CN109496064A - A kind of flexible circuit board - Google Patents

A kind of flexible circuit board Download PDF

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Publication number
CN109496064A
CN109496064A CN201811630524.3A CN201811630524A CN109496064A CN 109496064 A CN109496064 A CN 109496064A CN 201811630524 A CN201811630524 A CN 201811630524A CN 109496064 A CN109496064 A CN 109496064A
Authority
CN
China
Prior art keywords
circuit board
flexible circuit
voltage acquisition
acquisition end
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811630524.3A
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Chinese (zh)
Inventor
王文宝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Platinum Union Polytron Technologies Inc
Original Assignee
Xiamen Platinum Union Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Platinum Union Polytron Technologies Inc filed Critical Xiamen Platinum Union Polytron Technologies Inc
Priority to CN201811630524.3A priority Critical patent/CN109496064A/en
Publication of CN109496064A publication Critical patent/CN109496064A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

Abstract

The present invention relates to circuit board technology fields, particularly a kind of for detecting the flexible circuit board of voltage and temperature.The invention discloses a kind of flexible circuit boards, including flexible circuit board ontology, connectivity port, voltage acquisition end and temperature acquisition element, the connectivity port, voltage acquisition end and temperature acquisition element are separately positioned on flexible circuit board ontology, the conducting wire that the voltage acquisition end and temperature acquisition element pass through flexible circuit board ontology respectively is electrically connected with connectivity port, is transferred out the signal that voltage acquisition end and temperature acquisition element acquire by connectivity port.The present invention have many advantages, such as it is small in size, light-weight, be easily assembled, easily automation processing, voltage and temperature acquisition precision are high, can effectively be promoted battery pack using safe and service life.

Description

A kind of flexible circuit board
Technical field
The invention belongs to circuit board technology fields, more particularly to a kind of for detecting the flexible circuit of voltage and temperature Plate.
Background technique
Flexible circuit board (Flexible Printed Circuit, abbreviation FPC), also known as soft board, be with polyimides or Polyester film be substrate made of have height reliability and flexible printed circuit, be Aeronautics and Astronautics, military affairs, automobile and The indispensable heavy connection of consumption electronic product.
With the continuous aggravation got worse with energy crisis that world environments pollutes, new energy technology has obtained flourishing hair Exhibition, the battery as new energy technology develops very rapidly in recent years, and is widely used in electric automobiles, applies in electricity When on motor-car, the working performance and stability of battery will be very crucial, it is necessary to its working condition (including voltage and temperature Degree) acquisition monitoring in real time is carried out to avoid accident generation.
The voltage and temperature acquisition of existing battery are usually used harness and are acquired, also known as battery sampling line, tradition Harness is round flexible cord, and harness is thick and again, is required according to collection point different location, different in size, the automation of every sampling line Processing difficulties, and it is easy error, reliability is low.
Summary of the invention
The purpose of the present invention is to provide a kind of flexible circuit boards to solve above-mentioned technical problem.
To achieve the above object, the technical solution adopted by the present invention are as follows: a kind of flexible circuit board, including flexible circuit board sheet Body, connectivity port, voltage acquisition end and temperature acquisition element, the connectivity port, voltage acquisition end and temperature acquisition element point She Zhi not be on flexible circuit board ontology, the voltage acquisition end and temperature acquisition element pass through flexible circuit board ontology respectively Conducting wire is electrically connected with connectivity port, is transmitted out the signal that voltage acquisition end and temperature acquisition element acquire by connectivity port It goes.
Further, the voltage acquisition end and the conducting wire of flexible circuit board ontology are integrated.
Further, the voltage acquisition end is made of copper, aluminium, nickel or nickel alloy material.
Further, the thickness at the voltage acquisition end is greater than the conductor thickness of flexible circuit board ontology.
Further, the voltage acquisition end with a thickness of 0.2mm-0.3mm, the conducting wire of the flexible circuit board ontology With a thickness of 0.012-0.15mm.
Further, the temperature acquisition element is realized using thermistor.
Further, the temperature acquisition element is realized using NTC thermistor.
Further, the temperature acquisition element is coated with heat-conducting glue.
Further, the temperature acquisition element for the temperature of position corresponding to collection voltages collection terminal is arranged in the electricity Press near collection terminal, the conducting wire that connect with the voltage acquisition end, which is equipped with to open a window, forms thermally conductive window, the heat-conducting glue also cover to On the thermally conductive window.
Further, the flexible circuit board ontology includes conductor layer and the front for being separately positioned on conductor layer front and back sides Protective film and reverse side protective film.
Advantageous effects of the invention:
The present invention is compressed structure, have many advantages, such as it is small in size, light-weight, be easily assembled, easily automation processing, and voltage And temperature acquisition precision is high, can effectively be promoted battery using safe and service life.
The risks such as conducting wire is integrated with voltage acquisition end, and voltage acquisition end and conducting wire welding are bad, reliability Good, Tensile strength is high, and production process is short, at low cost.
Detailed description of the invention
Fig. 1 is the part-structure figure of the specific embodiment of the invention;
Fig. 2 is another part structure chart of the specific embodiment of the invention;
Fig. 3 is the structure chart of the specific embodiment of the invention;
Fig. 4 is the cross-sectional view of the specific embodiment of the invention.
Specific embodiment
Now in conjunction with the drawings and specific embodiments, the present invention is further described.
As shown in Figs 1-4, a kind of flexible circuit board, including flexible circuit board ontology 1, connectivity port 5, voltage acquisition end 2 With temperature acquisition element 3, the connectivity port 5, voltage acquisition end 2 and temperature acquisition element 3 are separately positioned on flexible circuit board On ontology 1, the voltage acquisition end 2 and temperature acquisition element 3 pass through the conducting wire of the conductor layer 12 of flexible circuit board ontology 1 respectively It is electrically connected with connectivity port 5, is transmitted out the signal that voltage acquisition end 2 and temperature acquisition element 3 acquire by connectivity port 5 It goes.
In this specific embodiment, the flexible circuit board ontology 1 be single-layer-flex circuit, including conductor layer 12 and point The front protecting film 11 and reverse side protective film 13 of 12 front and back sides of conductor layer are not set, and flexible circuit board ontology 1 is in substantially strip Shape structure.Certainly, in other embodiments, flexible circuit board ontology 1 can also with multi-layer flexible circuit board, such as it is double-deck, three layers, The shape of flexible circuit board ontology 1 can be set according to collection point physical location situation, this is that those skilled in the art can With what is realized easily, no longer describe in detail.
In this specific embodiment, the conductor thickness of the conductor layer 12 of the flexible circuit board ontology 1 is preferably 0.012- 0.15mm.Certainly, in other embodiments, the conductor thickness of the conductor layer 12 of flexible circuit board ontology 1 can be according to specified electricity Stream and space plate thickness require to be selected, this is that those skilled in the art can realize easily, is no longer described in detail.
In this specific embodiment, the voltage acquisition end 2 and the conducting wire of flexible circuit board ontology 1 are integrated, i.e., Integrated molding, the risks such as voltage acquisition end 2 and conducting wire welding are bad have high reliablity, and Tensile strength is high, production process It is short, it is at low cost the advantages that.
In this specific embodiment, the conducting wire of the voltage acquisition end 2 and flexible circuit board ontology 1 preferably uses copper, aluminium, nickel Or nickel alloy material is made, and conducts electricity very well, it is at low cost.
In order to meet weld strength, in this specific embodiment, the thickness at the voltage acquisition end 2 is preferably greater than flexible circuit The conductor thickness of plate ontology 1, has, and the thickness at the voltage acquisition end is preferably 0.2mm-0.3mm, but not limited to this.
In this specific embodiment, the quantity at voltage acquisition end 2 is 15, is separately positioned on the phase of flexible circuit board ontology 1 To two sides, but it is not limited to this, in other embodiments, the quantity at voltage acquisition end 2 and the setting in flexible circuit board ontology 1 Position can be set according to collection point physical location situation, this is that those skilled in the art can realize easily, no longer It describes in detail.
In this specific embodiment, the temperature acquisition element 3 is preferably realized using thermistor, it is furthermore preferred that described Temperature acquisition element 3 realizes that but it is not limited to this using NTC thermistor, in other embodiments, temperature acquisition element 3 Other temperature acquisition elements, such as thermocouple can also be used to realize, this is that those skilled in the art can realize easily, No longer describe in detail.
The flexible circuit board ontology 1 offers pad 14, the NTC thermistor 3 be welded on pad 14 and with it is soft Property circuit board body 1 conducting wire electrical connection.
In this specific embodiment, the quantity of NTC thermistor 3 is 3, and the front that flexible circuit board ontology 1 is arranged in is protected On cuticula 11, certainly, in other embodiments, the quantity of NTC thermistor 3 and setting position can be according to collection point actual bits It sets situation to be set, this is that those skilled in the art can realize easily, is no longer described in detail.
In this specific embodiment, the NTC thermistor 3 is coated with heat-conducting glue 4, both protects to NTC thermistor 3 Shield improves temperature acquisition precision but also heat transmitting is more evenly.
In this specific embodiment, the NTC thermistor 3 of the temperature for position corresponding to collection voltages collection terminal 2 is arranged Near the voltage acquisition end 2, that is, the voltage acquisition end 2 is nestled up, under the premise of guaranteeing insulating properties between them, makes it The distance between it is as small as possible, to improve temperature acquisition accuracy, the conducting wire that connect with the voltage acquisition end 2 is equipped with windowing shape At thermally conductive window 15, the heat-conducting glue 4 is also covered to the thermally conductive window 15, so that the temperature of position corresponding to voltage acquisition end 2 Degree successively can pass to NTC thermistor 3 from voltage acquisition end 2, conducting wire, thermally conductive window 15, heat-conducting glue 4, improve temperature Accuracy is detected, and makes more compact structure, volume is smaller.
In this specific embodiment, the connectivity port 5 realizes that connector 5 is corresponding by being welded on using connector It is arranged on the front protecting film 11 of flexible circuit board ontology 1 on pad 16, connector 5 is used for and battery management system BMS It is attached, the signal that voltage acquisition end 2 and NTC thermistor 3 acquire is transferred to battery management system BMS.
Brief manufacturing method of the invention is as follows:
Drilling, bores location hole on conductor sheet material, for exposure aligning and protective film fitting contraposition.
Subtract copper: positive whole plate and reverse side voltage acquisition end 2 are covered with dry film, then adjust etching ginseng according to etch-rate Number carries out subtracting copper, and the copper thickness of conductor section is made to reach product requirement, and reverse side retains voltage acquisition end 2 and is not etched.
Paste reverse side protective film 13: reverse side protective film is opened a window voltage acquisition end 2, by drilling-punching according to contraposition Hole contraposition patch reverse side protective film 13, and carry out lamination solidification.
Circuit etching: reverse side whole plate and front conducting wire and voltage acquisition end 2 are covered with dry film and are etched, positive to lead Line and voltage acquisition end 2 are not etched, remaining region etches away the copper thickness lefted in, form conductor layer 12.
Paste front protecting film 11: by front protecting film 11 by drilling-punching, by voltage acquisition end 2, NTC thermistor 3 and 5 pad of connector open a window, while being arranged on the conducting wire being connect with voltage acquisition end 2 near NTC thermistor 3 Thermally conductive window 15 aligns patch front protecting film 11 according to registration holes, and carries out lamination solidification.It can be according to requiring the reinforcing on product And double-sided adhesive etc..
Patch: connector 5 and NTC thermistor 3 are welded on corresponding pad, while the point in NTC thermistor 3 Heat-conducting glue 4, and heat-conducting glue 4 is connected and covers thermally conductive window area 15.
Surface treatment, silk-screen character, reinforcing, double-sided adhesive etc. can be increased according to consumer product demand.
The present invention is compressed structure, have many advantages, such as it is small in size, light-weight, be easily assembled, easily automation processing, and voltage And temperature acquisition precision is high, can effectively be promoted battery using safe and service life.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright It is white, it is not departing from the spirit and scope of the present invention defined by the appended claims, it in the form and details can be right The present invention makes a variety of changes, and is protection scope of the present invention.

Claims (10)

1. a kind of flexible circuit board, it is characterised in that: including flexible circuit board ontology, connectivity port, voltage acquisition end and temperature Acquisition elements, the connectivity port, voltage acquisition end and temperature acquisition element are separately positioned on flexible circuit board ontology, described The conducting wire that voltage acquisition end and temperature acquisition element pass through flexible circuit board ontology respectively is electrically connected with connectivity port, passes through connection Port transfers out the signal that voltage acquisition end and temperature acquisition element acquire.
2. flexible circuit board according to claim 1, it is characterised in that: the voltage acquisition end and flexible circuit board ontology Conducting wire be integrated.
3. flexible circuit board according to claim 2, it is characterised in that: the voltage acquisition end uses copper, aluminium, nickel or nickel Alloy material is made.
4. flexible circuit board according to claim 2 or 3, it is characterised in that: the thickness at the voltage acquisition end is greater than soft The conductor thickness of property circuit board body.
5. flexible circuit board according to claim 4, it is characterised in that: the voltage acquisition end with a thickness of 0.2mm- 0.3mm, the conductor thickness of the flexible circuit board ontology are 0.012-0.15mm.
6. flexible circuit board according to claim 1, it is characterised in that: the temperature acquisition element using thermistor come It realizes.
7. flexible circuit board according to claim 6, it is characterised in that: the temperature acquisition element is using NTC temperature-sensitive electricity Resistance is to realize.
8. flexible circuit board according to claim 7, it is characterised in that: the temperature acquisition element is coated with heat-conducting glue.
9. flexible circuit board according to claim 8, it is characterised in that: for position corresponding to collection voltages collection terminal The temperature acquisition element of temperature is arranged near the voltage acquisition end, and the conducting wire connecting with the voltage acquisition end is equipped with windowing and is formed Thermally conductive window, the heat-conducting glue are also covered to the thermally conductive window.
10. flexible circuit board according to claim 1, it is characterised in that: the flexible circuit board ontology includes conductor layer And it is separately positioned on the front protecting film and reverse side protective film of conductor layer front and back sides.
CN201811630524.3A 2018-12-29 2018-12-29 A kind of flexible circuit board Pending CN109496064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811630524.3A CN109496064A (en) 2018-12-29 2018-12-29 A kind of flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811630524.3A CN109496064A (en) 2018-12-29 2018-12-29 A kind of flexible circuit board

Publications (1)

Publication Number Publication Date
CN109496064A true CN109496064A (en) 2019-03-19

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Family Applications (1)

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CN201811630524.3A Pending CN109496064A (en) 2018-12-29 2018-12-29 A kind of flexible circuit board

Country Status (1)

Country Link
CN (1) CN109496064A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109982515A (en) * 2019-05-05 2019-07-05 东莞市奕东电子有限公司 A kind of power battery adopts crimping beam FPC manufacture craft
CN110087398A (en) * 2019-05-05 2019-08-02 东莞市奕东电子有限公司 A kind of production method of novel FPC
CN112582690A (en) * 2019-09-29 2021-03-30 比亚迪股份有限公司 Flexible circuit board, die-cut substrate, and battery device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012075948A1 (en) * 2010-12-08 2012-06-14 Byd Company Limited Battery module
US20120301747A1 (en) * 2011-05-25 2012-11-29 Samsung Sdi Co., Ltd. Battery pack
JP2013080693A (en) * 2011-09-20 2013-05-02 Auto Network Gijutsu Kenkyusho:Kk Wiring module for battery
CN206976518U (en) * 2017-06-27 2018-02-06 成都特隆美储能技术有限公司 A kind of lithium battery module battery core voltage, temperature acquisition board
CN207474621U (en) * 2017-07-12 2018-06-08 昆山龙朋精密电子有限公司 A kind of battery modules voltage, temperature acquisition component
CN207884968U (en) * 2018-03-13 2018-09-18 宁德时代新能源科技股份有限公司 A kind of flexible PCB and battery modules
CN208284594U (en) * 2018-05-09 2018-12-25 贵州贵安阳光新能源科技有限公司 A kind of novel voltage and temperature acquisition flexible board
CN209562921U (en) * 2018-12-29 2019-10-29 厦门市铂联科技股份有限公司 A kind of flexible circuit board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012075948A1 (en) * 2010-12-08 2012-06-14 Byd Company Limited Battery module
US20120301747A1 (en) * 2011-05-25 2012-11-29 Samsung Sdi Co., Ltd. Battery pack
JP2013080693A (en) * 2011-09-20 2013-05-02 Auto Network Gijutsu Kenkyusho:Kk Wiring module for battery
CN206976518U (en) * 2017-06-27 2018-02-06 成都特隆美储能技术有限公司 A kind of lithium battery module battery core voltage, temperature acquisition board
CN207474621U (en) * 2017-07-12 2018-06-08 昆山龙朋精密电子有限公司 A kind of battery modules voltage, temperature acquisition component
CN207884968U (en) * 2018-03-13 2018-09-18 宁德时代新能源科技股份有限公司 A kind of flexible PCB and battery modules
CN208284594U (en) * 2018-05-09 2018-12-25 贵州贵安阳光新能源科技有限公司 A kind of novel voltage and temperature acquisition flexible board
CN209562921U (en) * 2018-12-29 2019-10-29 厦门市铂联科技股份有限公司 A kind of flexible circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109982515A (en) * 2019-05-05 2019-07-05 东莞市奕东电子有限公司 A kind of power battery adopts crimping beam FPC manufacture craft
CN110087398A (en) * 2019-05-05 2019-08-02 东莞市奕东电子有限公司 A kind of production method of novel FPC
CN112582690A (en) * 2019-09-29 2021-03-30 比亚迪股份有限公司 Flexible circuit board, die-cut substrate, and battery device

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