class 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 150000004714 phosphonium salts Chemical class 0.000 claims description 2
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
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- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000012774 insulation material Substances 0.000 abstract 1
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- 238000006243 chemical reaction Methods 0.000 description 19
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- FJDJVBXSSLDNJB-LNTINUHCSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FJDJVBXSSLDNJB-LNTINUHCSA-N 0.000 description 5
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
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- 239000002904 solvent Substances 0.000 description 3
- 238000000967 suction filtration Methods 0.000 description 3
- 229920000388 Polyphosphate Polymers 0.000 description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
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- 238000005470 impregnation Methods 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000001205 polyphosphate Substances 0.000 description 2
- 235000011176 polyphosphates Nutrition 0.000 description 2
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- SEULWJSKCVACTH-UHFFFAOYSA-N 1-phenylimidazole Chemical compound C1=NC=CN1C1=CC=CC=C1 SEULWJSKCVACTH-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- BNQRPLGZFADFGA-UHFFFAOYSA-N benzyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 BNQRPLGZFADFGA-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Epoxy Resins (AREA)
Abstract
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CN2012100249265A CN102585663B (zh) | 2012-02-06 | 2012-02-06 | 一种电机用无卤阻燃耐高温绝缘漆 |
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CN102585663A CN102585663A (zh) | 2012-07-18 |
CN102585663B true CN102585663B (zh) | 2013-11-20 |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103319925A (zh) * | 2013-06-04 | 2013-09-25 | 常熟市九洲电器设备有限公司 | 一种高韧性和耐高低温电机用绝缘漆 |
CN104962167B (zh) * | 2015-06-18 | 2017-03-01 | 湖州湖杰漆业有限公司 | 一种耐高温绝缘漆及其制备方法 |
JP6671222B2 (ja) * | 2016-04-08 | 2020-03-25 | 日本化薬株式会社 | エポキシ樹脂、それを含有するエポキシ樹脂組成物とその硬化物 |
DE102018202061A1 (de) | 2018-02-09 | 2019-08-14 | Siemens Aktiengesellschaft | Isolation, elektrische Maschine und Verfahren zur Herstellung der Isolation |
DE102018202058A1 (de) * | 2018-02-09 | 2019-08-14 | Siemens Aktiengesellschaft | Formulierung zur Herstellung eines Isolationssystems, elektrische Maschine und Verfahren zur Herstellung eines Isolationssystems |
CN109749562A (zh) * | 2019-01-08 | 2019-05-14 | 杨记周 | 一种新能源汽车用阻燃绝缘涂料及其制备方法 |
CN111087777A (zh) * | 2020-02-10 | 2020-05-01 | 贵州富斯特化工材料科技有限公司 | 一种高效无卤阻燃pla复合材料及制备方法 |
CN111154185A (zh) * | 2020-02-10 | 2020-05-15 | 贵州富斯特化工材料科技有限公司 | 一种高性能纤维增强热塑性无卤阻燃复合材料及制备方法 |
CN112574643B (zh) * | 2020-12-16 | 2022-02-11 | 苏州太湖电工新材料股份有限公司 | 一种阻燃型水性绝缘漆及其制备方法和应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1900157A (zh) * | 2006-03-20 | 2007-01-24 | 刘萍 | 一种柔性印制电路覆盖膜及其制备方法 |
CN1984960A (zh) * | 2004-07-13 | 2007-06-20 | 日立化成工业株式会社 | 密封用环氧树脂成形材料及电子零件装置 |
CN101591421A (zh) * | 2009-06-30 | 2009-12-02 | 中南民族大学 | 硅骨架超支化环氧树脂及制备方法和以其组成的耐高温无溶剂绝缘漆 |
CN101687981A (zh) * | 2007-06-25 | 2010-03-31 | 三井金属矿业株式会社 | 树脂组合物以及使用该树脂组合物得到的带树脂铜箔 |
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- 2012-02-06 CN CN2012100249265A patent/CN102585663B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1984960A (zh) * | 2004-07-13 | 2007-06-20 | 日立化成工业株式会社 | 密封用环氧树脂成形材料及电子零件装置 |
CN1900157A (zh) * | 2006-03-20 | 2007-01-24 | 刘萍 | 一种柔性印制电路覆盖膜及其制备方法 |
CN101687981A (zh) * | 2007-06-25 | 2010-03-31 | 三井金属矿业株式会社 | 树脂组合物以及使用该树脂组合物得到的带树脂铜箔 |
CN101591421A (zh) * | 2009-06-30 | 2009-12-02 | 中南民族大学 | 硅骨架超支化环氧树脂及制备方法和以其组成的耐高温无溶剂绝缘漆 |
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