CN109951982A - A kind of the power supply connecting structure and air cleaning unit of thin film circuit - Google Patents
A kind of the power supply connecting structure and air cleaning unit of thin film circuit Download PDFInfo
- Publication number
- CN109951982A CN109951982A CN201910330387.XA CN201910330387A CN109951982A CN 109951982 A CN109951982 A CN 109951982A CN 201910330387 A CN201910330387 A CN 201910330387A CN 109951982 A CN109951982 A CN 109951982A
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- China
- Prior art keywords
- film circuit
- thin film
- shell
- fixed frame
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010409 thin film Substances 0.000 title claims abstract description 60
- 238000004140 cleaning Methods 0.000 title claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 2
- 239000005001 laminate film Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 2
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000035800 maturation Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses the power supply connecting structure and air cleaning unit of a kind of thin film circuit, the power supply for being to solve existing thin film circuit the problems in is plugged into.This product includes shell, fixed frame and external power part part, power connecting sheet and power connection end are installed in the shell, external power part part is mounted on the outside of shell, power connection end is connected with thin film circuit, power connecting sheet is connected with the circuit that connects of thin film circuit, fixed bracket is installed, fixed frame fastens on the shell and fixed frame and shell form an entirety in fixed frame.This product design is reasonable, pass through the cooperation of power connecting sheet, shell, fixed frame, external power part part etc., finished product can not only reduce the difficulty of plugging into for route of plugging into, it can largely save human and material resources simultaneously, it is particularly suitable for laminate film circuit and parallel alignment film circuit, is had broad application prospects.
Description
Technical field
The present invention relates to thin film circuit field, the power supply connecting structure of specifically a kind of thin film circuit.
Background technique
With the development of science and technology and progressive, many electronic original parts, heating device, electrostatic air conditioner filter element are all initially towards film
Change development, the application of thin film circuit is also more and more extensive.Thin film circuit is by the transistor of entire circuit, diode, resistance, electricity
Hold and elements and the interconnecting line between them such as inductance, all with thickness in 1 micron of metal below, semiconductor, metal
Oxide, various metals mixed phase, alloy or dielectric film, and be made up of techniques such as vacuum evaporation, sputtering and plating
Integrated circuit.
The connection of existing thin film circuit is mainly attached by modes such as cold end terminal, welding.But encounter stacking
If structure connects when perhaps dense arrangement structure is connected with thin film circuit by using cold end terminal or Welder
Skill, not only heavy workload, safety coefficient is low, and realizes that difficulty is bigger in technique and method, this is just the use of people
Bring inconvenience.
Summary of the invention
The power supply connecting structure for being designed to provide a kind of thin film circuit of the embodiment of the present invention, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the embodiment of the present invention provides the following technical solutions:
A kind of power supply connecting structure of thin film circuit, including shell, fixed frame and external power part part, in the shell
Power connecting sheet and power connection end are installed, external power part part is mounted on the outside of shell, and power connection end is connected with thin film circuit, power connecting sheet
Be connected with the circuit that connects of thin film circuit, fixed bracket be installed in fixed frame, fixed frame fasten on the shell and
Fixed frame and shell form an entirety.
As further embodiment of the embodiment of the present invention: power connecting sheet is made of copper material, cheap, easy to process,
It is conveniently replaceable.
As further embodiment of the embodiment of the present invention: shell, fixed bracket and fixed frame are all made of plastic material system
Make, technology maturation, market is easily bought.
As further embodiment of the embodiment of the present invention: fixed bracket and fixed frame are made of integral forming process,
Not easily to fall off, connectivity robustness is good.
As further embodiment of the embodiment of the present invention: the quantity of external power part part is four, it is ensured that this product
With the connection of other component, good operation stability.
As further embodiment of the embodiment of the present invention: four external power part parts are uniformly distributed four outside the shell
Angle does not influence the connection of thin film circuit, and can keep electrical communication with other component.
As further embodiment of the embodiment of the present invention: the groove for cooperating thin film circuit is provided in fixed frame,
Thin film circuit can preferably be fixed in the shell, connectivity robustness is good.
The purpose of the embodiment of the present invention, which also resides in, to be provided a kind of power supply including above-described thin film circuit and plugs into knot
The air cleaning unit of structure.
Compared with prior art, the beneficial effect of the embodiment of the present invention is:
Rationally, by the cooperation of power connecting sheet, shell, fixed frame, external power part part etc., finished product is not only for this product design
The difficulty of plugging into for route of plugging into can be reduced, while can largely be saved human and material resources, laminate film circuit is particularly suitable for
With parallel alignment film circuit, have broad application prospects.
Detailed description of the invention
Fig. 1 is the installation diagram of the power supply connecting structure of thin film circuit.
Wherein: 1- power connecting sheet, 2- shell, 3- power connection end, the external power part part of 4-, 5- fixed frame, the fixed bracket of 6-, 7-
Thin film circuit.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
Embodiment 1
A kind of power supply connecting structure of thin film circuit, including shell 2, fixed frame 5 and external power part part 4, it is described outer
Power connecting sheet 1 and power connection end 3 are installed, external power part part 4 is mounted on the outside of shell 2, power connection end 3 and thin film circuit 7 in shell 2
It is connected, power connection end 3 is located at the centre of thin film circuit 7, and power connecting sheet 1 is connected with the circuit that connects of thin film circuit 7, fixed frame 5
Fixed bracket 6 is inside installed, fixed frame 5 is fastened on shell 2 and fixed frame 5 and shell 2 form an entirety, when thin
When film circuit 7 is the homogeneous texture that whole film is made by punching, folding, we can be by thin film circuit 7
Position of joints carries out a punch press process, so that the thin film circuit 7 can be with the warp architecture of formation rule, while the warp architecture
Should there are certain intensity and elasticity.This product reserves power connection end 3, which can be printing electrically conductive ink, can be conduction
Silver paste is also possible to the metal material production of compound metal or plating.After obtaining warp architecture according to folded state,
Bending position is exposed power end of plugging into, then thin film circuit 7 is mounted in the fixtures such as mold or plastics, uses sheet metal
Or the power connecting sheet 1 of other conductor material production is connect with thin film circuit 7, because of the flexible and intensity of thin film circuit 7 itself,
Using the elasticity and intensity of thin film circuit 7 itself, by its it is firm be fitted on power connecting sheet 1, by the position of thin film circuit 7 and connect
The position of electric piece 1 carries out safe fixation, it is ensured that it can firmly be bonded naturally, so that the fitting is not needing cold end terminal
Or carry out other auxiliary equipment.
Embodiment 2
A kind of power supply connecting structure of thin film circuit, including shell 2, fixed frame 5 and external power part part 4, it is described outer
Power connecting sheet 1 and power connection end 3 are installed, external power part part 4 is mounted on the outside of shell 2, power connection end 3 and thin film circuit 7 in shell 2
It is connected, power connection end 3 is located at the both ends of thin film circuit 7, and power connecting sheet 1 is connected with the circuit that connects of thin film circuit 7, fixed frame 5
Fixed bracket 6 is inside installed, fixed frame 5 is fastened on shell 2 and fixed frame 5 and shell 2 form an entirety, when thin
When film circuit 7 is monolithic homogeneous texture, the modes such as printing electrically conductive circuits, plating metal general on thin-film material can be passed through
The production of thin film circuit 7 becomes the thin film circuit 7 that one side has exposed conductor of plugging into, and thin-film material, which uses, has some strength and bullet
Property PET (poly terephthalic acid), BOPP (Biaxially oriented polypropylene), the one or several kinds of PI (polyimides) film etc. it is multiple
Then condensation material it is adhesively fixed with original monolithic homogeneous texture using the mode of bending fold, it is ensured that this is thin
Film circuit 7 is connect with original homogeneous texture, after making the above circuit, then is connected by the way of embodiment 1.
In order to reduce production cost, power connecting sheet 1 is made of copper material, cheap, easy to process, is conveniently replaceable.
Further, shell 2, fixed bracket 6 and fixed frame 5 are all made of plastic material and make, technology maturation, and market is easy
It buys.
Further, fixed bracket 6 and fixed frame 5 are made of integral forming process, not easily to fall off, connectivity robustness
It is good.
Embodiment 3
A kind of power supply connecting structure of thin film circuit, including shell 2, fixed frame 5 and external power part part 4, it is described outer
Power connecting sheet 1 and power connection end 3 are installed, external power part part 4 is mounted on the outside of shell 2, power connection end 3 and thin film circuit 7 in shell 2
It is connected, power connection end 3 is located at the both ends of thin film circuit 7, and power connecting sheet 1 is connected with the circuit that connects of thin film circuit 7, fixed frame 5
Fixed bracket 6 is inside installed, fixed frame 5 is fastened on shell 2 and fixed frame 5 and shell 2 form an entirety, filtering
The both ends of filter core are provided with power supply connecting structure, by bending process, power supply connecting structure are all become curved structure, so
Filter core is fixed in shell 2 afterwards, and has reserved power connecting sheet 1 in shell 2 as power supply connecting device, the thin film circuit 7
Firmly it is connected with power connecting sheet 1 by the fixation of shell 2 using the elasticity of itself.
In order to guarantee connective stability, the quantity of external power part part 4 is four, it is ensured that this product and other component
Connection, good operation stability.
Further, four external power part parts 4 are evenly distributed on the quadrangle outside shell 2, do not influence thin film circuit 7
Connection, and electrical communication can be kept with other component.
Further, the groove for cooperating thin film circuit 7 is provided in fixed frame 5, it can be more preferable by thin film circuit 7
Be fixed in shell 2, connectivity robustness is good.
Embodiment 4
A kind of air cleaning unit, the power supply connecting structure including thin film circuit described in above embodiments.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.No
It should treat any reference in the claims as limiting the claims involved.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (8)
1. a kind of power supply connecting structure of thin film circuit, including shell (2), fixed frame (5) and external power part part (4),
It is characterized in that, power connecting sheet (1) and power connection end (3) is installed in the shell (2), external power part part (4) is mounted on shell (2)
Outside, is equipped with fixed bracket (6) in fixed frame (5), fixed frame (5) is fastened on shell (2) and fixed frame
(5) and shell (2) forms an entirety.
2. the power supply connecting structure of thin film circuit according to claim 1, which is characterized in that the power connecting sheet (1) uses
Copper material production.
3. the power supply connecting structure of thin film circuit according to claim 1 or 2, which is characterized in that the shell (2) is consolidated
Fixed rack (6) and fixed frame (5) are all made of plastic material production.
4. the power supply connecting structure of thin film circuit according to claim 1, which is characterized in that the fixed bracket (6) and
Fixed frame (5) is made of integral forming process.
5. the power supply connecting structure of thin film circuit according to claim 1, which is characterized in that the external power part part
(4) quantity is four.
6. the power supply connecting structure of thin film circuit according to claim 5, which is characterized in that four external power parts
Part (4) is evenly distributed on the external quadrangle of shell (2).
7. the power supply connecting structure of thin film circuit according to claim 1, which is characterized in that in the fixed frame (5)
It is provided with the groove for cooperating thin film circuit (7).
8. a kind of air cleaning unit, which is characterized in that the power supply including thin film circuit as claimed in claim 1 connects
Refute structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910330387.XA CN109951982B (en) | 2019-04-23 | 2019-04-23 | Power connection structure of thin film circuit and air purification device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910330387.XA CN109951982B (en) | 2019-04-23 | 2019-04-23 | Power connection structure of thin film circuit and air purification device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109951982A true CN109951982A (en) | 2019-06-28 |
| CN109951982B CN109951982B (en) | 2023-12-22 |
Family
ID=67014752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910330387.XA Active CN109951982B (en) | 2019-04-23 | 2019-04-23 | Power connection structure of thin film circuit and air purification device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109951982B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1026755A1 (en) * | 1998-05-22 | 2000-08-09 | Sumitomo Electric Industries, Ltd. | Method and device for cooling superconductor |
| CN101080338A (en) * | 2004-12-22 | 2007-11-28 | 罗伯特·博世有限公司 | Controlling module |
| CN202363631U (en) * | 2011-12-15 | 2012-08-01 | 特通科技有限公司 | Electric connector with thin-film circuit |
| CN202405453U (en) * | 2011-12-14 | 2012-08-29 | 特通科技有限公司 | Electric connector with thin film circuit |
| CN104158003A (en) * | 2013-05-14 | 2014-11-19 | 富士康(昆山)电脑接插件有限公司 | Electrical connector and assembly thereof |
| CN204043075U (en) * | 2014-08-14 | 2014-12-24 | 湖南双木环保科技有限公司 | Bidirectional circulating type air purifier |
| CN104882427A (en) * | 2014-02-27 | 2015-09-02 | 西安永电电气有限责任公司 | Plastic packaging type IPM module electrical connection structure |
| CN205508283U (en) * | 2016-03-18 | 2016-08-24 | 佛山市川东磁电股份有限公司 | Antifog demonstration screen structure |
| CN107046766A (en) * | 2017-03-06 | 2017-08-15 | 范雷达 | Flexible print thin film circuit and system |
| CN107152732A (en) * | 2017-06-16 | 2017-09-12 | 苏州博菡环保科技有限公司 | Bidirectional circulating type air purifier |
| CN107949163A (en) * | 2017-12-28 | 2018-04-20 | 东莞市台可名薄膜科技有限公司 | A kind of thin film printed circuit board and processing method |
| CN108518911A (en) * | 2018-04-03 | 2018-09-11 | 伦慧东 | A kind of refrigerator with antibacterial taste removal refrigerating chamber |
| CN210075793U (en) * | 2019-04-23 | 2020-02-14 | 台州思碳科技有限公司 | Power connection structure of thin film circuit and air purification device |
-
2019
- 2019-04-23 CN CN201910330387.XA patent/CN109951982B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1026755A1 (en) * | 1998-05-22 | 2000-08-09 | Sumitomo Electric Industries, Ltd. | Method and device for cooling superconductor |
| CN101080338A (en) * | 2004-12-22 | 2007-11-28 | 罗伯特·博世有限公司 | Controlling module |
| CN202405453U (en) * | 2011-12-14 | 2012-08-29 | 特通科技有限公司 | Electric connector with thin film circuit |
| CN202363631U (en) * | 2011-12-15 | 2012-08-01 | 特通科技有限公司 | Electric connector with thin-film circuit |
| CN104158003A (en) * | 2013-05-14 | 2014-11-19 | 富士康(昆山)电脑接插件有限公司 | Electrical connector and assembly thereof |
| CN104882427A (en) * | 2014-02-27 | 2015-09-02 | 西安永电电气有限责任公司 | Plastic packaging type IPM module electrical connection structure |
| CN204043075U (en) * | 2014-08-14 | 2014-12-24 | 湖南双木环保科技有限公司 | Bidirectional circulating type air purifier |
| CN205508283U (en) * | 2016-03-18 | 2016-08-24 | 佛山市川东磁电股份有限公司 | Antifog demonstration screen structure |
| CN107046766A (en) * | 2017-03-06 | 2017-08-15 | 范雷达 | Flexible print thin film circuit and system |
| CN107152732A (en) * | 2017-06-16 | 2017-09-12 | 苏州博菡环保科技有限公司 | Bidirectional circulating type air purifier |
| CN107949163A (en) * | 2017-12-28 | 2018-04-20 | 东莞市台可名薄膜科技有限公司 | A kind of thin film printed circuit board and processing method |
| CN108518911A (en) * | 2018-04-03 | 2018-09-11 | 伦慧东 | A kind of refrigerator with antibacterial taste removal refrigerating chamber |
| CN210075793U (en) * | 2019-04-23 | 2020-02-14 | 台州思碳科技有限公司 | Power connection structure of thin film circuit and air purification device |
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| Publication number | Publication date |
|---|---|
| CN109951982B (en) | 2023-12-22 |
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Address after: 317015 No. 62 Donghai Second Avenue, Toumengang New Area, Linhai City, Taizhou City, Zhejiang Province, China Applicant after: Taizhou Sitan Science and Technology Co.,Ltd. Address before: 317000, No. 62 Donghai Second Avenue, Zhejiang Toumen Port Economic Development Zone, Linhai City, Taizhou City, Zhejiang Province Applicant before: TAIZHOU SITAN TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20231115 Address after: 317015 No. 62 Donghai Second Avenue, Toumengang New Area, Linhai City, Taizhou City, Zhejiang Province, China Applicant after: Zhejiang Sican Yixin Environmental Protection Technology Co.,Ltd. Address before: 317015 No. 62 Donghai Second Avenue, Toumengang New Area, Linhai City, Taizhou City, Zhejiang Province, China Applicant before: Taizhou Sitan Science and Technology Co.,Ltd. |
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